CN101541493A - Thin-plate conveyance method and thin-plate processing device - Google Patents
Thin-plate conveyance method and thin-plate processing device Download PDFInfo
- Publication number
- CN101541493A CN101541493A CNA2008800004664A CN200880000466A CN101541493A CN 101541493 A CN101541493 A CN 101541493A CN A2008800004664 A CNA2008800004664 A CN A2008800004664A CN 200880000466 A CN200880000466 A CN 200880000466A CN 101541493 A CN101541493 A CN 101541493A
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- China
- Prior art keywords
- machined object
- plate
- thin
- platform
- row
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Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004080 punching Methods 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000007599 discharging Methods 0.000 abstract 1
- 230000007246 mechanism Effects 0.000 description 15
- 238000003754 machining Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Punching Or Piercing (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The present invention relates to a thin-plate conveyance method and thin-plate processing device. The thin-plate conveyance method includes: a step of positioning a workpiece on a temporary placement table; a step of sucking, after the positioning, the workpiece by using holes that form at least a row of holes out of the rows of holes, which are formed in the temporary placement table, without sucking portions near two opposite sides of the workpiece; a step of pressing the workpiece by a plate of a conveyance device with the workpiece sucked; a step of discharging, after the pressing, from holes that form rows of holes in the plate; a step of sucking by using the plate; a step of conveying, after the suction by the plate, the workpiece to a processing table; and a step of holding, after the conveyance, the workpiece on the processing table at the two opposite sides of the workpiece. The thin-plate processing is performed with good processing quality maintained.
Description
Technical field
The present invention relates to thin-plate conveyance method and the thin-plate processing device carried behind the machined object location of the thin sheet form that will form by soft materials such as raw cooks.
Background technology
When the machined object to the thin sheet form that formed by soft parts such as existing raw cooks positions, after having carried out the location, position on the absorptive table, adsorb and keep machined object.(for example with reference to patent documentation 1).
Fig. 4 A～Fig. 4 D is the figure of the method for carrying of the existing thin-plate processing device of expression.Among Fig. 4 A, machined object 102 positions by detent mechanism 101 and fixing presetting on the platform 100.What be positioned presets horizontal (Fig. 4 B) that platform 100 is set in Handling device 103.Then, Handling device 103 keeps machined object 102 and carries (Fig. 4 C).After machined object 102 carryings, preset platform 100 and be back to original position (Fig. 4 D).
In addition, in keeping such machined object under the situation of machined object distortion, proofread and correct by the punching press shaping and to be plane (for example with reference to patent documentation 2).
But, in above-mentioned existing thin-plate processing device, with behind the machined object location fixedly the time at machined object with preset and leave air between the platform, and when carrying with preset the platform friction, therefore, fold takes place in machined object easily.Therefore, the quality of the machining object after being difficult to guarantee to keep carrying.
Patent documentation 1:(Japan) spy opens flat 4-22850 communique
Patent documentation 2:(Japan) spy opens the 2001-257126 communique
Summary of the invention
The present invention prevents to carry generation fold and the position skew in the operation, and high-quality machining object is provided.
The invention provides a kind of thin-plate conveyance method, wherein, possess following steps: the machined object of the thin sheet form that will be formed by soft parts positions presetting on the platform; After having carried out the location, utilize hole portion in the hole portion preset a plurality of row of formation that possess on the platform, that under near the state the two opposite edges that does not attract machined object, form at least one row to attract to preset machined object on the platform; Under the state that attracts, carry out punching press with the plate of being located at Handling device; After punching press, the hole portion exhaust of a plurality of row of formation that slave plate possessed; Attract with plate; After plate attraction, machined object is carried to the processing objective table; After carrying, the relative both sides by machined object on the processing objective table keep machined object.
