KR100927425B1 - Wafer Level Camera Module and Manufacturing Method Thereof - Google Patents

Abstract

The present invention relates to a wafer level camera module and a method of manufacturing the same, comprising: an image sensor wafer having an image capturing unit and a transparent member sealing the image capturing unit on an upper surface thereof and an external connection means provided on a lower surface thereof; A wafer lens stacked on the transparent member of the image sensor wafer; And molding materials formed on both sides of the image sensor wafer including the transparent member and the wafer lens, and a molding material including a metal therein. The present invention also provides a wafer level camera module. It provides a manufacturing method.

Camera module, epoxy molding, metal fiber, shielding

Description

Wafer level camera module and method of manufacturing the same

The present invention relates to a wafer level camera module and a method of manufacturing the same. More specifically, after rearranging an image sensor wafer having a wafer lens stacked thereon on an adhesive sheet, a space between the image sensor wafers having the wafer lens stacked thereon. The present invention relates to a wafer level camera module and a method of manufacturing the same, after molding a molding material including metal fibers into a die, followed by dicing to complete the final camera module.

Nowadays, portable terminals such as mobile phones and PDAs are being used as a multi-convergence with music, movies, TV, and games as well as simple telephone functions with the development of the technology. The camera module is the most representative. The camera module is changing from the existing 300,000 pixels (VGA level) to the high pixel center of 8 million pixels or more, and is being changed to implement various additional functions such as auto focusing (AF) and optical zoom.

In general, a compact camera module (CCM) is a small size and is applied to various IT devices such as a camera phone, a PDA, a smart phone, and a portable mobile communication device. The market is gradually increasing the number of devices equipped with camera modules.

Such a camera module is manufactured using an image sensor such as a CCD or a CMOS as a main component, and collects an image of an object through the image sensor and stores it as data in a memory in the device, and the stored data is stored in the LCD or PC in the device. The image is displayed through a display medium such as a monitor.

Conventional camera module image sensor package methods include a flip chip method (COF; chip of board), a wire bonding method (COB; chip of board), and a chip scale package (CSP) method. Medium COF and COB methods are widely used.

Recently, a wafer level camera module (WLCM) has been proposed to maximize cost reduction.

The wafer level camera module is a camera module manufactured by manufacturing an image sensor and a lens by a wafer level method, suitable for mass production, and directly mounted on a main board of a mobile phone.

Conventional wafer level camera module, by bonding the lens wafer on the image sensor wafer in a bonding method, and then dicing to produce a unit module, by combining the optical case having an opening for opening only the entrance of the lens This completes the production of the module.

The conventional optical case described above has a metal coating for EMI / EMC shielding. There are various methods of coating the optical case with a metal, and in general, a method of depositing several layers of metal on the optical case is mainly used. However, the method of depositing a metal on the optical case has a disadvantage in that the process is complicated and expensive.

In addition, in order to couple the optical case to the diced unit module, since the rearrangement of the case, bond application, case attach and cure process, etc. must be accompanied, There is a problem.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to rearrange an image sensor wafer having a wafer lens stacked thereon on an adhesive sheet, and then, in the space between the wafer lens and the image sensor wafer. By molding a molding material containing metal, it is possible to reduce the size, manufacturing process and cost of the camera module compared to the case of using the conventional optical case, and wafer level to obtain the EMI / EMC shielding effect without a separate metal deposition process The present invention provides a camera module and a method of manufacturing the same.

A wafer level camera module according to an embodiment of the present invention for achieving the above object is provided with an image sensor wafer on the upper surface and a transparent member for sealing the image pickup unit, the image sensor wafer having an external connection means on the lower surface; A wafer lens stacked on the transparent member of the image sensor wafer; And molding materials formed on both sides of the image sensor wafer and the wafer lens including the transparent member and including metal therein.

Here, the molding material may be made of an epoxy resin.

In addition, the metal may have a fiber shape.

In addition, the wafer lens may be a rectangular unit wafer lens that is manufactured in an array form through a replica method at a wafer level and individually diced.

In addition, the wafer lens may be coated with a diaphragm to block the incidence of light to a portion except the center portion of the upper surface, and the diaphragm may be formed of a black-based coating film.

In addition, the external connection means may be any one selected from the group consisting of solder balls, bumps and pads.

In addition, a method of manufacturing a wafer level camera module according to an embodiment of the present invention for achieving the above object comprises the steps of: attaching an image sensor wafer on which the wafer lens is stacked on an adhesive sheet; Molding a molding material including a metal in a space between the image sensor wafers on which the wafer lenses are stacked; And dicing the central portion of the molding material to separate the unit camera module.

Here, the molding material may be made of an epoxy resin.

In addition, the metal may have a fiber shape.

In addition, the wafer lens may be a rectangular unit wafer lens that is manufactured in an array form through a replica method at a wafer level and individually diced.

In addition, the wafer lens may be coated with a diaphragm to block the incidence of light to a portion other than the center portion of the upper surface, and the diaphragm may be formed of a black-based coating film.

In addition, an image capturing unit and a transparent member may be formed on the upper surface of the image sensor wafer, and an external connection unit may be formed on the lower surface of the image sensor wafer.

