CN101578854A - Imaging device, method for manufacturing the imaging device, and portable terminal device - Google Patents
Imaging device, method for manufacturing the imaging device, and portable terminal device Download PDFInfo
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- CN101578854A CN101578854A CNA2008800019532A CN200880001953A CN101578854A CN 101578854 A CN101578854 A CN 101578854A CN A2008800019532 A CNA2008800019532 A CN A2008800019532A CN 200880001953 A CN200880001953 A CN 200880001953A CN 101578854 A CN101578854 A CN 101578854A
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- adhesive
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Images
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
A picked up image deteriorates due to entry and moving of dusts in an inner space of an imaging device. Provided is an imaging device wherein image quality deterioration is suppressed by capturing dusts. An imaging device (18) is provided with a lens block (19) housing a lens (2); a semiconductor imaging element (4) mounted on one surface of a substrate (1); and a translucent member (5) mounted on the other surface. On the outer side of a space surrounded by the semiconductor imaging element (4), the translucent member (5) and the substrate (1), outside an optically effective range, a gap (24) into which a solution (23) prepared by dissolving an adhesive agent can infiltrate is provided.
Description
Technical field
The present invention relates to image pick up equipment, its manufacture method and portable terminal, and relate to compact image pick device that adopts the semiconductor image pick device and the mobile phone that adopts this image pick up equipment particularly.
Background technology
Image pick up equipment is by semiconductor image pick device chip being installed on the installation base plate and implementing lens are attached to it.Leaded light space between semiconductor image pick device and the lens is being installed very importantly, if dust deposit or fault betide in this leaded light space, deterioration of image quality then occurs, and therefore proposes various countermeasures.
For example, a kind of image pick up equipment has been proposed, the sept member that wherein at one end has adherence (adhesion) on the face places in the space that is used for fixing the semiconductor image pick device, and dust is attached to the end face that exposes of this sept, thereby prevents that thus dust deposit from not influencing picture quality (patent documentation 1) on the semiconductor image pick device.
A kind of method has also been proposed, wherein can keep the holding device of dust to be provided in the leaded light space between semiconductor image pick device and the lens, and dust remains on this holding device, prevent dust deposit thus on the sensitive surface of lens, image pick-up device, optical filter etc., thereby prevent deterioration in image quality (patent documentation 2).
In addition, if the filler of cement places on the semiconductor image pick device, fault takes place, and is replenished by surrounding pixel by foundation fault size, can proofread and correct this fault, as patent documentation 3 disclosed (patent documentation 3).
Patent documentation 1:JP-2005-217546A (the 4th page, Fig. 6)
Patent documentation 2:JP-2005-316127A (the 6th page, Fig. 2)
Patent documentation 3:JP-2004-327914A (the 6th page, Fig. 6)
Summary of the invention
The problem that the present invention solves
In this manner, in the image pick up equipment that patent documentation 1 is described, suppose in the space of separating by semiconductor image pick device and optical component, sept is effective owing to catching dust, but known dust in the space has and the much the same size of Pixel Dimensions, and influence the output of image pick-up device, and reduce pixel output thus and produce fault.Therefore, as seen in the environment of enough cleanings the mounting equipment ratio to catch dust more effective because dust size to be caught is very little, have only a few μ m.Because the stress of thermal shock, vibration, impact etc. causes that the adhesive with bond properties comes off, there is the possibility that deterioration in image quality takes place.In addition, because adhesive area is formed in the plane of sept, the zone that the worry dust never is provided with sept enters.Sept insert and put the increase that causes number of components, cause taking place the variation of optical distance easily, and can not avoid the fluctuation of optical characteristics.
In the image pick up equipment that patent documentation 2 is described, can keep the holding device of dust to be arranged in the leaded light space between semiconductor image pick device and the lens, so that dust is remained on the holding device.Yet the dust size of deterioration picture quality is very little, and is similar with the Pixel Dimensions on semiconductor image pick device surface, but along with distance semiconductor image pick device is far away more, this size is big more on optical filter or lens.This means that dust change in size to be kept depends primarily on the distance with the semiconductor image pick device.Because the size range of dust to be kept is wide, it is necessary stably catching and keeping the dust of wide size range.Therefore, can change the size that remains on the dust on the holding device, it is important perhaps can keeping the enough wide size range of dust, and material is selected and the flexibility of design alternative reduces; This is a problem.
Also be suggested in patent documentation 3 although remove the method for fault by correction, move and attempt the stability characteristic (quality) that provides long-term in case deposition materials is inner, expectation is removed dust as much as possible from the effective coverage.
The present invention is intended to address the above problem, and the purpose of this invention is to provide the compact image pick device of high-quality and the portable terminal that adopts this image pick up equipment, the compact image pick device of this high-quality can reduce by the deposition of dust or move the deterioration in image quality that causes, and can strengthen the flexibility of design.
The means of dealing with problems
In order to reach this purpose, image pick up equipment of the present invention is characterised in that: the semiconductor image pick device is installed on the substrate, and the interval of transmissive member and lens use optical space is arranged in the image pickup zone of semiconductor image pick device; This adhesion area is formed in a part of zone that surrounds this optics effective coverage at least, can be in the image pickup zone outside the space that is surrounded by this semiconductor image pick device in this optical space, this transmissive member and this substrate in this optics effective coverage captured image.
According to this configuration, dust to be caught is hunted down outside the optics effective range, and the dust of catching thus can not influence picture quality optically.Compare with the space of the sensitive surface that has the semiconductor image pick device, captive dust size is big, even and little dust can not influence picture quality it can not be hunted down; Because adhesive need not to catch small dust, the broad range that can provide adhesive to select.In addition, by vibration or to impact the coming off of adhesive itself cause also be possible, if but dust is not bigger dust, picture quality can be not influenced, and therefore reliability increase.In addition, can form adhesive and need not adhere to for example other member of sept, the feasible generation that can not cause changes in optical properties.The optical space of herein mentioning refers to the zone that can form light path.
The present invention comprises above-mentioned image pick up equipment, wherein the semiconductor image pick device is installed on the face of this substrate, this transmissive member is installed on another face of substrate, and in addition, use prepared separation with this transmissive member, the lens block that will have lens is placed on to have on this substrate, and this gap that wherein allows to comprise the liquid infiltration of adhesive is arranged in the interface between this substrate and this lens block.
According to this configuration, also comprise the gap of the solution infiltration that allows to have the adhesive dissolving in addition, and therefore after the assembling image pick up equipment, adhesive is given outside the optics effective range, make the flexibility ratio of this process improve, and operation is good; Because form adhesive area to fill this gap, sealing also improves, and can form dust subtly in adhesion area, making to provide better reliability.
The present invention comprises above-mentioned image pick up equipment, and wherein this gap comprises injection portion, and this injection portion has than the big opening in this gap to inject solution.
