TWI386155B - Thermal module assembly and heat sink assembly thereof - Google Patents

Description

Thermal module combination and radiator combination

The present invention relates to a heat dissipation module combination, and more particularly to a heat dissipation module combination for heat dissipation of a plurality of heat-generating electronic components and a heat sink combination thereof.

With the continuous improvement of the power of heat-generating electronic components, the problem of heat dissipation has been paid more and more attention. This is especially true in computers, especially in notebook computers. In order to efficiently remove the heat generated by the system in a limited space, the current industry is mainly A heat dissipation module consisting of a heat pipe, a heat sink and a fan is mounted on a central processing unit (CPU) to bring the heat pipe into contact with the CPU to absorb the heat generated by the heat pipe. The heat transfer path of the method is: the heat generated by the CPU is transmitted to the heat sink through the heat pipe, and the air flow generated by the fan takes away the heat transferred to the heat sink.

Due to the continuous improvement of the functions and requirements of the computer, the heat generation of other heat-generating electronic components such as a video card (VGA) is also increasing. A heat-dissipating module is also needed to provide a heat-dissipating solution, and the heat-dissipating module also uses a heat pipe to display a video card or the like. The heat-generating electronic components are connected to the heat sink therein. In other words, in a computer, a plurality of heat dissipation modules, such as a first heat dissipation module and a second heat dissipation module, are generally used to dissipate heat from the central processing unit and the graphics card. Due to the limitation of the assembly space in the computer and the cost, the heat sink in the second heat dissipation module is usually disposed at the air outlet of the fan in the first heat dissipation module, that is, two heat sinks in the two heat dissipation modules. It is set in the air outlet of one fan in order to share the heat of the air blown by one fan.

Usually, the heat sink in the second heat dissipation module is cooled by the heat pipe and the electricity Sub-components such as graphics cards are connected. The second heat dissipation module is adapted to the arrangement of the electronic components in the computer by changing the shape of the heat pipe, and the heat sink in the second heat dissipation module is fixed in the fan of the first heat dissipation module by the heat pipe. The tuyere is disposed adjacent to the heat sink in the first heat dissipation module.

However, the heat pipe in the second heat dissipation module needs to extend from the graphics card to the fan in the first heat dissipation module, resulting in a long span of the heat pipe. After a long time of vibration or falling, the heat pipe is prone to swing deformation, so that the heat sink in the second heat dissipation module is offset from the air outlet of the fan in the first heat dissipation module. Therefore, how to make the heat-dissipating modules of the heat-generating electronic components can be fixed and positioned with each other and work with the best efficiency has become an urgent problem to be solved by the industry.

In view of the above, it is necessary to provide a heat dissipation module combination and a heat sink combination in which the heat sinks of the heat-generating electronic components can be fixed and positioned to each other.

A heat sink assembly includes a first heat sink and a second heat sink, the first heat sink is provided with a first fastening portion, and the second heat sink is provided with a second fastening portion, the first buckle The joint includes a groove, and the second fastening portion includes a hook, the hook is buckled in the groove to combine the second heat sink with the first heat sink.

A heat dissipation module assembly includes a first heat dissipation module and a second heat dissipation module, the first heat dissipation module includes a fan having an air outlet and a first heat sink disposed at the air outlet of the fan; The second heat dissipation module includes a second heat sink disposed at an air outlet of the fan in the first heat dissipation module and disposed alongside the first heat sink, the first heat dissipation The second heat sink is provided with a first fastening portion, and the second heat sink is provided with a second fastening portion, the first fastening portion and the second fastening portion are mutually buckled to make the second heat sink and the first The radiators are combined.

Compared with the prior art, the first heat sink and the second heat sink are buckled in the recesses on the second heat sink by the hooks of the ends of the board body fixed on the bottom of the first heat sink, thereby realizing two The fixing and positioning between the heat sinks allows them to work with optimum efficiency.

In addition, since the two heat sinks can be snap-fitted to each other, the heat sinks in different heat dissipation modules can be combined according to actual use conditions, so that the heat dissipation modules can be arranged according to the specific layout conditions of the electronic components in different systems. In order to optimize the distribution of the heat dissipation module in the system and improve the versatility of the heat dissipation module.

