CN101540331B - 影像显示系统及其制造方法 - Google Patents
影像显示系统及其制造方法 Download PDFInfo
- Publication number
- CN101540331B CN101540331B CN2009100092394A CN200910009239A CN101540331B CN 101540331 B CN101540331 B CN 101540331B CN 2009100092394 A CN2009100092394 A CN 2009100092394A CN 200910009239 A CN200910009239 A CN 200910009239A CN 101540331 B CN101540331 B CN 101540331B
- Authority
- CN
- China
- Prior art keywords
- dielectric layer
- layer
- bottom electrode
- active layer
- image display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 239000004973 liquid crystal related substance Substances 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 238000009434 installation Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 229920005591 polysilicon Polymers 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 238000002513 implantation Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 18
- 238000003860 storage Methods 0.000 description 18
- 150000002500 ions Chemical class 0.000 description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4908—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET for thin film semiconductor, e.g. gate of TFT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/052,197 US8045082B2 (en) | 2008-03-20 | 2008-03-20 | System for display images and fabrication method thereof |
US12/052,197 | 2008-03-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101540331A CN101540331A (zh) | 2009-09-23 |
CN101540331B true CN101540331B (zh) | 2013-11-20 |
Family
ID=41088511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100092394A Expired - Fee Related CN101540331B (zh) | 2008-03-20 | 2009-02-25 | 影像显示系统及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8045082B2 (zh) |
CN (1) | CN101540331B (zh) |
TW (1) | TWI383230B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8617941B2 (en) * | 2011-01-16 | 2013-12-31 | International Business Machines Corporation | High-speed graphene transistor and method of fabrication by patternable hard mask materials |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5767930A (en) * | 1994-05-20 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Active-matrix liquid crystal display and fabrication method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6833883B2 (en) * | 2001-02-13 | 2004-12-21 | Lg. Philips Lcd Co., Ltd. | Array substrate for reflective and transflective liquid crystal display devices and manufacturing method for the same |
KR100617031B1 (ko) * | 2003-12-30 | 2006-08-30 | 엘지.필립스 엘시디 주식회사 | 반사투과형 액정표시장치 및 그 제조방법 |
TWI297548B (en) * | 2006-06-19 | 2008-06-01 | Au Optronics Corp | Pixel structure for flat panel display and method for fabricating the same |
TW200814326A (en) * | 2006-09-08 | 2008-03-16 | Wintek Corp | Thin film transistor liquid crystal display panel and the method of making same |
-
2008
- 2008-03-20 US US12/052,197 patent/US8045082B2/en active Active
-
2009
- 2009-02-20 TW TW098105425A patent/TWI383230B/zh not_active IP Right Cessation
- 2009-02-25 CN CN2009100092394A patent/CN101540331B/zh not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5767930A (en) * | 1994-05-20 | 1998-06-16 | Mitsubishi Denki Kabushiki Kaisha | Active-matrix liquid crystal display and fabrication method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW200941104A (en) | 2009-10-01 |
US20090237580A1 (en) | 2009-09-24 |
US8045082B2 (en) | 2011-10-25 |
TWI383230B (zh) | 2013-01-21 |
CN101540331A (zh) | 2009-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: QIMEI ELECTRONIC CO LTD Free format text: FORMER OWNER: TONGBAO OPTOELECTRONICS CO., LTD. Effective date: 20131107 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: INNOLUX DISPLAY CORPORATION Free format text: FORMER NAME: QIMEI ELECTRONIC CO LTD |
|
CP03 | Change of name, title or address |
Address after: Hsinchu Science Park, Taiwan, China Patentee after: INNOLUX DISPLAY CORP. Address before: Miaoli County, Taiwan, China Patentee before: CHI MEI OPTOELECTRONICS CORP. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131107 Address after: Miaoli County, Taiwan, China Patentee after: CHI MEI OPTOELECTRONICS CORP. Address before: Hsinchu science industry zone, Taiwan, China Patentee before: TOPPOLY OPTOELECTRONICS Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20200225 |
|
CF01 | Termination of patent right due to non-payment of annual fee |