KR20190060158A - Directional microphone - Google Patents

Directional microphone Download PDF

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Publication number
KR20190060158A
KR20190060158A KR1020170158060A KR20170158060A KR20190060158A KR 20190060158 A KR20190060158 A KR 20190060158A KR 1020170158060 A KR1020170158060 A KR 1020170158060A KR 20170158060 A KR20170158060 A KR 20170158060A KR 20190060158 A KR20190060158 A KR 20190060158A
Authority
KR
South Korea
Prior art keywords
substrate
acoustic
formed
acoustic hole
housing
Prior art date
Application number
KR1020170158060A
Other languages
Korean (ko)
Inventor
박두영
Original Assignee
(주)파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)파트론 filed Critical (주)파트론
Priority to KR1020170158060A priority Critical patent/KR20190060158A/en
Publication of KR20190060158A publication Critical patent/KR20190060158A/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/323Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only for loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Abstract

A directional microphone of the present invention includes a substrate, a housing, a MEMS transducer, and a signal processing element. In one embodiment of the present invention, the substrate includes a second acoustic hole, and the housing may include a first acoustic hole.

Description

[0001] Directional microphone [0002]

The present invention relates to a microphone, and more particularly, to a directional MEMS microphone including a MEMS transducer element and having a directional acoustic characteristic.

2. Description of the Related Art In recent years, electronic devices such as mobile communication terminals such as mobile phones and smart phones, tablet PCs, and MP3 players have become smaller. As a result, parts of electronic devices are becoming smaller. Therefore, development of a MEMS (Micro Electro Mechanical System) technology capable of solving physical limitations of parts is underway.

MEMS technology can be applied to micro-scale micro-sensors, actuators, or electromechanical structures using micro-machining techniques based on integrated circuit technology. The MEMS microphone with such a MEMS technology not only can realize a very small device, but also can manufacture a large number of MEMS microphones on one wafer, thereby enabling mass production.

A variety of techniques for such MEMS microphones are known. For example, Korean Patent Laid-Open Publication No. 10-2007-0053763 (published May 25, 2007) entitled " Silicon condenser microphone and its manufacturing method ", Korean Patent Publication No. 10-2007-0078391 July 31, 2010), and a microphone of Korean Patent Laid-Open No. 10-0971293 (published on July 13, 2010).

Korean Patent Publication No. 10-2007-0053763 (published on May 25, 2007) Korean Patent Publication No. 10-2007-0078391 (Disclosure Date: July 31, 2007) Korean Patent Publication No. 10-0971293 (Published on July 13, 2010)

A problem to be solved by the present invention is to provide a microphone having a directivity characteristic.

Another object to be solved by the present invention is to provide a directional microphone capable of easily adjusting the directivity characteristic of a microphone.

According to an aspect of the present invention, there is provided a directional microphone including a substrate, a housing, a MEMS transducer, and a signal processing device.

The substrate includes a second acoustic hole, and a first acoustic hole is formed in the housing.

The directional microphone according to an embodiment of the present invention has a directivity characteristic and has a merit that it can detect the sound more clearly.

Further, the directional microphone according to an embodiment of the present invention has an advantage that directivity characteristics can be easily adjusted.

1 is a perspective view of a directional microphone according to an embodiment of the present invention.
2 is a rear perspective view of a directional microphone according to an embodiment of the present invention.
3 is a cross-sectional view taken along line AA of FIG.
4 is an exemplary cross-sectional view of the MEMS transducer shown in FIG.
5 and 6 are use state diagrams of a directional microphone according to an embodiment of the present invention.
7 is a cross-sectional view of a directional microphone according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is judged that it is possible to make the gist of the present invention obscure by adding a detailed description of a technique or configuration already known in the field, it is omitted from the detailed description. In addition, terms used in the present specification are terms used to appropriately express the embodiments of the present invention, which may vary depending on the person or custom in the relevant field. Therefore, the definitions of these terms should be based on the contents throughout this specification.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms as used herein include plural forms as long as the phrases do not expressly express the opposite meaning thereto. As used herein, the meaning of "comprising" embodies certain features, areas, integers, steps, operations, elements and / or components, And the like.

Hereinafter, a directional microphone according to an embodiment of the present invention will be described with reference to FIGS. 1 to 6 attached hereto.

