CN101572135A - Equipment for producing bonding wire for packaging semiconductor - Google Patents
Equipment for producing bonding wire for packaging semiconductor Download PDFInfo
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- CN101572135A CN101572135A CNA2008100278632A CN200810027863A CN101572135A CN 101572135 A CN101572135 A CN 101572135A CN A2008100278632 A CNA2008100278632 A CN A2008100278632A CN 200810027863 A CN200810027863 A CN 200810027863A CN 101572135 A CN101572135 A CN 101572135A
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Abstract
The invention discloses equipment for producing a bonding wire for packaging a semiconductor, which comprises a wire releasing device, a wire-drawing machine, a quenching and tempering device and a take-up device, wherein a metal wire in the wire releasing device is sent to the wire-drawing machine through a leading mechanism; the wire-drawing machine is arranged on one side of a wire outlet of the wire releasing device and comprises a wire-drawing component; the metal wire led out of the leading mechanism of the wire releasing device is connected to a wire-drawing component capable of gradually drawing the outer diameter of the metal wire small; the quenching and tempering device is arranged on one side of a wire outlet of the wire-drawing machine and comprises a wire sending device, a washing device, a coating device, an annealing device and a roasting oven; a thin metal wire conforming to specifications and pulling out of the wire-drawing machine is sent to the washing device through the wire sending device; the washed metal wire enters the annealing device for annealing; the annealed metal wire enters the coating device for coating; the coated metal wire enters the roasting oven for drying and then enters a cooling device for cooling; the wire take-up device is provided with a wire containing tray for collecting a finished wire, and the wire containing tray is connected with a driving device and driven by the driving device.
Description
[technical field]
The present invention relates to a kind ofly have wire drawing function, modified (annealing) function, divide equipment for producing bonding wire for packaging semiconductor around function.
[background technology]
Semiconductor packages, be to utilize membrane technology and fine interconnection technique, semiconductor components and devices and other inscape are arranged on framework or substrate, fixed and connect, draw binding post, and fix by the embedding of plasticity dielectric, constitute the technology of whole stereochemical structure.For the operate as normal of chip provides energy, control signal, and provide heat radiation and defencive function.And lead frame and bonding wire just play an important role in semiconductor package process.Lead frame is a kind of integrated circuit chip carrier that is used as, and by means of bonding wire chip internal circuit exit (bonding point) is realized and being electrically connected of outer lead by lead (bonding wire), forms the key structure spare of electric loop.
Existing gold, aluminium and copper bonding wire all are after moving it to needed smaller external diameter by the bigger wire of external diameter through wire drawing machine, carry out modified (annealing) through independent modified (annealing) machine and handle, the bonding wire after modified divides around to containing drum (or claiming bobbin) through an independent after-combustion machine again.It will pass through a plurality of stand-alone machines such as wire drawing, modified (annealing), after-combustion machine and finish.Particularly copper bonding wire after finishing each independent operation, all must leave in the sealed storage container of protection gas sweet smell (preventing the copper wire oxidation).This mode of production has increased the number of times that repeats unwrapping wire, the increase of unwrapping wire number of times, and the probability that causes breaking increases, line surface damage probability increases, and causes the torsion resistance of bonding wire, crimpness to increase easily; The storage and the volume of the circular flow of all size bare wire have also been increased simultaneously; And place for a long time and be in the bare wire of the tight state that jumps because self physical change (shape, internal structure, stress fracture, oxide etch etc.) causes many quality problems.
[summary of the invention]
The objective of the invention is to overcome the deficiencies in the prior art, can realize shortening processing procedure, cut down the consumption of energy, promote working (machining) efficiency, quality, rate of finished products, reach the target of energy-conservation, material-saving, environmental protection, and the area occupied space of reducing Manufacturing Worker's number and reducing equipment, realize promoting cost-benefit equipment for producing bonding wire for packaging semiconductor comprehensively.
