CN101534626A - Thermal module combination and radiator combination thereof - Google Patents

Thermal module combination and radiator combination thereof Download PDF

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Publication number
CN101534626A
CN101534626A CN200810065854A CN200810065854A CN101534626A CN 101534626 A CN101534626 A CN 101534626A CN 200810065854 A CN200810065854 A CN 200810065854A CN 200810065854 A CN200810065854 A CN 200810065854A CN 101534626 A CN101534626 A CN 101534626A
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CN
China
Prior art keywords
radiator
heat radiation
radiation module
combination
heat
Prior art date
Application number
CN200810065854A
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Chinese (zh)
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CN101534626B (en
Inventor
洪锐彣
黄清白
张�杰
Original Assignee
富准精密工业(深圳)有限公司
鸿准精密工业股份有限公司
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Priority to CN2008100658542A priority Critical patent/CN101534626B/en
Publication of CN101534626A publication Critical patent/CN101534626A/en
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Publication of CN101534626B publication Critical patent/CN101534626B/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/14Fastening; Joining by using form fitting connection, e.g. with tongue and groove
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making

Abstract

The invention relates to a thermal module combination and a radiator combination thereof. The thermal module combination comprises a fan with an air outlet, a first radiator arranged at the air outlet of the fan, and a second radiator parallelly arranged with the first radiator; the first radiator is provided with a groove; and the second radiator is provided with a folded hook which is buckled in the groove to lead the second radiator and the first radiator to be combined together. The thermal module combination realizes fixing and positioning between two radiators, thus leading the combination to work with optimal efficiency.

Description

Combination of heat radiation module and radiator combination thereof

Technical field

The invention relates to a kind of heat radiation module combination, particularly about a kind of combination of heat radiation module and radiator combination thereof that is used for a plurality of heat-generating electronic elements heat radiations.

Background technology

Along with improving constantly of heat-generating electronic elements power, heat dissipation problem more and more is subject to people's attention, especially all the more so in the notebook computer in computer, in order in limited space, to take away the heat that system produces efficiently, industry mainly adopts the heat radiation module of being made up of heat pipe, radiator and fan at present, it is installed on the central processing unit (CPU), heat pipe is contacted with CPU to absorb the heat that it is produced.The heat transfer path of this mode is: the heat that CPU produces passes to radiator through heat pipe, and the air-flow that is produced by the fan heat that will reach radiator is taken away again.

Because to the function of computer and improving constantly of requirement, video card (VGA) waits the caloric value of other heat-generating electronic elements also improving, the module that also needs to dispel the heat provides the heat radiation solution, in this heat radiation module also is by heat pipe heat-generating electronic elements such as video card and wherein radiator to be coupled together.In other words, in the computer, generally adopt a plurality of heat radiation modules, respectively central processing unit, video card etc. is dispelled the heat as the first heat radiation module and the second heat radiation module.Because factors such as the restriction of assembling space and cost are considered in the computer, usually the radiator in the second heat radiation module is arranged on the air outlet place of fan in the first heat radiation module, promptly two radiators of two heat radiations in the module are arranged on the air outlet place of a fan in turn, thus the air-flow that a shared fan blows out heat radiation.

Usually, the radiator in the second heat radiation module is to be connected with electronic component that is cooled such as video card etc. by heat pipe.This second heat radiation module adapts to the situation of arranging of each electronic component in the computer by the shape that changes heat pipe, and by this heat pipe with the radiator in the second heat radiation module be fixed on fan in the first heat radiation module the air outlet place and with the first heat radiation module in the adjacent setting of radiator.

Yet the heat pipe in the second heat radiation module need extend to the fan place in the first heat radiation module and cause the span of this heat pipe longer from video card.Through vibrating for a long time or when falling, heat pipe is easy to generate the swing distortion, make radiator in the second heat radiation module depart from the air outlet of fan in the first heat radiation module.Therefore, how to make the fixed to one another and location of heat radiation module energy of each heat-generating electronic elements, and come work to become dealer's urgent problem with the efficient of the best.

Summary of the invention

In view of this, be necessary to provide a kind of radiator of each heat-generating electronic elements combination of heat radiation module and the radiator fixed to one another and location to make up.

The combination of a kind of radiator comprises one first radiator and one second radiator, and this first radiator is provided with a groove, and this second radiator is provided with a folding hook, and it is interior and this second radiator and first radiator are combined that this folding dogging is buckled in this groove.

