CN101501162A - 用于形成抛光浆料的溶液、抛光浆料及相关方法 - Google Patents
用于形成抛光浆料的溶液、抛光浆料及相关方法 Download PDFInfo
- Publication number
- CN101501162A CN101501162A CN200780030186.3A CN200780030186A CN101501162A CN 101501162 A CN101501162 A CN 101501162A CN 200780030186 A CN200780030186 A CN 200780030186A CN 101501162 A CN101501162 A CN 101501162A
- Authority
- CN
- China
- Prior art keywords
- solution
- bta
- polishing slurries
- alkyl sulfate
- sodium alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
溶液:化学物质 | 量 |
1H-苯并三唑(BTA) | 大约1000-1600克 |
聚丙烯酸(PAA)溶液(大约61-65%聚丙烯酸部分钠盐,MW2000-20000) | 大约1500-2000克 |
烷基硫酸钠溶液(大约30%,在水中)(例如,Standapol) | 大约1500-2000ml |
溶液:化学物质 | 量 |
1H-苯并三唑(BTA) | 大约700-1500克 |
烷基硫酸钠溶液(大约30%,在水中)(例如,Standapol) | 大约20-30升 |
Claims (37)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/465,176 | 2006-08-17 | ||
US11/465,176 US7824568B2 (en) | 2006-08-17 | 2006-08-17 | Solution for forming polishing slurry, polishing slurry and related methods |
PCT/US2007/076098 WO2008022259A1 (en) | 2006-08-17 | 2007-08-16 | Solution for forming polishing slurry, polishing slurry and related methods |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101501162A true CN101501162A (zh) | 2009-08-05 |
CN101501162B CN101501162B (zh) | 2013-04-24 |
Family
ID=39082362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780030186.3A Expired - Fee Related CN101501162B (zh) | 2006-08-17 | 2007-08-16 | 用于形成抛光浆料的溶液、抛光浆料及相关方法 |
Country Status (4)
Country | Link |
---|---|
US (3) | US7824568B2 (zh) |
EP (1) | EP2054487A4 (zh) |
CN (1) | CN101501162B (zh) |
WO (1) | WO2008022259A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8440097B2 (en) | 2011-03-03 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
US8435896B2 (en) | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
CN102690604A (zh) * | 2011-03-24 | 2012-09-26 | 中国科学院上海微系统与信息技术研究所 | 化学机械抛光液 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
US6241586B1 (en) * | 1998-10-06 | 2001-06-05 | Rodel Holdings Inc. | CMP polishing slurry dewatering and reconstitution |
SG99289A1 (en) * | 1998-10-23 | 2003-10-27 | Ibm | Chemical-mechanical planarization of metallurgy |
US6375693B1 (en) * | 1999-05-07 | 2002-04-23 | International Business Machines Corporation | Chemical-mechanical planarization of barriers or liners for copper metallurgy |
US6348076B1 (en) * | 1999-10-08 | 2002-02-19 | International Business Machines Corporation | Slurry for mechanical polishing (CMP) of metals and use thereof |
US6899804B2 (en) * | 2001-12-21 | 2005-05-31 | Applied Materials, Inc. | Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
US6632259B2 (en) * | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
US6812193B2 (en) * | 2001-08-31 | 2004-11-02 | International Business Machines Corporation | Slurry for mechanical polishing (CMP) of metals and use thereof |
SE525558C2 (sv) * | 2001-09-20 | 2005-03-08 | Vaelinge Innovation Ab | System för bildande av en golvbeläggning, sats av golvskivor samt förfarande för tillverkning av två olika typer av golvskivor |
US7393819B2 (en) * | 2002-07-08 | 2008-07-01 | Mallinckrodt Baker, Inc. | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
US7044304B2 (en) * | 2002-08-28 | 2006-05-16 | Texas Instruments Incorporated | Anti-corrosion overcoat cover tape |
WO2004034841A2 (en) * | 2002-10-15 | 2004-04-29 | Dreamwell, Ltd. | Tray support for a mattress |
GB2395488A (en) * | 2002-11-22 | 2004-05-26 | Reckitt Benckiser Nv | Stain removal |
WO2004101222A2 (en) * | 2003-05-12 | 2004-11-25 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same |
US7736405B2 (en) * | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
US7201784B2 (en) * | 2003-06-30 | 2007-04-10 | Intel Corporation | Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics |
