CN101575721B - Flexible circuit plating surface whisker inhibition technology - Google Patents
Flexible circuit plating surface whisker inhibition technology Download PDFInfo
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- CN101575721B CN101575721B CN2009101119394A CN200910111939A CN101575721B CN 101575721 B CN101575721 B CN 101575721B CN 2009101119394 A CN2009101119394 A CN 2009101119394A CN 200910111939 A CN200910111939 A CN 200910111939A CN 101575721 B CN101575721 B CN 101575721B
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Abstract
The invention discloses a flexible circuit plating surface whisker inhibition technology. The technique adds acid cleaning, mechanical brushing and ageing treatment besides plating in the traditional technology. The adopted mechanical brushing can effectively mechanically damage the original plating metal structure, thereby damaging whisker growth condition and stopping the whisker growth, thus the flexible circuit product meets the requirement of long term reliability. The technology of the invention is implemented to eliminate the problem that the whisker growth is difficult to overcome in previous lead-free plating, find out a method with less investment, simple technology control and obvious whisker growth inhibiting effect, thus being a new technology with good plating workability andlow cost in the industry and providing basic assurance for long term reliability of the plating products of fine circuit processing.
Description
Technical field
The present invention relates to a kind of circuit board manufacturing method, particularly relate to a kind of flexible circuit plating surface whisker inhibition technology.
Background technology
Metal whisker one is to the stealthy killer who is electron device, equipment failure, because the very long time response of whisker growth, short period of time equipment operation is no problem, and old friends are easy to ignore its harm.Along with the technical progress of electronic circuit, density is increasing, and flexible circuit conductor spacing is meticulous all the more, show flexible circuit design, processing in, contradiction is more and more outstanding, has restricted the sound development of flexible circuit in each field.
The present situation of flexible circuit processing industry is at present: the application of tinsel, harmful for environment and HUMAN HEALTH though effectively inhibition of whiskers growth is seriously polluted, restriction uses the activity of leaded electronic material to start.Unleaded surface treatment is affirmed by the flexible circuit industry.It is following several to adopt unleaded treatment process to have: the one, adopt tin copper (Sn/Cu) alloy, in the orderly enterprise of management, if it is good to basic technology, metal ion ratio control, growth has obvious effects to inhibition of whiskers, but it is undesirable, stop fully also to be difficult to accomplish, especially huge apart from circuit hidden danger to fine lines; The 2nd, adopt Ni/Au to electroplate, though this kind method can be stopped whisker growth, cost is five times of Sn/Cu, improper economically, product is lacked competitiveness; The 3rd, adopt pure tin to electroplate (Sn), but the galvanized shortcoming of pure tin is outstanding, the greatest problem solder wettability is passed the generation deterioration in time, so be difficult for promoting.Seeking a kind of ideal Terne Electroplating technology controlling and process, is the big problem that current enterprise faces.
Summary of the invention
The object of the present invention is to provide a kind of flexible circuit plating surface whisker inhibition technology that can effectively destroy the whisker growth condition, stop whisker growth, this technology can make the flexible circuit product of production reach requirement to long-term reliability.
For achieving the above object, technical solution of the present invention is:
The present invention is a kind of flexible circuit plating surface whisker inhibition technology, and its processing step mainly comprises: blanking, subsides photosensory membrane, etching, the positive and negative facial mask of subsides, surface etching processing, plating, performance test; After plating step, also comprise pickling, mechanical polish-brush, burin-in process step; Described acid pickling step is: in the sulphuric acid soln groove of 1%-2%, spray under temperature 25-35 ℃, transmission speed 2-2.5 rice/minute condition, clear water cleans; Described mechanical polish-brush step is: on 1000 or 1200 purpose aluminum oxide brush rolls, transmission speed 1.5-2.0 rice/minute, the brush roll rotating speed is to carry out polish-brush under the 1200-1400 rev/min of condition; Described burin-in process step is: the product layering is placed in the baking oven, guarantees that heating temperature is even, under temperature 145--155 ℃ condition, be heated 120--150 minute, carry out the back burin-in process.
After adopting such scheme, the present invention passes through the analysis to the ionic bond of tin copper (Sn/Cu) alloy plating, find the characteristics of metal ion whisker growth under different technology conditions, the factors such as condition that produce whisker are analyzed, determine effective operational path, after electroplating work procedure, increased steps such as pickling, mechanical polish-brush, burin-in process; The mechanical polish-brush that is adopted is the former coated metal structure of physical disturbance effectively, reaches the condition of destroying whisker growth, stops whisker growth, makes the flexible circuit product reach requirement to long-term reliability.Implementation of processes of the present invention, eliminated on the unleaded in the past electroplating technology, be difficult to overcome the problem of whisker growth, found a kind of less investment, simple, the tangible method of inhibition of whiskers growth result of technology controlling and process, make this industry that electroplating activity novel process good, with low cost arranged.Long-term reliability for the plated item of fine-line processing provides basic assurance.
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Description of drawings
Fig. 1 is a process flow sheet of the present invention;
Fig. 2 is the schema of the skill step that increases newly of the present invention.
