CN201412696Y - led illuminating apparatus - Google Patents
led illuminating apparatus Download PDFInfo
- Publication number
- CN201412696Y CN201412696Y CN2008201298732U CN200820129873U CN201412696Y CN 201412696 Y CN201412696 Y CN 201412696Y CN 2008201298732 U CN2008201298732 U CN 2008201298732U CN 200820129873 U CN200820129873 U CN 200820129873U CN 201412696 Y CN201412696 Y CN 201412696Y
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- light source
- led light
- pedestal
- layer
- lighting device
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Abstract
The present utility model relates to an LED illuminating apparatus comprising a base, an LED unit, a power supply circuit board, wherein, the inner part of the base has at least one cavity, the base is made of aluminum, the inner and outer surface layers of the aluminum base have tight aluminum oxide layers with the thickness bigger than or equal to 20 micron; The LED unit comprises at least one LED illuminating source, the outer surface of the base provides an area for installing the LED illuminating source, copper conductive layers is positioned at the area of the base for wire connection, positive and negative electrodes of the LED illuminating source are electrically connected with the corresponding copper conductive layers, and a heat conducting part at the bottom of the LED illuminating source directly contacts with the aluminum oxide layer; The power supply circuit board is used for electrically connecting an external power supply with the LED illuminating source, the power supply circuit board is closed inside the base. Heat energy generated by the LED illuminating source can be transmitted to the outside quickly because the base is made of aluminum. The power supply circuit board is directly sealed in the cavity of the base for achieving a waterproof effect.
Description
Technical field
The utility model relates to a kind of lighting device, is meant a kind of luminous LED lighting device of led light source that utilizes especially.
Background technology
Characteristics such as the LED lighting device is energy-conservation owing to having, long service life are widely used on the lighting apparatus in a lot of fields.Though light emitting diode is a kind of cold light source, when the power of whole LED lighting device was very big, itself also can send a large amount of heats the LED lighting device.At present, having a lot, enumerating two pieces of technology in the patent documentation below and commenting about how solving the technology of LED lighting device heat dissipation problem:
Publication number is to have introduced a kind of LED lamp that dispels the heat good in the Chinese patent " high-powered LED lamp " of CN101270868A, this lamp as shown in Figure 8, comprise lamp housing 1, power control circuit 2 and the great power LED lamp body 3 that is electrically connected with it, the great power LED lamp body is made up of substrate 31 and the LED light emitting diode 32 that is located on the substrate, the opening of lamp housing 1 is provided with printing opacity light cover 6, be provided with heat-dissipating aluminium plate 4 between lamp housing 1 and the printing opacity light cover 6, substrate 31 contacts with heat-dissipating aluminium plate 4, lamp housing 1 is provided with the fan 5 that blows to heat-dissipating aluminium plate 4, printing opacity light cover 6 fronts are provided with reflection shield 7, the bottom of reflection shield 7 is provided with the hole, the LED light emitting diode stretches in the reflection shield 7 along the hole, and the limit, hole of reflection shield acts on it is crimped on the heat-dissipating aluminium plate.In the LED lamp of this structure, the heat that LED light emitting diode 32 sends at first conducts to heat-dissipating aluminium plate 4 via substrate 31, the heat that is positioned on the heat-dissipating aluminium plate 4 blows away via fan 5 again, though the LED lamp of this structure can solve heat dissipation problem, but because the parts that are used to dispel the heat are too many, thereby make that the volume of LED lamp is very big, and in this example, in order to make power control circuit 2 can not be subjected to extraneous gas, the influence of water, also power control circuit 2 usefulness lamp housings 1 will be closed, common this lamp housing 1 all is to be made of plastic material, so the resistance to compression poor effect, run into the collision in some external worlds, make power control circuit 2 be exposed in the external environment probably.
