CN106909210A - Closed enclosure heat radiation system based on flat board loop circuit heat pipe - Google Patents
Closed enclosure heat radiation system based on flat board loop circuit heat pipe Download PDFInfo
- Publication number
- CN106909210A CN106909210A CN201710257573.6A CN201710257573A CN106909210A CN 106909210 A CN106909210 A CN 106909210A CN 201710257573 A CN201710257573 A CN 201710257573A CN 106909210 A CN106909210 A CN 106909210A
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- Prior art keywords
- loop circuit
- heat pipe
- fin
- flat board
- closed
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of closed enclosure heat radiation system based on flat board loop circuit heat pipe, can realize the closure designs of cooling cabinet on the basis of high power components heat dissipation problem is solved.The closed enclosure heat radiation system includes：Closed case, the radiating fin outside closed case and a set of with upper flat plate loop circuit heat pipe inside closed case；The evaporator of its middle plateform loop circuit heat pipe is close in closed case need the device of radiating；Closed case includes：Mobile side board, chassis frame and side radiating plate-fin；One end of chassis frame is closed by mobile side board, and the other end is closed by side radiating plate-fin；The condenser of the radiating fin and flat board loop circuit heat pipe is integrated on side radiating plate-fin.The cooling system, by heat transmission to the outer dissipation of cabinet, realizes the closure designs of cabinet by flat board loop circuit heat pipe, realizes dust-proof, the protection against the tide of cabinet, it is possible to increase life-span of corresponding device, reliability and the adaptability to complicated, harsh use environment.
Description
Technical field
Invention is related to a kind of cooling system, and in particular to a kind of cooling system based on flat board loop circuit heat pipe heat transfer technology,
Belong to technical field of heat dissipation.
Background technology
Growing with computer and Internet technology, it is indispensable that desktop computer has become people's life
Part, computer popularization makes computer local environment also complicated various, and computer is electronic product, and dust, wet environment are equal
Computer glitch can be caused, it is extra that the whole machine replacing that computer cleaning is safeguarded, breakdown maintenance and failure cause can increase user
Cost.
CPU, GPU are the core power consumption components of computer, for ensure its service behaviour, it is necessary to it is carried out effectively radiating with
Its operating temperature is maintained, based on ventilation and heat, ventilation and heat needs cabinet to open, by drawing for current computer cabinet radiating
Enter extraneous air, to maintain system radiating border, the radiating mode cannot realize that cabinet is closed, it is impossible to prevent dust and moisture
Into, therefore open chassis design is the central factor for causing computer glitch, closed case design is to solve the above problems
Effective means, but influenceed by heat transfer technology development level, fail the application that puts it over.
The content of the invention
In view of this, the present invention provides a kind of closed enclosure heat radiation system based on flat board loop circuit heat pipe, is solving greatly
On the basis of power component heat dissipation problem, the closure designs of cooling cabinet are realized.
The described closed enclosure heat radiation system based on flat board loop circuit heat pipe, the flat board loop circuit heat pipe includes：Liquid storage
Device, evaporator, condenser, steam pipework and liquid line；
Characterized in that, the closed enclosure heat radiation system includes：Closed case, the radiating outside closed case
Fin and a set of with upper flat plate loop circuit heat pipe inside closed case；The evaporator of the flat board loop circuit heat pipe is close to envelope
Closing in cabinet needs the device of radiating；
The closed case includes：Mobile side board, chassis frame and side radiating plate-fin；One end of the chassis frame is by living
Dynamic side plate closing, the other end is closed by side radiating plate-fin；The condenser of the radiating fin and flat board loop circuit heat pipe is integrated in
On the side radiating plate-fin, specially：In the side radiating plate-fin towards integrated flat board loop heat on the side end face in chassis frame
The condenser of pipe, towards chassis frame outside a side end face on integrated heat dissipation fin.
As a kind of preferred embodiment of the invention, it is all provided with the steam pipework and liquid line of the flat board loop circuit heat pipe
Flexible joint is equipped with, the flexible joint realizes the flexible bending of conduit steam pipework and liquid line.
As a kind of preferred embodiment of the invention, the reservoir and evaporator integrated design.
