CN101565821B - Method for coating film on surface of drill point and drill point coated with film - Google Patents
Method for coating film on surface of drill point and drill point coated with film Download PDFInfo
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- CN101565821B CN101565821B CN2008100946022A CN200810094602A CN101565821B CN 101565821 B CN101565821 B CN 101565821B CN 2008100946022 A CN2008100946022 A CN 2008100946022A CN 200810094602 A CN200810094602 A CN 200810094602A CN 101565821 B CN101565821 B CN 101565821B
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Abstract
The invention discloses a method for coating a film on the surface of a drill point and a drill point coated with a film, wherein the method for coating the film on the surface of the drill point comprises the following steps: providing a drill point; cleaning the surface of the drill point, and heating the drill point; forming a coherent film on the surface of the drill point; forming a mixed film on the surface of the coherent film; and forming a non-crystalline diamond film on the surface of the mixed film so as to form a drill point coated with a film. The drill point coated with the film,which is manufactured by the method for coating the film on the surface of the drill point, comprises the drill point, the coherent film, the mixed film and the non-crystalline diamond film, wherein the mixed film comprises a non-crystalline diamond material and ingredients contained in the coherent film. In the mixed film, the further the part is from the drill point, the higher the content of the non-crystalline diamond material is in the part.
Description
Technical field
The present invention relates to a kind of drill point, particularly relate to a kind of technology of making a plated film drill point at a drilling needle surface plated film.
Background technology
In general processing operation, in that being holed, workpiece adds man-hour, all unavoidably can use drill point or little drill point.Generally speaking, drill bit is used for workpiece is carried out the boring processing operation of stock size, and little drill point then is used for workpiece is carried out the boring processing operation of reduced size (as micron or meter ruler cun grade how).
Particularly when multilayer circuit board is carried out the bore operation of conductive through hole,, can select the processing of holing of little drill point usually for use because finish size requires comparatively accurate cause.When little drill point carries out after bore operation reaches some amount, promptly can produce passivation and influence cutting precision, or produce the phenomenon of wearing and tearing and distortion.Therefore, the in good time replacing of little drill point is to be indispensable important step in the output manufacturing of multilayer circuit board; Simultaneously, can directly cause the work-ing life of little drill point the expendable cost of little drill point to increase, the expendable cost increase of little drill point then can cause the manufacturing cost of multilayer circuit board to increase.
In the prior art, in order to prolong the work-ing life of little drill point, can plate usually that (Dimond-Like Carbon, DLC) the amorphousness DLC film formed of material is used to form the little drill point of a plated film by amorphousness class diamond on the surface of little drill point.The structure of amorphousness DLC material is by carbon and hydrogen is tightly packed forms, and contains partly with sp2 hybridized orbital (hybirdized orbital) and more valence electron with the sp3 hybridized orbital.On bulk property, amorphousness DLC material and rough diamond are very close, have the hardness height equally, thermotolerance is good and etch-proof advantage.Therefore, if the little drill point of formed plated film just can possess preferable cutting power after plating amorphousness DLC film on the surface of little drill point, row cuts ability, fastness to rubbing and thermal stability.
Yet,, therefore, can exist the not good problem of the power of being attached to each other because little drill point and amorphousness DLC material are all the material of high rigidity.In addition, when the thickness of amorphousness DLC film increased, internal stress also can increase thereupon, and when internal stress was excessive, amorphousness DLC film will break and by the surfacial spalling of little drill point.Because above reason, in the prior art, when micro-drilling needle surface is carried out the plated film operation of amorphousness DLC film, in order to prevent of the surfacial spalling of amorphousness DLC film from little drill point, usually the thickness of amorphousness DLC film is all quite thin, causes amorphousness DLC film to improving cutting power, arranging on the effect of cutting ability, fastness to rubbing and thermal stability and have a greatly reduced quality.