Publication number is the Chinese patent " LED illuminating lamp " of CN101000131A, and this illuminating lamp also designs at the heat dissipation technology problem of known illuminating lamp.As shown in Figure 9, it mainly is made of head-shield 1, led board 2, luminous tube 10, heat radiation aluminium cover 4, fan 5, circuit board 6, tail-hood 7, needle stand 8, contact pin 9, and the design main points are head-shield 1 and led board 2, luminous tube 10 corresponding settings; The extension block of head-shield 1 and heat radiation aluminium cover 4 are connected and fixed by screw, in heat radiation aluminium cover 4 fan 5 are set.Fan 5 connects the circuit board 6 in the tail-hoods 7, and tail-hood 7 and heat radiation aluminium cover 4 are connected and fixed by screw, and tail-hood 7 connects needle stands 8, contact pin 9, and the power line of circuit board 6 inserts lamp socket again by tail-hood, needle stand, connection contact pin, and it is just bright to connect the power LED luminous tube.The heat radiation of this LED illuminating lamp is also fine, but this LED lighting is the same with above-mentioned " high-powered LED lamp ", all be to rely on heat radiation aluminium cover 4 to dispel the heat with fan 5, and circuit board 6 also is to rely on a tail-hood of establishing in addition 7 to be closed.Therefore, the structure more complicated of this LED illuminating lamp, overall volume is bigger, and aesthetic is bad, and owing to adopted heat radiation aluminium cover, these structures of fan, makes the manufacturing cost of lamp also than higher.
The utility model content
The purpose of this utility model provides a kind of LED lighting device simple in structure, and this device has good heat-radiation effect.
The utility model can be implemented by the following technical programs:
Technical scheme one:
A kind of LED lighting device comprises pedestal, and this base interior has a cavity at least, and the material of described pedestal is an aluminium, and the inside and outside top layer of this aluminium matter pedestal has fine and close alumina layer, and the thickness of described alumina layer is more than or equal to 20 microns; The LED unit, this LED unit comprises at least one led light source, has a zone that is used to install described led light source on the outer surface of described pedestal, described pedestal is provided with the copper conductive layer that is used for wiring being positioned at this location, positive and negative electrode on the described led light source is electrically connected to respectively on the corresponding copper conductive layer, the thermal conduction portions of described led light source bottom and the directly closely contact mutually of described alumina layer; Power supply circuit board, this power supply circuit board are used for extraneous power supply and described led light source are electrically connected, and described power supply circuit board is closed in the cavity of described base interior.
In above-mentioned technical scheme, also be provided with lampshade on the preferred LED lighting device, described lampshade is tightly connected mutually with the outer surface of described pedestal, and described led light source is enclosed in the described lampshade.
In above-mentioned technical scheme, described pedestal preferably is the truncated cones shape.
In above-mentioned technical scheme, it is rectangular-shaped that described pedestal preferably is.
Preferably, the outer surface of described pedestal is provided with many group radiating fins.
In the preferred version of above-mentioned technical scheme, also be provided with the copper heat-conducting layer in the zone that the heat-conducting part phase-splitting heat conduction that is positioned at bottom described led light source is connected on the outer surface of described pedestal, the thermal conduction portions of described led light source bottom is by soldering mode and the heat conduction connection mutually of described copper heat-conducting layer, the thermal conduction portions of described led light source bottom forms the soldering layer when welding with described copper heat-conducting layer, two surfaces of this soldering layer directly are adjacent to mutually with the thermal conduction portions and the described copper heat-conducting layer of described led light source bottom respectively.The area of described led light source bottom is less than the area of described soldering layer, the area of the described copper heat-conducting layer that the area of described soldering layer connects less than phase heat conduction with it.
Described copper conductive layer and copper heat-conducting layer preferably adopt PVD mode or mode of printing to be formed on the outer surface of described pedestal.Positive and negative electrode on the described led light source preferably is electrically connected on the corresponding copper conductive layer by the soldering mode.
Technical scheme two:
A kind of LED lighting device comprises
Pedestal, this base interior has a cavity at least, and the material of described pedestal is an aluminium, and the inside and outside superficial layer of this aluminium matter pedestal is coated with fine and close insulating barrier respectively, the thickness of this insulating barrier is preferred smaller or equal to 0.5mm, and the material of described insulating barrier is an epoxy resin;
The LED unit, this LED unit comprises at least one led light source, has a zone that is used to install described led light source on the outer surface of described pedestal, described pedestal is provided with the copper conductive layer that is used for wiring being positioned at this location, positive and negative electrode on the described led light source is electrically connected to respectively on the corresponding copper conductive layer, the thermal conduction portions of described led light source bottom and the heat conduction connection mutually of described insulating barrier;
Power supply circuit board, this power supply circuit board are used for extraneous power supply and described led light source are electrically connected, and described power supply circuit board is closed in the cavity of described base interior.
In above-mentioned technical scheme, also be provided with lampshade on the preferred described LED lighting device, described lampshade is tightly connected mutually with the outer surface of described pedestal, and described led light source is enclosed in the described lampshade.
Preferably, described pedestal is the truncated cones shape.