According to this configuration, in the time of outside adhesive is injected into effective optical range, because be provided with the opening bigger than this gap, operation is improved.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesive area is formed by the coated film that contains the adhesiveness composition.
According to this configuration, operation is improved, and this thickness almost do not have thickness, makes this optical distance to reduce.According to this configuration, can outside this optics effective range, adhesiveness be set.
Image pick up equipment of the present invention is characterised in that: the semiconductor image pick device is installed on the substrate, and the interval of transmissive member and lens use optical space is arranged in the image pickup zone of semiconductor image pick device; This adhesion area is formed in a part of zone that surrounds this optics effective coverage at least, can be in the image pickup zone outside the space that is surrounded by this semiconductor image pick device in the optical space, this transmissive member and this substrate in this optics effective coverage captured image.
According to this configuration, dust to be caught is hunted down outside the optics effective range, and the dust of catching thus can not influence picture quality optically.Because this adhesive area is formed on outside the space that is surrounded by semiconductor image pick device, transmissive member and substrate, therefore compare with the space of the sensitive surface that has the semiconductor image pick device, captive dust size is big, even and little dust can not influence picture quality it can not be hunted down; Because adhesive need not to catch small dust, the broad range that can provide adhesive to select.In addition, by vibration or to impact the coming off of adhesive itself cause also be possible, if but dust is not bigger dust, picture quality can be not influenced, and therefore reliability increase.In addition, can form adhesive and need not adhere to for example other member of sept, the feasible generation that can not cause changes in optical properties.The optical space of herein mentioning refers to the zone that can form light path.
The present invention comprises above-mentioned image pick up equipment, wherein this semiconductor image pick device is installed on the face of this substrate, this transmissive member is installed on another face of substrate, and uses the prepared separation with this transmissive member in addition, and the lens block that will have lens is placed on this substrate.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesive area is formed by the coated film that contains the adhesiveness composition.
According to this configuration, operation is improved, and this thickness almost do not have thickness, makes this optical distance to reduce.According to this configuration, can outside this optics effective range, adhesiveness be set.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesive is placed in the part of neighboring region of this lens block and this substrate at least.
According to this configuration, adhesive area is arranged in the part of neighboring region of lens block and substrate at least, and therefore compare with the space of the sensitive surface that has the semiconductor image pick device, captive dust size is big, even and little dust can not influence picture quality it can not be hunted down; Because adhesive need not to catch small dust, the broad range that can provide adhesive to select.In addition, by vibration or to impact the coming off of adhesive itself cause also be possible, if but dust is not bigger dust, picture quality can be not influenced, and therefore reliability increase.Because cleanliness factor can reduce in the entirety of lens package step, therefore can be in the environment of easy clean case etc. assembling lens, assemble ultra-clean chamber in and not be used in, and can reduce cost, also can reduce the depreciation cost that comprises ultra-clean chamber etc.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesive area is placed in the entire circumference of encirclement semiconductor image pick device of neighboring region of this lens block and this substrate.
The present invention comprises above-mentioned image pick up equipment, and wherein the width by reserving with the outer end of this substrate is arranged on inside position with this adhesive area, and along the peripheral disposition of this substrate.
According to this configuration, be low if form the viscosity of the applied adhesive of adhesive area, applied adhesive does not protrude, and this adhesion area can form well.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesion area outwards injects and makes the part in the periphery have an expansion portion at least.
According to this configuration, fill the adhesive that forms adhesive area and become easily, and can catch outside dust in addition effectively.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesive area is filled into the notch portion that is arranged in this substrate or this lens block.
According to this configuration, good precision definition is used in the zone that forms adhesive area, and forms effectively and do not have a protrusion.
If the gap is arranged in the lens block, for the different image pick up equipment of lens specification, only need to change the lens block, make that sharing this substrate becomes possibility.
The present invention comprises above-mentioned image pick up equipment, and wherein this transmissive member is the optical filter of a plurality of dielectric duplexers.
According to this configuration, can realize optical filter by laminated film, and be effective therefore for the slimming image pick up equipment.
The present invention comprises above-mentioned image pick up equipment, and wherein this substrate is three-dimensional substrate, and this solid substrate has and is used to place this semiconductor image pick device placement section thereon.
According to this configuration, as a reference, the semiconductor image pick device is placed and the lens block is attached to three-dimensional substrate, makes that crisscross optical axis alignment work etc. is reduced.
The present invention comprises above-mentioned image pick up equipment, wherein place these lens, this transmissive member, this substrate and this semiconductor image pick device, and this adhesive is formed at least in the part of neighboring region of these lens and this transmissive member with order from subject side along optical axis.
Expectation is dissolved with the solution evaporation of adhesive.According to this configuration, can shorten tack, because it need not to enter into drying oven, and can process continuously and without batch processing.
The present invention comprises above-mentioned image pick up equipment, and wherein this adhesive area is the zone that is used for this lens block is fixed to this substrate.
According to this configuration, adhesive is filled in the zone in original generation gap, so the gap is filled and adhesive area with dust capture effect is formed, make can form the image pick up equipment of high reliability and do not have the fluctuation of optical distance.
The manufacture method of above-mentioned image pick up equipment is characterized in that comprising following steps: lens, semiconductor image pick device, transmissive member and substrate are set; And this transmissive member, this semiconductor image pick device and this lens are installed on this substrate.
The manufacture method of image pick up equipment of the present invention is characterized in that comprising: the step that lens, semiconductor image pick device, transmissive member and substrate are set; The step of this transmissive member, this semiconductor image pick device and these lens is installed on this substrate; And after the step that lens are installed, to comprise binder liq and be filled in the gap with step around the optics effective coverage, can be in the image pickup zone outside the space that is surrounded by this semiconductor image pick device, this transmissive member and this substrate in this optics effective coverage captured image.
According to this step, after in very clean environment, being installed to transmissive member and semiconductor image pick device on the substrate, assembling lens, make that cleanliness factor can reduce in the entirety of lens package step, therefore can be in the environment of easy clean case etc. assembling lens, and not be used in the ultra-clean chamber assembling, and and can reduce cost, also can reduce the depreciation cost that comprises ultra-clean chamber etc.After being installed to the lens block on the substrate, have the solution that is dissolved with adhesive and be penetrated in the gap of this substrate and this lens block, make the installation strength of this lens block and this substrate can not reduce.
The manufacture method of image pick up equipment of the present invention is characterized in that comprising following steps: the lens block, this semiconductor image pick device, this transmissive member and this substrate that include these lens are set; This transmissive member and this semiconductor image pick device are installed on this substrate; This lens block is installed on this substrate; And will have the solution that is dissolved with adhesive and be penetrated in this gap between this substrate and this lens block.