In order to solve the technical problem of above-mentioned existence, the present invention adopts following technical proposals:
Equipment for producing bonding wire for packaging semiconductor is characterized in that including:
One actinobacillus device, its inside is provided with bearing support and guide mechanism, and the bobbin that metal wire is housed places on the bearing support, and metal wire is delivered to wire drawing machine through guide mechanism;
One wire drawing machine, the side that it is arranged on the actinobacillus device leading-out terminal includes the wire drawing assembly, and the metal wire of guiding out from the guide mechanism of actinobacillus device is connected to and its external diameter can be drawn little wire drawing assembly by ashamed;
One modifying device, it is arranged on a side of wire drawing machine leading-out terminal, it includes wire-sending device, cleans painting device and annealing device and baker, deliver to cleaning device from the lametta up to specification that wire drawing machine comes out by wire-sending device, metal wire after the cleaning enters annealing device and anneals, metal wire after the annealing enters into painting device and carries out application, and the metal wire after the application enters into the baker oven dry again, comes cooling device again and cools off;
One take-up is provided with the Sheng drum that is used to be gathered into line (bonding wire) (or claiming bobbin), contains that drum is connected with drive unit and by its driving.
Above-mentioned actinobacillus device, wire drawing machine, modifying device, take-up are arranged in order setting.
Aforesaid equipment for producing bonding wire for packaging semiconductor, it is characterized in that described frame includes two mounting layers, described actinobacillus device, wire drawing assembly and modifying device and take-up respectively are two groups, and each organizes actinobacillus device, wire drawing assembly and modifying device and the take-up correspondence is installed in each mounting layer.
Aforesaid equipment for producing bonding wire for packaging semiconductor, it is characterized in that described cleaning device includes the container of a splendid attire cleaning agent, measuring pump is transported to rinse bath with cleaning agent through pipeline, be equipped with lower felt absorption cleaning agent on the rinse bath, by being cleaned the agent cleaning, rinse bath is provided with the cleaning agent reflux line to wire in the middle of last lower felt.
Aforesaid equipment for producing bonding wire for packaging semiconductor, it is characterized in that described painting device includes the container of a splendid attire coating agent, measuring pump is transported to coating agent and is coated with tankage through pipeline, be coated with and be equipped with lower felt absorption coating agent on the tankage, wire is middle by being coated with the application material at last lower felt.
Aforesaid equipment for producing bonding wire for packaging semiconductor equipment is characterized in that described annealing device includes an electric furnace.
Aforesaid equipment for producing bonding wire for packaging semiconductor is characterized in that described baker includes a catalyst furnace, is provided with a blower fan in a side of catalyst furnace, and catalyst also is housed in catalyst furnace.
Aforesaid equipment for producing bonding wire for packaging semiconductor, it is characterized in that described wire drawing assembly includes first cone pulley, main mould bases, second cone pulley and lead-in wire wheels, on the main mould bases wire-drawing die is housed, first cone pulley and second cone pulley lay respectively at main mould bases both sides, and the described metal wire that comes out from actinobacillus device enters into the wire drawing assembly and carries out wire drawing.
Aforesaid equipment for producing bonding wire for packaging semiconductor is characterized in that also being provided with the take-up axle in the described mounting layer, and the Sheng drum (or claiming bobbin) that is used to be gathered into line is housed on the take-up axle, and described lead-in wire wheels are between second cone pulley and take-up axle.
Aforesaid equipment for producing bonding wire for packaging semiconductor, it is characterized in that described first cone pulley and second cone pulley are respectively equipped with from interior becomes big spin bath gradually toward overall diameter, corresponding above-mentioned each spin bath is organized mounting grooves from interior being provided with outward more on the described main mould bases, in each mounting groove wire-drawing die is housed, the aperture of wire-drawing die diminishes outward gradually from interior.
Aforesaid equipment for producing bonding wire for packaging semiconductor, it is characterized in that the inlet wire clamping that described mounting layer is provided with entrance hole and is used to keep inlet wire tension force near first cone pulley, one end, and the conduit that is used for guide wire, conduit and inlet wire clamping lay respectively at the entrance hole both sides, conduit one is rectified facing to entrance hole, and the conduit other end is positioned at described first cone pulley top.The invention has the beneficial effects as follows:
1. system height is integrated: with unwrapping wire, wire drawing, modified (annealing), cleaning, application, branch around etc. integrating series-operation, form a level, orthoscopic independent keys plying production line; And two such production lines are placed on the framework, form two independent production line structures of a framework, realize that system height is integrated.