Therefore, the surface that how to make amorphousness class diamond film closely be coated on little drill point increases the thickness of amorphousness DLC film, and then cuts ability, fastness to rubbing and thermal stability, real problem for demanding urgently now thinking deeply for the little drill point of plated film provides better cutting power, row.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of method for plating film on surface and plated film drill point of drill point, be used for by amorphousness DLC film is combined closely in the surface of drill point, solve in the prior art, under the double influence of and amorphousness DLC film internal stress not good at little drill point and amorphousness DLC material sticking power to each other, the thickness of amorphousness DLC film is all extremely thin usually, can't effectively improve cutting power, arrange the problem of cutting ability, fastness to rubbing and thermal stability.
To achieve these goals, the invention provides a kind of method for plating film on surface of drill point, it is characterized in that, may further comprise the steps:
A provides a drill point;
B cleans the surface of this drill point, and to this drill point heating;
C forms a coherent film on the surface of this drill point;
D forms a hybrid films on the surface of this coherent film, and the composition of this hybrid films contains an amorphousness class diamond material and the contained composition of this coherent film, and in this hybrid films, more away from this drill point place, the content of this amorphousness class diamond material is high more; And
E forms an amorphousness class diamond film on the surface of this hybrid films, is used to make a plated film drill point.
The method for plating film on surface of described drill point, wherein, this step b also comprises following steps:
B1 is arranged at this drill point in one vacuum environment;
B2 provides one to add electric power and produce a biasing electric field in this vacuum environment;
B3 imports this vacuum environment with at least one gas; And
B4 utilizes this biasing electric field that this gas is dissociated into an electric slurry like material, to clean the surface of this drill point.
The method for plating film on surface of described drill point, wherein, in this step b, a vacuum pressure of this vacuum environment is controlled at 1.5～4ubar when initial; And after 20 minutes, increase to 4～7ubar.
The method for plating film on surface of described drill point wherein, when carrying out this step c, lasts 1～5 minute altogether, and this vacuum pressure is controlled at 4～7ubar; When carrying out this steps d, when initial, this vacuum pressure is controlled at 4～7ubar, after 1～5 minute, this vacuum pressure is increased to 13～17ubar by 4～7ubar, and when keeping 5 minutes; When carrying out this step e, this vacuum pressure settings is kept 2 minutes to form this amorphousness class diamond film at 13～17ubar.
The method for plating film on surface of described drill point, wherein, in this step b, this adds electric power and is provided by an adjustable power supply unit, and when initial, this power that adds electric power is 300 watts, and a bias value of this biasing electric field is 300 volts; After 20 minutes, it is 600 watts that the power of this output power increases, this bias value increases is 500～600 volts; Afterwards, it is 1000 watts that the power of this output power increases again, and this bias value is adjusted into 550 volts, keeps 20 minutes cleaning the surface of this drill point, and this drill point is heated.
The method for plating film on surface of described drill point, wherein, when carrying out this step c, a bias value of this biasing electric field is set at 550～600 volts; When carrying out this steps d, this bias value comes down to 400～550 volts by 550～600 volts; When carrying out this step e, this bias value is set at 1000 volts.
The method for plating film on surface of described drill point, wherein, in this step b, this gas comprises hydrogen and argon gas, and this gas formed electric slurry like material in back be electric pulpous state hydrogen ion and argon ion that dissociated.
The method for plating film on surface of described drill point, wherein, in this step b, when initial, the flow rate that hydrogen and argon gas flow into this vacuum environment in this gas is set at 20sccm, 50sccm respectively; After 20 minutes, to increase respectively be 45～60sccm and 200～250sccm to the flow rate of hydrogen and argon gas in this gas.
The method for plating film on surface of described drill point, wherein, when carrying out this step c, this coherent film by a hydrogen and a silicon-containing gas through dissociating formation of deposits, the contained composition of this coherent film includes silicon, silicon carbide and hydrocarbon polymer, the flow rate that this hydrogen flows into this vacuum environment is controlled at 45～60sccm, and the flow rate that this silicon-containing gas flows into this vacuum environment is controlled at 180～250sccm.