Therefore according to this configuration, adhesive is filled in the gap that is created between lens block and the substrate, can catch dust and remove the gap, and making can provide the image pick up equipment of high reliability and can not cause the change of optical distance.
In the manufacture method of image pick up equipment of the present invention, impregnation step comprises that the solution with dissolved adhesive in the volatile solvent soln is filled into the step in this gap.
According to this configuration, can operation well adhesive be filled in the little gap.As adhesive, be dissolved in the adhesive in the volatile solvent soln, be easy to handle.Preferably, the viscosity of binder solution is about 100cp.
In the manufacture method of image pick up equipment of the present invention, impregnation step comprises the step of filling and permeating this solution from two relative directions.
According to this configuration, can operation well solution be filled in the All Ranges.The expectation opening is arranged on the long limit; Relatively, use good working also solution can be penetrated in the long limit.
In the manufacture method of image pick up equipment of the present invention, after the step of this semiconductor image pick device to this substrate is installed, come this assembling image pick up equipment to the step of this substrate and step that these lens are installed by using adhesive.
According to this configuration, in very clean environment, be installed to transmissive member and semiconductor image pick device on the substrate after, assembling lens makes that cleanliness factor can reduce in the entirety of lens package step.Therefore can be in the environment of easy clean case etc. assembling lens, assemble ultra-clean chamber in and not be used in, and can reduce cost, also can reduce the depreciation cost that comprises ultra-clean chamber etc.
Manufacture method of the present invention comprises: install before the step of these lens, with adhesive application on the part of these lens rather than the step of the optics effective range of these lens.
According to this method, install before the step of these lens, adhesive application outside the optics effective range of lens, therefore can be used adhesive individually, make the flexibility of in installation steps, operating be improved.
The invention is characterized in that portable terminal adopts above-mentioned image pick up equipment.
According to this configuration, the possibility that produces the deterioration in image quality of image pick up equipment in portable terminal can be lowered, and makes the reliability of portable terminal to be improved.
The invention is characterized in that portable terminal adopts the image pick up equipment of making by above-mentioned manufacture method.
According to this configuration, the possibility that produces the deterioration in image quality of image pick up equipment in portable terminal can be lowered, and makes the reliability of portable terminal to be improved.
Advantage of the present invention
Because the dust in image pick up equipment is hunted down outside the optics effective range, can prevent deterioration of image quality, and can realize the image pick up equipment of high reliability.After lens block etc. is mounted, filler can be filled in the gap and also has such advantage: in small gap, form adhesive area and fill this gap to form adhesive area, to make.
Description of drawings
Fig. 1 is the perspective view of the image pick up equipment of first embodiment of the invention.
Fig. 2 is the sectional drawing along the line X-X truncated picture pick device of Fig. 1.
Fig. 3 illustrates the concept map that concerns between the luminous flux in dust and the image pick up equipment.
Fig. 4 is the performance plot that the effect of dust of each several part in the image pick up equipment is shown.
Fig. 5 is the sectional drawing that the application site of image pick up equipment inner binder is shown.
Fig. 6 is the sectional drawing of the application process of description adhesive.
Fig. 7 is the major part plane graph of description adhesive flow and the sectional drawing of Y-Y intercepting along the line.
Fig. 8 is the flow chart that the manufacturing process of image pick up equipment is shown.
Fig. 9 is the performance plot that the effect of dust of each several part in the image pick up equipment of third embodiment of the invention is shown.
Figure 10 is the flow chart that the manufacturing process of image pick up equipment is shown.
Figure 11 is the outside drawing of the mobile phone of second embodiment of the invention.
Description of reference numerals
1 three-dimensional substrate
2,2a, 2b lens
3 diaphragms
4 semiconductor image pick devices
5 optical filters
6,6a, 6b adhesive
7 pedestal portions
The 7a portion of terminal
The 7c wiring pattern
8 image pick up equipment
9 sealants
10 openings
11 dividing walls
14 metal formings
15 FPC
15a platform (land)
16 welding
17 lens barrel portions
20 lens carriers
19 lens blocks (block)
20 lens carriers
21 lens mount
22 injection devices
23 comprise the solution of adhesive (adhesive)
24 gaps
25 cements (adhesive agent)
30 mobile phones
31 upper shells
32 lower houses
33 loud speakers
34 display screens
35 hinges
36 antennas
37 enter keies
38 image pick up equipment
39 microphones
Embodiment
(first embodiment)
Embodiments of the invention will at length be discussed with reference to the accompanying drawings.Fig. 1 is the perspective view of the image pick up equipment of first embodiment of the invention, Fig. 2 is the sectional drawing along the line X-X truncated picture pick device of Fig. 1, the concept map of Fig. 3 for concerning between dust and the luminous flux, Fig. 4 is the performance plot that the effect of dust of each several part is shown, Fig. 5 is the sectional drawing that the application site of adhesive is shown, Fig. 6 is the sectional drawing of the application process of description adhesive, Fig. 7 (a) is for describing the major part plane graph of adhesive flow, Fig. 7 (b) is the sectional drawing of Y-Y intercepting along the line among Fig. 7 (a), and Fig. 8 is the flow chart that the manufacturing process of image pick up equipment is shown.
The image pick up equipment of present embodiment is characterized in that: semiconductor image pick device 4 and be placed on the face of three-dimensional substrate 1 as the optical filter 5 of light transmissive material, and the lens 2 (lens block 19) that are structured in addition in the lens carrier 20 are placed on the another side of three-dimensional substrate 1, and the gap that allows to comprise the liquid infiltration of adhesive is arranged on outside the space that is surrounded by semiconductor image pick device, transmissive member and substrate, makes adhesive area can be formed in the above-mentioned image pickup zone outside of optics effective coverage that can captured image; After lens block 19 is placed on the substrate 1, by adhesive being filled in the gap that forms in the interface between lens block 19 and substrate 1, the zone around can the optics effective coverage of captured image in the image pickup zone of semiconductor image pick device forms adhesive area.In the lens placement surface, the zone around the optics effective coverage that can captured image in the image pickup zone of semiconductor image pick device forms by using adhesive 6, adhesive area that 6A, 6B provided.
This adhesive area is arranged on from the position of the inside preset width in outer end of three-dimensional substrate 1, thereby and arranges along the external margin of three-dimensional substrate and to stop that external dust enters.
Among Fig. 1, image pick up equipment 8 is formed by three-dimensional substrate 1, and this solid substrate 1 is made of pedestal portion 7 and the lens barrel portion 17 that is arranged in the pedestal portion 7.PPA (polyphthalamide resin) etc. is used for three-dimensional substrate 1, and three-dimensional substrate 1 is made black and seen through to stop extraneous light.Be connected to outside portion of terminal 7 and be arranged on the outside of pedestal portion 7, and be connected to and be formed on flexible print wiring board (hereinafter, FPC) connection platform (connection land) 15a on 15 by welding 16.The resin lens 2 that is assembled to lens carrier 20 is placed in the lens barrel portion 17.The lens 2 that are structured in lens carrier 20, the lens mount 21 are called lens block 19.In such a way, lens 2 are made up of two non-spherical lenses (hereinafter, lens) 2a that differs from one another in optical characteristics and 2b, be structured in the lens carrier 20, and form lens block 19, and the position along optical axis direction can be adjusted in the lens block.