Preferably, described pedestal is rectangular-shaped.
Preferably, the outer surface of described pedestal is provided with many group radiating fins.
Preferably, be provided with the copper heat-conducting layer in the zone that the heat-conducting part phase-splitting heat conduction that is positioned at bottom described led light source is connected on the outer surface of described pedestal, the thermal conduction portions of described led light source bottom is by soldering mode and the heat conduction connection mutually of described copper heat-conducting layer, the thermal conduction portions of described led light source bottom forms the soldering layer when welding with described copper heat-conducting layer, two surfaces of this soldering layer directly are adjacent to mutually with the thermal conduction portions and the described copper heat-conducting layer of described led light source bottom respectively.
Preferably, the area of described led light source bottom is less than the area of described soldering layer, the area of the described copper heat-conducting layer that the area of described soldering layer connects less than phase heat conduction with it.
Preferably, described copper conductive layer and copper heat-conducting layer all are to utilize PVD mode or mode of printing to be formed on the outer surface of described pedestal.
Preferably, the positive and negative electrode on the described led light source is electrically connected on the corresponding copper conductive layer by the soldering mode.
Preferably, the thickness of described insulating barrier is preferably smaller or equal to 0.2mm.
Compared with prior art the utility model has obtained following beneficial effect: by the aluminium matter pedestal that an inside and outside superficial layer is insulating barrier is set, on this aluminium matter pedestal, apply the copper conductive layer that is used for wiring again, make the effect that this aluminium matter pedestal can not only serve as mounting base, and, itself be exactly good thermal component because this pedestal is an aluminium material; In addition, the thermal conductivity factor of insulating barrier also reaches 5W/mK above (thermal conductivity factor of aluminium oxide reaches 10W/mK), can reach good heat-conducting effect so allow the thermal conduction portions of led light source bottom directly contact with insulating barrier with this thermal conductivity factor, the heat that led light source sends can be very fast pass through the aluminium lamination of minor insulation layer in the middle of being passed to, and then be delivered to the external world fast by the outer surface of pedestal.In addition, because base interior is provided with cavity, this just can realize power supply circuit board directly is encapsulated in this cavity, reaches good waterproof effect, and because the material of pedestal itself, the intensity of its external force resistance also intensity than former plastic seal shell is big.
In sum, LED lighting device of the present utility model has not only been simplified heat radiation and packaging power
The parts of road plate, and radiating effect is also fine, has solved the contradiction between heat radiation and the manufacturing cost.
Description of drawings
Accompanying drawing 2 is looked cutaway view for the master in this preferred embodiment;
Accompanying drawing 3 is the led light source in this preferred embodiment and the connection diagram of pedestal outer surface;
Accompanying drawing 4 is the stereogram of the pedestal of this preferred embodiment;
Accompanying drawing 5 is the cutaway view of the pedestal of this preferred embodiment along the A-A direction;
Accompanying drawing 6 is the stereogram of the pedestal in another preferred embodiment;
Accompanying drawing 7 is the stereogram of the pedestal in the another preferred embodiment;
Accompanying drawing 8 is the disassembly diagram of the high-powered LED lamp in the background technology;
Accompanying drawing 9 is the disassembly diagram of the LED illuminating lamp in the background technology;
Wherein: 1, lens;
2, pedestal; 21, top on the circle; 22, sidewall; 23, fillet; 24, cavity; 25, wire area; 26, line hole; 2a, outer surface layer; 2b, intermediate layer; 2c, interior surface layers;
3, LED unit; 31, led light source;
4, copper conductive layer; 41, positive electrode conducting layer; 42, negative conducting layer;
5, power supply circuit board; 6, lead; 7, bottom; 8, bolt; 9, plug;
10, copper heat-conducting layer; 11, soldering layer.
The specific embodiment
Referring to Fig. 1, Fig. 2, the preferred embodiment of the utility model LED lighting device comprises a pedestal 2, LED unit 3 and lens 1.