The method for plating film on surface of described drill point, wherein, when carrying out this steps d, this hybrid films is dissociated and formation of deposits by hydrogen, a silicon-containing gas and a carbonaceous gas.
The method for plating film on surface of described drill point, wherein, when carrying out this steps d, when initial, the flow rate that this hydrogen, this silicon-containing gas and this carbonaceous gas flow into this vacuum environment is set at 45sccm, 180sccm and 0sccm respectively; After 1～5 minute, the flow rate that this hydrogen, this silicon-containing gas and this carbonaceous gas flow into this vacuum environment is adjusted into 800sccm, 50sccm and 600sccm respectively; Again through after 2～5 minutes, the flow rate that this hydrogen, this silicon-containing gas and this carbonaceous gas flow into this vacuum environment is adjusted into 800sccm, 50sccm and 0sccm respectively, is used to make this hybrid films to contain this amorphousness class diamond and the contained composition of this coherent film simultaneously.
The method for plating film on surface of described drill point, wherein, this carbonaceous gas is an acetylene, and this silicon-containing gas is a tetramethylsilane.
To achieve these goals, the present invention also provides a kind of plated film drill point, it is characterized in that, comprising:
One drill point;
One coherent film coats the surface of this drill point;
One hybrid films coats the surface of this coherent film, and comprises an amorphousness class diamond material and the contained composition of this coherent film, and in this hybrid films, more away from this drill point place, the content of this amorphousness class diamond material is high more; And
One amorphousness class diamond film coats the surface of this hybrid films.
Described plated film drill point, wherein, this coherent film comprises silicon, silicon carbide and hydrocarbon polymer, and this hybrid films comprises silicon carbide and silicon, is used for tight joint and coats this coherent film.
Useful technique effect of the present invention is:
Compared to prior art, plated film drill point provided by the present invention possesses above-mentioned drill point, coherent film, hybrid films and amorphousness class diamond film.Wherein, because the composition of hybrid films comprises amorphousness DLC material and the contained composition of coherent film that amorphousness class diamond film is contained, and the contained component proportions of amorphousness DLC material and coherent film cushions variation according to the position of hybrid films inside; Therefore, by hybrid films, coherent film and amorphousness class diamond film are combined closely each other.In addition, add, cause amorphousness class diamond film to combine closely in drill point indirectly because coherent film itself can be combined closely in the cause of drill point again.
Because amorphousness class diamond film can be combined closely indirectly in the cause of drill point, causes the little drill point of plated film to possess preferable row and cuts ability and fastness to rubbing.Simultaneously, because it is relevant that the cutting power of the little drill point of plated film and row cut ability, amorphousness DLC material possesses quite high thermal conductivity, add the cause of amorphousness class diamond film difficult drop-off, therefore, tolerable plates thicker amorphousness DLC material at micro-drilling needle surface, and then impels the little drill point of plated film provided by the present invention to possess preferable cutting power and thermal stability.
In sum, the little drill point of plated film provided by the present invention can possess the cutting power of raising really, row cuts effects such as ability, fastness to rubbing and thermal stability, thus can effectively reduce the expendable cost of the little drill point of plated film, and then reduce the required tooling cost of bore operation.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 shows that a filming equipment is used for a drill point is carried out the synoptic diagram of surface coating;
Fig. 2 shows drill point is fixed in conduction rack, and adds electric power and produce a biasing electric field in vacuum environment with one;
Fig. 3 shows gas is directed in the vacuum environment, and make the gas that imports under the effect of biasing electric field, be dissociated into an electric slurry like material;
Fig. 4 is presented at the making processes that drilling needle surface forms coherent film;
Fig. 5 is the sectional view that shows zone shown in Fig. 4 centre circle X;
Fig. 6 is the making processes that is presented at the surface formation hybrid films of coherent film;
Fig. 7 is the sectional view that shows zone shown in Fig. 6 centre circle Y;
Fig. 8 is the making processes that is presented at the surface formation amorphousness class diamond film of hybrid films;
Fig. 9 is the sectional view that shows zone shown in Fig. 8 centre circle Z.