The structure of image pick up equipment 8 will be discussed in more detail with reference to figure 2.Fig. 2 is the sectional drawing along the X-X truncated picture pick device 8 of Fig. 1.Dividing wall 11 is formed in the border between pedestal portion 7 and the lens barrel portion 17, and opening 10 is formed on the center of dividing wall 11, and forms parallel tabular surface around the upper surface of the wall of opening 10 with lower surface.Optical filter 5 is placed on the tabular surface on the lens side of opening 10, and semiconductor image pick device 4 is placed on the opposite.Opening 10 forms the corresponding rectangle in image pickup zone with semiconductor image pick device 4.Pedestal portion 7 is formed on the back side with wiring pattern 7c by electroless plating etc., with the exposed semiconductor image pick device 4 of installing.Wiring pattern 7c is electrically connected to portion of terminal 7a by pattern.
Semiconductor image pick device 4 adopts the Baeyer (Bayer) of square pixels to arrange that each of these square pixels has the Pixel Dimensions of 2.25 μ m.The peripheral circuit that comprises OB (optical black) block, ADC, TG (timing sequencer) etc. be arranged at the effective range light accepting part that is subjected to light around, and have about 2, the 1/4 inch UXGA type CMOS bare chip that is called of 000,000 pixel is installed by SBB (stud bump welding), BGA upside-down mountings such as (ball grid array).After semiconductor image pick device 4 exposed the installations, use sealant 9 to carry out bonding and sealing.
Vision signal, external control signal and the power supply that is provided by semiconductor image pick device 4 is connected platform 15a supply by wiring pattern 7c and FPC's 15.In order to stop visible light and infrared light to enter into semiconductor image pick device 4, metal forming 14 is placed on the back side of FPC 15 from the back side of FPC15.
Then, will the work of image pick up equipment 8 be discussed., assemble and be formed incident on optical filter 5 through diaphragm 3 from the light of object, and unwanted infrared light and ultraviolet light are limited by lens 2.Light through optical filter 5 is incident on the semiconductor image pick device 4, through the unshowned known lens that is called lens on lenticule or the chip, process is present in the colour filter of the pigmentary system of lens below, and becomes the electrical signal of requirement by photodiode converts.This signal is that 4: 3 screen is exported as picture signal with the frame per second of per second 15 frames at horizontal vertical ratio, and outputs to external monitor etc. from the portion of terminal 7a on pedestal portion 7 outsides through FPC 15 by the wiring pattern 7c of pedestal portion 7.
Then, will " fault " and " stain " that be caused by dust of the present invention be discussed.In image pick up equipment 8, by the defective of semiconductor image pick device 4 or dim spot, bright spot of being deposited on the image that the dust on semiconductor image pick device 4 surfaces causes etc. be called " fault " jointly.If entering, the light in the dust deposit or place on the sensitive surface of semiconductor image pick device 4, pixel cell is suppressed.Even dust is optically transparent SiO
2Deng entering of, light owing to the refractive index difference with air is suppressed.That is to say that for fault, dust produces the influence to incident light, be placed in the pixel cell as bandage, and therefore the output of object pixel changes significantly with respect to surrounding pixel.Owing to big variation in the pixel cell, can clearly see the periphery of dust.Therefore, when seeing captured image, can in pixel cell, obviously clearly discern.
In addition on the one hand, for example place apart from semiconductor image pick device 4 about 0.2 to be positioned at the burnt position of mistake of lens 2 and to cause the reduction of luminous flux, thereby cast shadow is on semiconductor image pick device 4 to the dust more than the 0.5mm.Known this shade produces black umbra usually at the center, and produces bright penumbra around this umbra.Therefore, because the periphery of dust is fuzzy unlike fault, the shade that is caused by dust causes the image deterioration of very unintelligible sensation.Thereby fault causes luminous flux and reduces cast shadow on semiconductor image pick device 4 and directly do not cover the sensitive surface of semiconductor image pick device 4, so unsharp image deterioration be called " stain " with not in fault.For stain, use polytype image pick up equipment repeated experiments, and find when white object is taken a picture, unless with the strength difference of periphery be about more than 5%, otherwise can't discern this stain.In other words, do not make luminous flux reduce the size more than 5%, then not think and stain can take place if dust does not have.
Based on this viewpoint, dust and the notion that is produced the relation between the minimizing of the luminous flux cause by stain will be discussed with reference to figure 3.Now, make at lens incoming position place (corresponding to diaphragm 3 parts), in imaging surface in (sensitive surface of semiconductor image pick device 4) and to place the position luminous flux area vertical with optical axis between it be S, S
0, S '.Suppose that simply dust is that light transmission is that 0 perfect blackbody and luminous flux are even, is used to reduce the dust area of light quantity 5% corresponding to S, S with respect to the above-mentioned of luminous flux area
0, S ' area 5%.More accurately, suppose the projected area of the size indication of dust along optical axis direction.Because the area of luminous flux has S＞S '＞S in the image pick up equipment
0Relation, be appreciated that it will become stain when the sensitive surface of semiconductor image pick device 4 is farther when bigger dust.When its more close semiconductor image pick device 4, can cause stain even this means little dust.
As described in above-mentioned patent documentation 3, use the surrounding pixel of semiconductor image pick device 4 can carry out the fault correction.Yet, because the periphery of stain is fuzzy as mentioned above, carrying out based on shading characteristic if proofread and correct, it is very difficult that stain is proofreaied and correct; Any other measure except that dust is invalid basically.In the present embodiment, the distance from the sensitive surface of semiconductor image pick device 4 to the lower surface of optical filter 5 is 0.56mm, and the thickness of this optical filter 5 is 0.3mm.Lens 2 have F4, and the F number is represented brightness, and lens 2 have the focal length of 3.7mm.When dust is made into spherical when calculating roughly with the direct quilt that reduces luminous flux 5% and dust, obtain following result: consider that dust can be deposited on the possibility on the sensitive surface of semiconductor image pick device 4, from the sensitive surface of semiconductor image pick device 4 in the spatial dimension of the lower surface of optical filter 5, cause stain by the dust of the above size of 2.25 μ m that equals Pixel Dimensions.In this case, in fact, dust occurs as fault, thereby because it works bandage is placed on the pixel.If dust does not drop on the sensitive surface of semiconductor image pick device 4, in the lower surface of optical filter 5, stain is produced by the dust more than about 30 μ m.In the upper surface of optical filter 5, stain is produced by the dust more than about 45 μ m; In the lower surface (lower surface of lens 2b) of lens 2, stain is produced by the dust more than about 70 μ m.From semiconductor image pick device 4 position farthest, stain is produced by the dust more than about 200 μ m in Fig. 3.When the value about the image pick up equipment of some similar types was found, the most similar value was found.