1 is a perspective view of a directional microphone according to an embodiment of the present invention. 2 is a rear perspective view of a directional microphone according to an embodiment of the present invention. 3 is a cross-sectional view taken along line A-A in Fig. 4 is an exemplary cross-sectional view of the MEMS transducer shown in FIG. 5 and 6 are use state diagrams of a directional microphone according to an embodiment of the present invention.

1 to 3, a directional microphone according to an embodiment of the present invention includes a substrate 100, a housing 200, a MEMS transducer 400, and a signal processing device 500.

The substrate 100 is formed in the form of a plate, which is a lower part of the directional microphone of the present invention. The substrate 100 may be formed of a printed circuit board (PCB). The substrate 100 may be specifically formed of a rigid printed circuit board, a semiconductor substrate, a ceramic substrate, or the like.

The substrate 100 includes a second acoustic hole 110. The second acoustic holes 110 are formed through the substrate 100. Specifically, the second acoustic hole 110 extends from the inner opening 111 to the outer opening 112. The inner opening 111 of the second acoustic hole 110 may be formed on the upper surface of the substrate and the outer opening 112 may be formed on the side surface of the substrate. In particular, the inner opening 111 of the second acoustic hole 110 is formed to be connected to the lower space of the MEMS transducer 400 to be described later.

The second acoustic hole 110 includes at least a portion that horizontally penetrates the substrate 100. Specifically, the second acoustic hole 110 may include a horizontal portion 113 and a vertical portion 114. The horizontal portion 113 is a portion extending through the substrate 110 in a direction parallel to the upper and lower surfaces of the substrate 110. The vertical part 114 is connected to one end of the horizontal part 113 and extends through the substrate 110 in a direction perpendicular to the upper surface and the lower surface of the substrate 110.

Although the second acoustic holes 110 are shown as being formed in a single hole shape in FIGS. 1 to 3, in some cases, the plurality of holes may be located closely.

A MEMS transducer 400 and a signal processing element 500 to be described later are mounted on the upper surface of the substrate 100. The substrate 100 is coupled with a housing 200 to be described later to form an internal space S1.

The housing 200 is formed to cover the substrate 100. Specifically, the housing 200 is formed with the bottom surface opened, and the bottom is coupled to be covered by the substrate 100. The inner space S1 is formed by the combination of the substrate 100 and the housing 200. [ More specifically, the housing 200 includes an upper surface facing away from the substrate 100, and a side bent downwardly from a rim portion of the upper surface. The lower side of the side surface can be coupled with the substrate 100.

The housing 200 may be connected to the substrate 100 through a solder 150 or the like. Although not shown in the drawing, a ground portion having a ground potential is formed on the substrate 100, and the housing 200 can be electrically connected to the ground portion of the substrate 100 to be coupled.

The housing 200 may be of a can type, for example, made of a metal material or the like. However, the present invention is not limited thereto, and may be formed of the same material as the plastic injection molded article or the substrate 100, as the case may be.

The housing 200 includes a first acoustic hole 210. The first acoustic hole 210 is formed to penetrate a part of the housing 200. Although the first acoustic holes 210 are shown as being formed in a single hole shape in FIGS. 1 to 3, in some cases, the plurality of holes may be located closely.

As shown in FIG. 3, the first acoustic hole 210 may be formed to penetrate the side surface of the housing 200. Specifically, it is preferable that the first acoustic hole 210 is formed at an opposite portion of the portion where the outer opening 112 of the second acoustic hole 110 is formed. The outer opening 112 of the first acoustic hole 100 and the first acoustic hole 210 are formed in directions opposite to each other so that the directivity characteristic can be realized more effectively.

The MEMS transducer 400 is an element that converts a sound signal into an electric signal. The MEMS transducer 400 is mounted on the substrate 100 and accommodated in the inner space S1 formed by the substrate 100 and the housing 200. [ In addition, the MEMS transducer 400 may be electrically connected to the substrate 100 or the signal processing device 500 through a wire 450 or the like. The MEMS transducer (400) provides the converted electrical signal to the signal processing element (500).

The configuration of the MEMS transducer 400 will be described in detail with reference to FIG. Referring to FIG. 4, the MEMS transducer 400 may include a body 149, a back plate 146, and a diaphragm 148. When the back plate 146 and the diaphragm 148 are spaced apart from each other (that is, a cavity is located between the back plate 146 and the diaphragm 148) and the diaphragm 148 is vibrated by the negative pressure, And the capacitance with the plate 146 is measured to sense the acoustic signal. Although the back plate 146 is shown above the diaphragm 148 in the figure, it is not limited thereto. That is, the back plate 146 may be disposed below the diaphragm 148.