Hereinafter, the heat dissipation module assembly and the heat sink combination of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIG. 1 , a heat dissipation module assembly of the present invention includes a first heat dissipation module 10 and a second heat dissipation module 20 for respectively pairing two heat-generating electronic components. Cooling, such as cooling the CPU and graphics card in the notebook. The first heat dissipation module 10 includes a fan 300 having an air outlet and a first heat sink 120 disposed at an air outlet of the fan 300 and a first heat pipe 140. The second heat dissipation module 20 includes a second heat sink 220 and a second heat pipe 240 extending outward from the second heat sink 220. The second heat sink 220 is disposed in the first heat dissipation module 10 of the fan 300. The air outlet is disposed side by side with the first heat sink 120, and the second heat sink 220 is away from the fan 300 by the first heat sink 120. Air outlet. The first heat sink 120 is provided with a first fastening portion 122, and the second heat sink 10 is provided with a second fastening portion 222. The first fastening portion 122 and the second fastening portion 222 are mutually connected. The second heat sink 220 is combined with the first heat sink 120 by snapping.

Referring to FIG. 2 to FIG. 4 , the first heat sink 120 is composed of a plurality of first heat sinks 124 arranged in parallel with each other, and a first air flow channel 126 is formed between each two adjacent first heat sinks 124 ; the second heat sink The second heat sink 224 is formed by a plurality of parallel heat sinks 224. Each of the second heat sinks 224 forms a second air flow channel 226. Each of the second heat sinks 224 corresponds to a first heat sink 124.

The first heat sink 120 and the second heat sink 220 are fixedly connected to the second fastening portion 222 by the first fastening portion 122. The first fastening portion 122 can be a groove 122a. The portion 222 can be a plate body 222a. The plate body 222a is substantially rectangular parallelepiped and has the same length as the second heat sink 220 and the first heat sink 120. The plate body 222a is stamped upward at the end of the longitudinal side. The hook 222b is folded, and the free end of the hook 222b is biased toward the direction of the first heat sink 120. The second heat sink 220 forms a step portion 2222 on a side of the bottom portion 2220 adjacent to the first heat sink 120. The board body 222a is soldered to the step portion 2222 to be fixed on the second heat sink 220, and the board body is allowed to be fixed. One side of the 222a provided with the hook 222b extends to the outside. A recess 122a is formed in a shape of the bottom portion 1220 of the first heat sink 120 adjacent to the second heat sink 220. The recess 122a has a shape similar to that of the hook 222b, and the hook 222b is buckled in the recess 122a. Thereby, a fixed connection of the second heat sink 220 to the first heat sink 120 is achieved. The groove 122a divides the bottom portion 1220 of the first heat sink 120 into two portions, adjacent to the portion of the second heat sink 220 Slightly higher than the portion away from the second heat sink 220, such that the arrangement of the step portion 2222 can fix the plate body 222a on the first heat sink 120, the bottom surface of the plate body 222a and the two heat sinks 120, 220 The bottom surfaces 1220, 2220 are on the same plane.

Of course, in the embodiment, the plate body 222a may be welded to the bottom portion 1220 of the first heat sink 120, and the step portion 2222 is disposed at the bottom portion 1220 of the first heat sink 120, and the groove 122a is disposed at the second heat sink 220. The bottom portion 2220 also fixes the second heat sink 220 and the first heat sink 120 by the welding of the plate body 222a and the hook of the hook 222b. The design is simple in structure, low in manufacturing cost, and high in mass productivity.

In the embodiment, a first positioning portion, such as a protruding portion 128, is formed on a sidewall of each first heat sink 124 of the first heat sink 120, in which a second heat sink 220 is fixedly connected to the first heat sink 120. The protruding portion 128 protrudes from the sidewall of each of the first heat sinks 124 toward the second heat sink 220, and a second portion of the second heat sink 224 of the second heat sink 220 corresponds to the protruding portion 128. The positioning portion, such as the recess 228, allows the second heat sink 220 to be further fixedly connected to the first heat sink 120 by receiving the protruding portion 128 of the first heat sink 120 into the recess 228 of the second heat sink 220. Similarly, the protrusions 128 can also be disposed on the second heat sink 220. The recesses 228 are correspondingly disposed on the first heat sink 120.