Promptly be, in the space of taking in semiconductor image pick device 4, exist dust may be deposited on possibility on the sensitive surface of semiconductor image pick device 4, and therefore the size dust that is equal to, or greater than Pixel Dimensions need be removed.Because the dust of this magnitude size is floating and be difficult to fall, be appreciated that assembling is important and effective in the clean room.Especially in the assembling of semiconductor image pick device 4, improve operating environment cleannes, strengthen clean, to get rid of static energetically with ion generator etc. also be important.
Then, Fig. 4 illustrates and uses actual packet to be contained in the result that image pick up equipment 8 interior dusts come the qualitative influence of checking image.In Fig. 4, according to the distance of semiconductor image pick device 4, the part of image pick up equipment 8 is illustrated on the transverse axis, and allows that the dust size is shown in the longitudinal axis.As inspection method, image pick up equipment 8 is exposed in the atmosphere of the spherical dust circulation with wide particle size distribution, then according to position, size etc., can be disperseed from the dust that image is defined as stain, and detects size at microscopically.The part of image pick up equipment 8 and the dust that is sighted stain with * come mark, and be not sighted the dust usefulness of stain ● come mark.* and ● between the border connected smoothly.According to this point, be understood that this size becomes with Pixel Dimensions in the space that accommodates semiconductor image pick device 4 to equate; And from the upper surface of optical filter 5, tolerable size increases pro rata with distance to semiconductor image pick device 4.
Based on the viewpoint of stain generation and experimental result, catching of dust will be discussed with reference to figure 5 and 6 in the image pick up equipment 8.Fig. 5 is the sectional drawing that the application site of adhesive is shown, and Fig. 6 is the sectional drawing of the application process of description adhesive.Adhesive 6 and 6A are applied to the surface of going up three-dimensional substrate 1 outside the space that is surrounded by semiconductor image pick device 4, optical filter 5 and three-dimensional substrate 1, to form adhesive area.This part and can not influence picture quality at the dust of this part IT outside the optics effective range.Adhesive 6 is primarily aimed at the dust that moves from lens 2, and the dust that enters at the outside from lens barrel portion 17 parts of lens 2 and image pick up equipment 8 of adhesive 6A.On demand, adhesive 6B also can be used to be applied to the outside of the optics effective range in the upper surface of optical filter 5.In addition, adhesive can be applied to the part of corresponding lens barrel, and this is conspicuous.Dust is floating and mobile in the space, and therefore can be hunted down outside the optics effective range.Not preferred at optics effective range IT dust, because the dust that stays is indefinitely as the quality of stain and deterioration image pick up equipment.
As each adhesive of present embodiment, by by acrylic resin being dissolved in the volatile solvent for example 1 with fluorine, the adhesive that is provided in 3-two trifluorobromobenzenes or the hydrogen fluorine carbide is used.When the absorption of dust was evaluated, expectation should be chosen the ratio between acrylic resin and the solvent as requested; Be limited to the result that about 10 weight % can obtain on the setting resin.Although can use any other resin and solvent and can selecting as requested,, therefore need not so strong adhesiveness owing to be the situation of catching dust.This is that quality is at the most little of 0.5 μ gr because if supposition dust granule size (diameter) to be caught is that 50 μ m and density are about 7.For solution, viscosity should be littler, makes this solution even can permeate little gap; This viscosity preferably is about below the 0.01PaS, and more preferably is about the 0.001PaS with the same magnitude of water.According to temperature of penetration range, gap size, operating environment etc., this viscosity can be selected as required.
The application that comprises the solution 23 of adhesive will be discussed with reference to figure 6.As the method that solution is applied to required part, this solution can use hairbrush to use, shift or use syringe or dispenser to use by die, but has fluorine as mentioned above in the solvent of resin.Because surface energy, fluorine have very poor adhesiveness, and known be to be difficult to bonding material.Therefore, solution needs to use very carefully, makes solvent not be deposited on and treats on the bonding part.Therefore, subsidiary operations such as sheltering, wipe, remove takes place.In addition, if wipe fully,, stayed the possibility of adhesive strength deteriorates owing to slight residual fluorine.Then, use cement 25 that lens block 19 is bonding and be fixed to three-dimensional substrate 1.After this step operation, the solution 23 that comprises adhesive is injected into through injection portion 12 by injection device 22.
Then, this application process will be described in more detail with reference to figure 7.Fig. 7 (a) is for to observe the plane graph of three-dimensional substrate 1 from the lens side, and the solution 23 that comprises adhesive is injected into through injection portions 12 by injection device 22.Because be provided with between by three-dimensional substrate 1 and lens mount 21, capillarity in the gap 24 of the area part of four jiaos of band shapes that are illustrated by the broken lines, the solution that comprises adhesive 23 that is injected into through injection portion 12 is deployed into the corner shown in the figure arrow up and down, then along direction expansion left.Fig. 7 (a) illustrates the situation of injecting solution through the injection portion 12 of on the left side and the right setting.In view of the above, the solution 23 that comprises adhesive almost can be applied on the whole periphery of three-dimensional substrate 1.At first, use cement 25 that a part is bonding and be fixed in the core of each side of two relative sides of periphery of the lens mount 21 of lens block 19 and three-dimensional substrate 1.The epoxy radicals cement of UV curing type is as cement 25.The viscosity of the similar mayonnaise of this viscosity is about 5PaS.Cement has thixotropic behavior, and the periphery that is used to suppress from lens mount 21 and three-dimensional substrate 1 enters into inside through the gap.According to the material for the treatment of bonding three-dimensional substrate 1 and lens mount 21, shape face characteristic, penetration range etc., can select viscosity as requested.Thus, lens block 19 and three-dimensional substrate 1 are by being adhesively fixed.For the adhesive on the end face that injects the lens mount 21 be arranged on lens block 19 between lens mount 21 and the three-dimensional substrate 1, opening is arranged on a side greater than the injection portion 12 in gap 24, and this side is different from the side of using above-mentioned cement 25 bonding.When utilizing the capillarity in the gap 24 between lens mount 21 and the three-dimensional substrate 1, through injection portion 12, the solution 23 that comprises adhesive is filled by injection device 22.
Three-dimensional substrate 1 and injection portion 12 have the gap to allow circulation of air.Fig. 7 (b) is the zoomed-in view of Fig. 7 (a) major part.For easy to understand, Fig. 7 (a) illustrates the gap bigger than actual gap.
