CN101547386A - Printed circuit board and a microphone comprising the printed circuit board - Google Patents
Printed circuit board and a microphone comprising the printed circuit board Download PDFInfo
- Publication number
- CN101547386A CN101547386A CN200910004457A CN200910004457A CN101547386A CN 101547386 A CN101547386 A CN 101547386A CN 200910004457 A CN200910004457 A CN 200910004457A CN 200910004457 A CN200910004457 A CN 200910004457A CN 101547386 A CN101547386 A CN 101547386A
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- China
- Prior art keywords
- pcb
- foreign matter
- microphone
- sound
- signal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The invention provides a printed circuit board (PCB) and a microphone comprising the printed circuit board. The PCB comprises a plurality of layers formed by stacking and connecting two or more layers, the sound aperture penetrating through the plurality of layers to allow the external sound being transmitted by the PCB, and foreign materials flowing blocking member provided at the plurality of layers and formed to be at least more than the sound aperture at the sound hole; wherein the foreign materials flowing blocking member comprises a plurality of through holes being transmitted by sound but blocking the foreign materials. According to the PCB of the invention, because the foreign materials flowing blocking member is formed in the sound aperture, the foreign materials such as dust cannot penetrate the sound aperture.
Description
The related application cross reference
The application requires the rights and interests at the korean patent application No.10-2008-0027367 of Korea S Department of Intellectual Property application on March 25th, 2008, and the full content that it is disclosed is incorporated herein by reference.
Technical field
The present invention relates to printed circuit board (PCB) (PCB) and comprise the microphone of this printed circuit board (PCB), and relate in particular to and comprise that hole and foreign matter flow into PCB that stops member and the microphone that comprises this PCB, foreign matter flows into and stops member can stop foreign matter such as dust etc. to enter into the microphone that comprises PCB by the sound hole.
Background technology
Usually, printed circuit board (PCB) (PCB) not only plays the effect that is electrically connected electronic unit but also plays the effect that mechanically keeps them.PCB comprises insulating barrier that is formed by phenolic resins or epoxy resin and the copper foil layer that is connected on the insulating barrier.Predetermined wiring pattern is formed on the copper foil layer.
By flooding textile fibreglass with the preparation core with BT, FR-4 or other resin, afterwards, copper foil is stacked on two surfaces of core to form internal circuit, and carry out subtractive process (subtractive process) or half interpolation process (semi-additive process) afterwards, thereby make PCB.
Use the PCB of typical method manufacturing to be installed in the microphone.The type of microphone has many kinds, but at present, every type microphone all comprises the PCB with many circuit arrangement parts.
In this manual, the PCB that in microphone, uses comprise by its can external voice be sent in the microphone sound the hole.In some microphones, the sound hole is not formed among the PCB of microphone.Such microphone has the only sound hole in its shell.Yet the present invention is limited to the PCB that comprises hole.
For the situation of the PCB that comprises hole, foreign matter for example is suspended in dust in air, and various external voices can enter into microphone by the sound hole together.When foreign matter when for example dust enters in the microphone, deposition of foreign material on many parts of microphone inside, thereby the performance of microphone is had adverse influence.
The microphone that comprises PCB is the mini microphone that uses in miniature precision equipment.In addition, such mini microphone can be installed in the communication apparatus, outside sound signal is changed into the signal of telecommunication, such as mobile phone, MP3 player, telephone set or similar with it, Medical Devices such as hearing aids and miniature multi-function intelligence sensor (smart sensor).Yet such mini microphone is too little and can not comprise the ground area, therefore the sound effect that is not supposed to is minimized.
Summary of the invention
Present embodiment provides and has comprised that hole and foreign matter flow into PCB that stops member and the microphone that comprises this PCB, and foreign matter flows into and stops member can prevent that foreign matter from entering into the microphone that comprises PCB by the sound hole.
According to an aspect of the present invention, the printed circuit board (PCB) that uses in microphone (PCB) is provided, wherein, PCB comprises by piling up and make up a plurality of layers of two or more layers formation, the sound hole is passed a plurality of layers and is passed PCB to allow external voice to be transmitted, and foreign matter is set between a plurality of layers flows into the prevention member, described foreign matter flows into and stops member to be formed bigger than sound hole at least at place, sound hole, wherein, foreign matter flows into and stops member to comprise a plurality of through holes, sound can be transmitted by these a plurality of through holes, but stops foreign matter.
Foreign matter flows into and stops member to be formed and can be formed by metal by mesh element.
Further, foreign matter flows into and stops member can have and identical length and the width of a plurality of layers that is stacked.