US7186653B2 (en) * | 2003-07-30 | 2007-03-06 | Climax Engineered Materials, Llc | Polishing slurries and methods for chemical mechanical polishing |
US20050022456A1 (en) * | 2003-07-30 | 2005-02-03 | Babu S. V. | Polishing slurry and method for chemical-mechanical polishing of copper |
US20050090104A1 (en) * | 2003-10-27 | 2005-04-28 | Kai Yang | Slurry compositions for chemical mechanical polishing of copper and barrier films |
CN1899003B (zh) | 2004-03-03 | 2010-12-29 | 揖斐电株式会社 | 蚀刻液、蚀刻方法以及印刷电路板 |
US7427362B2 (en) * | 2005-01-26 | 2008-09-23 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Corrosion-resistant barrier polishing solution |
DE602006002900D1 (de) * | 2005-03-09 | 2008-11-13 | Jsr Corp | Wässrige Dispersion zum chemisch-mechanischen Polieren, Kit zu deren Herstellung und chemisch-mechanisches Polierverfahren |
WO2006125461A1 (en) * | 2005-05-25 | 2006-11-30 | Freescale Semiconductor, Inc | Treatment solution and method of applying a passivating layer |
-
2006
- 2006-08-17 US US11/465,176 patent/US7824568B2/en not_active Expired - Fee Related
-
2007
- 2007-08-16 EP EP07814169A patent/EP2054487A4/en not_active Withdrawn
- 2007-08-16 CN CN200780030186.3A patent/CN101501162B/zh not_active Expired - Fee Related
- 2007-08-16 WO PCT/US2007/076098 patent/WO2008022259A1/en active Application Filing
- 2007-10-31 US US11/930,236 patent/US8328892B2/en active Active
-
2010
- 2010-09-07 US US12/876,518 patent/US8636917B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8328892B2 (en) | 2012-12-11 |
US7824568B2 (en) | 2010-11-02 |
WO2008022259A8 (en) | 2009-08-20 |
EP2054487A4 (en) | 2010-09-08 |
US20100327219A1 (en) | 2010-12-30 |
US20080053002A1 (en) | 2008-03-06 |
US8636917B2 (en) | 2014-01-28 |
CN101501162B (zh) | 2013-04-24 |
WO2008022259A1 (en) | 2008-02-21 |
EP2054487A1 (en) | 2009-05-06 |
US20080042099A1 (en) | 2008-02-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI820006B (zh) | 處理液及積層體的處理方法 | |
US7419519B2 (en) | Engineered non-polymeric organic particles for chemical mechanical planarization | |
TWI244496B (en) | Prevention of precipitation defects on copper interconnects during CMP by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties | |
TWI422670B (zh) | 包含金屬-有機骨架材料之化學-機械拋光組合物 | |
JP5474400B2 (ja) | 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法 | |
TWI506128B (zh) | 研磨用組成物及研磨方法 | |
TW201819613A (zh) | 處理液及積層體的處理方法 | |
TWI593789B (zh) | Polishing composition and polishing method | |
US20080257862A1 (en) | Method of chemical mechanical polishing of a copper structure using a slurry having a multifunctional activator | |
CN107922787A (zh) | 化学机械抛光(cmp)组合物用于抛光含钴基材的用途 | |
KR101829635B1 (ko) | 안정하고 농축가능한 화학 기계적 연마 조성물 및 관련 방법 | |
JP2005167204A (ja) | アスパラギン酸/トリルトリアゾールを用いる化学的機械的平坦化のための調整可能な組成物および方法 | |
CN109988675A (zh) | 长效型化学机械抛光后清洗液、其制备方法和应用 | |
US20050112892A1 (en) | Chemical mechanical abrasive slurry and method of using the same | |
CN110177852B (zh) | 研磨组合物 | |
CN101501162B (zh) | 用于形成抛光浆料的溶液、抛光浆料及相关方法 | |
CN106661432A (zh) | 研磨用组合物 | |
CN107743515A (zh) | 研磨组合物及其制造方法、以及研磨方法 | |
EP1477538B1 (en) | Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same | |
JP2015019058A (ja) | 化学機械研磨用水系分散体および化学機械研磨方法 | |
TWI570796B (zh) | 用於形成穿底晶圓貫孔的方法 | |
US20050009714A1 (en) | Process and slurry for chemical mechanical polishing | |
JP2012089862A (ja) | 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法 | |
JP2006012969A (ja) | 研磨用シリカゾルおよびその製造方法 | |
JP4500429B2 (ja) | バリア膜用研磨剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171103 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171103 Address after: American New York Patentee after: Core USA second LLC Address before: American New York Patentee before: International Business Machines Corp. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130424 Termination date: 20190816 |
|
CF01 | Termination of patent right due to non-payment of annual fee |