The surface of the face by making the lens mount 21 that is adhered to three-dimensional substrate 1 has the surface roughness of about tens μ m, and gap 24 is formed between lens mount 21 and the three-dimensional substrate 1.Therefore produce surface roughness on lens mount 21 sides of lens block 19, to form gap 24, therefore need not to change three-dimensional substrate 1, make that sharing three-dimensional substrate 1 becomes possibility, and help increasing product type at the specification of various lens.Although same operation also can be carried out in three-dimensional substrate 1 side, also can form lens mount 21 similarly at different lens blocks 19, and the profile, surface roughness etc. that are more suitable for bonding and adhesive are easy to optimize, and be used for material change and can realize by scioptics block 19, make the degree of freedom of design to increase.
The gap 24 that is arranged on lens mount 21 sides can be set in the three-dimensional substrate 1, and alternatively can be arranged in two faces.When coming moulding, the texture that use joins the mould that is used for molded lens base 21 produces surface roughness simultaneously.Fig. 7 (b) illustrates by using texture to come roughened surface to form the situation in gap 24.Fig. 7 (b) is the amplification profile diagram of intercepting Y-Y in Fig. 7 (a).In Fig. 7 (b), texture is arranged on lens mount 21 sides with respect to three-dimensional substrate 1.The texture that is understood that almost smooth three-dimensional substrate 1 and is arranged on the lens mount 21 forms gap 24.According to launch, the application quantity of solution etc., can select the roughness in gap 24 etc. as requested.As mentioned above, the gap that is provided by texture is not filled by using cement 25, and the solution 23 that therefore comprises adhesive is injected into and spreads by surface tension, then solvent evaporates and adhesive are stayed on the surface of lens mount 21 shown in Fig. 7 (b) dotted line and three-dimensional substrate 1, make it as having fusible film and can catching dust.Because therefore adhesive is employed after using the cement assembling lens, this makes the fusible influence of eliminating the fluorine in the solvent that is included in adhesive become possibility, and the deterioration of the bonding strength between lens mount 21 and the three-dimensional substrate 1 can be prevented from.Because it is unwanted sheltering etc., can improve operation, and the production efficiency height.Correspondingly, the dust that falls from lens periphery is floating and move to and have fusible gap 24, and therefore catching dust becomes possibility.Consider that also dust that the outside enters through gap 24 and arrive the optics effective range, therefore also can catch the dust that enters.
In this manner, in the present embodiment, can use texture to form the gap, and alternatively can be pre-formed groove.
Then, the assembling sequence of image pick up equipment 8 is discussed reference flowchart Fig. 8.At first, provide lens 2, semiconductor image pick device 4, as the optical filter 5 and the three-dimensional substrate 1 (S101) of transmissive member.Before the assembling, use ion generator to eliminate the electricity of parts, to prevent the electrostatic precipitation of dust.Carry out ultrasonic purification as required.
Then, the optical filter 5 as transmissive member is installed on the three-dimensional substrate 1 (S102).After optical filter 5 is set on the three-dimensional substrate 1, use dispenser etc., with the epoxy radicals cement of the hot curing type of requirement be applied to optical filter 5 around.When carrying out this step, three-dimensional substrate 1 is adhered to optical filter 5 and intensity enhancing, makes that the installation stability among SBB (stud bump welding) in the thin image pick device or the BGA (ball grid array) also is improved.
Subsequently, according to SBB or BGA semiconductor image pick device 4 (S103) is installed.After semiconductor image pick device 4 is installed, by unshowned ultraviolet ray in the direction irradiation of optical filter 5, use the sealant of the UV+ hot curing type of requirement.Correspondingly, be formed for stoping sealant to be projected into the embankment of the effective range of semiconductor image pick device 4, and prevent virtualization etc.
Subsequently, carry out the step (S104) that lens are installed, finish the assembling of image pick up equipment thus.As image pick up equipment, can before assembling lens, carry out the inspection of dust, perhaps can after assembling lens, carry out.Carry out in clean room after the step before entirety of lens package, entirety of lens package can be finished in the environment that cleannes reduce to a certain extent.These steps can depend on image pick up equipment and change as required.
Then, the solution 23 that comprises adhesive injects (S105) through injection portion 12 by being arranged on three-dimensional substrate 1 injection device 22 on every side.The solution 23 that comprises adhesive launches in the gap by capillarity, solvent evaporates, and use and finish.Because the solvent evaporates and the application of adhesive finish as mentioned above, operation is good, and can process continuously and without batch processing.
Because adhesive is employed after using the cement assembling lens, makes the adhesiveness that to eliminate the fluorine in the solvent that is included in adhesive influence, and prevent the deterioration of the bonding strength between lens mount 21 and the three-dimensional substrate 1.Owing to do not need to shelter etc., make and to improve operation and production efficiency height.
By carrying out in the image pick up equipment 8 that these steps assemble, fault and cause that the dust of fault can reduce reliably, and can prevent that because of the effect of adhesive stain from producing.
(second embodiment)
The manufacture method of image pick up equipment then, will be discussed according to a second embodiment of the present invention.In above-mentioned first embodiment, filling adhesive after lens are installed; In a second embodiment, will the method for lens being installed in adhesive application after substrate be discussed.
Before describing, Figure 10 illustrates, and according to the method that is different from the foregoing description, uses the actual image pick up equipment 8 interior dusts that are mixed into to check result to the influence of picture quality.In Figure 10, according to the distance of semiconductor image pick device 4, the part of image pick up equipment 8 is illustrated on the transverse axis, and allows that the dust size is illustrated on the longitudinal axis by the two point dotted line.On the other hand, the line that dotted line is represented among the figure illustrates the tolerable size when the dust of supposition lens component is fallen the upper surface (degree of influence height) of optical filter 5.
As inspection method, image pick up equipment 8 is exposed in the atmosphere of the spherical dust circulation with wide particle size distribution, then according to position, size etc., can be disperseed from the dust that image is defined as stain, and detects size at microscopically.The part of image pick up equipment 8 and the dust that is sighted stain with * come mark, and be not sighted the dust usefulness of stain ● come mark.* and ● between the border connected smoothly.According to this point, be understood that this size becomes with Pixel Dimensions in the space that accommodates semiconductor image pick device 4 to equate; And from the upper surface of optical filter 5, tolerable size increases pro rata with distance to semiconductor image pick device 4.If the dust of supposition lens component is finally fallen the upper surface of optical filter 5, think that this characteristic is the characteristic that dotted line is represented among the figure.