Description of drawings
By with reference to the accompanying drawing of enclosing exemplary embodiment of the present invention being described in detail, above-mentioned feature and advantage with other of the present invention will become apparent, wherein:
Fig. 1 is the perspective view of the printed circuit board (PCB) (PCB) according to the embodiment of the invention;
Fig. 2 is the perspective view according to the cross section of the PCB of Fig. 1 of the embodiment of the invention;
Fig. 3 is the perspective view according to the microphone of the PCB that comprises Fig. 1 of the embodiment of the invention;
Fig. 4 is the cross sectional representation along the IV-IV line of Fig. 3 according to the embodiment of the invention;
Fig. 5 is that the foreign matter according to the PCB of sound corresponding Fig. 1 in hole of the embodiment of the invention and PCB Fig. 1 flows into one one the amplification view that stops member;
Fig. 6 is the amplification plan view that the foreign matter of PCB according to another embodiment of the present invention flows into a part that stops member; With
Fig. 7 is the cross sectional representation of microphone according to another embodiment of the present invention.
Embodiment
With reference now to accompanying drawing, the printed circuit board (PCB) (PCB) according to the embodiment of the invention is carried out more complete description.
Fig. 1 is the perspective view of the printed circuit board (PCB) (PCB) 1 according to the embodiment of the invention; Fig. 2 is the perspective cross-sectional view according to the PCB 1 of Fig. 1 of the embodiment of the invention; Fig. 3 is the perspective view according to the microphone 100 of the PCB that comprises Fig. 11 of the embodiment of the invention; Fig. 4 is the cross sectional representation along the IV-IV line of Fig. 3 according to the embodiment of the invention;
PCB1 is installed in the microphone 100.
At first, with reference to figure 3 and Fig. 4 the microphone 10 that comprises PCB 1 is described in detail.Microphone 100 is the mini microphones that use in miniature precision equipment.In addition, microphone 100 can be installed in the communication apparatus outside sound signal is changed into the signal of telecommunication, such as mobile phone, MP3 player, telephone set or similar with it, Medical Devices such as hearing aids and miniature multi-function intelligence sensor.Yet PCB 1 of the present invention is confined to use and can use in employing comprises any microphone of PCB in hole at mini microphone.
With reference to figure 3 and Fig. 4, microphone 100 comprises shell 102 and form and signal of telecommunication generation unit 112 that external voice is converted to the signal of telecommunication in shell 102.
Form parts and the minimizing electromagnetic influence of shell 102 protections of microphone 100 outsides in microphone 100 inside.Signal of telecommunication generation unit 112 may be by circuit arrangement (such as MEMS (micro electro mechanical system) (MEMS) chip, application-specific integrated circuit (ASIC) (ASIC), loud speaker, filter, or similar with it equipment) form, and be mounted the inside of PCB 1, this PCB 1 is formed on the inside of shell 102.In the present embodiment, signal of telecommunication generation unit 112 comprises MEMS chip (MEMSdie).
The shell sound hole 104 that is used for outside sound signal is sent to the MEMS chip is formed on shell 102.Because signal of telecommunication generation unit 112 is used for sound signal is converted to the signal of telecommunication, by using surface mounting technology, terminal conjunction method or all similarly methods that circuit arrangement (such as the MEMS chip that comprises barrier film, amplification/filtered electrical signal and the emission signal of telecommunication loud speaker 144 to the external equipment (not shown), filter, ASIC etc.) is installed on the PCB 1.
The conductive pattern that is used for transmission signal between internal unit is formed on PCB 1.Sound hole 10 is formed among the PCB 1, so that corresponding with shell sound hole 104.
Microphone 100 also comprises bottom PCB 106, and shell 102 is set on the bottom PCB 106.Be used for a plurality of electrodes 108 that the signal of telecommunication that receives from signal of telecommunication generation unit 112 imposes on the external equipment (not shown) are formed on the lower surface of bottom PCB 106.Conductive member 110 is as the conductive path of the signal of telecommunication that is transmitted in generation among the PCB 1 to the electrode 108 of bottom PCB 106.
Hereinafter, will be described in detail the PCB 1 that is applied in the microphone 100 with reference to figure 1 and Fig. 2.
PCB 1 is by forming by piling up and making up two or more layers of a plurality of layer of forming.With reference to figure 2, PCB 1 comprises that copper foil layer 30, the prepreg (prepreg) 22 that has been used for connecting foreign matter inflow prevention member 20, the foreign matter inflow that will describe afterwards stop member 20, prepreg 24, copper foil layer 31, prepreg 32 and copper foil layer 33, and they are stacked gradually with such order.