Embodiment
As shown in Figure 1, traditional flexible circuit plating surface whisker inhibition technology, processing steps such as its bag blanking, subsides photosensory membrane, etching, the positive and negative facial mask of subsides, surface etching processing, plating, performance test.
As shown in Figure 2, the present invention has increased by three steps such as pickling, mechanical polish-brush, burin-in process after the plating step of traditional technology.
Embodiment 1:
Described acid pickling step is: in 1% sulphuric acid soln groove, spray under 25 ℃ of temperature, 2 meters/minute conditions of speed; Clear water cleans.
Described mechanical polish-brush step is: on 1000 purpose aluminum oxide brush rolls, 1.5 meters/minute of transmission speeds, rotating speed be to carry out polish-brush under 1200 rev/mins of conditions.
Described burin-in process step is: the product layering is placed in the baking oven, guarantees that heating temperature is even, under the condition of 145 ℃ of temperature, be heated 120 minutes, carry out the back burin-in process.
Embodiment 2:
Described acid pickling step is: in 2% sulphuric acid soln groove, be to spray under 2.5 meters/minute conditions in 35 ℃ of temperature, speed; Clear water cleans.
Described mechanical polish-brush step is: on 1200 purpose aluminum oxide brush rolls, 2.0 meters/minute of transmission speeds, rotating speed be to carry out polish-brush under 1400 rev/mins of conditions.
Described burin-in process step is: the product layering is placed in the baking oven, guarantees that heating temperature is even, under the condition of 155 ℃ of temperature, be heated 150 minutes, carry out the back burin-in process.
In addition, the present invention requires as follows to the technology management and control main points of eleetrotinplate copper (Sn/Cu) alloy product:
1) separating out the cupric ion ratio, must carry out quantitative analysis electrolytic coating.Under the situation that the containing ratio of cupric ion in the electrolytic solution increases, the cupric ion containing ratio in the coating is almost growth also with being directly proportional, carries out the management of alloy ratio according to this approximate linear.The cupric ion containing ratio wants consistent in cathode current density when the containing ratio of cupric ion is with 1wt% in the electrolytic solution and the coating.
2) current density surpasses 2A/cm
2After, the containing ratio of the cupric ion in the coating no longer is subjected to about cathode current density basically, and the also necessary management and control of this point is good.
Product evaluation result of the present invention:
Product with after handling is placed into 60--65 ℃, deposits 3 months in the climatic chamber of humidity 90-95%, observes under 100 power microscopes, can not produce whisker.
Emphasis of the present invention just is: increase by three steps such as pickling, mechanical polish-brush, burin-in process after plating step.
The above, only for preferred embodiment of the present invention, so can not limit scope of the invention process with this, i.e. the equivalence of doing according to the present patent application claim and description changes and modification, all should still belong in the scope that patent of the present invention contains.
Claims (1)
1. flexible circuit plating surface whisker inhibition technology, its processing step mainly comprises: blanking, paste photosensory membrane, etching, the positive and negative facial mask of subsides, surface etching processing, plating, performance test; It is characterized in that: after plating step, also comprise pickling, mechanical polish-brush, burin-in process step; Described acid pickling step is: in the sulphuric acid soln groove of 1%-2%, spray under temperature 25-35 ℃, transmission speed 2-2.5 rice/minute condition, clear water cleans; Described mechanical polish-brush step is: on 1000 or 1200 purpose aluminum oxide brush rolls, transmission speed 1.5-2.0 rice/minute, the brush roll rotating speed is to carry out polish-brush under the 1200-1400 rev/min of condition; Described burin-in process step is: the product layering is placed in the baking oven, guarantees that heating temperature is even, under temperature 145--155 ℃ condition, be heated 120--150 minute, handle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101119394A CN101575721B (en) | 2009-05-27 | 2009-05-27 | Flexible circuit plating surface whisker inhibition technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101119394A CN101575721B (en) | 2009-05-27 | 2009-05-27 | Flexible circuit plating surface whisker inhibition technology |
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| Publication Number | Publication Date |
|---|---|
| CN101575721A CN101575721A (en) | 2009-11-11 |
| CN101575721B true CN101575721B (en) | 2010-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009101119394A Active CN101575721B (en) | 2009-05-27 | 2009-05-27 | Flexible circuit plating surface whisker inhibition technology |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029408A (en) * | 2006-03-02 | 2007-09-05 | 富士通株式会社 | Whiskerless plated structure and plating method |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
-
2009
- 2009-05-27 CN CN2009101119394A patent/CN101575721B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101029408A (en) * | 2006-03-02 | 2007-09-05 | 富士通株式会社 | Whiskerless plated structure and plating method |
| CN101146407A (en) * | 2006-09-15 | 2008-03-19 | 李东明 | Graph transfer shaping technology for carrier board circuit of printed circuit board |
Non-Patent Citations (3)
| Title |
|---|
| JP特开2003-193289A 2003.07.09 |
| JP特开2008-21559A 2008.01.31 |
| JP特开2008-240018A 2008.10.09 |
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| CN101575721A (en) | 2009-11-11 |
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