CN104938043B - Heat removes component - Google Patents
Heat removes component Download PDFInfo
- Publication number
- CN104938043B CN104938043B CN201280077899.6A CN201280077899A CN104938043B CN 104938043 B CN104938043 B CN 104938043B CN 201280077899 A CN201280077899 A CN 201280077899A CN 104938043 B CN104938043 B CN 104938043B
- Authority
- CN
- China
- Prior art keywords
- heat
- hot
- plate
- heat pipe
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2280/00—Mounting arrangements; Arrangements for facilitating assembling or disassembling of heat exchanger parts
- F28F2280/10—Movable elements, e.g. being pivotable
- F28F2280/105—Movable elements, e.g. being pivotable with hinged connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of heat is provided herein and removes component.The heat, which removes component, includes evaporator block, heat pipe and condenser plate.Evaporator block removes the heat from electronic component.Evaporator block engaged with electronic component and formed therebetween remove it is hot thermally coupled from electronic component.Heat pipe is connected to evaporator block, for removing the heat from evaporator block.Condenser plate is connected to heat pipe, and receives the heat from heat pipe.Condenser plate includes hot matching surface, and the hot matching surface and hot component coordinate so that heat is via hot matching surface from assembly removal.
Description
Background technology
Electronic component or electronic equipment have temperature requirement.The heat utilization component or system produced using electronic component is removed,
So as to remove heat.It is different according to the structural environment of electronic component types and electronic component that heat is removed from electronic component.
Brief description of the drawings
The non-limiting example of the disclosure is described in description below, the example is carried out with reference to this accompanying drawing is additional to
Understand, and do not limit the scope of claims.In the accompanying drawings, the identical and similar knot in more than one figure is appeared in
Structure, its element or part are generally identified in the figure of its appearance with same or analogous reference.Element shown in accompanying drawing
With the size of feature primarily to the convenience of display and clear and select, is not in proportion.Refer to the attached drawing：
Fig. 1 illustrates the block diagram of the system of the removal heat according to example；
Fig. 2 illustrates the schematic diagram of the system of Fig. 1 according to example；
Fig. 3 illustrates the block diagram that component is removed according to the heat of example；
Fig. 4 illustrates the stereogram of the component of Fig. 3 according to example；
Fig. 5 illustrates the sectional view of the heat pipe according to example；
Fig. 6 illustrates the block diagram that component is removed according to the heat of example；With
Fig. 7-Fig. 9 illustrates the stereogram of the component of Fig. 6 according to example.
Embodiment
Refer to the attached drawing in the following detailed description, these accompanying drawings constitute a part for this description, and pass through diagrammatic illustration
The specific example of the disclosure can wherein be put into practice by having shown.It will be understood that, other examples can be used and can make in structure or logic
On change without departing from the scope of this disclosure.
Electronic component is designed between balance power density, space layout, temperature requirement, noise and other factors
Contradiction.Air cooling system removes " unnecessary " heat from electronic component usually using fin and fan.Use fan
The electrical power needed for operation electronic component can be increased by carrying out cooling air, and can also be caused excessive noise and be dropped system density
It is low.Heat is removed with cooling air becomes less efficient generally as power density increases.Liquid cooling is generally colder than air
It is more efficient, particularly under higher power density；However, the pipeline that liquid cooling is generally included in electronic component connects
Connect.When being connected with liquid by the pipeline, risk of the liquid in electronic component internal leakage is introduced.
A kind of heat is provided in this example and removes component.The heat, which removes component, includes evaporator block, heat pipe and condenser plate.Steam
Send out device block and remove the heat from electronic component.Evaporator block is engaged with electronic component, and forms removal therebetween from electronics member
Part it is hot thermally coupled.Heat pipe is connected to evaporator block to remove the heat from evaporator block.Condenser plate is connected to heat pipe, and
Receive the heat from heat pipe.Condenser plate includes hot matching surface, and the hot matching surface coordinates with hot component so that heat is via heat
Matching surface is from the assembly removal.The component removes the heat from electronic component using heat pipe, so that liquid cooling can be remote
Electronic component occurs, so as to reduce risk of the liquid in electronic component internal leakage.
Fig. 1 exemplifies the block diagram for being used to remove the system 100 of heat according to example.System 100 includes electronic component 110
Component 120 is removed with the hot heat from electronic component 110 is removed.Heat, which removes component 120, includes evaporator block 140, heat pipe 160
With condenser plate 180.Evaporator block 140 is engaged with electronic component 110, and is formed therebetween thermally coupled.Heat pipe 160 is connected to steaming
Device block 140 is sent out, and removes the heat from evaporator block 140.Condenser plate 180 is connected to heat pipe 160, and receives from heat pipe
160 heat.Condenser plate 180 includes hot matching surface, and the hot matching surface is aligned with hot component so that heat coordinates table via heat
Face removes component 120 from heat and removed.