Each copper foil layer 30,31 and 33 comprises circuit.
Prepreg 22,24,32 usefulness are mediated, be used to connect copper foil layer 30,31 and 33 and foreign matter flow into to stop member 20.Prepreg 22,24 and 32 is that resin soaks into finishing agent, and it is by obtaining with the manufacturing of resin impregnation glass fibre.
By copper foil layer 30,31 and 33 and foreign matter flow into to stop the layer of prepreg 22,24 and 32 that is in the partially hardened state be set between the member 20, and they are forced together prepare PCB 1 afterwards with fusing with in conjunction with these layers.
Foreign matter flow into to stop member 20 and hole 10 corresponding parts partly to be passed.Just,, especially stop in the member 20, so can introduce sound by the sound hole 10 that is formed among the PCB 1 at foreign matter because a plurality of through hole 27 is formed in the hole 10.
Foreign matter stops inflow member 20 to be arranged on and forms between the above-mentioned layer of PCB 1.It is bigger than sound hole 10 at least that the foreign matter inflow stops member 20 to be formed, so that cover whole sound hole 10.In addition, the size of the through hole 27 of foreign matter inflow prevention member 20 is formed and makes external voice to be transmitted by through hole 27, but foreign matter such as dust etc. can not pass through hole 27.
In the present embodiment, foreign matter inflow prevention member 20 is formed with copper foil layer 30,31 and 33 has identical width and length, and is formed by mesh element.
Fig. 5 is according to the amplification views embodiment of the invention and parts sound hole 10 corresponding foreign matters inflow prevention members 20.With reference to figure 5, foreign matter flow into to stop member 20 form by x wire 25 and vertical line 26 form netted.In addition, in the present embodiment, foreign matter flow into to stop member 20 to be formed by conducting metal.
According to one embodiment of present invention, because stoping member 20 to be formed on, foreign matter is formed in order in the sound hole 10 of passing PCB 1, so the external voice that only is supposed to can be transmitted by sound hole 10, and the foreign matter that is not supposed to such as dust, suspended particles or suchlike can not be by sound hole 10.Correspondingly, can prevent to comprise the deterioration of performance of the microphone 100 of PCB 1.
In addition, in embodiments of the present invention,,, foreign matter can play ground connection so flowing into prevention member 20 because foreign matter flow into to stop member 20 to be formed by conducting metal.Correspondingly, because the insufficient contact area that their miniature sizes causes, so the sound effect of not expecting that produces in traditional mini microphone can be minimized.
According to the embodiment of the invention, it is netted that foreign matter stops member 20 to have, but the present invention is not limited to this.Go up in this respect, Fig. 6 is the amplification view that foreign matter inflow in accordance with another embodiment of the present invention stops the part of member 20a.With reference to figure 6, flow into according to the foreign matter of present embodiment and to stop member 20a can be formed writing board shape rather than netted, and comprise a plurality of through hole 27a by its conduction sound.
In addition, according to embodiment shown in Figure 5, foreign matter flow into to stop member 20 to be formed by metal, but the present invention is not limited to this.Just, foreign matter flows into and stops member 20 to be formed by the nonmetallic materials that comprise a plurality of through holes.
In addition, according to embodiment shown in Figure 5, foreign matter flow into to stop member 20 to have width and the length identical with copper foil layer 30,31 and 33, but the present invention is not limited to this.Just, stop member 20 to introduce foreign matter with stoping by sound hole 10 in covering sound hole 10 as long as foreign matter flows into, the foreign matter inflow stops member 20 can be formed with any size.
Hereinafter, will carry out comparatively detailed description to the microphone 100 that comprises PCB 1 with reference to figure 3 and Fig. 4.
In the present embodiment, microphone 100 comprises shell 102, is formed on shell 102 inside and signal of telecommunication generation unit 112 and PCB 1 that external voice is converted to the signal of telecommunication.
Signal of telecommunication generation unit 112 comprises the MEMS chip.The MEMS chip is installed among the PCB 1 so that corresponding with sound hole 10, and transforms because the acoustic pressure that the sound that is introduced into by sound hole 10 causes converts the signal of telecommunication to.
Can produce the semiconductor processes that MEMS technology to semiconductor processes to the silicon wafer especially adopts integrated circuit technique to the microminiature electromechanical structure by using micro-processing technology to apply, make such MEMS chip.The MEMS chip that uses said method to make forms silicon thin film, is commonly called barrier film and the back plate that the semipermanent electric charge is arranged.Yet, because the present invention is not limited to the MEMS chip, so will not provide detailed description here.