Used as a kind of preferred embodiment of the invention, the radiating fin is integrally formed with side radiating plate-fin, the flat board loop
The condenser side plate of heat pipe is complex as a whole by the way of soldering or stickup with side radiating plate-fin.
Beneficial effect：
(1) compared to traditional copper water heat pipe, there is flat board loop circuit heat pipe heat-transfer capability higher and limit heat-flow density to radiate
Ability, can solve the problem that the heat dissipation problem under the unforced concurrent condition of the high power devices such as CPU, GPU；
(2) heat transmission to the outer dissipation of cabinet is realized by the closure designs of cabinet by flat board loop circuit heat pipe, is realized
Dust-proof, the protection against the tide of cabinet, it is possible to increase life-span of corresponding device, reliability and the adaptability to complicated, harsh use environment；
(3) designed using fan-free, realize cabinet muting function, while cabinet compact design can be realized, be effectively compressed
Cabinet Size and volume.
Brief description of the drawings
Fig. 1 is the schematic diagram of the totally-enclosed computer cabinet based on flat board loop circuit heat pipe；
Fig. 2 is totally-enclosed computer cabinet external structure；
Fig. 3 is totally-enclosed computer cabinet side radiating plate-fin structure chart；
Wherein：10- totally-encloseds computer cabinet, 11- mobile side boards, 12- chassis frames, 13- side radiating plate-fins, 13-1- sides
Plate substrate, 20- radiating fins, 30- flat boards loop circuit heat pipe, 31- reservoirs, 32- evaporators, 33- condensers, 34- conduits, 34-
1- steam pipeworks, 34-2- liquid lines, 34-3- flexible joints.
Specific embodiment
Develop simultaneously embodiment below in conjunction with the accompanying drawings, and the present invention will be described in detail.
The present embodiment provides a kind of closed computer heat radiation system based on flat board loop circuit heat pipe, changes traditional computer
The radiating mode of cabinet ventilation and heat, uses flat board loop circuit heat pipe heat transfer technology pair on the basis of computer cabinet totally-enclosed is made
Its high power device is radiated.
As shown in figure 1, the totally-enclosed computer heat radiation system includes：Closed case 10, radiating fin 20 and flat board loop
Heat pipe 30；Wherein, flat board loop circuit heat pipe 30 can need to set many sets according to radiating element, be set in the closed case 10 shown in Fig. 1
It is equipped with two sets of flat board loop circuit heat pipes 30.
Flat board loop circuit heat pipe 30 is installed in the inside of closed case 10, and radiating fin 20 is installed in outside, and flat board loop circuit heat pipe 30 is received
Collect big power consuming devices heat, being transmitted to radiating fin 20 through closed case 10 carries out dissipation, radiating fin 20 is integrated in closing machine
On case 10, the condensation end of flat board loop circuit heat pipe 30 is also integrated on closed case 10.
The flat board loop circuit heat pipe 30 includes：Reservoir 31, evaporator 32, condenser 33 and conduit 34.Wherein reservoir
31 use integrated design with evaporator 32, and when using, evaporator 32 is close to the high power device in closed case 10, cold
Condenser 33 and closed case 10, radiating fin integrated design, when using, loop working medium is with gas-liquid binary states along flat board loop circuit heat pipe
30 circulate, and realize dissipation of the high power device heat to the external environment condition of radiating fin 20.
The conduit 34 includes：Steam pipework 34-1, liquid line 34-2 and flexible joint 34-3.Working medium in reservoir 31
It is liquid, working medium is absorbed heat vaporization in evaporator 32, steam flows to condenser 33 along steam pipework 34-1, and working medium is in condenser
33 condensation liquefactions, are back to reservoir 31 along liquid line 34-2 afterwards, realize that working medium gas-liquid two-phase is circulated.In the steaming
Flexible joint 34-3 is provided with vapor pipeline 34-1 and liquid line 34-2, flexible joint 34-3 can realize the flexibility of conduit 34
Bending, facilitates the mounting arrangements of flat board loop circuit heat pipe 30.