A kind of heat radiation module combination comprises one first heat radiation module and one second heat radiation module, and this first heat radiation module comprises that a fan and with air outlet is arranged on first radiator at this fan outlet place; This second heat radiation module comprises one second radiator, this second radiator is arranged on the air outlet place of fan in this first heat radiation module and is arranged side by side with first radiator, this first radiator is provided with a groove, this second radiator is provided with a folding hook, and it is interior and second radiator and first radiator are combined that this folding dogging is buckled in this groove.

Compared with prior art, this first radiator and second radiator are buckled in the groove on second radiator by the folding dogging that is fixed in the plate body end on first radiator bottom, realize fixing and positioning between two radiators, make its efficient work with the best.

In addition, because two radiators can be clasped mutually, can make up the radiator in the different heat radiation modules according to actual behaviour in service, thereby can arrange to the heat radiation module, thereby the versatility of heat radiation module distribution situation, lifting heat radiation module in the optimization system according to the concrete layout situation of electronic component in the different system.

Description of drawings

Be further described in conjunction with the embodiments with reference to the accompanying drawings:

Fig. 1 makes up the three-dimensional assembly diagram of a preferred embodiment for the present invention's module that dispels the heat.

Fig. 2 is the three-dimensional assembly diagram of radiator combination among Fig. 1.

Fig. 3 is the three-dimensional exploded view of Fig. 2.

Fig. 4 is the front view of Fig. 2.

Embodiment

Be illustrated in figure 1 as a dispel the heat preferred embodiment of module combination of the present invention, this heat radiation module combination comprises one first heat radiation module 10 and one second heat radiation module 20, be respectively applied for two heat-generating electronic elements heat radiations, such as respectively CPU in the notebook computer and video card being dispelled the heat.This first heat radiation module 10 comprises that a fan 300 and with air outlet is arranged on first radiator 120 and first heat pipe 140 at these fan 300 air outlet places.This second heat radiation module 20 comprises one second radiator 220 and this second radiator, 220 outward extending second heat pipes 240 certainly, the air outlet place and first radiator 120 that this second radiator 220 is arranged on fan 300 in this first heat radiation module 10 are arranged side by side, and this second radiator 220 is compared the air outlet of this first radiator 120 away from this fan 300.Wherein, this first radiator 120 is provided with a groove 122, and this second radiator 10 is provided with a folding hook 222, and this groove 122 combines second radiator 220 and first radiator 120 with the mutual buckle of this folding hook 222a.

Please refer to Fig. 2 to Fig. 4, this first radiator 120 is made up of some parallel first fin 124 alternately, and 124 of every adjacent two first fin form one first gas channel 126; This second radiator 220 is made up of some parallel second fin 224 alternately, and 224 of every adjacent two second fin form one second gas channel 226, each second fin, 224 corresponding one first fin 124.

This first radiator 120 is fixedlyed connected with folding hook 222a by groove 122 with second radiator 220, in the present embodiment, this folding hook 222a be by the end of plate body 222 upwards bending form, this plate body 222 is a rectangle plate body, and its length is identical with the length of second radiator 220 and first radiator 120.Side near first radiator 120 forms an end difference 2222 to this second radiator 220 in its bottom 2220, and this plate body 222 is welded in end difference 2222 places is fixed on second radiator 220 it, and a side that allows plate body 222 be provided with folding hook 222a is stretched in the outside.This groove 122 is to be pressed near a side blow of second radiator 220 by the bottom 1220 of first radiator 120 to form, the shape of this groove 122 is similar with the shape of folding hook 222a, allow folding hook 222a be buckled in the groove 122, thereby realize fixedlying connected of second radiator 220 and first radiator 120.This groove 122 is divided into two parts with the bottom 1220 of first radiator 120, the part of close second radiator 220 is a little more than the part away from second radiator 220, after being provided with of this set and end difference 2222 can make plate body 222 be fixed on first radiator 120, the bottom surface 1220,2220 of the bottom surface of plate body 222 and two radiators 120,220 at grade.

Certainly, in the present embodiment, also plate body 222 can be welded on the bottom 1220 of first radiator 120, then end difference 2222 is arranged on the bottom 1220 of first radiator 120, groove 122a is arranged on the bottom 2220 of second radiator 220, by the welding of plate body 222 and the fastener of folding hook 222a second radiator 220 and first radiator 120 is fixed together equally, and this kind project organization is simple, it is low to manufacture cost, and production is strong.