Fig. 2 exemplifies the schematic diagram of the system 100 according to Fig. 1 of example.System 100 includes electronic component 110 and removed
Hot heat from electronic component 110 removes component 120.Illustrated system 100 also includes receiving carrying out self-heating remove group part 120
Hot cooling component 200.Heat, which removes component 120, includes evaporator block 140, heat pipe 160 and condenser plate 180.Evaporator block
140 engage with electronic component 110, and form thermally coupled 246 therebetween.For example, evaporator block 140 is illustrated as the first evaporator
The evaporator block 240 of block 140 and second.Each surface 212,214 having with electronic component 110 in evaporator block 140,240
Flush and formed therebetween thermally coupled 246,248 evaporator hot surface 242,244.Thermally coupled 246,248 can be by heat from electricity
Subcomponent 110 is delivered to evaporator block 140,240.The transmission removes the heat from electronic component 110.
Heat pipe 160 is thermally connected to evaporator block 140, and passively removes the heat from evaporator block 140.The quilt of heat pipe 160
It is illustrated as the first heat pipe 160 and the second heat pipe 260.First heat pipe 160 is connected to the first evaporator block 140, and the second heat pipe 260
It is connected to the second evaporator block 240.
Condenser plate 180 is thermally connected to the first heat pipe 160 and the second heat pipe 260, and receives from the first heat pipe 160, the
The heat of two heat pipes 260.Condenser plate 180 includes the hot matching surface 282 being aligned with hot component 202.The heat of transmission is matched somebody with somebody via heat
Surface 282 is closed to remove from heat removal component 120.Hot matching surface 282 is flushed with the receiving surface 204 of hot component 202, and at it
Between form thermally coupled 284.For example, hot component 202 is the part for cooling down component 200, the cooling component 200 removes the system of coming from
100 heat, so as to cool down electronic component 110.
The configuration of second heat pipe 260 can change to adapt to different electronic components 110, and during assembly in pivoting point or
Pivot or rotate at hinge.For example, the second heat pipe 260 includes Part I, Part II and bellows in-between.The
The Part I of two heat pipes 260 is connected to condenser plate 180.Bellows can make the Part II of the second heat pipe 260 on
The Part I of two heat pipes 260 is pivoted, and is kept therebetween thermally coupled.In the example of replacement, the chain connection of the second heat pipe 260
To condenser plate 180 so that the second heat pipe 260 rotates the second evaporator block 240, to be aligned with electronic component 110 and not right
It is accurate.Second heat pipe 260 and condenser plate 180 are thermally coupled, so that heat, which can be delivered to condenser plate 180 and leave heat, removes component
120。
Condenser plate 180 alternatively, or in addition includes the first plate and the second plate.First plate includes the first heat and coordinates table
Face, and the second plate includes the second hot matching surface.First plate of condenser plate 180 and the alignment of the second plate so that the first heat coordinates
Surface and the second hot matching surface are aligned with hot component 202.First plate and the second plate are using for example forming in the first plate and second
Alignment members between plate and be aligned.First plate of condenser plate 180 and the second plate are aligned by alignment members so that the first heat is matched somebody with somebody
Close surface and the second hot matching surface is aligned with hot component 202.And provide from the first heat pipe 160 and the second heat pipe 260
Heat transfer is thermally coupled to condenser plate 180.The example of alignment members includes being coupled to the first plate to be formed in condenser plate 180
And the pin in the second hole between plate.
Fig. 3 illustrates the block diagram that component 120 is removed according to the heat of example.Heat remove component 120 include evaporator block 140,
Heat pipe 160 and condenser plate 180.Evaporator block 140 removes the heat from electronic component.Evaporator block 140 and electronic component 110
Engagement, and formed therebetween thermally coupled.Heat pipe 160 is thermally connected to evaporator block 140, passively to remove from evaporator block
140 heat.
Condenser plate 180 is thermally connected to heat pipe 160.Condenser plate 180 receives the heat from heat pipe 160.As shown in Fig. 2
Condenser plate 180 includes the hot matching surface 282 being aligned with hot component 202 so that heat removes component 120 from heat and coordinated via heat
Transmit on surface 282.
Fig. 4 shows the stereogram of the component of Fig. 3 according to example.Heat, which removes component 120, includes evaporator block 140, heat pipe
160 and condenser plate 180.Evaporator block 140 removes the heat from electronic component.Evaporator block 140 connects with electronic component 110
Close, and formed therebetween thermally coupled.For example, the engagement between evaporator block 140 and electronic component 110 occurs in evaporator hotlist
Face, the evaporator hot surface is flushed with the part of electronic component 110, with hot from its removal.Thermally coupled 246 by the surface and all
Contact between such as heat-conducting substance 444 of the HiTherm heat-conducting silicone greases of the G750 or Graftech companies of company of SHIN-ETSU HANTOTAI is formed,
And can be used in thermally coupled to improve between the part of evaporator hot surface and electronic component 110.Formed it is appropriate it is thermally coupled with
Just it is important efficiently and effectively to remove the heat from electronic component 110.
