CN101539252A - LED lamp encapsulation structure with bolt - Google Patents

LED lamp encapsulation structure with bolt Download PDF

Info

Publication number
CN101539252A
CN101539252A CN200910115257A CN200910115257A CN101539252A CN 101539252 A CN101539252 A CN 101539252A CN 200910115257 A CN200910115257 A CN 200910115257A CN 200910115257 A CN200910115257 A CN 200910115257A CN 101539252 A CN101539252 A CN 101539252A
Authority
CN
China
Prior art keywords
bolt
electrode pin
encapsulation structure
led lamp
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910115257A
Other languages
Chinese (zh)
Inventor
裘国江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN200910115257A priority Critical patent/CN101539252A/en
Publication of CN101539252A publication Critical patent/CN101539252A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention belongs to the field of LED encapsulation structure technology, relating to an LED lamp encapsulation structure with a bolt; the encapsulation structure comprises an LED wafer and an electrode pin; the upper part of the bolt is provided with a PCB plate and the LED wafer; the lower surface of the PCB plate is provided with a concentric ring-shaped electrode pin; the electrodes on the LED wafer are electrically connected with the electrode pins or the bolt and the electrode pin respectively; the PCB plate on the electrode pin, the bolt and the LED wafer are covered by a transparent plastic rubber. The LED lamp encapsulation structure has the advantages that when in use, the bolt is only fastened on a target substrate without needs of manual welding; furthermore, after the positions of the anode and the cathode are uniformly standardized, the wiring error of reversed polarity can be avoided; the bolt has a function of heat accumulation and heat conduction simultaneously; and the bolt is closely bonded to the heat dissipation part and has large area, thus having better heat dissipation effect and convenient maintenance and replacement in the future.