In order further second radiator 220 to be fixedlyed connected with first radiator 120, in the present embodiment, sidewall at each first fin 124 of first radiator 120 forms first location division such as protuberance 128, this protuberance 128 is given prominence to the direction of second radiator 220 by the sidewall of each first fin 124 and is extended, the corresponding protuberance 128 of sidewall at each second fin 224 of second radiator 220 is provided with one second location division such as recess 228, is contained in by the protuberance 128 with first radiator 120 and realizes further fixedlying connected of second radiators 220 and first radiator 120 in the recess 228 on this second radiator 220.In like manner, this protuberance 128 also can be arranged on second radiator 220, being located on first radiator 120 of 228 correspondences of this recess.

Please be simultaneously with reference to Fig. 1 and Fig. 4, this second radiator 220 contacts with heat-generating electronic elements (scheming not show) with first heat pipe 140 by second heat pipe 240 respectively with first radiator 120, with to its heat radiation.It is curved that first heat pipe 140,240 is Curved Flat, comprises evaporation ends 142,242 and condensation end 144,244 respectively.This first radiator 120 has an accepting groove 130, in order to the condensation end 144 of first heat pipe 140 is accommodated wherein, the evaporation ends 142 of first heat pipe 140 secures it on the heat-generating electronic elements CPU (figure does not show) by first endothermic section 100, thereby absorbs its heat.The evaporation ends 242 of second heat pipe 240 secures it on the heat-generating electronic elements video card (figure does not show) by second endothermic section 200, absorbs its heat, and condensation end 244 is fixed by welding on second radiator 220.

During work, the heat transferred that CPU produces to the evaporation ends 142 of first heat pipe 140 of CPU thermo-contact, by first heat pipe 140 heat is passed to first radiator 120, heat exchange takes place in the air-flow and first radiator 120 that produces by fan 300 at last, simultaneously, the heat transferred that video card produces to the evaporation ends 242 of second heat pipe 240 of video card thermo-contact, by second heat pipe 240 heat is passed to second radiator 220, because second radiator 220 is fixedlyed connected with first radiator 120, heat exchange can directly take place with second radiator 220 in the air-flow of blowing over first radiator 120 by fan 300, heat finally is dispersed in the environment goes, to reach the purpose of quick efficiently radiates heat.By folding hook 222a and groove 122 fixedlying connected with second radiator 220 and first radiator 120, and the protuberance 128 of second 120 in radiator 220 and first radiator and the setting of recess 228, further with second radiator 220 and first radiator, 120 location, make first gas channel, the 126 corresponding linkings of second gas channel 226 with first radiator 120 of second radiator 220, the air-flow that makes two radiators 120,220 utilize fan 300 to blow out jointly.In addition, because the setting of folding hook 222a and groove 122, even having assembled the product of this heat radiation module takes place to vibrate even fall, the position that second radiator 220 that only leans on the second long heat pipe 240 to connect also can not depart from the air outlet of fan 300, the phenomenon that more can not cause second heat pipe 240 to deform and damage, also solve simultaneously under the situation to many fansink designs of different electronic element radiatings, can make to interfix between the radiator and locate, guarantee modular structure and performance.

In addition, because two radiators can be clasped mutually, can make up the radiator in the difference heat radiation module according to actual behaviour in service, thereby can arrange to the heat radiation module, thereby the versatility of heat radiation module distribution situation, lifting heat radiation module in the optimization system according to the concrete layout situation of electronic component in the different system.

Claims (12)