Wherein, Reference numeral:
100 filming equipments
1 plated film drill point
11 drill points
12 coherent films
13 hybrid films
14 amorphousness class diamond films
2 coating chambers
21～24 ventages
3 vacuum pumps
4 power control units
41 adjustable power supply units
42 conduction racks
H hydrogen
H ' hydrogen ion
The A argon gas
A ' argon ion
The S silicon-containing gas
The C carbonaceous gas
The E biasing electric field
Embodiment
Below in conjunction with the drawings and specific embodiments technical scheme of the present invention is made further more detailed description.
Because the method for plating film on surface of the drill point that the invention work is provided, can extensively carry out the plated film operation and make various plated film drill points drill point, its combination embodiment is too numerous to enumerate especially, so give unnecessary details no longer one by one at this, only enumerates a preferred embodiment and is specified.
See also Fig. 1, it shows that a filming equipment is used for a drill point is carried out the synoptic diagram of surface coating.As shown in the figure, a filming equipment 100 is used for a drill point 11 is carried out surface coating, is used for drill point 11 is made a plated film drill point 1 (being shown in Fig. 8 and Fig. 9).Filming equipment 100 comprises a coating chamber 2, a vacuum pump 3 and a power control unit 4, and wherein, coating chamber 2 has four ventages 21,22,23 and 24; Vacuum pump 3 is communicated with coating chamber 2; Power control unit 4 comprises an adjustable power supply unit 41 and a conduction rack 42, and adjustable power supply unit 41 is positioned at outside the coating chamber 2, and conduction rack 42 extends in the coating chamber 2 from adjustable power supply unit 41.
Then, see also Fig. 2 to Fig. 9, it illustrates in the preferable enforcement of the present invention, drill point is carried out a series of making processes synoptic diagram of surface coating.At first, see also Fig. 2, its demonstration is fixed in conduction rack with drill point, and adds electric power and produce a biasing electric field in vacuum environment with one.As shown in the figure, before drill point 11 is carried out surface coating, must earlier drill point 11 be set up on the conduction rack 42, make drill point 11 be electrically connected at adjustable power supply unit 41.Then, utilize 3 pairs of coating chambers 2 of vacuum pump to bleed, make and form a vacuum environment in the coating chamber 2, to adjust and a vacuum pressure of controlling in the vacuum environment.Simultaneously, utilize adjustable power supply unit 41 to apply one and add electric power, make conduction rack 42 form noble potential point, the vacuum environment in the coating chamber 2 forms low potential point, produces a biasing electric field E according to this.
Please continue to consult Fig. 3, its demonstration is directed into gas in the vacuum environment, and make the gas that imports under the effect of biasing electric field, be dissociated into an electric slurry like material.As shown in the figure, in the present embodiment, when drill point 11 is carried out surface coating, open ventage 21 and 22 importing gases such as a hydrogen H and an argon gas A respectively, and close ventage 23 and 24.In hydrogen H that is imported and the vacuum environment of argon gas A in coating chamber 2, be subjected to the effect of biasing electric field E in the vacuum environment, can be dissociated into two electric slurry like material, be i.e. the hydrogen ion H ' of electric pulpous state and argon ion A '.Under the effect of biasing electric field E, the hydrogen ion H ' of electric pulpous state and argon ion A ' can bombard the surface of drill point 11, are used to clean drill point 11.
In this stage, when initial, hydrogen H and argon gas A are set respectively with the vacuum environment in the flow rate inflow coating chamber 2 of 20sccm (standard cc/min) and 50sccm; At this moment, the power initial value that adds electric power that adjustable power supply unit 41 is provided is 300W, and the bias value of biasing electric field E is 300V, and vacuum pressure is 1.5～4ubar.After 20 minutes, the flow rate of hydrogen H and argon gas A can be increased respectively is 45～60sccm and 200～250sccm, and the power that adds electric power increases to 600W, and it is 500～600V that the bias value of biasing electric field increases, and vacuum pressure is increased to 4～7ubar.After 30 minutes, the power that adds electric power can be increased and be that 1000W, the bias value of biasing electric field are 550V to strengthen electric current, kept other parameter simultaneously 20 minutes, be used to strengthen cleaning the surface of this drill point 11, and this drill point 11 is heated.