As shown in Fig. 2 closed computation machine cabinet 10 includes：Mobile side board 11, chassis frame 12 and side radiating plate-fin 13.Cabinet
Framework 12, one end and the affixed rear enclosed of mobile side board 11 of chassis frame 12, the other end and the affixed rear enclosed of side radiating plate-fin 13.Adopt
It is connected with chassis frame 12 with mobile side board 11, can be conveniently dismantled, for computer dismounting provides convenient space；Chassis frame 12 with
Side radiating plate-fin 13 is connected the installation fixed support structure as computer-internal board, part.Mobile side board 11 and cabinet
Framework 12, side radiating plate-fin 13 can take certain closed or even sealing with the connecting portion of chassis frame 12 according to actual environment requirement
Measure.
As shown in figure 3, the side radiating plate-fin 13 of totally-enclosed computer cabinet 10 is composite construction, including：Side plate substrate 13-1,
It is integrated in the condenser and collection of the flat board loop circuit heat pipe 10 of the inner surface of side radiating plate-fin 13 (end face i.e. in chassis frame 12)
Into the radiating fin in the outer surface of side radiating plate-fin 13 (end face i.e. outside chassis frame 12).Side plate substrate 13-1 and radiating fin
Piece 20 is integrally formed, side plate substrate 13-1 and the condenser 33 of flat board loop circuit heat pipe 10 use the process combinings such as soldering, stickup for
Integrally, integrated composite construction helps to reduce too many levels thermal contact resistance, can effectively improve system radiating performance.
In sum, presently preferred embodiments of the present invention is these are only, is not intended to limit the scope of the present invention.
All any modification, equivalent substitution and improvements within the spirit and principles in the present invention, made etc., should be included in of the invention
Within protection domain.
Claims (4)
1. the closed enclosure heat radiation system of flat board loop circuit heat pipe is based on, and the flat board loop circuit heat pipe includes：Reservoir, evaporation
Device, condenser, steam pipework and liquid line；
Characterized in that, the closed enclosure heat radiation system includes：Closed case, the radiating fin outside closed case
With it is a set of with upper flat plate loop circuit heat pipe inside closed case；The evaporator of the flat board loop circuit heat pipe is close to closing machine
The device of radiating is needed in case；
The closed case includes：Mobile side board, chassis frame and side radiating plate-fin；One end of the chassis frame passes through active side
Plate is closed, and the other end is closed by side radiating plate-fin；The condenser of the radiating fin and flat board loop circuit heat pipe is integrated in described
On side radiating plate-fin, specially：In the side radiating plate-fin towards integrated flat board loop circuit heat pipe on the side end face in chassis frame
Condenser, towards chassis frame outside a side end face on integrated heat dissipation fin.
2. the closed enclosure heat radiation system of flat board loop circuit heat pipe is based on as claimed in claim 1, it is characterised in that described
Flexible joint is provided with the steam pipework and liquid line of flat board loop circuit heat pipe, the flexible joint realizes conduit steam pipe
Road and the flexible bending of liquid line.
3. the closed enclosure heat radiation system of flat board loop circuit heat pipe is based on as claimed in claim 1 or 2, it is characterised in that institute
State reservoir and evaporator integrated design.