According to microphone 100 of the present invention, foreign matter stops member 20 to be formed in the hole 10, so that foreign matters is introduced in the microphone 100.
In addition, if foreign matter flow into to stop member 20 to be formed by metal, foreign matter flows into and stops member 20 can play the effect of ground connection, and can minimize the sound effect of not expecting because of having increased contact area.Especially, hypomegetic if microphone 100 is formed, such sound effect of not expecting can further be reduced.
Fig. 7 is the cross sectional representation according to another embodiment of the invention microphone 100a.
With reference to figure 7, microphone 100a according to the present invention comprises shell 102a and inner formation and signal of telecommunication generation unit 112a and 114a that external voice is converted to the signal of telecommunication at shell 102a.
Be similar to the above embodiments, in the present embodiment, microphone 100a comprises the PCB 1 that shell is provided thereon.Signal of telecommunication generation unit 112a and 114a are formed on the PCB 1.Sound hole 10 is formed among the PCB 1 and the foreign matter inflow stops member 20 to be formed in the hole 10.
Microphone 100a adopts and to comprise that foreign matter flows into the PCB 1 that stops member 20, thereby obtains and the identical effect of embodiment before.
Signal of telecommunication generation unit 112a is the MEMS chip, and signal of telecommunication generation unit 114a is application-specific integrated circuit (ASIC) (ASIC) semiconductor chip.Because the structure of signal of telecommunication generation unit 112a and 114a is known, so detailed description is not provided herein.Electrode 108a is used to connect microphone 100a to external equipment.
Microphone 100a according to present embodiment comprises the MEMS chip, but the present invention is not limited to this.Just, microphone 100a can not comprise the MEMS chip as signal of telecommunication generation unit, and can comprise the traditional structure with same function.
According to microphone of the present invention can be the microphone that includes any kind of PCB, and this PCB has the sound hole that is formed with foreign matter inflow prevention member therein.
Though the present invention has been carried out detailed demonstration and description with reference to exemplary embodiment of the present invention, it will be appreciated by those skilled in the art that, under situation about not departing from, can carry out various changes to form of the present invention and details by subsequently the spirit and scope of the invention that claim limited.
Claims (6)
1. printing board PCB that in microphone, uses;
Wherein, PCB comprises by piling up and make up a plurality of layer of two-layer or more multi-layered formation,
The sound hole is passed described a plurality of layer and is transmitted through PCB to allow external voice, and
Between described a plurality of layers foreign matter is set and flows into the prevention member, it is bigger than sound hole at least that described foreign matter inflow stops member to be formed at place, sound hole, and wherein, foreign matter flows into the prevention member and comprises a plurality of through holes, and sound can be transmitted by this through hole, but the prevention foreign matter.
2. PCB according to claim 1, wherein, foreign matter flows into and stops member to comprise netted mesh element.
3. PCB according to claim 1, wherein, foreign matter flows into and stops the length of member identical with a plurality of layers that pile up length and width with width.
4. PCB according to claim 3, wherein, foreign matter flows into and stops member to comprise the metal with conductivity.
5. microphone comprises:
Shell;
At inner form and the signal of telecommunication generation unit that external voice is converted to the signal of telecommunication of shell; With
PCB according to claim 1.