The concrete structure of pedestal 1 as shown in Figure 4, by top 21 on the circle and on the circle circumferential periphery on top 21 constitute along the truncated cones shape sidewall 22 of dispersing extension downwards, an annular fillet 23 is formed on the bottom of this sidewall 22.When lighting device is worked, directly expose in the external world on the sidewall 22 of pedestal 2, and carry out heat exchange with the external world.As shown in Figure 5, cavity 24 of pedestal 2 inner formation, pedestal 2 is a kind of composite bed that is made of three-decker, be that the intermediate layer is aluminium lamination 2b, inside and outside superficial layer is fine and close alumina layer 2a, 2c, fine and close alumina layer can constitute insulating barrier, and the heat-conducting effect of this alumina layer is also relatively good, and thermal conductivity factor is 10W/mK.Usually, pedestal 2 is to be formed by the aluminium sheet compacting that the surface all grows up to compact aluminum oxide, and the thickness of alumina layer will could guarantee alumina layer can not punctured under normal operating voltage like this more than 20 microns.
As shown in fig. 1,3 these LED unit, LED unit comprise a plurality of led light sources 31, has a wire area 25 that is used to install led light source 31 on the outer surface of pedestal 2, pedestal 2 is provided with copper conductive layer 4 and the copper heat-conducting layer 10 that is used for wiring being positioned at regional 25 places, does not have conduction between copper heat-conducting layer 10 and the copper conductive layer 4 and contacts.Copper conductive layer 4 bronze medal heat-conducting layers 10 all are to use a kind of special growth technique to be formed on the alumina layer, special growth technique such as PVD (English Physical Vapor Deposition, i.e. physical vapour deposition (PVD)) mode, mode of printing etc.As shown in Figure 2, copper conductive layer 4 is made of positive electrode conducting layer 41 and negative conducting layer 42, positive and negative electrode on the led light source 31 is electrically connected to respectively on corresponding copper conductive layer 41 and 42, and positive and negative electrode is welded on the corresponding copper conductive layer by the soldering mode usually.The thermal conduction portions of led light source 31 bottoms utilizes soldering mode and copper heat-conducting layer 10 to weld together, as shown in Figure 3, in the soldering process, between the thermal conduction portions of led light source 31 bottoms and copper heat-conducting layer 10, form soldering layer 11, the upper and lower surface of this soldering layer 11 is adjacent to mutually with the thermal conduction portions of led light source 31 bottoms that are positioned at the top and the copper heat-conducting layer 10 that is positioned at the below respectively, and the thermal conduction portions that connects led light source 31 bottoms, back has so just realized the outer surface layer 2a-alumina layer heat conduction connection mutually with pedestal 2.As shown in the figure, the face of soldering layer 11 connects the thermal conduction portions area greater than led light source 31 bottoms, the area of copper heat-conducting layer 10 is again greater than the area of soldering layer 11, the area of the outer surface layer 2a of pedestal 2 is again greater than the area of copper heat-conducting layer 10, realized like this central heat source on the thermal conduction portions of led light source 31 bottoms such as pyramid structure are spread from level to level, made and finally dispel the heat by outer surface layer 2a with the direct substrate contacted 2 in the external world.
Power supply circuit board 5 is used for extraneous power supply and led light source 31 are electrically connected, as shown in FIG., power supply circuit board 5 is closed in the cavity 24 of pedestal 2 inside, by a bottom 7 lower seal of pedestal 2 is got up again, the power supply circuit board 5 that is installed in like this in the cavity 24 just can waterproof, as shown in FIG., also be provided with a plurality of connecting holes on the fillet 23 of substrate 2, also offer a plurality of connecting holes on the bottom 7, just the two can be fixed up by bolt 8, in addition, also it is noted that during connection and assembled the back both must reach close-fitting effect.
In order to make copper conductive layer 1 to be electrically connected with power supply circuit board 5, offering two line holes 26 on the top 21 on the circle of pedestal 2, lead 6 passes from line hole 26, one end and the power supply circuit board 5 of lead 6 are electrically connected, the other end is connected with corresponding copper conductive layer 4, all connects in order to realize both positive and negative polarity, needs two leads 6, one is used for being communicated with positive pole, and one is used to be communicated with negative pole.In addition, the outside of bottom 7 also is equipped with the plug 9 that an energy and household electrical source now are electrically connected, and this plug 9 also is electrically connected by lead 6 and power supply circuit board 5.
As shown in the figure, also be covered with a lampshade 1 on the LED unit 3, lampshade 1 is hemispherical, and lampshade 1 is tightly connected mutually with the outer surface of pedestal 2, and led light source 31 is enclosed in the lampshade 1.Usually the connected mode of lampshade and pedestal can be by offering groove on the outer surface of pedestal, and the lower bottom part circumferential edges with lampshade is embedded in the groove then, by fluid sealant it is sealed again, and lampshade 1 all has light transmissive material to make.