1. radiator combination, comprise one first radiator and one second radiator, it is characterized in that: this first radiator is provided with a groove, and this second radiator is provided with a folding hook, and it is interior and this second radiator and first radiator are combined that this folding dogging is buckled in this groove.
2. radiator as claimed in claim 1 combination is characterized in that: this folding hook-forming and is bent by the end of plate body and to form on a plate body, and this plate body is fixed in the bottom of second radiator.
3. radiator combination as claimed in claim 2 is characterized in that: this second radiator bottom has an end difference, and this plate body is fixedly welded on the end difference of this second radiator.
4. radiator combination as claimed in claim 2, it is characterized in that: this groove is formed on the bottom of first radiator, and the bottom of first radiator is not contour in the both sides of groove.
5. radiator combination as claimed in claim 1, it is characterized in that: this first radiator comprises some first fin, this second radiator comprises some second fin, each second fin is corresponding with one first fin, the sidewall of each first fin forms one first location division, on the sidewall of each second fin position that should first location division is formed one second location division, dock with corresponding second location division by each first location division and realize further being located by connecting of first radiator and second radiator.
6. radiator combination as claimed in claim 5, it is characterized in that: this first location division is a protuberance, and this second location division is a recess, and described each protuberance is contained in the corresponding recess.
7. heat radiation module combination comprises one first heat radiation module and one second heat radiation module, it is characterized in that: this first heat radiation module comprises that a fan and with air outlet is arranged on first radiator at this fan outlet place; This second heat radiation module comprises one second radiator, this second radiator is arranged on the air outlet place of fan in this first heat radiation module and is arranged side by side with first radiator, this first radiator is provided with a groove, this second radiator is provided with a folding hook, and it is interior and second radiator and first radiator are combined that this folding dogging is buckled in this groove.
8. heat radiation module combination as claimed in claim 7 is characterized in that: this first heat radiation module also comprises first endothermic section and first heat pipe, and this first heat pipe is connected this first endothermic section with this first radiator; This second heat radiation module also comprises second endothermic section and second heat pipe, and this second heat pipe is connected this second endothermic section with this second radiator.
9. heat radiation module combination as claimed in claim 7 is characterized in that: this folding hook is formed by the end bending of a plate body, and the bottom of this second radiator has an end difference that makes progress, and this plate body is fixedly welded on the end difference of this second radiator.
10 heat radiation module combinations as claimed in claim 7, it is characterized in that: this groove is formed on the bottom of first radiator, and the bottom of this first radiator is not contour in the both sides of groove.
11. heat radiation module combination as claimed in claim 7, it is characterized in that: this first radiator comprises some first fin, this second radiator comprises some second fin, form first gas channel between every two first adjacent fin, form second gas channel between every two second adjacent fin, each first gas channel is corresponding with one second gas channel, the sidewall of each first fin forms one first location division, on the sidewall of each second fin position that should first location division is formed one second location division, dock with corresponding second location division by each first location division and realize further being located by connecting of first radiator and second radiator.
12. heat radiation module combination as claimed in claim 11, it is characterized in that: this first location division is a protuberance, and this second location division is a recess, and described each protuberance is contained in the corresponding recess.
CN2008100658542A 2008-03-14 2008-03-14 Thermal module combination and radiator combination thereof CN101534626B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008100658542A CN101534626B (en) 2008-03-14 2008-03-14 Thermal module combination and radiator combination thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2008100658542A CN101534626B (en) 2008-03-14 2008-03-14 Thermal module combination and radiator combination thereof
US12/099,171 US8459343B2 (en) 2008-03-14 2008-04-08 Thermal module assembly and heat sink assembly having at least two engageable heat sinks

Publications (2)

Publication Number Publication Date
CN101534626A true CN101534626A (en) 2009-09-16
CN101534626B CN101534626B (en) 2011-06-08

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102105035A (en) * 2009-12-21 2011-06-22 富准精密工业(深圳)有限公司 Radiating module
CN104582459A (en) * 2013-10-25 2015-04-29 纬创资通股份有限公司 Electronic device and electromagnetic wave shielding module thereof