Referring to FIG. 1 and FIG. 4 simultaneously, the second heat sink 220 and the first heat sink 120 are respectively in contact with the heat-generating electronic components (not shown) by the second heat pipe 240 and the first heat pipe 140 to dissipate heat therefrom. The first heat pipes 140, 240 are in a flat curved shape and include evaporation ends 142, 242 and condensation ends 144, 244, respectively. The first heat sink 120 has a receiving slot 130 for the first The condensation end 144 of the heat pipe 140 is received therein, and the evaporation end 142 of the first heat pipe 140 is fixed to a heat-generating electronic component such as a CPU (not shown) by the first heat absorption portion 100, thereby absorbing heat. The evaporation end 242 of the second heat pipe 240 is fixed to a heat-generating electronic component such as a video card (not shown) by the second heat-absorbing portion 200 to absorb heat thereof, and the condensation end 244 is fixed to the second heat sink 220 by soldering.

During operation, the heat generated by the CPU is absorbed by the first heat absorbing portion 100 and transmitted to the evaporation end 142 of the first heat pipe 140. The heat is transferred from the first heat pipe 140 to the first heat sink 120, and finally the airflow generated by the fan 300 is The heat exchange of the first heat sink 120 occurs, and the heat generated by the graphics card is absorbed by the second heat sink 200 and transmitted to the evaporation end 242 of the second heat pipe 240, and the heat is transferred to the second heat sink 220 by the second heat pipe 240. The second heat sink 220 is fixedly connected to the first heat sink 120. The airflow blown by the fan 300 through the first heat sink 120 can directly exchange heat with the second heat sink 220 to finally dissipate heat to the environment. The purpose of fast and efficient heat dissipation. The second heat sink 220 is fixedly connected to the first heat sink 120 by the board body 222a, and the protrusions 128 and the recesses 228 between the second heat sink 220 and the first heat sink 120 are further disposed to further dissipate the second heat sink. The first heat sink 120 is positioned to connect the second air flow channel 226 of the second heat sink 220 to the first air flow channel 126 of the first heat sink 120, so that the two heat sinks 120 and 220 can jointly utilize the fan 300. The airflow that is blown out. In addition, due to the arrangement of the plate body 222a and the groove 122a, even if the product in which the heat dissipation module is assembled is vibrated or even dropped, the second heat sink 220 does not deviate from the position of the air outlet of the fan 300, and does not cause the second. The heat pipe 240 is deformed and damaged.

In addition, since the two heat sinks can be snap-fitted to each other, the heat sinks in different heat dissipation modules can be combined according to actual use conditions, so that the heat dissipation modules can be arranged according to the specific layout conditions of the electronic components in different systems. Thereby optimizing the distribution of the heat dissipation module in the system and improving the versatility of the heat dissipation module.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

10‧‧‧First Thermal Module

20‧‧‧Second thermal module

100‧‧‧First heat absorption department

120‧‧‧First radiator

122‧‧‧The first fastening department

122a‧‧‧ Groove

124‧‧‧First heat sink

126‧‧‧First airflow channel

128‧‧‧protrusion

130‧‧‧ Reception trough

140‧‧‧First heat pipe

142, 242‧‧‧ Evaporation end

144, 244‧‧ ‧ condensation end

200‧‧‧second heat sink

220‧‧‧second radiator

222‧‧‧Second Fasting Department

222a‧‧‧ board

222b‧‧‧ hook

224‧‧‧second heat sink

226‧‧‧Second airflow channel

228‧‧‧ recess

240‧‧‧second heat pipe

300‧‧‧fan

1220, 2220‧‧‧ bottom

2222‧‧‧Steps

1 is a perspective assembled view of a preferred embodiment of a heat dissipation module assembly of the present invention.

2 is an assembled, isometric view of the heat sink assembly of FIG. 1.