In addition, the invention provides a kind of thin-plate processing device, it possesses: preset platform, it has the hole portion that dismounting attracts the machined object of the thin sheet form that formed by soft parts freely; The location division, the position to machined object positions on platform presetting for it; Handling device, it has the plate that dismounting attracts machined object freely, and from presetting platform carrying machined object; The processing objective table, it is by near the machined object that keeps the Handling device carrying the relative both sides of machined object, and the length on one side of plate is shorter than the interval of the maintenance machined object of processing objective table.
By such structure, guarantee to be set in the positional precision that presets the machined object on the platform, by carrying out punching press and exhaust and attraction, prevent that air is retained and the generation of fold.In addition, can eliminate machined object and the friction of processing between the objective table.
Description of drawings
Figure 1A is the thin-plate processing device of expression embodiment of the present invention and the figure of action thereof;
Figure 1B is the thin-plate processing device of expression embodiment of the present invention and the figure of action thereof;
Fig. 1 C is the thin-plate processing device of expression embodiment of the present invention and the figure of action thereof;
Fig. 1 D is the thin-plate processing device of expression embodiment of the present invention and the figure of action thereof;
Fig. 1 E is the thin-plate processing device of expression embodiment of the present invention and the figure of action thereof;
Fig. 2 is presetting the exhaust on the platform and attracting the figure of mechanism of expression embodiment of the present invention;
Fig. 3 is the flow chart of the thin-plate conveyance method of expression embodiment of the present invention;
Fig. 4 A is the figure of the method for carrying of the existing thin-plate processing device of expression;
Fig. 4 B is the figure of the method for carrying of the existing thin-plate processing device of expression;
Fig. 4 C is the figure of the method for carrying of the existing thin-plate processing device of expression;
Fig. 4 D is the figure of the method for carrying of the existing thin-plate processing device of expression;
Description of reference numerals
1 machined object
2 preset platform
3,4 alignment pins
5,6 detent mechanisms
7 plates
8 Handling devices
9 lowering or hoisting gears
10 processing objective tables
20,21,22 hole portions
221,222 holes
The specific embodiment
At first, the thin-plate processing device to processing machined object 1 describes.
Figure 1A～Fig. 1 E is the thin-plate processing device of expression embodiment of the present invention and the figure of action thereof.Directions X and Y direction are represented with arrow among Figure 1A.
Slim processing unit (plant) possesses: preset platform 2, location division, Handling device 8, lowering or hoisting gear 9, processing objective table 10.The machined object 1 of thin sheet form is formed by soft parts.The platform 2 that presets of machined object 1 has and exhaust described later and the hole portion 20,21,22 that attracts mechanism to be connected.
The location division is made of alignment pin 3,4 and detent mechanism 5,6, and the position to machined object positions on the platform 2 presetting.Promptly, alignment pin 3 becomes the benchmark that presets the directions X on the platform 2, alignment pin 4 becomes the benchmark of Y direction, and 6 pairs of the detent mechanism 5 of directions X and the detent mechanisms of Y direction never position the position that supplies to the machined object 1 that presets platform 2, the supply position of illustrated machined object.
The size h ratio that carries out the plate 7 of punching press and exhaust and attraction keeps the maintenance size of space H weak point of the processing objective table 10 of machining object 1 by relative both sides.In addition, the length of the Y direction of machined object 1 is longer than the maintenance size of space H of processing objective table 10.
Fig. 2 is presetting the exhaust on the platform and attracting the figure of mechanism of expression embodiment of the present invention.Among Fig. 2, presetting on the platform 2, disposing and exhaust and the hole portion 20,21,22 that attracts mechanism to be connected with becoming three row along the Y direction.The row of the centre in three row are configured in the position that the area by the four limits regulation of surrounding machined object 1 is divided into two five equilibriums in fact.Possess a plurality of holes in each row, for example, machined object 1 (not shown) is fixed on presets on the platform 2 by sucking air from these holes.At this moment, near the hole the relative both sides of the Y of machined object 1 direction (for example hole 221 in the hole portion 22 and hole 222) do not attract machined object 1 (not shown).In addition, the hole portion of at least 1 row attracts machined object 1 (not shown) in the hole portion 20,21,22 of 3 row.