4. the closed enclosure heat radiation system of flat board loop circuit heat pipe is based on as claimed in claim 1 or 2, it is characterised in that institute
State that radiating fin is integrally formed with side radiating plate-fin, the condenser side plate of the flat board loop circuit heat pipe is by the way of soldering or stickup
It is complex as a whole with side radiating plate-fin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710257573.6A CN106909210A (en) | 2017-04-19 | 2017-04-19 | Closed enclosure heat radiation system based on flat board loop circuit heat pipe |
| PCT/CN2017/000654 WO2018191835A1 (en) | 2017-04-19 | 2017-10-31 | Flat loop heat pipe-based closed machine case cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710257573.6A CN106909210A (en) | 2017-04-19 | 2017-04-19 | Closed enclosure heat radiation system based on flat board loop circuit heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106909210A true CN106909210A (en) | 2017-06-30 |
Family
ID=59211194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710257573.6A Pending CN106909210A (en) | 2017-04-19 | 2017-04-19 | Closed enclosure heat radiation system based on flat board loop circuit heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106909210A (en) |
| WO (1) | WO2018191835A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018191835A1 (en) * | 2017-04-19 | 2018-10-25 | 北京空间飞行器总体设计部 | Flat loop heat pipe-based closed machine case cooling system |
| CN112486286A (en) * | 2020-12-01 | 2021-03-12 | 珠海大横琴科技发展有限公司 | Big data server |
| CN112566465A (en) * | 2020-12-08 | 2021-03-26 | 泰睿(北京)技术服务有限公司 | Built-in heat abstractor of quick-witted case based on loop heat pipe |
| CN113451925A (en) * | 2021-08-19 | 2021-09-28 | 冯秀君 | High-performance explosion-proof intelligent distribution box |
| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
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| CN101308398A (en) * | 2008-06-30 | 2008-11-19 | 中山大学 | Radiation system for calculation processing arrangements and equipment adopting the heat radiation system |
| CN101610662A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| CN102157468A (en) * | 2011-03-17 | 2011-08-17 | 北京芯铠电子散热技术有限责任公司 | High-power loop heat pipe radiator and manufacturing method thereof |
| CN104820480A (en) * | 2015-04-30 | 2015-08-05 | 天津徊达科技有限公司 | Heat dissipation dustproof case for desktop computer |
| CN105992476A (en) * | 2016-07-13 | 2016-10-05 | 西安电子工程研究所 | Sealed cabinet with independent cooling air duct for each module |
| CN205812614U (en) * | 2016-06-14 | 2016-12-14 | 中国航空无线电电子研究所 | A kind of liquid metal heat radiation cabinet |
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| CN103576811A (en) * | 2013-11-06 | 2014-02-12 | 曙光信息产业(北京)有限公司 | Heat dissipation assembly for computer |
| CN106909210A (en) * | 2017-04-19 | 2017-06-30 | 北京空间飞行器总体设计部 | Closed enclosure heat radiation system based on flat board loop circuit heat pipe |
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2017
- 2017-04-19 CN CN201710257573.6A patent/CN106909210A/en active Pending
- 2017-10-31 WO PCT/CN2017/000654 patent/WO2018191835A1/en active Application Filing
Patent Citations (6)
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| CN101610662A (en) * | 2008-06-20 | 2009-12-23 | 沈国忠 | Heat pipe cooling type fully sealed high-efficiency radiating electronic cabinet |
| CN101308398A (en) * | 2008-06-30 | 2008-11-19 | 中山大学 | Radiation system for calculation processing arrangements and equipment adopting the heat radiation system |
| CN102157468A (en) * | 2011-03-17 | 2011-08-17 | 北京芯铠电子散热技术有限责任公司 | High-power loop heat pipe radiator and manufacturing method thereof |
| CN104820480A (en) * | 2015-04-30 | 2015-08-05 | 天津徊达科技有限公司 | Heat dissipation dustproof case for desktop computer |
| CN205812614U (en) * | 2016-06-14 | 2016-12-14 | 中国航空无线电电子研究所 | A kind of liquid metal heat radiation cabinet |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018191835A1 (en) * | 2017-04-19 | 2018-10-25 | 北京空间飞行器总体设计部 | Flat loop heat pipe-based closed machine case cooling system |
| CN112486286A (en) * | 2020-12-01 | 2021-03-12 | 珠海大横琴科技发展有限公司 | Big data server |
| CN112566465A (en) * | 2020-12-08 | 2021-03-26 | 泰睿(北京)技术服务有限公司 | Built-in heat abstractor of quick-witted case based on loop heat pipe |
| CN112566465B (en) * | 2020-12-08 | 2022-02-08 | 泰睿(北京)技术服务有限公司 | Built-in heat abstractor of quick-witted case based on loop heat pipe |
| CN113451925A (en) * | 2021-08-19 | 2021-09-28 | 冯秀君 | High-performance explosion-proof intelligent distribution box |
| CN113451925B (en) * | 2021-08-19 | 2022-11-01 | 浙江启明电力集团有限公司 | High-performance explosion-proof intelligent distribution box |
| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018191835A1 (en) | 2018-10-25 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170630 |
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| RJ01 | Rejection of invention patent application after publication |