Heat pipe 160 is connected to evaporator block 140, passively to remove the heat from evaporator block 140.Fig. 5 illustrates basis
The sectional view of the heat pipe 160 of example.With reference to Fig. 5, heat pipe 160 includes heat pipe wall 510, wicking portion (wicking portion)
520 and steam channel 530.Heat pipe 160 is formed by such as copper pipe.Copper pipe is received from such as electronics member via evaporator block 140
The heat 550 of the thermal source of part 110.Heat 550 passes through the heat pipe wall 510 of heat pipe 160 from evaporator block 140, into wicking portion
520.Wicking portion 520 includes such as sintering core, groove-type core, wire bundle core or wire web-roll core.The liquid phase work of such as water
Make fluid 522 to be present in the wicking portion 520 of neighbouring evaporator block 140.Liquid phase working fluid 522 is heated and becomes steam
535。
As shown in steam arrow 532, intrinsic vaporized expanding makes the steam 535 from liquid phase working fluid 522 along steaming
Vapour passage 530 is advanced.When steam 535 is by steam channel 530, heat on the way is taken.In the opposite end of heat pipe 160, neighbouring
At condenser plate 180, heat pipe wall 510 is maintained at lower temperature by being contacted with condenser plate 180.Keeping temperature difference is necessary
, otherwise heat pipe 160 transmits heat 550 in which will cease to have effect.In other words, heat by condenser plate 180 continuously from heat pipe
160 remove, to remain able to the temperature difference for making heat pipe 160 effectively work.
Relatively low temperature makes liquid phase working fluid 522 be agglomerated on wicking portion 520, and heat 550 is delivered into heat pipe wall 510
In, and spread out of to condenser plate 180.As liquid phase working fluid 522 is agglomerated in wicking portion 520, it is made by capillary
With the end that heat pipe 160 is sucked back towards evaporator block 140.As long as the condenser plate in evaporator block 140 and the end of heat pipe 160
There is enough temperature differences between 180, the circulation can be repeated infinitely.Heat 550 is via the condenser that heat 550 is collected from steam 535
Plate 180 is removed from heat pipe 160.
The quantity of heat pipe 160, size and dimension according to electronic component 110, evaporator block 140 and can be connected to heat pipe 160
Condenser plate 180 configuration and change.Connection between evaporator block 140 and condenser plate 180 is usually rigid.Example
Such as, heat pipe 160 is soldered to evaporator block 140 and condenser plate 180.
Referring back to Fig. 4, condenser plate 180 is connected to heat pipe 160.Condenser plate 180 receives the heat from heat pipe 160.
As shown in Fig. 2 condenser plate 180 includes the hot matching surface 282 being aligned with hot component 202 so that heat removes component 120 from heat
Removed via hot matching surface 282.Hot matching surface 282 is flushed with the receiving surface 204 of hot component 202.For example, heat coordinates table
Face 282 is the matching surface connected with the cooperation of receiving surface 204 of hot component 202.Thermally coupled 284 by directly contacting or making
Formed and matched somebody with somebody in heat with the heat-conducting substance 444 of the HiTherm heat-conducting silicone greases of the G750 or Graftech companies of such as company of SHIN-ETSU HANTOTAI
Close between surface 282 and receiving surface 204.Thermally coupled 284 are properly formed heat efficiently and effectively is removed into component from heat
120 to be delivered to hot component 202 be important.
Hot component 202 can be the part for cooling down component 200, such as provide chassis level cooling away from electronic component 110
The hot bus (thermal bus bar) of (rack level cooling).Heat removes component 120 using for example by condenser plate
180 connection and/or fixed to cooling component 200 a part fastener and/or support 490 and be connected to cooling component 200,
The part of cooling component 200 is all to enable condenser plate 180 and hot component 202 form hot linked therebetween with merging in this way
Part.
The electronic component 110 that can be used with heat removal component 120 may include one or more additional devices for producing heat
464, such as it is attached to the memory of electronic component 110.For example, the large-scale device of such as graphics processing unit can be in printed circuit
It is stored by surrounding on the both sides or surface of plate (PCB).Heat removal component can be also comprised in by producing the auxiliary equipment 464 of heat
In 120.For example, memory, power-supply device or other subsidiary components 464 also may be mounted to that PCB seat (mounting)
On.Evaporator block 140 can also be attached to by heat by producing the additional device of heat, to remove unnecessary heat.
Fig. 6 illustrates the block diagram that component 120 is removed according to the heat of example.Heat, which removes component 120, includes the first evaporator block
140th, the first heat pipe 160, the second evaporator block 240, the second heat pipe 260 and condenser plate 180.First evaporator block 140 is removed
The heat of first surface 212 from electronic component 110.The first surface 212 of first evaporator block 140 and electronic component 110 connects
Close, and form first thermally coupled 246 therebetween.For example, the engagement between the first evaporator block 140 and electronic component 110 occurs
In the evaporator hot surface the 242 of Fig. 4 (i.e. Fig. 2 and) flushed with the surface of electronic component 110 (i.e. the 212 of Fig. 2), come with removing
From the heat of electronic component 110.First heat pipe 160 is connected to the first evaporator block 140, and the first evaporator block 140 is come to remove
Heat.
Second evaporator block 240 removes the heat of the second surface 214 from electronic component.Second evaporator block 240 and electricity
Subcomponent 110 is engaged, and formation second is thermally coupled between the second surface 214 of evaporator hot surface 244 and electronic component
248.For example, the engagement between the second evaporator block 240 and electronic component 110 occurs (to scheme with the surface of electronic component 110
The 2 evaporator hot surface (i.e. the 244 of Fig. 2) 214) flushed, to remove the heat from electronic component 110.Second heat pipe 260 connects
The second evaporator block 240 is connected to remove the heat from the second evaporator block 260.The configuration of second heat pipe 260 can change with suitable
Different electronic components 110 are answered, and pivots or rotates at pivoting point or hinge during assembly.
