CN105448754B - Wedge bonding spun gold gas flow optimized parts force mechanisms a little - Google Patents
Wedge bonding spun gold gas flow optimized parts force mechanisms a little Download PDFInfo
- Publication number
- CN105448754B CN105448754B CN201510942756.2A CN201510942756A CN105448754B CN 105448754 B CN105448754 B CN 105448754B CN 201510942756 A CN201510942756 A CN 201510942756A CN 105448754 B CN105448754 B CN 105448754B
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- CN
- China
- Prior art keywords
- spun gold
- pedestal
- compressed air
- spun
- inflatable mouth
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
The invention discloses a kind of wedge bonding spun gold gas flow optimized to part force mechanisms a little, solves the problems, such as that spun gold tension force is whard to control in existing full-automatic lead bonding machine and is easily broken off.It is included in compressed air inflatable mouth（4）The pedestal of front side（1）Top end face be fixedly installed front apron（5）, in compressed air inflatable mouth（4）The top end face of the pedestal of rear side is fixedly installed rear baffle（6）, in front apron（5）With rear baffle（6）Between be provided with spun gold lifting seam（7）, lift and stitch in spun gold（7）Upper end set position sensor（11）, lift and stitch in spun gold（7）In be movably set with spun gold（9）, the one ends wound of spun gold is in pedestal（1）The spun gold winding motor in left side（8）On, the other end of spun gold is arranged on pedestal（1）The bonding machine weld clip on right side（10）In, position sensor and spun gold winding motor are electrically connected with Industrial Control Computer respectively.Realize effective control of the slight tension of different spun golds.
Description
Technical field
The present invention relates to a kind of spun gold mild tension condition mechanism, more particularly to one kind is applied on full-automatic lead bonding machine
The mechanism for spun gold tension force.
Background technology
Absorption of the full-automatic lead bonding machine by completing chip and substrate positions, chopper and substrate pads it is accurate right
Position, can realize the functions such as wire bonding, substrate heating, automatic feeding, Stress control simultaneously, to realize that the lead of chip chamber is mutual
Connection.In order to ensure the quality of gold wire bonding, it is necessary to assure spun gold has certain tension force, at present, is protected mostly using hanging type
Demonstrate,prove spun gold tension force, the structure for different spun golds need change and adjust pendency weight size, use it is very inconvenient,
And easily swing spun gold during high-speed motion, cause to be broken.
The content of the invention
The invention provides a kind of wedge bonding spun gold gas flow optimized to part force mechanisms a little, solves existing full-automatic lead bonding
The technical problem that spun gold tension force is difficult to control and is easily broken off in machine.
The present invention is that solve above technical problem by the following technical programs：
A kind of wedge bonding spun gold gas flow optimized parts force mechanisms, including pedestal and Industrial Control Computer a little, and gas is provided with pedestal
Road, the top end face center of pedestal is provided with compressed air inflatable mouth, compressed air inflatable mouth connects with one end of gas circuit, in gas
The other end on road is connected with compressed air input pipe, manual modulation valve is provided with compressed air input pipe, in compressed air
The top end face of pedestal on front side of inflatable mouth is fixedly installed front apron, and the top end face of the pedestal on rear side of compressed air inflatable mouth is consolidated
Surely rear baffle is provided with, spun gold lifting seam is provided between front apron and rear baffle, is provided with the upper end of spun gold lifting seam
Position sensor, spun gold is movably set with spun gold lifting seam, the spun gold winding electricity of the one ends wound of spun gold on the left of pedestal
On machine, the other end of spun gold is arranged in the bonding machine weld clip on the right side of pedestal, position sensor and spun gold winding motor respectively with
Industrial Control Computer is electrically connected.
Muffler is provided with front apron.
Compressed air input pipe is fixed with the bottom of pedestal, main function is to introduce a gas into pedestal, muffler self-conductance
Screw thread is connected with front apron, and main function is to drain air-flow, is abated the noise simultaneously；Position sensor is threadedly secured to gold
, can be with adjusting position in silk lifting seam, to be adapted to sense the requirement of spun gold, its main function is when spun gold is blown afloat by air-flow
During to position sensor mounting location, position sensor sends signal, and spun gold winding motor stops putting silk, front apron and rear baffle
Playing prevents spun gold from disorderly flying under airflow function.
The present invention is the critical component applied on full-automatic lead bonding machine, for realizing the work(of spun gold tension force
Can, the control function that force mechanisms realize different spun gold slight tensions is parted a little by gas flow optimized.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the longitudinal sectional view of the present invention.