The method may further include peeling the adhesive sheet from the image sensor wafer after dicing the central portion of the molding material to separate the unit camera module.

As described above, according to the wafer level camera module and the manufacturing method thereof according to the present invention, after rearranging the image sensor wafer on which the wafer lens is stacked on the adhesive sheet, the space between the image sensor wafer on which the wafer lens is stacked is formed. By molding with a molding material containing a metal, it is possible to replace the existing optical case component with the molding material to reduce the manufacturing process and cost of the camera module, and the size of the module.

In addition, according to the present invention, since the metal fiber is included in the molding material, there is an advantage that the EMI / EMC shielding effect can be obtained without a separate metal deposition process.

Matters concerning the operational effects, including the technical configuration for the above object of the camera module and its manufacturing method according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

Structure of Wafer Level Camera Module

A wafer level camera module according to an embodiment of the present invention will be described in detail with reference to FIG. 1.

1 is a cross-sectional view showing the structure of a wafer level camera module according to an embodiment of the present invention.

As shown in FIG. 1, the wafer level camera module 100 according to the embodiment of the present invention includes an image sensor wafer 10 having an image capturing unit 20 thereon, and the image sensor wafer 10. The image sensor wafer including a transparent member 50 formed to seal the image capturing unit 20 thereon, a wafer lens 70 stacked on the transparent member 50, and the transparent member 50. 10) and molding materials 90 formed on both side surfaces of the wafer lens 70.

The lower surface of the image sensor wafer 10 is provided with an external connection means 30, the external connection means 30 may be formed of any one of a solder ball (bump), bump (pad) or pad (pad). have.

On the image sensor wafer 10, an adhesive means 40 supporting both bottom surfaces of the transparent member 50 attached to an upper portion thereof may be provided. In this case, the bonding means 40 is preferably formed such that a cavity space is provided between the upper surface of the image pickup unit 20 of the image sensor wafer 10 and the bottom surface of the transparent member 50.

The transparent member 50 may be made of glass.

The wafer lens 70 stacked on the transparent member 50 may include one or two or more wafer lenses.

The wafer lens 70 may be a rectangular unit wafer lens that is manufactured in an array form through a replica method at a wafer level and individually diced.

In the wafer lens 70, an aperture 80 may be formed on the front surface of the wafer lens 70 except for the entrance hole 75 formed at the center of the image surface.

The aperture 80 is preferably formed of a black-based coating film to prevent the transmission of external light.

Between the wafer lens 70 as described above and the transparent member 50 below the spacer 60 having a window (not shown) that does not cover the image capturing unit 20 of the image sensor wafer 10. ) May be formed.

The spacer 60 may be made of silicon, glass, or the like.

In particular, in the wafer level camera module 100 according to the embodiment of the present invention, the molding material 90 is, as described above, the image sensor wafer 10 and the wafer lens 70 stacked thereon. It is formed by a molding process on both sides of the, can take the role of a conventional optical case.

The molding material 90 may be made of an opaque material that can block light such as an epoxy resin.

That is, in the embodiment of the present invention, by replacing the conventional optical case component with the molding material 90, the case rearrangement, bond application, case attach and cure ( By eliminating the cure process, the manufacturing process of the camera module can be shortened, and the manufacturing cost can be reduced.

In addition, in the case of the conventional wafer level camera module using the optical case, a thickness of about 0.35 mm or more is required in consideration of the thickness of the case and the assembly tolerance in one side direction, but the molding material 90 formed by the molding process In this case, since it is possible to form a thickness of less than 0.3 mm, there is an advantage that can reduce the size of the camera module.

In addition, in the wafer level camera module 100 according to the embodiment of the present invention, the metal 95 may be included in the molding material 90, and the metal 95 may have a metal fiber shape. have.

As described above, in the embodiment of the present invention, by using the molding material 90 including the metal 95 in the form of fiber, an EMI / EMC shielding effect may be obtained even without a separate metal deposition process. have.

As an example of a material containing metal fibers in the molding material 90, Paradex, etc. of GE plastic, is known.

Referring to Figure 2 and the following equation 1, the electromagnetic shielding mechanism of the molding material containing a metal in the form of fiber will be described.

FIG. 2 is a view for explaining the electromagnetic shielding mechanism of Paradex, in which part of the incident wave P1 of the electromagnetic wave is absorbed inside the paradex material, and part is reflected by the metal fiber 95, and eventually Only very few electromagnetic waves will pass through the material.

In this case, the Paradex material is to block the electromagnetic wave by the mechanism as shown in Equation 1 below.

Meanwhile, in FIG. 2 and Equation 1, A represents an electromagnetic wave absorbed inside the paradex material, R represents a reflected wave, P1 represents an incident wave, and P2 represents a transmitted wave.

As described above, according to the embodiment of the present invention, when the molding material including the metal fiber is formed on both sides of the image sensor wafer 10 on which the wafer lens 70 is stacked, the conventional optical case is used. In addition, the size, manufacturing process and manufacturing cost of the camera module can be reduced, and EMI / EMC shielding effect can be obtained without a separate metal deposition process.