Description

The LED lamp encapsulation structure of strap bolt
Technical field
The invention belongs to LED encapsulating structure technical field, refer in particular to a kind of LED lamp encapsulation structure of strap bolt.
Background technology
The LED lamp is as a kind of luminescent device that directly electric energy is converted into visible light and radiant energy, it is low to have operating voltage, power consumption is little, the luminous efficiency height, emission response time is short, product itself and and manufacturing process all pollution-free, shock resistance, vibration resistance, stable and reliable for performance, in light weight, volume is little, and cost is low, series of advantages such as the life-span is long, be widely applied to fields such as light source on the LCD screen, projecting lamp, traffic lights, auto lamp, and beginning day by day replaces traditional filament bulb, be considered to top quality light source of 21 century.
The encapsulating structure of traditional LED lamp generally has straight cutting and two kinds of packing forms of paster, as shown in Figure 1, direct insertion LED lamp generally has a long and short two electrode pin 2, is respectively both positive and negative polarity, the LED wafer encapsulates with plastic shell 1, and the bottom is that insulating base is used for fixing electrode pin; The adopting surface mounted LED lamp generally is a rectangular base, the LED wafer is positioned at the middle part, two of rectangular base is provided with electrode pin, electrode pin adopts high heat radiating metal to make, to realize thermolysis to the LED wafer, adopt the LED of above-mentioned two kinds of packing forms, all must the technical staff it be welded on printed circuit board (pcb) or the relevant electronic equipment, its weak point is: the one, when using, need the technical staff that the both positive and negative polarity of LED lamp is welded on circuit board or the relevant electronic equipment, easily polarity is connect instead during welding, even burn out other electron component in the circuit; The 2nd, the radiating effect of LED lamp is not very good, causes reduce the service life of LED lamp.
Summary of the invention
The purpose of this invention is to provide a kind of good heat dissipation effect, exempt from the LED lamp encapsulation structure of the strap bolt that welds in use.
The object of the present invention is achieved like this:
The LED lamp encapsulation structure of strap bolt, comprise LED wafer and electrode pin, be provided with pcb board and LED wafer on the top of bolt, be provided with the electrode pin of concentric circles annular at the lower surface of pcb board, electrode on the LED wafer is respectively with electrode pin or be electrically connected the pcb board on the electrode pin, bolt and LED wafer perspex sealing cover respectively with bolt and electrode pin.
The electrode pin of above-mentioned concentric circles annular and bolt are concentric circles, and the internal diameter of the inner ring of the electrode pin of concentric circles annular is greater than the external diameter of bolt.
Above-mentioned concentric circles annular electrode pin has a circle at least.
The top semicircular in shape of above-mentioned perspex sealing cover, a ring-shaped step is arranged at the bottom, and the bottom flushes with pcb board.
Above-mentioned bolt is that metal or the nonmetallic materials that good or thermal conductivity and electric conductivity are all good with thermal conductivity are made.
The electrode pin of above-mentioned concentric circles annular also can replace with the spring leaf of good conductivity, and spring leaf is arranged on the placement of the electrode pin of concentric circles annular.
The outstanding compared to existing technology advantage of the present invention is:
The present invention only needs use proper implements when using, with the bolted in the present invention an existing silk tooth, and the target base plate of the printing ring that coincide of prefabricated electrode retaining collar on, or see through substrate and directly be screwed on the radiator below the substrate just passable.Need not manual welding, therefore can abolish the operation of erection welding LED aborning, such benefit, can avoid LED in assembling process, to be subjected to static and welding high-temperature damage to greatest extent, and after the unified standard of both positive and negative polarity position, can thoroughly stop polarity and connect anti-possibility, bolt among the present invention also plays the effect of accumulation of heat and heat conduction simultaneously, tight and area is big because of the joint of itself and radiator portion, radiating effect is desirable more, also having a benefit is exactly that the situation that LED damages takes place, and need not soldering appliance, even maintenance that in the open air also can be easy and convenient is changed.
Description of drawings
Fig. 1 is the schematic perspective view of background technology;
Fig. 2 is a schematic perspective view of the present invention;
Fig. 3 is a cutaway view of the present invention;
Fig. 4 is the upward view of Fig. 3;
Fig. 5 is the cutaway view of second kind of structure of the present invention;
Fig. 6 is the cutaway view of the third structure of the present invention.
The specific embodiment
With specific embodiment also in conjunction with the accompanying drawings, the present invention is further described below:
Embodiment 1, referring to Fig. 2-4:
The LED lamp encapsulation structure of strap bolt, comprise LED wafer 20 and electrode pin 40, top at metal (generally selecting the copper or the aluminum material of good heat conductivity for use) bolt 60 is provided with pcb board 50 and LED wafer 20, the edge shape of pcb board 50 can be according to the shape of standard nut, perhaps be made into the special hole slot that can twist with the specific purpose tool of correspondence, be provided with the electrode pin 40 of two circle concentric circles annulars at the lower surface of pcb board 50, the quantity of annular electrode pin 40, can be according to the kind increase and decrease of packaged chip, electrode 30 on the LED wafer 20 is electrically connected with electrode pin 40 respectively, the pcb board 50 on the electrode pin 40, bolt 60 and LED wafer 20 usefulness perspex sealing covers 10.
The electrode pin 40 and the bolt 60 of above-mentioned concentric circles annular are concentric circles, and the internal diameter of the inner ring of the electrode pin 40 of concentric circles annular is greater than the external diameter of bolt 60.
The top semicircular in shape 11 of above-mentioned perspex cover 10, bottom have a ring-shaped step 12, and the bottom flushes with pcb board 50.
Above-mentioned bolt 60 is that metal or the nonmetallic materials that good or thermal conductivity and electric conductivity are all good with thermal conductivity are made.
The electrode pin 40 of above-mentioned concentric circles annular also can replace with the spring leaf of good conductivity, and spring leaf is arranged on the placement of the electrode pin of concentric circles annular.
Embodiment 2, referring to Fig. 5:
The structure of embodiment 2 is substantially the same manner as Example 1, difference is: electrode pin 40 has been made a circle, an electrode 30 of LED wafer 20 is electrically connected with bolt 60, bolt is used as one of them electrode pin herein, and another electrode 30 is electrically connected with the electrode pin 40 of annular.
Embodiment 3, referring to Fig. 6:
The structure of embodiment 3 is substantially the same manner as Example 1, and difference is: three electrodes 30 are arranged on the LED wafer 20, and an electrode 30 of LED wafer 20 is electrically connected with bolt 60, and two electrodes 30 are electrically connected with the electrode pin 40 of annular respectively in addition.
Certainly, electrode 30 quantity on the LED wafer 20 can be more, but no matter what, electrode 30 quantity on the LED wafer 20 should equate with the number of turns of the electrode pin 40 of annular or the number of spring leaf, or equate with bolt number sum, so that realize being electrically connected with the number of turns of electrode pin 40 or the number of spring leaf.
During application, the bolt among the present invention is tightened on has corresponding installation screw and connect on the circuit board of electricity ring, promptly install; When single LED lamp of the present invention damages, can screw off the LED lamp of damage, replace with new LED lamp, just can make the whole LED lamp as excellent as before, repair and replacement are convenient, do not need welding; Certainly, bolt can directly be tightened on bolt on the circuit board that is threaded the hole with being connected of circuit board, also bolt can be passed circuit board with holes, cooperated with bolt with nut the present invention is connected on the circuit board again.
The foregoing description is one of preferred embodiment of the present invention only, is not to limit protection scope of the present invention according to this, so: all equivalences of doing according to structure of the present invention, shape, principle change, and all should be covered by within protection scope of the present invention.