In fact, the structure of pedestal 2 can also be shown in Fig. 6,7, and it is box-packed that the pedestal integral body among Fig. 6 is cuboid, and the surface is formed with a lot of groups of radiating fins, and certainly, the pedestal radiating effect of this mechanism is better certainly.Pedestal among Fig. 7 is to be made of cylindrical and frustroconical parts, and this pedestal also has very big radiating surface and connects, and radiating effect is good.
Commenting below, this has the course of work of the LED lighting device of this kind structure: pedestal 2 is except having a zone 25 because support led light source 31 and the line, the pedestal of remaining sidewall area all is the function that has heat radiation concurrently, by this, when LED unit 3 is luminous, the heat energy that led light source 31 is produced can directly conduct to whole pedestal 2 through top 21 on the circle of this pedestal 2, at this moment, cool ambient air is in the circulation of the sidewall of pedestal 2, thereby make and when pedestal 2 and cool ambient air are carried out heat exchange heat is taken away, reach the lifting radiating effect, this LED lighting device does not need to establish in addition other thermal components, rely on the heat-sinking capability of pedestal self just can rapidly the heat that sends on the LED unit 3 be conducted to the external world, thereby make led light source in the LED lighting device be unlikely to because the inner heat of assembling is too big and burn, promptly make LED lighting device operate as normal always.
Embodiment two:
The structure chart of this embodiment is identical with the above embodiments one, and different is or not to generate fine and close alumina layer on the inside and outside surface of aluminium matter pedestal 2, but by the inside and outside surface-coated insulating barrier of modes such as coating at aluminium matter pedestal 2.The material of insulating barrier is selected epoxy resin for use, epoxy resin is because the characteristic of itself, all fine with the compatibility of aluminium and copper, so promptly apply firm epoxy resins insulation layer easily in the aluminium lamination medial and lateral, and on this insulating barrier, grow easily copper heat-conducting layer and copper conductive layer.It is thin that the thickness of this insulating barrier will be tried one's best, and reaches below the 0.5mm, preferably reaches below the 0.1mm, and insulating barrier can reach micron-sized standard substantially like this, because thickness is thinner, heat can penetrate soon, and be delivered to inner aluminium lamination.
The structure of the LED unit among this embodiment two, power supply circuit board, pedestal itself and the annexation between them all with the above embodiments one in identical, just repeat no more herein.
Above embodiment only is explanation technical conceive of the present utility model and characteristics; its purpose is to allow the people that is familiar with this technology understand content of the present utility model and is implemented; can not limit protection domain of the present utility model with this; all equivalences of doing according to the utility model spirit essence change or modify, and all should be encompassed in the protection domain of the present utility model.
Claims (19)
1, a kind of LED lighting device is characterized in that: comprise
Pedestal, this base interior have a cavity at least, and the material of described pedestal is an aluminium, and the inside and outside superficial layer of this aluminium matter pedestal has fine and close alumina layer, and the thickness of described alumina layer is more than or equal to 20 microns;
The LED unit, this LED unit comprises at least one led light source, has a zone that is used to install described led light source on the outer surface of described pedestal, described pedestal is provided with the copper conductive layer that is used for wiring being positioned at this location, positive and negative electrode on the described led light source is electrically connected to respectively on the corresponding copper conductive layer, the thermal conduction portions of described led light source bottom and the heat conduction connection mutually of described alumina layer;
Power supply circuit board, this power supply circuit board are used for extraneous power supply and described led light source are electrically connected, and described power supply circuit board is closed in the cavity of described base interior.
2, LED lighting device according to claim 1 is characterized in that: also be provided with lampshade on the described LED lighting device, described lampshade is tightly connected mutually with the outer surface of described pedestal, and described led light source is enclosed in the described lampshade.
3, LED lighting device according to claim 1, it is characterized in that: described pedestal is the truncated cones shape.
4, LED lighting device according to claim 1, it is characterized in that: described pedestal is rectangular-shaped.
5, according to claim 1 or 2 or 3 or 4 described LED lighting devices, it is characterized in that: the outer surface of described pedestal is provided with many group radiating fins.
6, LED lighting device according to claim 1, it is characterized in that: also be provided with the copper heat-conducting layer in the zone that the heat-conducting part phase-splitting heat conduction that is positioned at bottom described led light source is connected on the outer surface of described pedestal, the thermal conduction portions of described led light source bottom is by soldering mode and the heat conduction connection mutually of described copper heat-conducting layer, the thermal conduction portions of described led light source bottom forms the soldering layer when welding with described copper heat-conducting layer, two surfaces of this soldering layer directly are adjacent to mutually with the thermal conduction portions and the described copper heat-conducting layer of described led light source bottom respectively.