Please continue to consult Fig. 4 and Fig. 5, Fig. 4 is presented at the making processes that drilling needle surface forms coherent film; Fig. 5 shows the sectional view in zone shown in Fig. 4 centre circle X.As shown in the figure, when forming a coherent film 12 (being shown in Fig. 5) on the surface of drill point 11, must close ventage 21 and 24, and open ventage 22 and 23 with hydrogen H and a silicon-containing gas S with one fixedly flow rate import in the vacuum environment in the coating chamber 2, utilize biasing electric field E to be dissociated, be used for formation of deposits coherent film 12 on drill point 11 surfaces, and make between coherent film 12 and the drill point 11 and possess the good bond effect.
In the stage that forms coherent film 12, last 1～5 minute altogether, wherein, the flow rate of hydrogen H can maintain between 45～60sccm; And silicon-containing gas S can be silane (SiH
4), silicon tetrafluoride (SiF
4), silicon tetrachloride (SiCl
4) and tetramethylsilane (Si (CH
3)
4).When if silicon-containing gas S is tetramethylsilane, its flow rate can be 180～250sccm, and the hydrocarbon polymer that makes this coherent film 12 have silicon (Si), silicon carbide (SiC) and minute quantity, these coherent film 12 siliceous ratios very are higher than the amorphousness class and bore (diamond like carbon; DLC) material, close attachment is in drill point 11.At this moment, the power that adds electric power that adjustable power supply unit 41 is provided remains on 1000W, and the bias value of biasing electric field E then is set in 550～600V, and vacuum pressure then is set between 4～7ubar.
See also Fig. 6 and Fig. 7, Fig. 6 is presented at the making processes of the surface formation hybrid films of coherent film; Fig. 7 shows the sectional view in zone shown in Fig. 6 centre circle Y.As shown in the figure, when forming a hybrid films 13 (being shown in Fig. 7) on the surface of coherent film, must close ventage 21, and open ventage 22,23 and 24, in the vacuum environment in hydrogen H, silicon-containing gas S and the carbonaceous gas C importing coating chamber 2, utilize biasing electric field E to be dissociated, be used at the surface deposition of coherent film 12 to form hybrid films 13, wherein carbonaceous gas C can be acetylene.
In the stage that forms hybrid films 13, when initial, the flow rate that each gas must be flowed into vacuum environment is controlled to be respectively: hydrogen H 45sccm, silicon-containing gas S 180sccm and carbonaceous gas C 0sccm; The power that adds electric power that adjustable power supply unit 41 is provided should be adjusted into 1000～1500W, continues to light to keep the electricity slurry, and the bias value of biasing electric field can be set at 550～600V, and the vacuum pressure of vacuum environment is controlled in 4～7ubar.
After 1～5 minute, will hydrogen H, silicon-containing gas S and the flow rate of carbonaceous gas C be adjusted into 800sccm, 50sccm and 600sccm respectively, the bias value of biasing electric field should be adjusted to 400～550V, and vacuum pressure should to increase be 13～17ubar, and keep above-mentioned parameter 5 minutes to finish this hybrid films 13, only after 2～5 minutes, must close ventage 23, make the flow rate of silicon-containing gas S be kept to 0sccm.
The composition of hybrid films 13 includes silicon carbide, amorphousness DLC material and a spot of silicon at least.Because hybrid films 13 also has the composition (as silicon and silicon carbide etc.) of coherent film 12, and when the original state of formation hybrid films 13, the material of the material of hybrid films 13 and coherent film 12 is close, but so hybrid films 13 tight joint on coherent film 12.
