CN103687433A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN103687433A CN103687433A CN201210364753.1A CN201210364753A CN103687433A CN 103687433 A CN103687433 A CN 103687433A CN 201210364753 A CN201210364753 A CN 201210364753A CN 103687433 A CN103687433 A CN 103687433A
- Authority
- CN
- China
- Prior art keywords
- radiator
- fin
- fins
- sheet
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A radiator is provided. The radiator comprises a bottom plate, a plurality of first fins located on the bottom plate and a plurality of second fins which are detachably connected with the first fins. According to the radiator of the invention, a corresponding number of second fins can be mounted on the first fins based on different radiating requirements of electronic components. Therefore, the radiator is advantageous in strong adaptability. With the radiator adopted, waste can be avoided.
Description
Technical field
The present invention relates to a kind of radiator.
Background technology
Electronic component in server is as CPU(central processing unit) need to heat be conducted by radiator.The power consumption of different CPU is different, and caloric value is also different, and existing radiator generally will meet the radiating requirements of the CPU that power consumption is the highest, and such design obviously lacks flexibility, and when radiator is used in the CPU of low-power consumption, comparatively wastes.
Summary of the invention
In view of above content, be necessary to provide a kind of radiator, adapt to the different electronic component of caloric value.
A radiator, comprises a base plate, is arranged at some the first fins and some second fins that is removably connected in respectively these the first fins of this base plate.
This radiator can be installed the second fin to the first fin of respective amount according to the different radiating requirements of electronic component, strong adaptability, has avoided waste.
Accompanying drawing explanation
In conjunction with embodiment, the invention will be further described with reference to the accompanying drawings.
Fig. 1 is the three-dimensional exploded view of the embodiment of radiator of the present invention.
Fig. 2 is that wherein one second fin of the radiator in Fig. 1 is in the stereo amplification figure of other direction.
Fig. 3 is the three-dimensional combination figure of Fig. 1.
Fig. 4 is the enlarged drawing of IV part in Fig. 3.
Main element symbol description
|
10 |
The |
20 |
The |
30 |
|
31 |
|
32 |
Draw-in |
322 |
|
33 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
Please refer to Fig. 1 and Fig. 2, the better embodiment of radiator of the present invention comprises a base plate 10, is vertically installed in some the first fins 20 and some second fins 30 of this base plate 10.
Each second fin 30 comprises a body 31 and pair of spaced is located at the mounting bar 32 of these body 31 bottoms.Between two mounting bars 32, form a draw-in groove 322.This is provided with some to having the flexible sheet 33 of supporting accordingly to the bottom of mounting bar 32.Support sheet 33 for every pair and arrange dorsad, it is c-shaped that each supports sheet 33.
Please refer to Fig. 3 and Fig. 4, during assembling, press down after the draw-in groove of each the second fin 30 322 is aligned to one first corresponding fin 20.This first fin 20 to supporting sheet 33 and snapping in draw-in groove 322, makes every pair of both sides of supporting sheet 33 strains and supporting this first fin 20 through these of this second fin 30.
During dismounting, firmly upwards extract each second fin 30.
During use, according to the caloric value of electronic component, at the first fin 20 of this radiator, the second fin 30 of respective numbers is installed.
In present embodiment, two first fins 20 of one first fin 20 are installed respectively one second fin 30 separately.
Claims (4)
1. a radiator, comprises a base plate, is arranged at some the first fins and some second fins that is removably connected in respectively these the first fins of this base plate.
2. radiator as claimed in claim 1, it is characterized in that: the bottom of each the second fin is provided with the mounting bar of pair of spaced, between two mounting bars, form a draw-in groove, one first fin corresponding with this second fin snaps in this draw-in groove, the bottom of two mounting bars is relatively provided with a pair of flexible sheet of supporting that has, and this supports the both sides of this first fin to supporting sheet strain.