7, LED lighting device according to claim 6 is characterized in that: the area of described led light source bottom is less than the area of described soldering layer, the area of the described copper heat-conducting layer that the area of described soldering layer connects less than phase heat conduction with it.
8, LED lighting device according to claim 6 is characterized in that: described copper conductive layer and copper heat-conducting layer all are to utilize PVD mode or mode of printing to be formed on the outer surface of described pedestal.
9, LED lighting device according to claim 1 is characterized in that: the positive and negative electrode on the described led light source is electrically connected on the corresponding copper conductive layer by the soldering mode.
10, a kind of LED lighting device is characterized in that: comprise
Pedestal, this base interior has a cavity at least, and the material of described pedestal is an aluminium, and the inside and outside superficial layer of this aluminium matter pedestal is coated with fine and close insulating barrier respectively, the thickness of this insulating barrier is smaller or equal to 0.5mm, and the material of described insulating barrier is an epoxy resin;
The LED unit, this LED unit comprises at least one led light source, has a zone that is used to install described led light source on the outer surface of described pedestal, described pedestal is provided with the copper conductive layer that is used for wiring being positioned at this location, positive and negative electrode on the described led light source is electrically connected to respectively on the corresponding copper conductive layer, the thermal conduction portions of described led light source bottom and the heat conduction connection mutually of described insulating barrier;
Power supply circuit board, this power supply circuit board are used for extraneous power supply and described led light source are electrically connected, and described power supply circuit board is closed in the cavity of described base interior.
11, LED lighting device according to claim 10 is characterized in that: also be provided with lampshade on the described LED lighting device, described lampshade is tightly connected mutually with the outer surface of described pedestal, and described led light source is enclosed in the described lampshade.
12, LED lighting device according to claim 10, it is characterized in that: described pedestal is the truncated cones shape.
13, LED lighting device according to claim 10, it is characterized in that: described pedestal is rectangular-shaped.
14, according to claim 10 or 11 or 12 or 13 described LED lighting devices, it is characterized in that: the outer surface of described pedestal is provided with many group radiating fins.
15, LED lighting device according to claim 10, it is characterized in that: be provided with the copper heat-conducting layer in the zone that the heat-conducting part phase-splitting heat conduction that is positioned at bottom described led light source is connected on the outer surface of described pedestal, the thermal conduction portions of described led light source bottom is by soldering mode and the heat conduction connection mutually of described copper heat-conducting layer, the thermal conduction portions of described led light source bottom forms the soldering layer when welding with described copper heat-conducting layer, two surfaces of this soldering layer directly are adjacent to mutually with the thermal conduction portions and the described copper heat-conducting layer of described led light source bottom respectively.
16, LED lighting device according to claim 15 is characterized in that: the area of described led light source bottom is less than the area of described soldering layer, the area of the described copper heat-conducting layer that the area of described soldering layer connects less than phase heat conduction with it.
17, LED lighting device according to claim 15 is characterized in that: described copper conductive layer and copper heat-conducting layer all are to utilize PVD mode or mode of printing to be formed on the outer surface of described pedestal.
18, LED lighting device according to claim 10 is characterized in that: the positive and negative electrode on the described led light source is electrically connected on the corresponding copper conductive layer by the soldering mode.
19, LED lighting device according to claim 10, it is characterized in that: the thickness of described insulating barrier is less than 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008201298732U CN201412696Y (en) | 2008-12-31 | 2008-12-31 | led illuminating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008201298732U CN201412696Y (en) | 2008-12-31 | 2008-12-31 | led illuminating apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN201412696Y true CN201412696Y (en) | 2010-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008201298732U Expired - Fee Related CN201412696Y (en) | 2008-12-31 | 2008-12-31 | led illuminating apparatus |
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| Country | Link |
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| CN (1) | CN201412696Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102155669A (en) * | 2011-04-22 | 2011-08-17 | 廖光华 | LED (Light Emitting Diode) lamp body with built-in power supply |
-
2008
- 2008-12-31 CN CN2008201298732U patent/CN201412696Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102155669A (en) * | 2011-04-22 | 2011-08-17 | 廖光华 | LED (Light Emitting Diode) lamp body with built-in power supply |
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Granted publication date: 20100224 Termination date: 20161231 |
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