Therefore, if the position of optical filter 5 is positioned as close to semiconductor image pick device 4, and optical filter 5 is thick as much as possible, and this is favourable.In this case, the gross thickness of image pick up equipment increases, and therefore has good range of balance.Consider the dividing wall 10 that is used to form three-dimensional substrate 1 thickness, be used to carry out bump height that SBB installs etc., and as result to similar image pick up equipment check, length (gap) L between semiconductor image pick device 4 and the optical filter 5 preferably at about 0.3mm in the scope of about 0.8mm, and more preferably in the scope of 0.4mm to about the 0.6mm.This also is tangible from the analysis of image pick up equipment: the thickness t of optical filter 5 can be in the scope of 0.15mm to about the 0.6mm.In order to use glass baseplate, find that the thickness of filter 5 can be preferably in 0.2mm arrives the scope of 0.4mm.
The base material of optical filter 5 is parallel and smooth, but has slight fluctuating (wave).In other one side, the closer to semiconductor image pick device 4, the area of luminous flux is more little.Correspondingly, the incident light on the optical filter 5 launches because of this fluctuating.Therefore, when on the optics of the position of optical filter 5 during more close semiconductor image pick device 4, the resolution degradation of institute's captured image is less, and this is known.In addition, by experiment discovery repeatedly: become possibility in order to make image pick up equipment 8 whole slimmings, the scope of L and t is preferably about 1.0≤(L/t)≤2.5.
Then, according to embodiments of the invention, the assembling sequence of image pick up equipment 8 is discussed reference flowchart Figure 10 in the manufacture method of image pick up equipment.At first, provide lens 2, semiconductor image pick device 4, as the optical filter 5 and the three-dimensional substrate 1 (S101) of transmissive member.Before the assembling, use ion generator to eliminate the electricity of parts, to prevent the electrostatic precipitation of dust.Carry out ultrasonic purification as required.
Then, the optical filter 5 as transmissive member is installed on the three-dimensional substrate 1 (S102).After optical filter 5 is arranged on the three-dimensional substrate 1, use dispenser etc., with the epoxy radicals cement of the hot curing type of requirement be applied to optical filter 5 around.When carrying out this step, three-dimensional substrate 1 is adhered to optical filter 5 and intensity enhancing, makes that the installation stability among SBB (stud bump welding) in the thin image pick device or the BGA (ball grid array) also is improved.
Subsequently, according to SBB or BGA semiconductor image pick device 4 (S103) is installed.After semiconductor image pick device 4 is installed, by unshowned ultraviolet light in the direction irradiation of optical filter 5, use the sealant of the UV+ hot curing type of requirement.Correspondingly, be formed for stoping sealant to be projected into the embankment of the effective range of semiconductor image pick device 4, and prevent virtualization etc.
Then, adhesive application is at need partly (S104) of three-dimensional substrate 1.Parallel with this step, adhesive is applied in the outside of the optics effective range of lens as required.Because the solvent evaporates and the application of adhesive are finished as mentioned above, operation is good.
Then, carry out the step (S105) that lens are installed, finish the assembling of image pick up equipment thus.
As image pick up equipment, can before assembling lens, carry out the inspection of dust, perhaps can after assembling lens, carry out.Carry out in clean room after the step before entirety of lens package, entirety of lens package can be finished in the environment that cleannes reduce to a certain extent.These steps can depend on image pick up equipment and change as required.
In above embodiment, use adhesive and realize by being applied to substrate 1 before, but the neighboring region (S106) of lens block and substrate 1 also can be used or be filled into to adhesive to form adhesive area before or after adherent lens block 19 at adherent lens (lens block) to form adhesive area.Step S106 can carry out with using the step S104 of adhesive to substrate before the lens block is installed, and perhaps can carry out individually.The profile of lens carrier and the lens that are made of the lens block can change as required.
In the present embodiment, use three-dimensional substrate 1, the semiconductor image pick device is installed on the face, transmissive member is installed on the face of opposition, not it should be noted that they also can be placed on same but have, and substrate is not limited to three-dimensional substrate, can use planar substrates.
Assemble image pick up equipment according to this embodiment, so fault and cause that the dust of fault can reduce reliably, and can prevent the generation of stain because of the effect of adhesive.
(the 3rd embodiment)
Figure 11 is the plane graph of the mobile phone 30 of the image pick up equipment 8 of use first embodiment of the invention.The 3rd embodiment is the example that image pick up equipment is installed to folding mobile telephone 30.Particularly, realize the raising of miniaturization and convenience.Among Figure 11, mobile phone 30 has upper shell 31 and lower house 32, and they can be folding by hinge 35.LCD Panel 34, loud speaker 33, the antenna 36 that is used to transmit and receive, image pick up equipment 38 etc. are installed in the upper shell 31.Microphone 39, enter key 37 etc. are installed in the lower house 32.Image pick up equipment 38 adopts the image pick up equipment 8 of first embodiment of the invention.The image pickup direction of image pick up equipment 38 is perpendicular to the plane of Fig. 7.When using mobile phone, upper shell 31 and lower house 32 are opened; When not using mobile phone, upper shell 31 and lower house 32 are folding.
According to first embodiment to being installed in the test of landing of image pick up equipment 38 in the mobile phone.Carry out such experiment, mobile phone is fallen concrete floor 10 times and checked the variation of captured image quality from about 1.5m eminence.The direction of landing is downside and the upside along optical axis direction.Consequently, before falling 10 times and afterwards, both do not find the generation of stain, do not had to find the quality of institute's captured image is had the increase of substantial effect yet.After image pick up equipment 8 is exposed in the atmosphere of above-mentioned dust circulation, do not find image deterioration yet.When decomposition and facilities for observation, observe dust deposit in the adhesive 6A of the shoulder that is applied to three-dimensional substrate 1 part.Therefore, think and to prevent that dust from entering and can play the effect that stain produces that suppresses.
Correspondingly, the stain generation and the mobile phone deterioration of image quality that are caused by dust can be prevented, and reliability is improved.Mobile phone of the present invention is not limited to this configuration, and the present invention can be applied to various mobile information apparatus.For example, the present invention can be applied to the external mechanical of the mobile information apparatus of PDA (personal digital assistant), individual calculator and personal computer etc., and this is tangible.
Industrial applicability
In image pick up equipment of the present invention, by semiconductor image pick device, transmissive member and base Upper outside the space that plate surrounds have cohesive to the part outside the optics effective range, causes thereby catch The dust of stain is to stop the deterioration of picture quality; This is for image pick up equipment and be installed in mobile phone Portable terminal in camera be useful.
Claims (24)
1. image pick up equipment,
Wherein the semiconductor image pick device is installed on the substrate, and transmissive member and lens use optical space to separate and be arranged in the image pickup zone of this semiconductor image pick device, and
The gap that wherein allows to comprise the liquid infiltration of adhesive is arranged on the outside in the space that is surrounded by this semiconductor image pick device, this transmissive member and this substrate in this optical space, makes adhesive area can be formed on the outside of the optics effective coverage that image in this image pickup zone can be picked.
