CN101521161B - 无铅二极管的台面制作工艺 - Google Patents

无铅二极管的台面制作工艺 Download PDF

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Publication number
CN101521161B
CN101521161B CN2009101346788A CN200910134678A CN101521161B CN 101521161 B CN101521161 B CN 101521161B CN 2009101346788 A CN2009101346788 A CN 2009101346788A CN 200910134678 A CN200910134678 A CN 200910134678A CN 101521161 B CN101521161 B CN 101521161B
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lead
corrosion
diode
free diode
technology
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CN101521161A (zh
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陆国华
陈炎
吴亚红
吴刚
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Lu Bingqi
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RUGAO RIXIN ELECTRONIC CO Ltd
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Abstract

本发明公开了一种无铅二极管的台面制作工艺,所述无铅二极管芯片的台面腐蚀用酸洗腐蚀;其特征在于:所述无铅二极管芯片的台面腐蚀在酸洗腐蚀之前,先用强碱、弱碱进行两次腐蚀。以上工艺制作的为无铅二极管,且由于产品台面采用碱腐蚀工艺,使得产品的高温焊接保证为265±5℃/10秒,适用于所有产品,有利于净化环境。

Description

无铅二极管的台面制作工艺
技术领域
本发明涉及一种无铅二极管芯片的台面制作工艺,具体涉及一种熔点大于270℃,适用于集成电路、高压硅堆、多芯片及单芯片无铅二极管的台面制作工艺。
背景技术
目前,单芯片二极管的芯片台面腐蚀传统的工艺为酸洗,该工艺的缺点在于酸与无铅焊片反应导致产品断裂。
发明内容
本发明的主要任务在于提供一种无铅二极管的制作工艺。
为了解决以上技术问题,本发明的一种无铅二极管的台面制作工艺,所述无铅二极管芯片的台面腐蚀用酸洗腐蚀;其特征在于:所述无铅二极管芯片的台面腐蚀在酸洗腐蚀之前,先用强碱、弱碱进行两次腐蚀。
进一步地,所述腐蚀二极管台面的浓碱和弱碱均为氢氧化钾。
进一步地,所述氢氧化钾浓度为:8-15%,腐蚀温度为70-95℃,时间为5-15分钟。
进一步地,所述第二次腐蚀二极管台面的氢氧化钾浓度为:2-6%,腐蚀温度为70-95℃,时间为5-15分钟。
本发明的优点在于:以上工艺制作的为无铅二极管,且由于产品台面采用碱腐蚀工艺,解决酸与无铅焊片反应导致产品断裂的问题,且还使得产品的高温焊接保证为265±5℃/10秒,适用于所有产品,有利于净化环境。
附图说明
图为本发明的结构示意图。
具体实施方式
如图所示,所述二极管由电极1、焊片2、芯片3、焊片4、电极5焊接为一体,焊接后在两电极之间用硅橡胶或聚酰亚胺胶6密封,再在其组成的整体外表面用环氧树脂进行封装组成。
上述的芯片台面腐蚀工艺由传统的酸腐蚀改为先碱腐蚀后酸腐蚀。具体步骤如下:首先,用强碱进行腐蚀,本发明中所用的强碱为氢氧化钾溶液,该溶液浓度为:8-15%,腐蚀温度为70-95℃,对芯片台面的腐蚀时间为5-15分钟。
然后,用弱碱进行腐蚀,本发明中所用的弱碱为氢氧化钾溶液,其氢氧化钾浓度为:2-6%,腐蚀温度为70-95℃,时间为5-15分钟。
再用传统酸腐蚀中的第二个步骤和第三个步骤进行酸腐蚀,即用含磷酸、双氧水、去离子水的酸和含氨水、双氧水、去离子水的酸按常规方法进行腐蚀,具体步骤为常规步骤,在此故不累述。

Claims (1)

1.一种无铅二极管的台面制作工艺,所述无铅二极管芯片的台面腐蚀用酸洗腐蚀;其特征在于:所述无铅二极管芯片的台面腐蚀在酸洗腐蚀之前,先用强碱腐蚀、再用弱碱进行腐蚀;所述腐蚀二极管台面的强碱和弱碱均为氢氧化钾;所述强碱腐蚀二极管台面的氢氧化钾浓度为:8-15%,腐蚀温度为70-95℃,时间为5-15分钟;所述弱碱腐蚀二极管台面的氢氧化钾浓度为:2-6%,腐蚀温度为70-95℃,时间为5-15分钟。
CN2009101346788A 2009-04-28 2009-04-28 无铅二极管的台面制作工艺 Expired - Fee Related CN101521161B (zh)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101924141A (zh) * 2010-09-07 2010-12-22 如皋市日鑫电子有限公司 一种适用于do-27和a-201ad封装结构的大功率二极管
CN102543721A (zh) * 2011-02-23 2012-07-04 如皋市日鑫电子有限公司 无铅二极管的台面制作工艺
CN102437131A (zh) * 2011-12-28 2012-05-02 如皋市大昌电子有限公司 聚酰亚胺钝化保护整流芯片

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