Simultaneously, in the process that forms hybrid films 13, by the flow rate growth and decline of carbonaceous gas C, silicon-containing gas S and hydrogen H, can make the hybrid films 13 that forms because of deposition possess following feature: near drill point 11 places, the moiety in the hybrid films 13 approaches coherent film 12 more more; Away from drill point 12 places, the content of the amorphousness DLC material in the hybrid films 13 is high more more.
See also Fig. 8 and Fig. 9, Fig. 8 is presented at the making processes of the surface formation amorphousness class diamond film of hybrid films; Fig. 9 shows the sectional view in zone shown in Fig. 8 centre circle Z.As shown in the figure, when forming an amorphousness class diamond film 14 (being shown in Fig. 9) on the surface of hybrid films 13, must close ventage 21 and 23, and open ventage 22,24, in the vacuum environment in hydrogen H and the carbonaceous gas C importing coating chamber 2, utilize biasing electric field E to be dissociated, be used at the surface deposition of hybrid films 13 to form amorphousness class diamond film 14.So far, finished the making of plated film drill point 1.
In the stage that forms amorphousness class diamond film 14, the flow rate of silicon-containing gas S must be reduced to 0sccm, and will keep the flow rate of hydrogen H, this carbonaceous gas C to be controlled at 800sccm and 600sccm respectively; And with the bias value of biasing electric field, vacuum pressure, be controlled at 400V, 13～17ubar, 1000W respectively with the parameters such as power that add electric power, to form an amorphousness class diamond film 13, with this understanding, approximately kept 2 minutes, and can form amorphousness class diamond film 14 on the surface of hybrid films 13 smoothly.
Because the very approaching pure amorphousness DLC material of composition of the outermost of hybrid films 13, therefore, amorphousness class diamond film 14 can closely be engaged in the surface of hybrid films 13.Simultaneously, but since hybrid films 13 tight joint in the surface of this coherent film 12, but and coherent film 12 close attachment in the surface of this drill point 11, therefore, make drill point 1 have the amorphousness class diamond film 14 of a tight joint.
Combine and put in order the above, according to the above coating technique that provides, present embodiment provides the structure of above-mentioned plated film drill point 1 simultaneously.As shown in Figure 9, above-mentioned plated film drill point 1 comprises above-mentioned drill point 11, above-mentionedly is coated on the coherent film 12 on these drill point 11 surfaces, the above-mentioned hybrid films 13 that is coated on coherent film 12 surfaces, and the above-mentioned amorphousness class diamond film 14 that is coated on these hybrid films 13 surfaces.Hybrid films 13 comprises compound (as silicon and silicon carbide etc.) and the amorphousness DLC material congruent with coherent film 12, closely to be binding on coherent film 12.Simultaneously, in hybrid films 13, possess following feature: near drill point 11 places, the composition of hybrid films 13 is more near coherent film 12 more; Away from these drill point 11 places, amorphousness class diamond composition ratio contained in the hybrid films 13 is high more more.
When above-mentioned plated film drill point 1 apply to micron or how meter ruler cun grade add man-hour, can be considered the little drill point of a plated film.In addition, with regard to regard to the making field of little drill point, though in the prior art, there to be the technology that can on little drill point, plate amorphousness class diamond film; Yet, in the prior art, but have the problem that is not easy to be attached to micro-drilling needle surface.Otherwise, in the present invention, before forming amorphousness class diamond film 14, coat coherent film 12 and hybrid films 13 in regular turn earlier, make amorphousness class diamond film 14 be able to combine closely with drill point 11 with hybrid films 13 by coherent film 12, therefore, amorphousness class diamond film 14 is come off from hybrid films 13 surfaces that are difficult for plated film drill point 1.Even it is during above-mentioned plated film drill point 1 to be plated film little drill point, as the same.