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101166408A (en) * 2006-10-20 2008-04-23 富准精密工业(深圳)有限公司 Heat radiation module
JP4357569B2 (en) * 2008-01-31 2009-11-04 株式会社東芝 Electronics
CN101861078A (en) * 2009-04-10 2010-10-13 富准精密工业(深圳)有限公司 Heat sink and manufacturing method thereof
US20110168358A1 (en) * 2010-01-13 2011-07-14 Asia Vital Components Co., Ltd. Lap-joined heat pipe structure and thermal module using same
CN102738097B (en) * 2011-04-01 2016-09-21 奇鋐科技股份有限公司 Combined structure for heat radiation apparatus
TWI536899B (en) * 2011-05-16 2016-06-01 鴻準精密工業股份有限公司 Heat dissipation device and electronic device having the same
TWI576038B (en) * 2011-07-13 2017-03-21 鴻準精密工業股份有限公司 Heat sink
TW201312330A (en) * 2011-09-09 2013-03-16 Hon Hai Prec Ind Co Ltd Radiator, cooling assembly using the radiator and electronic device using same
JP5408285B2 (en) * 2012-04-27 2014-02-05 ダイキン工業株式会社 Refrigerator, electrical component unit and refrigeration system
CN103687433A (en) * 2012-09-26 2014-03-26 鸿富锦精密工业(深圳)有限公司 Radiator
EP2936953A4 (en) * 2012-12-19 2016-07-13 Hewlett Packard Development Co Heat removal assembly
JP5775062B2 (en) * 2012-12-27 2015-09-09 レノボ・シンガポール・プライベート・リミテッド Electronic equipment and electronic equipment system
US9081554B2 (en) * 2012-12-28 2015-07-14 Intel Corporation Heat exchanger assembly for electronic device
TW201440624A (en) * 2013-04-02 2014-10-16 Quanta Comp Inc Heat dissipation module and centrifugal fan thereof
CN104125744A (en) * 2013-04-24 2014-10-29 全亿大科技(佛山)有限公司 Radiator
US10720683B2 (en) 2014-09-30 2020-07-21 Cps Technology Holdings Llc Battery module thermal management features for internal flow
US10658717B2 (en) 2014-09-30 2020-05-19 Cps Technology Holdings Llc Battery module active thermal management features and positioning
US9825343B2 (en) 2014-09-30 2017-11-21 Johnson Controls Technology Company Battery module passive thermal management features and positioning

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2434676A (en) * 1944-03-11 1948-01-20 Scovill Manufacturing Co Cooling unit
US3220471A (en) * 1963-01-15 1965-11-30 Wakefield Engineering Co Inc Heat transfer
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
GB1502428A (en) * 1974-06-08 1978-03-01 Lucas Electrical Ltd Full wave rectifier assembly
US4800956A (en) * 1986-04-25 1989-01-31 Digital Equipment Corporation Apparatus and method for removal of heat from packaged element
DE3814145C2 (en) * 1988-04-27 1998-07-23 Hess Joachim Device for supplying or removing heat
US5042257A (en) * 1989-05-01 1991-08-27 Kendrick Julia S Double extruded heat sink
US5227663A (en) * 1989-12-19 1993-07-13 Lsi Logic Corporation Integral dam and heat sink for semiconductor device assembly
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5184281A (en) * 1992-03-03 1993-02-02 Digital Equipment Corporation Heat dissipation apparatus
US5419041A (en) * 1992-08-04 1995-05-30 Aqty Co., Ltd. Process for manufacturing a pin type radiating fin
US5293930A (en) * 1992-09-24 1994-03-15 Hewlett-Packard Company Surface-to-air heat exchanger for electronic devices
US5343362A (en) * 1994-01-07 1994-08-30 Zytec Corporation Heat sink assembly
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
US6545872B1 (en) * 2001-10-12 2003-04-08 Compaq Information Technologies Group, L.P. Heat sink for edge connectors
US20040150955A1 (en) * 2003-01-31 2004-08-05 You-Tien Lin Connecting apparatus of one single radiation plate
CN1734395A (en) * 2004-08-12 2006-02-15 威盛电子股份有限公司 Expansive heat radiation device
US7265974B2 (en) * 2004-09-16 2007-09-04 Industrial Design Laboratories Inc. Multi-heatsink integrated cooling device
CN100379333C (en) * 2004-11-15 2008-04-02 广达电脑股份有限公司 Radiating device
TWI263474B (en) 2005-01-14 2006-10-01 Foxconn Tech Co Ltd Heat sink and method for making the same
US7497013B2 (en) * 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
US7725011B2 (en) * 2005-07-29 2010-05-25 Calorigen Usa Corp. Temperature exchanging element made by extrusion and incorporating an infrared radiation diffuser
US7104311B1 (en) * 2005-10-17 2006-09-12 Kwo Ger Metal Technology, Inc. Heat sink assembly
CN100482060C (en) * 2006-02-22 2009-04-22 富准精密工业(深圳)有限公司 Heat radiator
US7530388B2 (en) * 2007-06-06 2009-05-12 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102105035A (en) * 2009-12-21 2011-06-22 富准精密工业(深圳)有限公司 Radiating module
CN104582459A (en) * 2013-10-25 2015-04-29 纬创资通股份有限公司 Electronic device and electromagnetic wave shielding module thereof

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