Fig. 3 is an exploded perspective view of Fig. 2;

Figure 4 is a front elevational view of Figure 2.

120‧‧‧First radiator

122a‧‧‧ Groove

128‧‧‧protrusion

130‧‧‧ Reception trough

220‧‧‧second radiator

222‧‧‧Second Fasting Department

222a‧‧‧ board

222b‧‧‧ hook

226‧‧‧Second airflow channel

Claims (12)

A heat sink assembly includes a first heat sink and a second heat sink, wherein the first heat sink is provided with a first fastening portion, and the second heat sink is provided with a second fastening portion. The first fastening portion includes a recess, the second fastening portion includes a hook, and the hook is buckled in the recess to combine the second heat sink with the first heat sink. A heat sink includes a plurality of first heat sinks, the second heat sink includes a plurality of second heat sinks, each of the second heat sinks corresponding to a first heat sink, and a sidewall of each of the first heat sinks forms a first positioning portion a second positioning portion is formed on the sidewall of each of the second heat sinks corresponding to the first positioning portion, and the first heat sink and the second positioning portion are respectively connected to the corresponding second positioning portion to realize the first heat sink and the second Further positioning of the heat sink. The heat sink assembly of claim 1, wherein the hook is formed on a plate body and is bent from an end of the plate body, the plate body being fixed to the bottom of the second heat sink. The heat sink assembly of claim 2, wherein the bottom portion of the second heat sink has a stepped portion, and the plate body is welded and fixed to the step portion of the second heat sink. The heat sink assembly of claim 2, wherein the groove is formed at a bottom of the first heat sink, and a bottom of the first heat sink is not equal in height on both sides of the groove. The heat sink assembly of claim 1, wherein the first positioning portion is a protruding portion, and the second positioning portion is a concave portion, and the protruding portions are received in the corresponding concave portions. A heat dissipation module assembly comprising a first heat dissipation module and a second heat dissipation module The improvement is that the first heat dissipation module includes a fan having an air outlet and a first heat sink disposed at the air outlet of the fan; the second heat dissipation module includes a second heat sink, the second The heat sink is disposed at an air outlet of the fan in the first heat dissipation module and is disposed alongside the first heat sink. The first heat sink is provided with a first fastening portion, and the second heat sink is provided with a second buckle The first fastening portion and the second fastening portion are mutually buckled to combine the second heat sink with the first heat sink, and the first heat dissipation module further includes a first heat absorption portion and a first heat pipe. The first heat pipe connects the first heat absorption portion to the first heat sink; the second heat dissipation module further includes a second heat absorption portion and a second heat pipe, the second heat pipe is configured to the second heat absorption portion and the second heat pipe The radiator is connected. The heat dissipation module assembly of claim 6, wherein the first fastening portion comprises a groove; the second fastening portion comprises a hook, the hook is buckled in the groove. The heat dissipation module assembly according to claim 7, wherein the hook is bent by an end of a plate body, and the bottom of the second heat sink has an upward step portion, and the plate body is welded. a step fixed to the second heat sink. The heat dissipation module assembly of claim 7, wherein the groove is formed at a bottom of the first heat sink, and a bottom of the first heat sink is not equal in height on both sides of the groove. The heat dissipation module assembly of claim 6, wherein the first heat sink comprises a plurality of first heat sinks, and the second heat sink comprises a plurality of second heat sinks, each adjacent two first heat sinks Forming a first air flow channel between the sheets, and forming a second air flow channel between each adjacent two second heat sinks, each first air flow channel corresponding to a second air flow channel, and sidewalls of each of the first heat sinks are formed a first positioning portion, a side of each second heat sink A second positioning portion is formed on the wall corresponding to the position of the first positioning portion, and the first positioning portion and the corresponding second positioning portion are butted to realize further positioning connection between the first heat sink and the second heat sink. The heat dissipation module assembly of claim 10, wherein the first positioning portion is a protrusion, the second positioning portion is a recess, and the protrusions are received in the corresponding recesses. . The heat dissipation module assembly of claim 6, wherein the first heat sink and the second heat sink are detachably combined by the interaction of the first fastening portion and the second fastening portion.