3. radiator as claimed in claim 2, is characterized in that: support sheet for every pair and arrange dorsad, it is c-shaped that each supports sheet.
4. radiator as claimed in claim 1, is characterized in that: two first fins of one first fin are connected with respectively one second fin separately.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210364753.1A CN103687433A (en) | 2012-09-26 | 2012-09-26 | Radiator |
TW101137072A TW201414981A (en) | 2012-09-26 | 2012-10-08 | Heat sink |
US13/669,454 US20140083669A1 (en) | 2012-09-26 | 2012-11-06 | Heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210364753.1A CN103687433A (en) | 2012-09-26 | 2012-09-26 | Radiator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103687433A true CN103687433A (en) | 2014-03-26 |
Family
ID=50323292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210364753.1A Pending CN103687433A (en) | 2012-09-26 | 2012-09-26 | Radiator |
Country Status (3)
Country | Link |
---|---|
US (1) | US20140083669A1 (en) |
CN (1) | CN103687433A (en) |
TW (1) | TW201414981A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105186927A (en) * | 2015-10-13 | 2015-12-23 | 魏淏 | Gas stove pot rack employing waste heat for power generation |
CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109004811A (en) * | 2018-06-22 | 2018-12-14 | 江苏英杰铝业有限公司 | A kind of variable-frequency power sources aluminium sheet radiator |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5437328A (en) * | 1994-04-21 | 1995-08-01 | International Business Machines Corporation | Multi-stage heat sink |
US5957194A (en) * | 1996-06-27 | 1999-09-28 | Advanced Thermal Solutions, Inc. | Plate fin heat exchanger having fluid control means |
US6862183B2 (en) * | 2001-10-29 | 2005-03-01 | Intel Corporation | Composite fins for heat sinks |
US6672379B1 (en) * | 2002-07-29 | 2004-01-06 | Waffer Technology Corp. | Positioning and buckling structure for use in a radiator |
TW547918U (en) * | 2002-10-25 | 2003-08-11 | Hon Hai Prec Ind Co Ltd | Heat dissipating device |
US6639802B1 (en) * | 2002-11-05 | 2003-10-28 | Hon Hai Precision Ind. Co., Ltd. | Heat sink with interlocked fins |
CN2736925Y (en) * | 2004-09-15 | 2005-10-26 | 鸿富锦精密工业(深圳)有限公司 | Heat sink |
US20090165999A1 (en) * | 2007-12-27 | 2009-07-02 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
CN101534626B (en) * | 2008-03-14 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Thermal module combination and radiator combination thereof |
US8002019B2 (en) * | 2008-03-20 | 2011-08-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8230903B2 (en) * | 2008-04-18 | 2012-07-31 | International Business Machines Corporation | Low profile heat sink for semiconductor devices |
CN101641002B (en) * | 2008-07-28 | 2012-10-10 | 富准精密工业(深圳)有限公司 | Radiator and radiation device using same |
CN101754649B (en) * | 2008-12-03 | 2013-06-05 | 富准精密工业(深圳)有限公司 | Radiator and making method of radiating fins thereof |
-
2012
- 2012-09-26 CN CN201210364753.1A patent/CN103687433A/en active Pending
- 2012-10-08 TW TW101137072A patent/TW201414981A/en unknown
- 2012-11-06 US US13/669,454 patent/US20140083669A1/en not_active Abandoned
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105186927A (en) * | 2015-10-13 | 2015-12-23 | 魏淏 | Gas stove pot rack employing waste heat for power generation |
CN105186927B (en) * | 2015-10-13 | 2018-07-27 | 魏淏 | A kind of gas stove wok stand using cogeneration |
CN110187750A (en) * | 2019-05-28 | 2019-08-30 | 浪潮商用机器有限公司 | A kind of server, onboard structure and more efficiency composite layer radiators |
Also Published As
Publication number | Publication date |
---|---|
TW201414981A (en) | 2014-04-16 |
US20140083669A1 (en) | 2014-03-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140326 |