2. this equipment has characteristics such as volume is little, compact conformation, reduces the floor space space than legacy equipment, can be illumination, air conditioning economization electric power energy.
3. reduce the number of times that repeats unwrapping wire, shorten the turnaround time of bare wire, the bare wire that significantly reduces all size accumulates quantity, and prevent to leave standstill and many quality problems that the bare wire that is in the tight state that jumps causes owing to self physical change (shape, internal structure, stress fracture, oxide etch etc.).
4. production management has more efficient: make backguy, modified (annealing), divide around etc. separations management mode change single centralized management pattern into, can reduce the management employee and significantly reduce the Manufacturing Worker.
5. level, orthoscopic continuous producing method have better the bonding wire of production, permanent steady electric property and mechanical property.
6. simultaneously, but painting device also the para-linkage silk carry out application, can produce the bonding wire of surperficial tape insulation performance.
Generally speaking since the present invention be with unwrapping wire, wire drawing, modified (annealing), cleaning, application, branch around etc. function etc. be integrated in one, can directly draw the fine bonding wire or the bonding wire of insulation by tiny outer naked wire.The height of system is integrated, reaches the shortening processing procedure, promotes working (machining) efficiency, quality and rate of finished products, reaches the target of energy-conservation, material-saving, environmental protection; The area occupied space of reducing Manufacturing Worker's number and reducing equipment reaches comprehensive lifting cost benefit.
[description of drawings]
Fig. 1 is a perspective view of the present invention;
Fig. 2 is the part figure of bonding wire for packaging semiconductor equipment;
Fig. 3 is the stereogram of wire drawing machine of the present invention;
Fig. 4 is a B place enlarged drawing among Fig. 3;
Fig. 5 is main mould bases perspective view;
Fig. 6 is cleaning device and painting device structural representation.
[embodiment]
Below in conjunction with accompanying drawing and embodiment the present invention is described in further detail: as shown in the figure, bonding wire for packaging semiconductor equipment, be with unwrapping wire, wire drawing, modified (annealing), cleaning, application, branch around etc. function be integrated in one with level, linear fashion, can directly draw the fine bonding wire or the bonding wire of insulation by tiny outer naked wire, it includes:
One actinobacillus device 01, its inside is provided with bearing support and guide mechanism, and the Sheng drum (or claiming bobbin) that metal wire is housed places on the bearing support, and metal wire is delivered to wire drawing machine through guide mechanism;
One wire drawing machine 02, it is arranged on a side of actinobacillus device 01, include frame 021 and wire drawing assembly 022, described wire drawing assembly 022 includes first cone pulley 0221, main mould bases 0222, second cone pulley 0223 and lead-in wire wheels 0224, on the main mould bases 0222 the backguy mould is housed, first cone pulley 0221 and second cone pulley 0223 lay respectively at main mould bases 0222 both sides, and the described metal wire that comes out from actinobacillus device 01 enters into wire drawing assembly 022 and carries out wire drawing;
One modifying device 03, it is arranged on a side of wire drawing machine 02, it includes wire-sending device 0311, cleans painting device 0312 and annealing device 0313 and baker 0315, wire-sending device 0311 will be sent to annealing device 0313 again through cleaning device 03121 cleaning through the metal wire after wire drawing machine 02 wire drawing and anneal, metal wire after the annealing enters into painting device 03122 and carries out application, metal wire after the application enters into baker 0315, comes cooling device 0314 again and cools off;
One take-up 04 is provided with the Sheng drum that is used to be gathered into line (bonding wire) (or claiming bobbin), contains that drum is connected with drive unit and by its driving.
Described cleaning painting device 0312 includes a cleaning device 03121 and a painting device 03122, cleaning agent or coating agent are transported to rinse bath respectively or are coated with tankage through pipeline by measuring pump, be equipped with lower felt absorption cleaning agent or coating agent on the groove, wire is middle by being cleaned or being coated with the application material at last lower felt.