Condenser plate 180 is connected to the first heat pipe 160 and the second heat pipe 260, and receives from the first heat pipe 160 and second
The heat of heat pipe 260.As shown in Figure 2 and Figure 4, condenser plate 180 includes the hot matching surface for coordinating or being aligned with hot component 202
282.The position that hot matching surface 282 is for example flushed in the receiving surface 204 with hot component 202 coordinates with hot component 202.Hot structure
Part 202 is the part for cooling down component 200, and cooling component 200 removes the heat from system 100, so as to cool down electronics member
Part 110.Heat removes component 120 from heat and removed via hot matching surface 282.
Fig. 7-Fig. 9 illustrates the stereogram of the component of Fig. 6 according to example.Each component include two evaporator blocks 140,
240, for cooling down electronic component 110.On the not homonymy of each comfortable electronic component 110 of two evaporator blocks 140,240, Fig. 7-
It is illustrated as in Fig. 9 on two opposite sides.Heat removes the both sides that component 120 cools down electronic component 110, for example, in system board
When there is chip both sides, such as general graphical processing unit (GPGPU) or graphics processing unit (GPU), wherein dynamic random is deposited
Access to memory (DRAM) chip (that is, upper and lower surface of system board) in two opposed surfaces of system board.Electronics member
Other examples of part 110 include CPU (CPU), dual inline memory module (DIMM), power panel, disk unit and
Battery.
When using evaporator block, two opposite sides of cooling electronic component 110 are challenging.Work as evaporator block
During including very flat surface to coordinate or be aligned with electronic component 110, for cooling electronic component 110, evaporator block
140th, 240 is more more effective than air and efficient.Heat pipe 160,260 is generally rigidly welded on evaporator block 140,240 and condensation
Between device plate 180.When the very flat surface of condenser plate 180 coordinates or is aligned with hot component 202, condenser plate 180
Also it is more effective and efficient.The surface profile of the electronic component 110 of such as system board it is practically impossible to not to evaporator block
140th, 240 and/or condenser plate 180 surface smoothness make a concession and between system board install two it is rigidly connected steam
Send out device block 140,240.
With reference to Fig. 7-Fig. 9, the first evaporator block 140 and the second evaporator block 240 are mutually similar, and the first heat pipe 160
Do not change.However, the second heat pipe 260 and/or condenser plate 180 are adapted between two evaporator blocks 140,240
Electronic component 110, and provide between the evaporator block 140 of electronic component 110 and first and the second evaporator block 240 appropriate
It is thermally coupled.Fig. 7-Fig. 8 illustrates the example of the configuration modification to the second heat pipe 260, the second heat pipe 260 pivot during assembly or
Rotate to adapt to electronic component 110 and be aligned efficiently to cool down electronic component 110 with electronic component 110.
With reference to Fig. 7, the second heat pipe 260 includes Part I 762, Part II 764 and bellows 766.Second heat pipe 260
Part I 762 be connected to condenser plate 180.The Part II 764 of second heat pipe 260 is connected to the second evaporator block 240.
Bellows 766 is formed between Part I 762 and Part II 764.Fig. 7 illustrates the cutting figure of a part for bellows 766,
Bellows 766 includes the inside stream in core component 770, such as wire bundle or woven wire, the region to promote bellows 766
Body is returned.The outer surface 768 of bellows 766 can make thermally coupled 765,767 be maintained at heat pipe 260 first by such as copper
The conductive material between 762 and Part II 764 is divided to be formed.
Bellows 766 enables the Part II 764 of the second heat pipe 260 relative to Part I 762, i.e. around from
The axis A that the Part I 762 of two heat pipes 260 extends is rotated with α.For example, Part II 764 is in two position alphas1、α2Between
Rotation so that the moving evaporation device block 240 of the second heat pipe 260 and be aligned and misalignment with electronic component 110.For example, bellows 766
The interval of scheduled volume between first evaporator block 140 and the second evaporator block 240 is provided, made in the first evaporator block 140 and
There can be the space that electronic component 110 is set between two evaporator blocks 240.Bellows 766 enables the second evaporator block 240 to exist
Moved between two positions.During assembling, in first position α1, the second evaporator block 240 flushes with a part for electronic component 110
Or contact so that thermally coupled 246,248 formed between the evaporator block 140 of electronic component 110 and first and electronic component 110 with
Between second evaporator block 240.For example, electron surface 212,214 of the evaporator hot surface 242,244 with electronic component 110
Coordinate or be aligned.
By increasing all between the evaporator hot surface 242,244 and electron surface 212,214 of evaporator block 140,240
Such as the heat-conducting substance 444 of the HiTherm heat-conducting silicone greases of the G750 or Graftech companies of company of SHIN-ETSU HANTOTAI, thermally coupled to be changed
It is kind.In second place α2, the second evaporator block 240 rotates to increase between the first evaporator block 140 and the second evaporator block 240
Space or interval, to allow the insertion of electronic component 110.If for example, install electronic component 110 need be removed and/
Or new electronic component needs to be mounted, the second evaporator block 240 is rotated to and not connect with electronic component 110 by the second heat pipe 260
Tactile second place α2.The flexible structure of bellows 766 enables evaporator block 240 to rotate, so as to install and/or remove electronics
Element 110.