2. image pick up equipment as claimed in claim 1,
Wherein this semiconductor image pick device is installed on the face of this substrate, and this transmissive member is installed on another face of substrate, and in addition, the lens block that carries these lens is placed on this substrate, this lens block and this transmissive member have predetermined space, and
This gap that wherein allows to comprise the liquid infiltration of adhesive is arranged in the interface between this substrate and this lens block.
3. image pick up equipment as claimed in claim 2,
Wherein this gap comprises injection portion, and this injection portion has than the big opening in this gap to inject this solution.
4. as any described image pick up equipment of claim 1 to 3,
Wherein this adhesive area is formed by the coated film that contains the adhesiveness composition.
5. image pick up equipment as claimed in claim 1,
Wherein this adhesive area is formed in this optical space at least by in this image pickup zone outside the space of this semiconductor image pick device, this transmissive member and the encirclement of this substrate, in a part of zone of this optics effective coverage that the encirclement image can be picked.
6. image pick up equipment as claimed in claim 5,
Wherein this semiconductor image pick device is installed on the face of this substrate, and this transmissive member is installed on another face of this substrate, and
The lens block that wherein carries these lens in addition is placed on this substrate, and this lens block and this transmissive member have predetermined space.
7. as claim 5 or 6 described image pick up equipment,
Wherein this adhesive area is formed by the coated film that contains the adhesiveness composition.
8. as any described image pick up equipment of claim 2 to 7,
Wherein this adhesive area is arranged in the part of neighboring region of this lens block and this substrate at least.
9. image pick up equipment as claimed in claim 8,
Wherein this adhesive area is arranged in the whole periphery neighboring region of this lens block and this substrate, that surround this semiconductor image pick device.
10. image pick up equipment as claimed in claim 8,
Wherein this adhesive area is provided with from the position of the inside preset width in outer end of this substrate, and along the peripheral disposition of this substrate.
11. as any described image pick up equipment of claim 2 to 10,
Wherein this adhesive area is filled in the recess that is arranged in this substrate or this lens block.
12. as any described image pick up equipment of claim 1 to 11,
Wherein this transmissive member is the optical filter of a plurality of dielectric duplexers.
13. as any described image pick up equipment of claim 1 to 12,
Wherein this substrate is three-dimensional substrate, and this solid substrate has and is used to place this semiconductor image pick device placement section thereon.
14. as any described image pick up equipment of claim 1 to 13,
Wherein these lens, this transmissive member, this substrate and this semiconductor image pick device are placed along optical axis according to this order from subject side, and this adhesive area is formed in the part of neighboring region of these lens and this transmissive member at least.
15. as claim 2 or 6 described image pick up equipment,
Wherein this adhesive area is the zone that is used for this lens block is fixed to this substrate.
16. as the manufacture method of any described image pick up equipment of claim 1 to 15, this manufacture method comprises following steps:
These lens, this semiconductor image pick device, this transmissive member and this substrate are provided; And
This transmissive member, this semiconductor image pick device and this lens are installed on this substrate.
17. the manufacture method of image pick up equipment as claimed in claim 16 comprises:
After the step that these lens are installed, the liquid filling that will comprise adhesive is in this gap, to surround the step of this optics effective coverage that can be picked by the image in this image pickup zone outside the space of this semiconductor image pick device, this transmissive member and the encirclement of this substrate.
18. the manufacture method of image pick up equipment as claimed in claim 17 comprises following steps:
The lens block, this semiconductor image pick device, this transmissive member and this substrate that include these lens are provided;
This transmissive member and this semiconductor image pick device are installed on this substrate;
This lens block is installed on this substrate; And
To have the solution that is dissolved with adhesive is penetrated in this gap between this substrate and this lens block.
19. the manufacture method of image pick up equipment as claimed in claim 18,
Wherein impregnation step comprises that adhesive is dissolved in solution in the volatile solvent soln is filled into step in this gap.
20. the manufacture method of image pick up equipment as claimed in claim 19,
Wherein impregnation step comprises the step of filling and permeating this solution from two relative directions.
21. the manufacture method of image pick up equipment as claimed in claim 16,
Wherein after the step of this semiconductor image pick device on this substrate is installed, assemble this image pick up equipment to the step of this substrate and step that these lens are installed by using adhesive.
22. the manufacture method of image pick up equipment as claimed in claim 21 comprises:
Before the step that these lens are installed, use the step of adhesive on the part beyond the optics effective range of these lens.
23. the portable terminal of employing such as any described image pick up equipment of claim 1 to 15.
24. an employing is by the portable terminal of the image pick up equipment of making as the manufacture method of any described image pick up equipment of claim 16 to 22.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP001678/2007 | 2007-01-09 | ||
| JP001677/2007 | 2007-01-09 | ||
| JP2007001677A JP2008172349A (en) | 2007-01-09 | 2007-01-09 | Imaging apparatus, its manufacturing method, and portable terminal apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101578854A true CN101578854A (en) | 2009-11-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008800019532A Pending CN101578854A (en) | 2007-01-09 | 2008-01-09 | Imaging device, method for manufacturing the imaging device, and portable terminal device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2008172349A (en) |
| CN (1) | CN101578854A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511206A (en) * | 2014-09-26 | 2016-04-20 | 宁波舜宇光电信息有限公司 | Image module and photosensitive chip packaging structure and method thereof |
| CN109491179A (en) * | 2018-11-29 | 2019-03-19 | 业成科技（成都）有限公司 | Lens barrel structure and its assemble method |
| US11942494B2 (en) | 2018-04-04 | 2024-03-26 | Sony Semiconductor Solutions Corporation | Imaging device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8982267B2 (en) * | 2011-07-27 | 2015-03-17 | Flextronics Ap, Llc | Camera module with particle trap |
| TWI600928B (en) * | 2016-09-30 | 2017-10-01 | 光寶電子（廣州）有限公司 | Filter assembly and camera module having the same |
-
2007
- 2007-01-09 JP JP2007001677A patent/JP2008172349A/en not_active Withdrawn
-
2008
- 2008-01-09 CN CNA2008800019532A patent/CN101578854A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105511206A (en) * | 2014-09-26 | 2016-04-20 | 宁波舜宇光电信息有限公司 | Image module and photosensitive chip packaging structure and method thereof |
| US11942494B2 (en) | 2018-04-04 | 2024-03-26 | Sony Semiconductor Solutions Corporation | Imaging device |
| CN109491179A (en) * | 2018-11-29 | 2019-03-19 | 业成科技（成都）有限公司 | Lens barrel structure and its assemble method |
| TWI680319B (en) * | 2018-11-29 | 2019-12-21 | 大陸商業成科技（成都）有限公司 | Lens barrel structure and assembly method for same |
| CN109491179B (en) * | 2018-11-29 | 2020-10-30 | 业成科技（成都）有限公司 | Lens barrel structure and assembling method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008172349A (en) | 2008-07-24 |
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