For the thin-plate processing device of above structure, utilize Figure 1A～Fig. 1 E, Fig. 3 that its action is described.
Fig. 3 is the flow chart of the thin-plate conveyance method of embodiment of the present invention.Among Fig. 3, machined object 1 is transported to from the feedway (not shown) of machined object 1 presets platform 2 (S60).Next, make alignment pin 3,4 actions (S61) of the benchmark that becomes the XY direction.From being connected in exhaust and attracting the hole portion 20,21,22 of mechanism to carry out exhaust, simultaneously, position (S63) by detent mechanism 5,6.Near hole, both sides relative on the Y direction of machined object 1 does not attract machined object 1.In addition, at least 1 row hole portion attracts machined object 1 in the hole portions 20,21,22 of 3 row, like this machined object 1 is fixed in preset platform 2 after, the detent mechanism 3,4,5,6 of action is back to original position (S64, Figure 1A).
Next, Handling device 8 actions, plate 7 moves to the position of presetting platform 2.And, under above-mentioned state, make lowering or hoisting gear 9 make down maneuver and carry out punching press (S65, Figure 1B) at the machined object 1 that presets on the platform 2 by 7 pairs of attractions of plate.Preset platform 2 and plate 7 mutual exhausts, thereafter, after attracting each other, carry out mutual exhaust (S66) once more.At this moment, discharge be clipped in machined object 1 and preset platform 2 and machined object 1 and plate 7 between air.And, presetting platform 2 and carry out exhaust, plate 7 attracts, and makes lowering or hoisting gear 9 carry out vertical motion and joins (S67).Machined object 1 is not having fold and is retaining under the air state to be attracted (Fig. 1 C) by plate 7.
Secondly, make Handling device 8 actions, make lowering or hoisting gear 9 carry out down maneuver, will be transported to processing mounting table 10 (S68, Fig. 1 D) by the machined object 1 that plate 7 attracts.
Next,, make lowering or hoisting gear 9 carry out vertical motion, join (S69) by processing objective table 10 by near both sides relative on the Y direction, keeping machined object 1.At this moment, the size h of plate 7 that is installed in Handling device 8 is shorter than the maintenance size of space H of the processing objective table (10) that keeps machined object by relative both sides, therefore, can carry out handing-over (figure E1) from last direction by lowering or hoisting gear 9.Therefore, can prevent horizontal machined object 1 that takes place and the friction of bearing platform etc. when moving into action.In addition, processing objective table 10 moves to machining area (not shown) machined object 1 is processed.
More than a series of processing operation finish (S70).
What be provided with on the platform 2 with presetting of the thin-plate processing device of present embodiment in addition, is listed as formation with exhaust and the hole portion that attracts mechanism to be connected with 3.But these row are not limited to 3 row, can be 4 row or 5 row.But columns is under the situation of odd number, wishes that the row of central authorities are configured in the position that the area that will surround four limit defineds of machined object is divided into two five equilibriums in fact.
Industrial utilizability
According to method for carrying of the present invention and thin-plate processing device, the product of the fold in can preventing from processing etc. Give birth to, can carry out simply the good processing of precision, industrial be useful.
Claims (4)
1, a kind of thin-plate conveyance method wherein, possesses following steps:
The machined object of the thin sheet form that will be formed by soft parts positions presetting on the platform;
After having carried out described location, utilize described hole in the described hole portion of presetting a plurality of row of formation that possess on the platform, that under near the state the two opposite edges that does not attract described machined object, form at least one row portion to attract the described described machined object that presets on the platform;
Under the state of described attraction, carry out punching press with the plate of being located at Handling device;
After described punching press, from the hole portion exhaust of a plurality of row of formation that described plate possessed;
Attract with described plate;
After described plate attraction, described machined object is carried to the processing objective table;
After described carrying, the relative both sides by described machined object on described processing objective table keep described machined object.