Described annealing device 0313 includes an electric furnace.Wire is in cold working (wire drawing) process, variation has taken place in its lattice structure, the wire hardening, machinery wiry and electric property reduce significantly, annealing device 0313 is exactly for the wire of hardening being eliminated internal stress through high annealing, lattice wiry being rearranged, thereby improve pliability wiry, improve percentage elongation, modulus of elasticity and conductance, make bonding wire satisfy technological requirement.
Described baker 0315 includes a catalyst furnace 03151, is provided with a blower fan in a side of catalyst furnace 03151, and catalyst also is housed in catalyst furnace 03151.When the wire that scribbles the application material enters baker burner hearth 0315, under thermal radiation, solvent evaporation in the application material, the application material is dried, and is subjected to the effect of blower fan, and the solvent of evaporation is sucked out burner hearth and enters catalyst furnace 03151, the solvent of evaporation is heated burning, gas after the burning its harmful substance under the effect of catalyst is decomposed, and gas is discharged from chimney, and fresh air is sent into burner hearth through the burner hearth both sides.
Described frame 05 includes two mounting layers 0211, described actinobacillus device 01, wire drawing assembly 022 and modifying device 03 and take-up 04 respectively are two groups, and each organizes actinobacillus device 01, wire drawing assembly 022 and modifying device 03 and take-up 04 correspondence is installed in each mounting layer 0211.
Also be provided with take-up axle 02111 in the described mounting layer 0211, the Sheng drum (or claiming bobbin) that is used to be gathered into line is housed on the take-up axle 02111, described lead-in wire wheels 0224 are between second cone pulley 0223 and take-up axle 02111.
Described first cone pulley 0221 and second cone pulley 0223 are respectively equipped with from interior and become big backguy groove 0226 gradually toward overall diameter, corresponding above-mentioned each spin bath 0226 is organized mounting grooves 02261 from interior being provided with outward more on the described main mould bases 0222, in each mounting groove 02261 wire-drawing die is housed, the wire-drawing die aperture diminishes outward gradually from interior.
Also being provided with on the described frame 021 can be to first cone pulley 0221 of main mould bases 0222 and both sides thereof, the pipeline that second cone pulley 0223 is carried lubricating oil, and oil pipeline can directly be introduced with drawing oil pipe.When first cone pulley 0221,0223 work of second cone pulley, it is lubricated that oil pipeline promptly begins oil transportation, and the assurance wire drawing is normally carried out.
The inlet wire clamping that described mounting layer 0211 is provided with entrance hole 0214 and is used to keep inlet wire tension force near first cone pulley, 0,221 one end, and the conduit 0216 that is used for guide wire, conduit 0216 lays respectively at entrance hole 0214 both sides with the inlet wire clamping, conduit 0,216 one is rectified facing to entrance hole 0214, and conduit 0216 other end is positioned at described first cone pulley 0221 top.
During work, wire is through actinobacillus device 01 unwrapping wire and enter into first cone pulley 0221 in the wire drawing machine, first cone pulley 0221 and second cone pulley 0223 rotate synchronously, under first cone pulley 0221 and 0223 traction of second cone pulley, wire makes wire pass a plurality of wire-drawing dies on the main mould bases 0222 back and forth through the wire-drawing die on the main mould bases 0222 and second cone pulley 0223 and wraparound to the first cone pulley 0221.Can once use six or eight wire-drawing dies also can once use 15 wire-drawing dies to carry out wire drawing repeatedly during actual production, wire-drawing die on the main mould bases 0222 of the every process of wire once, wire is compressed, external diameter diminishes, length increases, and the cone pulley diameter of wire process increases, and linear velocity is accelerated, the second volume flow that realizes each compression is synchronous, and the assurance wire drawing normally, carry out continuously.
Wire enters modifying device 03 after drawing-down, by wire-sending device 0311 carry out line sending, wire-sending device 0311 is delivered to cleaning device 03121 with wire and is cleaned, entering annealing device 0313 after the cleaning again anneals, deliver to painting device 03122 after the wire annealing and carry out application, wire after the application is cooled off by cooling device 0314 afterwards through baker 0315 oven dry; Cooled wire is collected by take-up 04, finishes whole process.