The signal processing element 500 amplifies the electric signal transmitted from the MEMS transducer 400. The signal processing device 500 may be, for example, an application-specific integrated circuit (ASIC), but is not limited thereto. The signal processing device 500 may be fixed to the upper surface of the substrate 100 by die bonding or wire bonding.

5 to 6, the directional characteristics of a directional microphone according to an embodiment of the present invention will be described.

Referring to FIG. 5, the directional microphone according to an embodiment of the present invention forms a first acoustic path P1 and a second acoustic path P2.

The first acoustic path P1 is a path from the outside of the housing 200 to the MEMS transducer 400 through the first acoustic hole 210. [

The second acoustic path P 2 is a path extending from the outside of the substrate 100 to the MEMS transducer 400 through the second acoustic hole 110. The first acoustic path P1 follows the top of the MEMS transducer 400 and the second acoustic path P2 follows the bottom of the MEMS transducer 400. [

The second acoustic path P2 may be changed depending on the position and the shape of the second acoustic hole 110. [ Specifically, if the length of the horizontal portion 113 of the second acoustic hole 110 is short, the second acoustic path P2 can be relatively shortened. However, if the length of the horizontal portion 113 of the second acoustic hole 210 is long, the second acoustic path P2 can be relatively extended.

The directional microphone according to an embodiment of the present invention corresponds to a front type that receives sound from the outside of the portion where the first acoustic hole 210 is formed in the housing 200 to the microphone as a main receiving sound . Therefore, the outside direction of the portion where the first acoustic hole 210 of the microphone 200 is formed is referred to as front, and the opposite direction is referred to as rearward. As described above, the outer opening 113 of the second acoustic hole 110 is formed in the opposite direction to the portion of the housing 200 where the first acoustic hole 210 is formed. Therefore, it can be understood that the outer opening 113 of the second acoustic hole 110 faces backward.

In the microphone of the present invention, the sound generated in the front corresponds to the main sound, and the MEMS transducer 400 smoothly receives the sound. However, the sound generated from the backside corresponds to noise and should be removed from the MEMS transducer 400 so as not to affect the reception of the main sound generated in the front.

6, the noise generated from the rear can reach the MEMS transducer 400 through the first acoustic path P1 and reach the MEMS transducer 400 through the second acoustic path P2. can do. At this time, a first time T1 at which the noise sound reaches the MEMS transducer 400 through the first acoustic path P1 and a second time T2 at which the acoustic sound reaches the MEMS transducer 400 through the second acoustic path P2 The two times T2 may be equal to each other. Here, the first time T1 and the second time T2 are equal to each other, and the first time T1 and the second time T2 are completely equal to each other, and the error includes an error that can occur in a manufacturing process. This is because the progress of the noise sound is delayed while passing through the second acoustic hole 110 when the noise sound proceeds through the second acoustic path P2. The passage of the noise sound through the second acoustic hole 110 produces an effect similar to that through a delay unit formed of the same material as the micro-perforated plate.

As such, if the first time T1 and the second time T2 are the same, the noise sound reaches the MEMS transducer 400 through the first acoustic path P1 and the noise sound reaches the second acoustic path < RTI ID = P2 to the MEMS transducer 400 affects the diaphragm of the MEMS transducer 400 at the same time. Therefore, the two sounds propagated through different paths interfere with each other, and the MEMS transducer 400 is hardly affected by the noise signal S1. Therefore, the MEMS transducer 400 recognizes only the main acoustic signal generated in front, and does not recognize the noise signal. In this way, a unidirectional characteristic can be realized.

The extent to which the progress of the noise sound is delayed can be adjusted by adjusting the size and shape of the second acoustic hole 110, thereby adjusting the degree to which the progress of the noise sound is delayed. Specifically, it can be achieved by adjusting the length and width of the horizontal portion 113 of the second acoustic hole 110. As a result, the degree of attenuation of noise or the direction of noise can be adjusted.

Hereinafter, a directional microphone according to another embodiment of the present invention will be described with reference to FIG.

