CN101521161B - 无铅二极管的台面制作工艺 - Google Patents
无铅二极管的台面制作工艺 Download PDFInfo
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- CN101521161B CN101521161B CN2009101346788A CN200910134678A CN101521161B CN 101521161 B CN101521161 B CN 101521161B CN 2009101346788 A CN2009101346788 A CN 2009101346788A CN 200910134678 A CN200910134678 A CN 200910134678A CN 101521161 B CN101521161 B CN 101521161B
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- Prior art keywords
- lead
- corrosion
- diode
- free diode
- technology
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005516 engineering process Methods 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000005260 corrosion Methods 0.000 claims abstract description 22
- 230000007797 corrosion Effects 0.000 claims abstract description 22
- 239000003513 alkali Substances 0.000 claims abstract 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 23
- 239000002585 base Substances 0.000 claims 3
- 239000002253 acid Substances 0.000 abstract description 10
- 238000003466 welding Methods 0.000 abstract description 2
- 238000004140 cleaning Methods 0.000 abstract 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000003518 caustics Substances 0.000 description 2
- 239000004567 concrete Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101346788A CN101521161B (zh) | 2009-04-28 | 2009-04-28 | 无铅二极管的台面制作工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101346788A CN101521161B (zh) | 2009-04-28 | 2009-04-28 | 无铅二极管的台面制作工艺 |
Publications (2)
Publication Number | Publication Date |
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CN101521161A CN101521161A (zh) | 2009-09-02 |
CN101521161B true CN101521161B (zh) | 2010-09-01 |
Family
ID=41081675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009101346788A Expired - Fee Related CN101521161B (zh) | 2009-04-28 | 2009-04-28 | 无铅二极管的台面制作工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN101521161B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101924141A (zh) * | 2010-09-07 | 2010-12-22 | 如皋市日鑫电子有限公司 | 一种适用于do-27和a-201ad封装结构的大功率二极管 |
CN102543721A (zh) * | 2011-02-23 | 2012-07-04 | 如皋市日鑫电子有限公司 | 无铅二极管的台面制作工艺 |
CN102437131A (zh) * | 2011-12-28 | 2012-05-02 | 如皋市大昌电子有限公司 | 聚酰亚胺钝化保护整流芯片 |
-
2009
- 2009-04-28 CN CN2009101346788A patent/CN101521161B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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CN101521161A (zh) | 2009-09-02 |
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Owner name: LU BINGYI Free format text: FORMER OWNER: RUGAO RIXIN ELECTRONIC CO., LTD. Effective date: 20131211 |
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Effective date of registration: 20131211 Address after: 226500 Jiangsu city of Rugao Province under the original town LeightonWebworks Road No. 186 Patentee after: Lu Bingqi Address before: 226500, Jiangsu, Rugao Province under the original industrial concentration zone Patentee before: Rugao RiXin Electronic Co., Ltd. |
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Owner name: RUGAO RIXIN ELECTRONIC CO., LTD. Free format text: FORMER OWNER: LU BINGYI Effective date: 20140114 |
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Effective date of registration: 20140114 Address after: 226500, Jiangsu, Rugao Province under the original industrial concentration zone Patentee after: Rugao RiXin Electronic Co., Ltd. Address before: 226500 Jiangsu city of Rugao Province under the original town LeightonWebworks Road No. 186 Patentee before: Lu Bingqi |
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Owner name: LU BINGYI Free format text: FORMER OWNER: RUGAO RIXIN ELECTRONIC CO., LTD. Effective date: 20140714 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140714 Address after: 226500 Jiangsu city of Rugao Province under the original town LeightonWebworks Road No. 186 Patentee after: Lu Bingqi Address before: 226500, Jiangsu, Rugao Province under the original industrial concentration zone Patentee before: Rugao RiXin Electronic Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
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