Claims (10)
1, equipment for producing bonding wire for packaging semiconductor is characterized in that including:
One actinobacillus device (01), its inside is provided with bearing support and guide mechanism, and the bobbin that metal wire is housed places on the bearing support, and metal wire is delivered to wire drawing machine through guide mechanism;
One wire drawing machine (02), the side that it is arranged on actinobacillus device (01) leading-out terminal includes wire drawing assembly (022), and the metal wire of guiding out from the guide mechanism of actinobacillus device (01) is connected to and its external diameter can be drawn little wire drawing assembly (022) by ashamed;
One modifying device (03), it is arranged on a side of wire drawing machine (02) leading-out terminal, it includes wire-sending device (0311), clean painting device (0312) and annealing device (0313) and baker (0315), deliver to cleaning device (03121) from the lametta up to specification that wire drawing machine (02) comes out by wire-sending device (0311), metal wire after the cleaning enters annealing device (0313) and anneals, metal wire after the annealing enters into painting device (03122) and carries out application, metal wire after the application enters into baker (0315) oven dry again, comes cooling device (0314) again and cools off;
One take-up (04) is provided with the Sheng drum that is used to be gathered into line (bonding wire) (or claiming bobbin), contains that drum is connected with drive unit and by its driving.
Above-mentioned actinobacillus device (01), wire drawing machine (02), modifying device (03), take-up (04) are arranged in order setting.
2, equipment for producing bonding wire for packaging semiconductor according to claim 1, it is characterized in that described frame (05) includes two mounting layers (0211), described actinobacillus device (01), wire drawing assembly (022) and modifying device (03) and take-up (04) respectively are two groups, and each organizes actinobacillus device (01), wire drawing assembly (022) and modifying device (03) and take-up (04) correspondence is installed in each mounting layer (0211).
3, equipment for producing bonding wire for packaging semiconductor according to claim 2, it is characterized in that described cleaning device (03121) includes the container of a splendid attire cleaning agent, measuring pump is transported to rinse bath with cleaning agent through pipeline, be equipped with lower felt absorption cleaning agent on the rinse bath, by being cleaned the agent cleaning, rinse bath is provided with the cleaning agent reflux line to wire in the middle of last lower felt.
4, equipment for producing bonding wire for packaging semiconductor according to claim 2, it is characterized in that described painting device (0316) includes the container of a splendid attire coating agent, measuring pump is transported to coating agent and is coated with tankage through pipeline, be coated with and be equipped with lower felt absorption coating agent on the tankage, wire is middle by being coated with the application material at last lower felt.
5,, it is characterized in that described annealing device (0313) includes an electric furnace according to claim 3 or 4 described equipment for producing bonding wire for packaging semiconductor equipment.
6, equipment for producing bonding wire for packaging semiconductor according to claim 1, it is characterized in that described baker (0315) includes a catalyst furnace (03151), side at catalyst furnace (03151) is provided with a blower fan, in catalyst furnace (03151) catalyst is housed also.
7, equipment for producing bonding wire for packaging semiconductor according to claim 2, it is characterized in that described wire drawing assembly (022) includes first cone pulley (0221), main mould bases (0222), second cone pulley (0223) and lead-in wire wheels (0224), main mould bases is equipped with wire-drawing die on (0222), first cone pulley (0221) and second cone pulley (0223) lay respectively at main mould bases (0222) both sides, and the described metal wire that comes out from actinobacillus device (01) enters into wire drawing assembly (022) and carries out wire drawing.
8, equipment for producing bonding wire for packaging semiconductor according to claim 2, it is characterized in that also being provided with in the described mounting layer (0211) take-up axle (02111), the Sheng drum (or claiming bobbin) that is used to be gathered into line is housed on the take-up axle (02111), and described lead-in wire wheels (0224) are positioned between second cone pulley (0223) and the take-up axle (02111).