Therefore, compared to the existing drill point that is coated with amorphousness DLC material, because in the present invention, the plated film drill point has the strong and amorphousness class diamond film of difficult drop-off of associativity, therefore, the plated film drill point that is provided among the present invention (comprising the little drill point of plated film) can possess higher thickness, and the cutting power that is used to provide better, row cut ability, fastness to rubbing and thermal stability, prolongs the work-ing life of plated film drill point and saves the expendable cost of plated film drill point.
In order to verify whether the little drill point of plated film provided by the present invention possesses the character of amorphousness class diamond film difficult drop-off really, further to little drill point of existing plated film and the test of carrying out reality according to the little drill point of the plated film of made of the present invention, finish the discovery of test back: compared to the little drill point of existing plated film, the row of the little drill point of foundation plated film provided by the present invention cuts ability and fastness to rubbing is about 5 times that have the little drill point of plated film now.
Why the little drill point of plated film can possess preferable chip removal efficient and fastness to rubbing, because the surface of the little drill point of plated film possesses the higher amorphousness DLC material of hardness.Obvious by test result, therefore the certain difficult drop-off of amorphousness class diamond film of the little drill point of plated film provided by the present invention just can possess preferable fastness to rubbing.
It is relevant that the cutting power of the little drill point of plated film and row cut ability, and amorphousness DLC material possesses quite high thermal conductivity.Because the cause of amorphousness class diamond film difficult drop-off, therefore, tolerable plates thicker amorphousness DLC material at micro-drilling needle surface, and then impels the little drill point of plated film provided by the present invention to possess preferable cutting power and thermal stability.
By the above-mentioned embodiment of the invention as can be known, the present invention has the utility value on the industry really.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (14)
1. the method for plating film on surface of a drill point is characterized in that, may further comprise the steps:
A provides a drill point;
B cleans the surface of this drill point, and to this drill point heating;
C forms a coherent film on the surface of this drill point;
D forms a hybrid films on the surface of this coherent film, and the composition of this hybrid films contains an amorphousness class diamond material and the contained composition of this coherent film, and in this hybrid films, more away from this drill point place, the content of this amorphousness class diamond material is high more; And
E forms an amorphousness class diamond film on the surface of this hybrid films, is used to make a plated film drill point.
2. the method for plating film on surface of drill point according to claim 1 is characterized in that, this step b also comprises following steps:
B1 is arranged at this drill point in one vacuum environment;
B2 provides one to add electric power and produce a biasing electric field in this vacuum environment;
B3 imports this vacuum environment with at least one gas, and this gas is hydrogen or argon gas; And
B4 utilizes this biasing electric field that this gas is dissociated into an electric slurry like material, to clean the surface of this drill point.
3. the method for plating film on surface of drill point according to claim 2 is characterized in that, in this step b, a vacuum pressure of this vacuum environment is controlled at 1.5～4ubar when initial; And after 20 minutes, increase to 4～7ubar.
4. the method for plating film on surface of drill point according to claim 2 is characterized in that, when carrying out this step c, lasts 1～5 minute altogether, and this vacuum pressure is controlled at 4～7ubar; When carrying out this steps d, when initial, this vacuum pressure is controlled at 4～7ubar, after 1～5 minute, this vacuum pressure is increased to 13～17ubar by 4～7ubar, and when keeping 5 minutes; When carrying out this step e, this vacuum pressure settings is kept 2 minutes to form this amorphousness class diamond film at 13～17ubar.
5. the method for plating film on surface of drill point according to claim 2 is characterized in that, in this step b, this adds electric power and is provided by an adjustable power supply unit, when initial, this power that adds electric power is 300 watts, and a bias value of this biasing electric field is 300 volts; After 20 minutes, it is 600 watts that the power of this output power increases, this bias value increases is 500～600 volts; Afterwards, it is 1000 watts that the power of this output power increases again, and this bias value is adjusted into 550 volts, keeps 20 minutes cleaning the surface of this drill point, and this drill point is heated.