2, a kind of thin-plate processing device is characterized in that, possesses:
Preset platform, it has the hole portion that dismounting attracts the machined object of the thin sheet form that formed by soft parts freely;
The location division, it presets described that the position to described machined object positions on the platform;
Handling device, it has the plate that dismounting attracts described machined object freely, and from the described platform carrying machined object that presets;
The processing objective table, the described machined object that it is come by near the described Handling device carrying of the maintenance relative both sides of described machined object,
The length on one side of described plate is shorter than the interval of the maintenance machined object of described processing objective table.
3, thin-plate processing device as claimed in claim 2, wherein, described hole portion constitutes a plurality of row, utilizes the described hole portion that forms at least one row under near the state that does not attract the relative both sides of described machined object, attracts the described described machined object that presets on the platform.
4, thin-plate processing device as claimed in claim 3, wherein, described row in a plurality of described row are disposed at, and will be divided into the position of two five equilibriums by the area of the four limits regulation of surrounding described machined object.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP064764/2007 | 2007-03-14 | ||
| JP2007064764 | 2007-03-14 | ||
| PCT/JP2008/000539 WO2008111311A1 (en) | 2007-03-14 | 2008-03-12 | Thin-plate conveyance method and thin-plate processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101541493A true CN101541493A (en) | 2009-09-23 |
| CN101541493B CN101541493B (en) | 2011-08-24 |
Family
ID=39759254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800004664A Active CN101541493B (en) | 2007-03-14 | 2008-03-12 | Thin-plate conveyance method and thin-plate processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5110078B2 (en) |
| CN (1) | CN101541493B (en) |
| TW (1) | TWI383875B (en) |
| WO (1) | WO2008111311A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103481355A (en) * | 2013-09-27 | 2014-01-01 | 福建群峰机械有限公司 | Novel brick splitter |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3053104B2 (en) * | 1990-05-18 | 2000-06-19 | 株式会社日立製作所 | Thin plate holding device |
| JP3567802B2 (en) * | 1999-06-28 | 2004-09-22 | 株式会社村田製作所 | Manufacturing method of multilayer ceramic electronic component |
| JP3417376B2 (en) * | 2000-03-13 | 2003-06-16 | 株式会社村田製作所 | Manufacturing method and manufacturing apparatus for multilayer ceramic electronic component |
| JP4438269B2 (en) * | 2002-04-04 | 2010-03-24 | 株式会社村田製作所 | Processing method of ceramic green sheet |
| JP2004031489A (en) * | 2002-06-24 | 2004-01-29 | Murata Mfg Co Ltd | Ceramic green sheet peeling method and ceramic green sheet peeling device |
| JP2004276279A (en) * | 2003-03-13 | 2004-10-07 | Murata Mfg Co Ltd | Ceramic green sheet with support film and its manufacturing method |
| CN1792746A (en) * | 2005-12-27 | 2006-06-28 | 友达光电股份有限公司 | Working piece deliverying method and hold thereof |
-
2008
- 2008-03-12 CN CN2008800004664A patent/CN101541493B/en active Active
- 2008-03-12 WO PCT/JP2008/000539 patent/WO2008111311A1/en active Application Filing
- 2008-03-12 TW TW097108664A patent/TWI383875B/en active
- 2008-03-12 JP JP2009503907A patent/JP5110078B2/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103481355A (en) * | 2013-09-27 | 2014-01-01 | 福建群峰机械有限公司 | Novel brick splitter |
| CN103481355B (en) * | 2013-09-27 | 2015-11-11 | 福建群峰机械有限公司 | One splits brick machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2008111311A1 (en) | 2010-06-24 |
| WO2008111311A1 (en) | 2008-09-18 |
| CN101541493B (en) | 2011-08-24 |
| TWI383875B (en) | 2013-02-01 |
| JP5110078B2 (en) | 2012-12-26 |
| TW200902269A (en) | 2009-01-16 |
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| C14 | Grant of patent or utility model | ||
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