Claims (6)

1, the LED lamp encapsulation structure of strap bolt, comprise LED wafer and electrode pin, it is characterized in that: be provided with pcb board and LED wafer on the top of bolt, be provided with the electrode pin of concentric circles annular at the lower surface of pcb board, electrode on the LED wafer is respectively with electrode pin or be electrically connected the pcb board on the electrode pin, bolt and LED wafer perspex sealing cover respectively with bolt and electrode pin.
2, according to the LED lamp encapsulation structure of the described strap bolt of claim 1, it is characterized in that: the electrode pin of described concentric circles annular and bolt are concentric circles, and the internal diameter of the inner ring of the electrode pin of concentric circles annular is greater than the external diameter of bolt.
3, according to the LED lamp encapsulation structure of the described strap bolt of claim 1, it is characterized in that: described concentric circles annular electrode pin has a circle at least.
4, according to the LED lamp encapsulation structure of the described strap bolt of claim 1, it is characterized in that: the top semicircular in shape of above-mentioned perspex sealing cover, a ring-shaped step is arranged at the bottom, the bottom flushes with pcb board.
5, according to the LED lamp encapsulation structure of the described strap bolt of claim 1, it is characterized in that: described bolt is that metal or the nonmetallic materials that good or thermal conductivity and electric conductivity are all good with thermal conductivity are made.
6, according to the LED lamp encapsulation structure of the described strap bolt of claim 1, it is characterized in that: the electrode pin of described concentric circles annular also can replace with the spring leaf of good conductivity, and spring leaf is arranged on the placement of the electrode pin of concentric circles annular.
CN200910115257A 2009-04-27 2009-04-27 LED lamp encapsulation structure with bolt Pending CN101539252A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200910115257A CN101539252A (en) 2009-04-27 2009-04-27 LED lamp encapsulation structure with bolt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200910115257A CN101539252A (en) 2009-04-27 2009-04-27 LED lamp encapsulation structure with bolt

Publications (1)

Publication Number Publication Date
CN101539252A true CN101539252A (en) 2009-09-23

Family

ID=41122584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910115257A Pending CN101539252A (en) 2009-04-27 2009-04-27 LED lamp encapsulation structure with bolt

Country Status (1)

Country Link
CN (1) CN101539252A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011029154A1 (en) * 2009-09-10 2011-03-17 Hamish Mclennan Improved light emitting diode (led) assembly and method of manufacturing the same
CN102184685A (en) * 2011-04-22 2011-09-14 深圳市中庆微科技开发有限公司 Urltra-light and ultrathin LED display screen
CN104048194A (en) * 2013-03-16 2014-09-17 深圳市邦贝尔电子有限公司 LED (Light Emitting Diode) lamp bead and optical component
CN113767247A (en) * 2019-03-07 2021-12-07 宜家供应有限公司 Light source and lamp

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011029154A1 (en) * 2009-09-10 2011-03-17 Hamish Mclennan Improved light emitting diode (led) assembly and method of manufacturing the same
CN102184685A (en) * 2011-04-22 2011-09-14 深圳市中庆微科技开发有限公司 Urltra-light and ultrathin LED display screen
CN102184685B (en) * 2011-04-22 2015-11-11 深圳市中庆微科技开发有限公司 A kind of ultralight ultra-thin LED display
CN104048194A (en) * 2013-03-16 2014-09-17 深圳市邦贝尔电子有限公司 LED (Light Emitting Diode) lamp bead and optical component
CN113767247A (en) * 2019-03-07 2021-12-07 宜家供应有限公司 Light source and lamp

Similar Documents

Publication Publication Date Title
JP6007325B2 (en) General-purpose LED bulb construction method, flange snap ring type LED bulb and LED lamp
KR20150086226A (en) Method for constructing universal led bulb and snap ring lens type led bulb and led lamp
CN101980388A (en) Radiator package-based LED device and manufacturing process for LED device
CN101539252A (en) LED lamp encapsulation structure with bolt
CN201149869Y (en) LED encapsulation structure
CN201373367Y (en) High-power LED light source module adopting semiconductor for cooling
CN201401747Y (en) LED encapsulation structure with bolts
CN207455482U (en) A kind of mounting structure of car light LED chip
CN201925782U (en) LED (light-emitting diode) lamp
CN204611455U (en) All-round smooth Dimmable LED light fixture
CN201779608U (en) Heat dissipating device for LED lamp
CN202215985U (en) Metal bolt type high-power LED (light-emitting diode) light source
CN2706871Y (en) Radiating device for LED
CN2706872Y (en) Radiating device for LED
KR20100001116A (en) Heat radiating led mount and lamp
CN201368359Y (en) LED luminous module
CN2932076Y (en) High power light-emitting diode lighting device
CN202074312U (en) High-power light emitting diode (LED) tube lamp with high light emitting efficiency
CN213810085U (en) Novel high-efficient radiating LED ball bubble lamp
CN201412696Y (en) led illuminating apparatus
CN204201656U (en) Led light source module and led street lamp
CN204756489U (en) Heat radiator for be used for explosion -proof non -maintaining LED light
CN202189831U (en) High-power high-brightness LED light source packaging structure
CN201475728U (en) Ultra-high power integrated packaging LED module
CN204268280U (en) A kind of LED light lamp with so lder ball bonding

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20090923