With reference to Fig. 8, the second heat pipe 260 is hingedly connected to condenser plate 180.Hinge 860 uses and for example extends through second
Heat pipe 260 and the pin of condenser plate 180 880 are formed.Hinge 860 enables the second heat pipe 260 around the axle for extending through pin 880
Point b on line B is pivoted or rotation β.Hinge 860 moves the second evaporator block 240 and is aligned and misalignment with electronic component 110,
That is, position β 1 and β 2.Second evaporator block 240 enables electronic component 110 to be inverted and/or inserted via the movement of hinge 860
Enter.There is provided thermally coupled between the second heat pipe 260 and condenser plate 180, heat is delivered to condenser plate 180 and leave heat
Remove component 120.For example, being not only the second heat pipe 260 and condenser plate 180 is formed by the hot material of such as copper.In addition, such as
The heat-conducting substance 444 of the HiTherm heat-conducting silicone greases of the G750 or Graftech companies of company of SHIN-ETSU HANTOTAI can also hinge 860 it
Between use, to transmit heat and increase therebetween thermally coupled.
With reference to Fig. 9, the second heat pipe 260 is welded between the second evaporator block 240 and condenser plate 180.Condenser plate
180 are modified to include two parts, the first plate 982 and the second plate 984.First plate 982 includes the first hot matching surface 983,
And the second plate 984 of condenser plate 180 includes the second hot matching surface 985.First plate 982 of condenser plate 180 and the second plate
984 alignments so that the first hot matching surface 985 of hot matching surface 983 and second is aligned with hot component 202, i.e. as shown in Fig. 2
Hot component 202 can be the part for cooling down component 200.
For example, the first hot matching surface 985 of hot matching surface 983 and second is matched somebody with somebody by the receiving surface 204 with hot component 202
Two matching surfaces connected closed are formed.By directly contact and/or such as company of SHIN-ETSU HANTOTAI G750 or Graftech companies
HiTherm heat-conducting silicone greases heat-conducting substance 444 it is every in the first hot matching surface 985 of hot matching surface 983 and second
It is individual to form thermally coupled between receiving surface 204.Be suitably formed it is thermally coupled so as to efficiently and effectively by heat from heat remove component
120 to be delivered to hot component 202 be important.
Being properly aligned between the first plate 982 and the second plate 984 helps to be formed and keeps suitably thermally coupled.For example,
Need first thermally coupled, and coordinate in the second heat between the first hot matching surface 983 and the receiving surface 204 of hot component 202
Needed between the receiving surface 204 of surface 985 and hot component 202 second thermally coupled.First plate 982 will come from the first heat pipe 160
Heat remove component 120 from heat and be delivered to hot component 202, and the second plate 984 is by the heat transfer from the second heat pipe 260 to hot structure
Part 202.First plate 982 and the second plate 984 have thermally coupled (that is, the first hot matching surface 983 and reception with hot component 202
It is thermally coupled between thermally coupled and the second hot matching surface 985 and receiving surface 204 between surface 204) for effectively and
The heat that efficiently removal carrys out self-heating remove group part 120 is important.However, when between the first plate and hot component 202 and second
When having thermally coupled between plate 984 and hot component 202, needed not exist between the first plate 982 and the second plate 984 it is thermally coupled,
Because heat passes through the second hot matching surface 985 of the first hot plate 984 of matching surface 983 and second of the first plate 982 respectively
Remove.
As shown in the dotted portion as mobile arrow 990 and component 120, the first plate 982 and the second plate 984 are formed to make
Two plates are obtained to may move and be aligned with another and misalignment (that is, separate and be aligned again).For example, the second plate 984 can be relative to
First plate 982 is moved up and down, to provide the gap value between the first evaporator block 140 and the second evaporator block 240, the gap value
Electronic component 110 is set to coordinate between the first evaporator block 140 and the second evaporator block 240.Although Fig. 9, which is illustrated in, not to be had
Evaporator block 240 and the second heat pipe 260 of condenser plate 180 are welded in the case of bellows 766 or hinge 860, such as Fig. 7-
The second heat pipe 260 shown in Fig. 8 can be also used together with the condenser plate 180 with two parts, as shown in Figure 9.
First plate 982 of condenser plate 180 and the second plate 984 use the Part I for example formed in condenser plate 180
Alignment members 986 between Part II are aligned or are aligned again.Alignment members 986 are directed at the first plate 982 of condenser plate 180
With the second plate 984 so that the first hot matching surface 985 of hot matching surface 983 and second is aligned with hot component 202, and provide by
Heat transfer from the first heat pipe 160 and the second heat pipe 260 is to the thermally coupled of condenser plate 180.The alignment of alignment members 986 first
The plate 984 of plate 982 and second is so that the first hot matching surface 985 of hot matching surface 983 and second to be set together, so as to form non-
Chang Pingtan surface with hot component 202 to coordinate.It is used to contribute to using alignment members 986 easily and as one man to set the first heat
The hot matching surface 985 of matching surface 983 and second so that the first plate 982 and the second plate 984 can efficiently and effectively by
Carry out the heat transfer of self-heating remove group part 120 to hot component 202.