Embodiment
The present invention is described in detail below in conjunction with the accompanying drawings：
A kind of wedge bonding spun gold gas flow optimized parts force mechanisms, including pedestal 1 and Industrial Control Computer a little, is provided with pedestal 1
Gas circuit 2, compressed air inflatable mouth 4 is provided with the top end face center of pedestal 1, and compressed air inflatable mouth 4 and one end of gas circuit 2 connect
It is logical, compressed air input pipe 3 is connected with the other end of gas circuit 2, manual modulation valve is provided with compressed air input pipe 3
13, front apron 5 is fixedly installed in the top end face of the pedestal 1 of the front side of compressed air inflatable mouth 4, after compressed air inflatable mouth 4
The top end face of the pedestal 1 of side is fixedly installed rear baffle 6, and spun gold lifting seam 7 is provided between front apron 5 and rear baffle 6,
The upper end of spun gold lifting seam 7 sets position sensor 11, and spun gold 9 is movably set with spun gold lifting seam 7, and the one of spun gold 9
End is wrapped on the spun gold winding motor 8 in the left side of pedestal 1, and the other end of spun gold 9 is arranged on the bonding machine weld clip 10 on the right side of pedestal 1
In, position sensor 11 and spun gold winding motor 8 are electrically connected with Industrial Control Computer respectively.
Muffler 12 is provided with front apron 5.
During work, spun gold 9 penetrates tension control mechanism from the side of pedestal 1, is then passed from opposite side, the spun gold passed
9 enter chopper, and after spun gold is through spun gold lifting seam 7, spun gold 9 is blown afloat upwards in the presence of air-flow, when spun gold 9 reaches
During the location of position sensor 11, position sensor 11 goes out signal, stops spun gold winding motor 8, spun gold 9 is in air-flow
Under effect, the position is maintained at, after movement uses one section to spun gold from bonding machine weld clip 10, spun gold 9 drops to position sensing
During the lower section of the location of device 11, position sensor 11 sends signal, rotates spun gold winding motor 8 and puts silk, until spun gold 9
During the location of in-position sensor 11, spun gold winding motor 8 stops again, so as to ensure that the tension force of spun gold 9 is substantially permanent
It is fixed, the tension force of spun gold had so both been ensure that, in turn ensure that spun gold there are enough surpluses.
Claims (2)
1. a kind of wedge bonding spun gold gas flow optimized parts force mechanisms, including pedestal a little（1）And Industrial Control Computer, in pedestal（1）Middle setting
There is gas circuit（2）, in pedestal（1）Top end face center be provided with compressed air inflatable mouth（4）, compressed air inflatable mouth（4）With gas
Road（2）One end connection, in gas circuit（2）The other end be connected with compressed air input pipe（3）, in compressed air input pipe（3）
On be provided with manual modulation valve（13）, it is characterised in that in compressed air inflatable mouth（4）The pedestal of front side（1）Top end face consolidate
Surely it is provided with front apron（5）, in compressed air inflatable mouth（4）The pedestal of rear side（1）Top end face be fixedly installed rear baffle
（6）, in front apron（5）With rear baffle（6）Between be provided with spun gold lifting seam（7）, lift and stitch in spun gold（7）Upper end be provided with
Position sensor（11）, lift and stitch in spun gold（7）In be movably set with spun gold（9）, spun gold（9）One ends wound in pedestal（1）
The spun gold winding motor in left side（8）On, spun gold（9）The other end be arranged on pedestal（1）The bonding machine weld clip on right side（10）In, position
Put sensor（11）Motor is wound with spun gold（8）It is electrically connected respectively with Industrial Control Computer.
2. a kind of wedge bonding spun gold gas flow optimized according to claim 1 parts force mechanisms a little, it is characterised in that in front apron
（5）On be provided with muffler（12）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510942756.2A CN105448754B (en) | 2015-12-16 | 2015-12-16 | Wedge bonding spun gold gas flow optimized parts force mechanisms a little |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510942756.2A CN105448754B (en) | 2015-12-16 | 2015-12-16 | Wedge bonding spun gold gas flow optimized parts force mechanisms a little |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105448754A CN105448754A (en) | 2016-03-30 |
| CN105448754B true CN105448754B (en) | 2017-12-29 |
Family
ID=55558804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510942756.2A Active CN105448754B (en) | 2015-12-16 | 2015-12-16 | Wedge bonding spun gold gas flow optimized parts force mechanisms a little |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105448754B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572135A (en) * | 2008-04-28 | 2009-11-04 | 袁毅 | Equipment for producing bonding wire for packaging semiconductor |
| CN202479992U (en) * | 2011-12-16 | 2012-10-10 | 东莞华中科技大学制造工程研究院 | Micro holder for lead bonding |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011077681A1 (en) * | 2009-12-25 | 2011-06-30 | アダマンド工業株式会社 | Air tension apparatus |
-
2015
- 2015-12-16 CN CN201510942756.2A patent/CN105448754B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572135A (en) * | 2008-04-28 | 2009-11-04 | 袁毅 | Equipment for producing bonding wire for packaging semiconductor |
| CN202479992U (en) * | 2011-12-16 | 2012-10-10 | 东莞华中科技大学制造工程研究院 | Micro holder for lead bonding |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105448754A (en) | 2016-03-30 |
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