6. microphone according to claim 5, wherein, signal of telecommunication generation unit comprises MEMS (micro electro mechanical system) (MEMS) chip.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080027367 | 2008-03-25 | ||
| KR1020080027367A KR100971293B1 (en) | 2008-03-25 | 2008-03-25 | mircophone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101547386A true CN101547386A (en) | 2009-09-30 |
Family
ID=41194204
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200058581U Expired - Lifetime CN201435805Y (en) | 2008-03-25 | 2009-02-25 | Printed circuit board and microphone comprising the same |
| CN200910004457A Pending CN101547386A (en) | 2008-03-25 | 2009-02-25 | Printed circuit board and a microphone comprising the printed circuit board |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200058581U Expired - Lifetime CN201435805Y (en) | 2008-03-25 | 2009-02-25 | Printed circuit board and microphone comprising the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100971293B1 (en) |
| CN (2) | CN201435805Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104854880A (en) * | 2012-08-10 | 2015-08-19 | 美商楼氏电子有限公司 | Microphone assembly with barrier to prevent contaminant infiltration |
| CN106303809A (en) * | 2015-06-09 | 2017-01-04 | 钰太芯微电子科技（上海）有限公司 | A kind of pcb board and water proof type mike and processing technology |
| CN106658956A (en) * | 2017-02-14 | 2017-05-10 | 江苏普诺威电子股份有限公司 | Waterproof and ventilating sound aperture structure and processing technology therefor |
| DE102017115407B3 (en) | 2017-07-10 | 2018-12-20 | Epcos Ag | Manufacturing method for a MEMS component with particle filter |
| CN112399733A (en) * | 2019-08-16 | 2021-02-23 | Oppo（重庆）智能科技有限公司 | Electronic equipment |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102357419B1 (en) * | 2014-01-15 | 2022-02-08 | 엘지이노텍 주식회사 | Printed circuit board and Electronic parts having the same |
| KR102246801B1 (en) * | 2014-01-15 | 2021-04-30 | 엘지이노텍 주식회사 | Printed circuit board and Electronic parts having the same |
| KR20190060158A (en) | 2017-11-24 | 2019-06-03 | (주)파트론 | Directional microphone |
| KR102085201B1 (en) | 2018-11-15 | 2020-04-20 | (주)파트론 | Directional microphone device |
| KR102085210B1 (en) | 2018-11-15 | 2020-03-04 | (주)파트론 | Directional microphone device |
| KR102106170B1 (en) | 2018-12-14 | 2020-04-29 | (주)파트론 | Directional microphone package and method for manufacturing the same |
| KR102209688B1 (en) | 2019-10-29 | 2021-01-29 | (주)파트론 | Directional microphone device |
| KR20210128734A (en) | 2020-04-17 | 2021-10-27 | (주)파트론 | Microphone device |
| KR20220001373A (en) | 2020-06-29 | 2022-01-05 | (주)파트론 | Microphone device |
| KR102350882B1 (en) | 2020-10-29 | 2022-01-13 | (주)다빛센스 | Microphone device |
| CN114136433A (en) * | 2021-12-02 | 2022-03-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | Pulse sound wave signal detection system based on MEMS microphone array |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100406256B1 (en) * | 2001-06-05 | 2003-11-14 | 주식회사 삼부커뮤닉스 | Microphone including printed circuit board having protrusion portion for electrical contact and Method of connecting for it to outer apparatus |
| JP2003133703A (en) | 2001-10-29 | 2003-05-09 | Mitsubishi Electric Corp | Surface-mounting module |
| KR100466403B1 (en) * | 2002-03-08 | 2005-01-13 | 주식회사 삼부커뮤닉스 | Condenser microphone |
| KR100797443B1 (en) * | 2006-07-10 | 2008-01-23 | 주식회사 비에스이 | Packging structure of mems microphone |
-
2008
- 2008-03-25 KR KR1020080027367A patent/KR100971293B1/en active IP Right Grant
-
2009
- 2009-02-25 CN CN2009200058581U patent/CN201435805Y/en not_active Expired - Lifetime
- 2009-02-25 CN CN200910004457A patent/CN101547386A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104854880A (en) * | 2012-08-10 | 2015-08-19 | 美商楼氏电子有限公司 | Microphone assembly with barrier to prevent contaminant infiltration |
| CN110312176A (en) * | 2012-08-10 | 2019-10-08 | 美商楼氏电子有限公司 | Microphone assembly |
| CN104854880B (en) * | 2012-08-10 | 2020-03-20 | 美商楼氏电子有限公司 | Microphone assembly |
| CN106303809A (en) * | 2015-06-09 | 2017-01-04 | 钰太芯微电子科技（上海）有限公司 | A kind of pcb board and water proof type mike and processing technology |
| CN106658956A (en) * | 2017-02-14 | 2017-05-10 | 江苏普诺威电子股份有限公司 | Waterproof and ventilating sound aperture structure and processing technology therefor |
| CN106658956B (en) * | 2017-02-14 | 2023-03-31 | 江苏普诺威电子股份有限公司 | Waterproof and breathable sound hole structure and processing technology thereof |
| DE102017115407B3 (en) | 2017-07-10 | 2018-12-20 | Epcos Ag | Manufacturing method for a MEMS component with particle filter |
| US11787689B2 (en) | 2017-07-10 | 2023-10-17 | Tdk Corporation | MEMS device with particle filter and method of manufacture |
| CN112399733A (en) * | 2019-08-16 | 2021-02-23 | Oppo（重庆）智能科技有限公司 | Electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20090102117A (en) | 2009-09-30 |
| CN201435805Y (en) | 2010-03-31 |
| KR100971293B1 (en) | 2010-07-20 |
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Application publication date: 20090930 |