The example of alignment members 986 includes pin 992, and it is coupled to the first plate 982 and second to be formed in condenser plate 180
In hole 994 between plate 984.For example, hole 994 is illustrated as being formed in the first plate 982, and pin 992 is formed in the second plate 984
In.However, hole 994 may be formed in the second plate 984, and pin 992 may be formed in the first plate 982.Alternatively, pin 992 can be with
First plate 982 and the second plate 984 are separated, and the first plate 982 and the second plate 984 may each comprise hole 994 formed therein, with
Receive pin 992 and be directed at the first plate 982 and the second plate 984.Then, the first plate 982 and the second plate 984 such as screw or clip
Fastener 996 keep together.
The disclosure is described using nonrestrictive detailed example explanation, and is not intended to limitation the scope of the present disclosure.
It should be appreciated that the feature and/or operation that are described on an example can be used together with other examples, and not all public affairs
The example opened all has to be illustrated or all features with reference to the example description in example and/or operation in specific accompanying drawing.
To those skilled in the art, the variant of described example will be expected.In addition, work as makes in the disclosure and/or claim
Used time, term "comprising", " comprising ", " having " and its cognate should be represented " including but being not necessarily limited to ".
It may not be essential to the present invention but be intended to example it should be noted that some in above-mentioned example may include
Structure, action or the structure of property and the details of action.As it is known in the art, structure described here and action can be by performing
The equivalent of identical function is replaced, even if the structure or action are different.Therefore, the scope of the present disclosure is only by such as claim
Used in key element and limitation limit.
Claims (15)
1. a kind of heat removes component, including：
Evaporator block, for removing the heat from electronic component, the evaporator block is engaged with the electronic component and described
Formed between evaporator block and the electronic component remove it is hot thermally coupled from the electronic component；
Be connected to the evaporator block be used for remove the hot heat pipe from the evaporator block；
Be connected to the heat pipe be used for receive the hot condenser plate from the heat pipe, the condenser plate include heat cooperation table
Face, the hot matching surface coordinates with hot component so that heat removes assembly removal via the hot matching surface from the heat, its
In：
The condenser plate includes the first plate and the second plate, and second plate can be moved up and down relative to first plate,
The heat pipe includes the first heat pipe and the second heat pipe,
The evaporator block includes the first evaporator block and the second evaporator block, and
First heat pipe is connected to first evaporator block, and second heat pipe is connected to second evaporator block, institute
State the first plate and the heat from first heat pipe is delivered to the hot component from the heat removal component, second plate is in the future
From the heat transfer of second heat pipe to the hot component.
2. heat according to claim 1 removes component, wherein the hot matching surface and the receiving surface of the hot component
Flush.
3. heat according to claim 1 removes component, wherein every in first evaporator block and the second evaporator block
Individual to further comprise evaporator hot surface, the evaporator hot surface is flushed with a part for the electronic component to be come from removing
The heat of the electronic component.
4. heat according to claim 1 removes component, wherein first plate includes the first hot matching surface, described second
Plate includes the second hot matching surface, and first plate is aligned with second plate so that the first hot matching surface and described
Second hot matching surface coordinates with the hot component.
5. heat according to claim 4 removes component, further comprise the alignment members to be formed in the condenser plate,
For being directed at first plate and second plate so that the first hot matching surface and the second hot matching surface and institute
State hot component cooperation.
6. it is according to claim 1 heat remove component, wherein second heat pipe include Part I, Part II and
Bellows between the Part I and the Part II, the Part I is connected to the condenser plate, the ripple
Line pipe enables the Part II of second heat pipe to be pivoted relative to the Part I of second heat pipe.
7. heat according to claim 1 removes component, wherein second heat pipe is pivotally connected to the condenser plate,
Second heat pipe and the condenser plate are provided the heat of the heat transfer from second heat pipe to the condenser plate even
Connect.
8. a kind of system for being used to remove heat, including：
Electronic component；With
Heat removes component, including：
Evaporator block, for removing the heat from the electronic component, the evaporator block engaged with the electronic component and
Formed between the evaporator block and the electronic component remove it is hot thermally coupled from the electronic component；
Be connected to the evaporator block be used for remove the hot heat pipe from the evaporator block；
Be connected to the heat pipe be used for receive the hot condenser plate from the heat pipe, the condenser plate include heat cooperation table
Face, the hot matching surface is aligned with hot component so that heat removes assembly removal via the hot matching surface from the heat, its
In：
The condenser plate includes the first plate and the second plate, and second plate can be moved up and down relative to first plate,
The heat pipe includes the first heat pipe and the second heat pipe,
The evaporator block includes the first evaporator block and the second evaporator block, and
First heat pipe is connected to first evaporator block, and second heat pipe is connected to second evaporator block, institute
State the first plate and the heat from first heat pipe is delivered to the hot component from the heat removal component, second plate is in the future
From the heat transfer of second heat pipe to the hot component.
9. system according to claim 8, wherein：
The hot matching surface is flushed with the receiving surface of the hot component；And
Each further comprise evaporator hot surface in first evaporator block and the second evaporator block, evaporator heat
Surface flushes to remove the heat from the electronic component with a part for the electronic component.