9, equipment for producing bonding wire for packaging semiconductor according to claim 7, it is characterized in that described first cone pulley (0221) and second cone pulley (0223) are respectively equipped with from interior becomes big spin bath (0226) gradually toward overall diameter, described main mould bases (0222) is gone up corresponding above-mentioned each spin bath (0226) and is organized mounting grooves (02261) from interior being provided with outward more, each mounting groove is equipped with wire-drawing die in (02261), and the aperture of wire-drawing die diminishes outward gradually from interior.
10, equipment for producing bonding wire for packaging semiconductor according to claim 8, it is characterized in that the inlet wire clamping that described mounting layer (0211) is provided with entrance hole (0214) and is used to keep inlet wire tension force near first cone pulley (0221) one end, and the conduit (0216) that is used for guide wire, conduit (0216) lays respectively at entrance hole (0214) both sides with the inlet wire clamping, conduit (0216) one is rectified facing to entrance hole (0214), and conduit (0216) other end is positioned at described first cone pulley (0221) top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100278632A CN101572135B (en) | 2008-04-28 | 2008-04-28 | Equipment for producing bonding wire for packaging semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100278632A CN101572135B (en) | 2008-04-28 | 2008-04-28 | Equipment for producing bonding wire for packaging semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101572135A true CN101572135A (en) | 2009-11-04 |
| CN101572135B CN101572135B (en) | 2011-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100278632A Expired - Fee Related CN101572135B (en) | 2008-04-28 | 2008-04-28 | Equipment for producing bonding wire for packaging semiconductor |
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| Country | Link |
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| CN (1) | CN101572135B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810361A (en) * | 2012-08-20 | 2012-12-05 | 江苏南海线缆设备有限公司 | Wheel track adjustor for copper wire annealing device |
| CN105448754A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Airflow control mechanism for micro-tension of wedge-bonding gold wire |
| CN104073619B (en) * | 2014-06-25 | 2018-01-16 | 青岛永泰控制技术有限公司 | A kind of bonding wires annealing system |
| CN108998749A (en) * | 2018-08-15 | 2018-12-14 | 自贡硬质合金有限责任公司 | A kind of wire protective layer drying oven and wire annealing system |
| CN111776869A (en) * | 2020-05-28 | 2020-10-16 | 重庆市润金新材料科技有限公司 | Production coiling device of bonding wire |
| CN116121498A (en) * | 2023-02-07 | 2023-05-16 | 金长城线缆有限公司 | Copper wire continuous annealing device |
-
2008
- 2008-04-28 CN CN2008100278632A patent/CN101572135B/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102810361A (en) * | 2012-08-20 | 2012-12-05 | 江苏南海线缆设备有限公司 | Wheel track adjustor for copper wire annealing device |
| CN102810361B (en) * | 2012-08-20 | 2014-08-06 | 江苏南海线缆设备有限公司 | Wheel track adjustor for copper wire annealing device |
| CN104073619B (en) * | 2014-06-25 | 2018-01-16 | 青岛永泰控制技术有限公司 | A kind of bonding wires annealing system |
| CN105448754A (en) * | 2015-12-16 | 2016-03-30 | 中国电子科技集团公司第二研究所 | Airflow control mechanism for micro-tension of wedge-bonding gold wire |
| CN105448754B (en) * | 2015-12-16 | 2017-12-29 | 中国电子科技集团公司第二研究所 | Wedge bonding spun gold gas flow optimized parts force mechanisms a little |
| CN108998749A (en) * | 2018-08-15 | 2018-12-14 | 自贡硬质合金有限责任公司 | A kind of wire protective layer drying oven and wire annealing system |
| CN111776869A (en) * | 2020-05-28 | 2020-10-16 | 重庆市润金新材料科技有限公司 | Production coiling device of bonding wire |
| CN116121498A (en) * | 2023-02-07 | 2023-05-16 | 金长城线缆有限公司 | Copper wire continuous annealing device |
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| Publication number | Publication date |
|---|---|
| CN101572135B (en) | 2011-04-27 |
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Granted publication date: 20110427 Termination date: 20200428 |