7 is a cross-sectional view of a directional microphone according to another embodiment of the present invention. For convenience of explanation, the differences from those described in Figs. 1 to 6 will be mainly described.

Referring to FIG. 7, the directional microphone of the present embodiment further includes a delay unit 600. The delay unit 600 may be positioned to cover the second acoustic hole 110.

The delay unit 600 serves to delay the acoustic signal coming through the second acoustic path P2. The delay unit 600 may be a plate including micro-perforations. The plate may be, for example, a metal or a semiconductor such as silicon. The metal or silicon has a relatively high heat-resistant temperature, and can easily withstand the operating temperature of the MEMS microphone.

Also, the plate may have one or more micropores. Depending on the number of micro-perforations or the size of the micro-perforations, the degree of delay of the delay unit 600 can be adjusted. That is, if the number of microperforations is large and the size is large, the degree of delay is small. Conversely, if the number of microperforations is small and the size is small, the degree of delay is large.

As described above, the acoustic signal arriving at the MEMS transducer 400 through the second acoustic path P2 is delayed while passing through the second inner space S2, and the degree of delay by the delay unit 600 is . Optionally, the delay unit 600 may be added to reduce the length and size of the second acoustic hole 110, which may contribute to downsizing the overall size of the directional microphone of the present invention.

The embodiments of the directional microphone of the present invention have been described above. The present invention is not limited to the above-described embodiments and the accompanying drawings, and various modifications and changes may be made by those skilled in the art to which the present invention pertains. Accordingly, the scope of the present invention should be determined not only by the claims of the present specification, but also by equivalents to the claims.

100: substrate 110: second acoustic hole
200: housing 210: first sound hole
400: MEMS transducer 500: signal processing element

Claims (8)

  1. Board;
    A housing coupled to the substrate to form an inner space;
    A MEMS transducer coupled to the substrate, the MEMS transducer positioned in the interior space and converting an acoustic signal to an electrical signal; And
    And a signal processing element located in the inner space and electrically connected to the MEMS transducer,
    A first acoustic hole communicating the inner space and the outer space of the housing is formed in the housing,
    And a second acoustic hole is formed in the substrate.
  2. The method according to claim 1,
    Wherein the MEMS transducer includes a sensing portion including a diaphragm,
    Wherein the internal space is divided into a first space and a second space separated by the sensing unit,
    The first acoustic hole communicates with the first space,
    And the second acoustic hole communicates with the second space.
  3. The method according to claim 1,
    Wherein the first acoustic hole and the second acoustic hole are formed so that outer openings opened to an outer space are formed in directions opposite to each other.
  4. The method according to claim 1,
    And the second acoustic hole includes a second acoustic path formed inside the substrate.
  5. 5. The method of claim 4,
    And the second acoustic path is bent at least once inside the substrate.
  6. 5. The method of claim 4,
    Wherein the first acoustic hole includes a first acoustic path formed inside the housing,
    Wherein the first acoustic path is formed to be shorter than the second acoustic path.
  7. The method according to claim 1,
    Wherein the housing includes an upper surface opposed to the substrate while being spaced apart from the substrate, and a side surface connecting the substrate and the upper surface,
    Wherein the first acoustic hole is formed on a side surface of the housing.
  8. The method according to claim 1,
    Wherein the substrate includes an upper surface that directly contacts the inner space, a lower surface that is an opposite surface of the upper surface, and a side surface that connects the upper surface and the lower surface,
    And the second acoustic hole is formed on the side surface.
KR1020170158060A 2017-11-24 2017-11-24 Directional microphone KR20190060158A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070053763A (en) 2004-08-19 2007-05-25 노우레스 일렉트로닉스, 엘엘시 Silicon condenser microphone and manufacturing method
KR20070078391A (en) 2006-01-26 2007-07-31 소니온 엠이엠에스 에이/에스 An elastomeric shield for miniature microphones
KR100971293B1 (en) 2008-03-25 2010-07-20 주식회사 비에스이 mircophone

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070053763A (en) 2004-08-19 2007-05-25 노우레스 일렉트로닉스, 엘엘시 Silicon condenser microphone and manufacturing method
KR20070078391A (en) 2006-01-26 2007-07-31 소니온 엠이엠에스 에이/에스 An elastomeric shield for miniature microphones
KR100971293B1 (en) 2008-03-25 2010-07-20 주식회사 비에스이 mircophone

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