10. system according to claim 8, wherein first plate includes the first hot matching surface, the second plate bag
The second hot matching surface is included, first plate is aligned with second plate so that the first hot matching surface and described second
Hot matching surface is aligned with the hot component.
11. system according to claim 10, further comprises being formed in first plate of the condenser plate and institute
The alignment members between the second plate are stated, first plate and second plate for being directed at the condenser plate so that：
The first hot matching surface and the second hot matching surface are aligned with the hot component；And
The first hot matching surface and the second hot matching surface are provided from first heat pipe and the second heat pipe
Heat transfer is thermally coupled to the condenser plate.
12. system according to claim 11, wherein the alignment members include pin, the pin coordinate be formed at it is described cold
In hole between first plate and second plate of condenser plate.
13. system according to claim 8, wherein：
Second heat pipe includes the ripple between Part I, Part II and the Part I and the Part II
Pipe, the Part I of second heat pipe is connected to the condenser plate, and the bellows makes the institute of second heat pipe
Stating Part II can pivot and in the Part I and described second relative to the Part I of second heat pipe
Kept between part thermally coupled.
14. system according to claim 8, wherein：
Second heat pipe is hingedly connected to the condenser plate so that second heat pipe：
Second evaporator block is rotated to be aligned and misalignment with the electronic component, and
There is provided thermally coupled between second heat pipe and the condenser plate.
15. a kind of heat removes component, including：
First evaporator block, the heat for removing the first surface from electronic component, first evaporator block and the electricity
The first surface engagement of subcomponent simultaneously forms removal from institute between first evaporator block and the first surface
Hot first for stating electronic component is thermally coupled；
Be connected to first evaporator block be used for remove the first hot heat pipe from first evaporator block；
Second evaporator block, the heat for removing the second surface from the electronic component, second evaporator block and institute
State electronic component engagement and formed to remove between second evaporator block and the electronic component and come from the electronic component
Hot second it is thermally coupled；
Be connected to second evaporator block be used for remove the second hot heat pipe from second evaporator block；With
Being connected to first heat pipe and second heat pipe is used to receiving from first heat pipe and second heat pipe
The condenser plate of heat, the condenser plate includes hot matching surface, and the hot matching surface coordinates with hot component so that heat is via institute
State hot matching surface and remove assembly removal from the heat, wherein the condenser plate includes the first plate and the second plate, described second
Plate can be moved up and down relative to first plate, and
Heat from first heat pipe is removed component from the heat and is delivered to the hot component, described second by first plate
Plate is by the heat transfer from second heat pipe to the hot component.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2012/070727 WO2014098851A1 (en) | 2012-12-19 | 2012-12-19 | Heat removal assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104938043A CN104938043A (en) | 2015-09-23 |
| CN104938043B true CN104938043B (en) | 2017-07-18 |
Family
ID=50978937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280077899.6A Active CN104938043B (en) | 2012-12-19 | 2012-12-19 | Heat removes component |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20150354901A1 (en) |
| EP (1) | EP2936953A4 (en) |
| CN (1) | CN104938043B (en) |
| TW (1) | TW201428226A (en) |
| WO (1) | WO2014098851A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016116410A1 (en) * | 2015-01-20 | 2016-07-28 | Abb Technology Ag | Switchgear cooling system comprising a heat pipe, fan and thermoelectric generation |
| US9750127B2 (en) * | 2015-12-04 | 2017-08-29 | General Electric Company | Circuit card assembly including heat transfer assembly and method of manufacturing such |
| US10253595B2 (en) * | 2016-10-12 | 2019-04-09 | Baker Hughes, A Ge Company, Llc | Evaporative cooling using a refrigerant, a selectively permeable membrane, and a drawing fluid |
| US10159165B2 (en) * | 2017-02-02 | 2018-12-18 | Qualcomm Incorporated | Evaporative cooling solution for handheld electronic devices |
| US10670650B2 (en) * | 2017-09-28 | 2020-06-02 | Advantest Corporation | Device testing with heat pipe cooling assembly |
| US11153990B2 (en) * | 2018-12-21 | 2021-10-19 | Intel Corporation | Movable heat-transfer system |
| US10788637B2 (en) * | 2018-12-21 | 2020-09-29 | Juniper Networks, Inc. | Apparatus, system, and method for dissipating heat emitted by individual communication modules via ganged heat exchangers |
| US10856055B2 (en) * | 2019-03-20 | 2020-12-01 | Mellanox Technologies, Ltd. | Apparatuses for improved thermal performance of dynamic network connections |
| CN112783299B (en) * | 2019-11-06 | 2023-10-13 | 富联精密电子(天津)有限公司 | LTS radiator and electronic equipment with same |