Manufacturing Method of Wafer Level Camera Module

Hereinafter, a method of manufacturing a wafer level camera module according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 6.

3 to 6 are cross-sectional views sequentially illustrating a method of manufacturing a wafer level camera module according to an embodiment of the present invention.

First, as illustrated in FIG. 3, the plurality of image sensor wafers 10 having the wafer lenses 70 stacked thereon are rearranged and repositioned to be spaced apart from each other to form a predetermined interval on the adhesive sheet.

An upper surface of the image sensor wafer 10 may include an image capturing unit 20 and a transparent member 50 that seals the image capturing unit 20, and an external connection means 30 may be formed on the lower surface of the image sensor wafer 10. . In this case, the transparent member 50 may be made of glass or the like, and the external connection means 30 may be made of solder balls, bumps, or pads.

In addition, the wafer lens 70 may be a rectangular unit wafer lens that is manufactured in an array form through a replica method in a wafer level state and diced separately.

The wafer lens 70 may be formed with an aperture 80 that blocks incidence of external light on the front surface of the wafer lens 70 except for the entrance hole 75 formed at the center of the image, and the aperture 80 may be black so as to prevent transmission of external light. It may be formed as a series coating film.

Meanwhile, reference numeral 40 not described in FIG. 3 denotes an adhesive means, and 60 denotes a spacer.

Next, as shown in FIG. 4, the molding material 90 including the metal 95 is formed in the spaced space between the image sensor wafer 10 on which the wafer lens 70 is stacked.

The molding material 90 may be formed by molding by using a molding process using the mold 300. When using the mold 300, a protective tape 210 may be formed between the mold 300 and an upper surface of the wafer lens 70 to protect the wafer lens 70 from damage.

The molding material 90 may be formed of an epoxy resin, or the like, and the metal 95 may have a metal fiber shape.

Next, as shown in FIG. 5, the center portion of the molding material 90 is diced and separated into the unit camera module 100.

Thereafter, as shown in FIG. 6, the adhesive sheet 200 is peeled from the image sensor wafer 10 to complete the manufacture of the camera module 100.

As described above, according to the manufacturing method of the wafer level camera module according to an embodiment of the present invention, by replacing the conventional optical case with a molding material 90 containing the metal 95 of the fiber form, Size, manufacturing process and manufacturing cost can be reduced.

In addition, EMI / EMC shielding effect may be obtained by the metal 95 included in the molding material 90.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is a cross-sectional view showing the structure of a wafer level camera module according to an embodiment of the present invention.

2 is a view for explaining the electromagnetic shielding mechanism of the molding material containing a metal fiber.

3 to 6 are process cross-sectional views sequentially shown to explain a method of manufacturing a wafer level camera module according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: image sensor wafer 20: image pickup unit

30: external connection means 40: adhesive means

50: transparent member 60: spacer

70: wafer lens 75: entrance hole

80: aperture 90: molding material

95: metal 100: camera module

200: adhesive sheet 210: protective tape

300: mold

Claims (15)

An image sensor wafer having an image capturing unit and a transparent member sealing the image capturing unit on an upper surface thereof, and an external connection means provided on the lower surface of the image sensor wafer; A wafer lens stacked on the transparent member of the image sensor wafer; And Molding materials formed on both sides of the image sensor wafer and the wafer lens including the transparent member and made of an epoxy resin including a metal having a fiber shape therein; Wafer level camera module comprising a. delete delete The method of claim 1, The wafer lens is a wafer level camera module which is a rectangular unit wafer lens which is manufactured in an array form through a replica method in a wafer level state and individually diced. The method of claim 4, wherein The wafer lens is a wafer-level camera module coated with an iris to block the incident light to the portion except the center portion of the image. The method of claim 5, The aperture is a wafer level camera module formed of a black coating film. The method of claim 1, The external connection means is a wafer level camera module any one selected from the group consisting of solder balls, bumps and pads. Attaching a plurality of image sensor wafers in which a wafer lens is stacked thereon to be spaced apart from each other at regular intervals on an adhesive sheet; Molding a molding material made of an epoxy resin including a metal having a fiber shape in a space between the image sensor wafers on which the wafer lenses are stacked; And Dicing the central portion of the molding material to separate the unit camera module; Method of manufacturing a wafer level camera module comprising a. delete delete The method of claim 8, The wafer lens is a wafer level camera module manufacturing method of a rectangular unit wafer lens that is manufactured in an array form through a replica method in a wafer level state and diced individually. The method of claim 11, The wafer lens is a manufacturing method of a wafer-level camera module coated with an iris that is blocked the incident light to the portion except the center portion of the image. The method of claim 12, The aperture is a manufacturing method of a wafer level camera module is formed of a black coating film. The method of claim 8, The upper surface of the image sensor wafer is provided with an image capturing unit and a transparent member for sealing the image capturing unit, the lower surface of the manufacturing method of a wafer level camera module is formed. The method of claim 8, After dicing the central portion of the molding material to separate the unit camera module, Peeling the adhesive sheet from the image sensor wafer.

Images