6. the method for plating film on surface of drill point according to claim 2 is characterized in that, when carrying out this step c, a bias value of this biasing electric field is set at 550～600 volts; When carrying out this steps d, this bias value comes down to 400～550 volts by 550～600 volts; When carrying out this step e, this bias value is set at 1000 volts.
7. the method for plating film on surface of drill point according to claim 2 is characterized in that, in this step b, this gas comprises hydrogen and argon gas, and this gas formed electric slurry like material in back be electric pulpous state hydrogen ion and argon ion that dissociated.
8. the method for plating film on surface of drill point according to claim 7 is characterized in that, in this step b, when initial, the flow rate that hydrogen and argon gas flow into this vacuum environment in this gas is set at 20sccm, 50sccm respectively; After 20 minutes, to increase respectively be 45～60sccm and 200～250sccm to the flow rate of hydrogen and argon gas in this gas.
9. the method for plating film on surface of drill point according to claim 2, it is characterized in that, when carrying out this step c, this coherent film by a hydrogen and a silicon-containing gas through dissociating formation of deposits, this silicon-containing gas is a tetramethylsilane, the contained composition of this coherent film includes silicon, silicon carbide and hydrocarbon polymer, and the flow rate that this hydrogen flows into this vacuum environment is controlled at 45～60sccm, and the flow rate that this silicon-containing gas flows into this vacuum environment is controlled at 180～250sccm.
10. the method for plating film on surface of drill point according to claim 2 is characterized in that, when carrying out this steps d, this hybrid films is dissociated and formation of deposits by hydrogen, a silicon-containing gas and a carbonaceous gas.
11. the method for plating film on surface of drill point according to claim 10, it is characterized in that, when carrying out this steps d, when initial, the flow rate that this hydrogen, this silicon-containing gas and this carbonaceous gas flow into this vacuum environment is set at 45sccm, 180sccm and 0sccm respectively; After 1～5 minute, the flow rate that this hydrogen, this silicon-containing gas and this carbonaceous gas flow into this vacuum environment is adjusted into 800sccm, 50sccm and 600sccm respectively; Again through after 2～5 minutes, the flow rate that this hydrogen, this silicon-containing gas and this carbonaceous gas flow into this vacuum environment is adjusted into 800sccm, 50sccm and 0sccm respectively, is used to make this hybrid films to contain this amorphousness class diamond and the contained composition of this coherent film simultaneously.
12. the method for plating film on surface of drill point according to claim 10 is characterized in that, this carbonaceous gas is an acetylene, and this silicon-containing gas is a tetramethylsilane.
13. a plated film drill point is characterized in that, comprising:
One drill point;
One coherent film coats the surface of this drill point;
One hybrid films coats the surface of this coherent film, and comprises an amorphousness class diamond material and the contained composition of this coherent film, and in this hybrid films, more away from this drill point place, the content of this amorphousness class diamond material is high more; And
One amorphousness class diamond film coats the surface of this hybrid films.
14. plated film drill point according to claim 13 is characterized in that this coherent film comprises silicon, silicon carbide and hydrocarbon polymer, and this hybrid films comprises silicon carbide and silicon, is used for tight joint and coats this coherent film.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1034879A (en) * | 1987-06-11 | 1989-08-23 | 诺顿公司 | Improved have coating polycrystalline diamond monomer and products thereof and a manufacture method |
| CN1195387A (en) * | 1995-08-03 | 1998-10-07 | 德雷瑟工业公司 | Hardfacing with coated diamond particles |
| JP2005219156A (en) * | 2004-02-05 | 2005-08-18 | Fsk Corp | Cutting tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1034879A (en) * | 1987-06-11 | 1989-08-23 | 诺顿公司 | Improved have coating polycrystalline diamond monomer and products thereof and a manufacture method |
| CN1195387A (en) * | 1995-08-03 | 1998-10-07 | 德雷瑟工业公司 | Hardfacing with coated diamond particles |
| JP2005219156A (en) * | 2004-02-05 | 2005-08-18 | Fsk Corp | Cutting tool |
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