| US11647612B2 (en) * | 2020-11-23 | 2023-05-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | High-density integrated power electronic assembly including double-sided cooling structure |
| US11647579B2 (en) * | 2021-05-04 | 2023-05-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Chip-on-chip power devices embedded in PCB and cooling systems incorporating the same |
| US11732976B1 (en) * | 2022-03-02 | 2023-08-22 | Aic Inc. | Rapid heat dissipation device |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4422501A (en) * | 1982-01-22 | 1983-12-27 | The Boeing Company | External artery heat pipe |
| JPH0724293B2 (en) * | 1987-09-30 | 1995-03-15 | 株式会社日立製作所 | Boiling cooler |
| US6125035A (en) * | 1998-10-13 | 2000-09-26 | Dell Usa, L.P. | Heat sink assembly with rotating heat pipe |
| US6209626B1 (en) * | 1999-01-11 | 2001-04-03 | Intel Corporation | Heat pipe with pumping capabilities and use thereof in cooling a device |
| US6674643B2 (en) * | 2001-08-09 | 2004-01-06 | International Business Machines Corporation | Thermal connector for transferring heat between removable printed circuit boards |
| TWM245507U (en) * | 2003-10-29 | 2004-10-01 | Ching-Yuan Ruan | Bending structure of heat conducting pipe |
| TWM249410U (en) * | 2003-12-26 | 2004-11-01 | Hon Hai Prec Ind Co Ltd | Heat dissipating device using heat pipe |
| US20050145371A1 (en) * | 2003-12-31 | 2005-07-07 | Eric Distefano | Thermal solution for electronics cooling using a heat pipe in combination with active loop solution |
| KR100558065B1 (en) * | 2004-03-15 | 2006-03-10 | 삼성전자주식회사 | Semiconductor module with heat sink |
| US6978828B1 (en) * | 2004-06-18 | 2005-12-27 | Schlumberger Technology Corporation | Heat pipe cooling system |
| US7327576B2 (en) * | 2005-06-24 | 2008-02-05 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Heat dissipation device |
| CN100455175C (en) * | 2005-07-08 | 2009-01-21 | 富准精密工业(深圳)有限公司 | Loop-type radiating module group |
| US20070119566A1 (en) * | 2005-11-30 | 2007-05-31 | Xue-Wen Peng | Heat dissipation device |
| CN101534626B (en) * | 2008-03-14 | 2011-06-08 | 富准精密工业(深圳)有限公司 | Thermal module combination and radiator combination thereof |
| CN101754657B (en) * | 2008-12-10 | 2013-04-24 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN101776941B (en) * | 2009-01-08 | 2013-03-13 | 富准精密工业(深圳)有限公司 | Radiating device |
| CN201518567U (en) * | 2009-08-26 | 2010-06-30 | 富准精密工业(深圳)有限公司 | Radiating die set |
| CN102056461A (en) * | 2009-11-05 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipating device |
-
2012
- 2012-12-19 US US14/650,571 patent/US20150354901A1/en not_active Abandoned
- 2012-12-19 EP EP12890444.8A patent/EP2936953A4/en not_active Withdrawn
- 2012-12-19 CN CN201280077899.6A patent/CN104938043B/en active Active
- 2012-12-19 WO PCT/US2012/070727 patent/WO2014098851A1/en active Application Filing
-
2013
- 2013-10-02 TW TW102135690A patent/TW201428226A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014098851A1 (en) | 2014-06-26 |
| US20150354901A1 (en) | 2015-12-10 |
| TW201428226A (en) | 2014-07-16 |
| CN104938043A (en) | 2015-09-23 |
| EP2936953A4 (en) | 2016-07-13 |
| EP2936953A1 (en) | 2015-10-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104938043B (en) | Heat removes component | |
| US8913391B2 (en) | Board-level heat transfer apparatus for communication platforms | |
| CN100491888C (en) | Loop type heat-exchange device | |
| CN101095386B (en) | Cooling apparatus, method for cooling printed circuit board | |
| US8915293B2 (en) | Heat exchanger | |
| US7926553B2 (en) | Cooling system for electronic devices, in particular, computers | |
| US8542489B2 (en) | Mechanically-reattachable liquid-cooled cooling apparatus | |
| US20110198057A1 (en) | Heat dissipation apparatus for data center | |
| CN203786651U (en) | Liquid cooling system of server and server comprising liquid cooling system | |
| WO2017148050A1 (en) | Cooling device for data centre machine cabinet, machine cabinet, and cooling system | |
| CN109195411A (en) | For conducting the device and associated components, system and method for heat between the guide rail of rack mounted device and the guide groove of cooling holder shell | |
| JP2010079397A (en) | Electronic device | |
| BRPI0901418A2 (en) | compact equipment cooling system | |
| US20100032141A1 (en) | cooling system utilizing carbon nanotubes for cooling of electrical systems | |
| WO2016095589A1 (en) | Semiconductor refrigerator | |
| CN104329828A (en) | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof | |
| JP2004319628A (en) | System module | |
| CN212906119U (en) | Server | |
| WO2015146110A1 (en) | Phase-change cooler and phase-change cooling method | |
| CN104329850A (en) | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof | |
| JP2007010211A (en) | Cooling device of electronics device | |
| CN106909210A (en) | Closed enclosure heat radiation system based on flat board loop circuit heat pipe | |
| JP2010067660A (en) | Electronic device and component for the same | |
| JP2010079403A (en) | Cooling system for electronic equipment | |
| JP2024513805A (en) | Liquid cooling heat dissipation equipment, cabinets and systems |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161017 Address after: American Texas Applicant after: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP Address before: American Texas Applicant before: Hewlett-Packard Development Company, Limited Liability Partnership |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |