CN101485004B - Lighting device package - Google Patents
Lighting device package Download PDFInfo
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- CN101485004B CN101485004B CN2007800256853A CN200780025685A CN101485004B CN 101485004 B CN101485004 B CN 101485004B CN 2007800256853 A CN2007800256853 A CN 2007800256853A CN 200780025685 A CN200780025685 A CN 200780025685A CN 101485004 B CN101485004 B CN 101485004B
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- light
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate; a compound lens disposed to interact with light emitted by the one or more light-emitting elements, the compound lens including at least an inner lens element and an outer lens element, the inner lens element having a first index of refraction and the outer lens element having a second index of refraction, the first index of refraction being greater than the second index of refraction; the compound lens, the one or more light-emitting elements and the substrate defining an enclosed space between them; and an encapsulation material filling at least part of said space, the encapsulation material having a third index of refraction equal or greater than the first index of refraction.
Description
Technical field
The present invention relates to luminescent device, especially, relate to the design of the optics of illuminating device encapsulation.
Background technology
If light-emitting diode (LED) encapsulation suitably is designed to extract effectively the inner light that produces of this LED encapsulation under the condition of work, these LED can be more effective so.From the viewpoint of device designer, effectively light extraction possibly be to improve that light from LED tube core (die) can leave the LED encapsulation and the thing that needn't experience the chance of reflection unnecessary in this LED encapsulation.For example, some design features possibly influence light path, and said design feature is the optical properties of the associated components of orientation and position and the LED encapsulation of optical interface for example, for example the material type on the optical interface either side.And; Light can also for example depend on that in the inner propagation of LED encapsulation its wavelength, its intensity, the size of LED tube core and opacity, the LED of the optical element that luminous efficacy (luminous efficacy), drive current, LED encapsulate encapsulate temperature inside situation, the material of LED package parts and the refractive index of surrounding medium, and the temperature dependency of the refractive index of associated materials.Prior art LED encapsulation has LED tube core and sealant (encapsulant) lens at least.In some LED encapsulation, lens and sealant are perhaps being made from a variety of materials of separating.Therefore, the LED encapsulation possibly have tube core-sealant optical interface, sealant-lens optical interface and lens-air optical interface.
Except the direction of propagation that changes the light that the LED tube core sends, optical interface can also reflect the light with the transmission variable part, and this depends on the refractive index of two media on incidence angle and the optical interface either side at light wavelength, optical interface place.The partial reflection at the optical interface place of LED encapsulation and the light that transmission can cause a series of repeated reflections and transmission.As a result, some reflections possibly prolong light path, and this can increase the possibility that LED encapsulates inner undesirable light absorption.And light possibly experience total internal reflection (TIR), and said total internal reflection meeting takes place under specific incidence angle, and these specific incidence angles depend on refractive indices.This effect can have at light to be propagated in the medium of first refractive index and bombardment takes place when having the optical interface of another enough thick dielectric layer, and said another dielectric layer has second refractive index less than first refractive index.TIR has stoped light transmission and basically fully away from optical interface.In addition, the light that the incorrect design of refracting element possibly cause LED to send has unpractical potentially spatial light emission attribute, and these attributes possibly comprise brightness or the scrambling of color in the optical transmission mode that causes owing to monochromatic aberration or aberration.
Even in the visible part of spectrum, for example the refractive index of LED tube core also possibly change significantly.The most of tube cores that use at present have in visible spectrum and are higher than about 1.6 refractive index.In addition, for example some are blue and the green LED tube core has the refractive index of about 2.6-2.7.For example, if surrounding medium is the air with refractive index of about 1.0, and if the refractive index of tube core be 1.6, the maximum critical angle of TIR will be about 39 degree with respect to the optical interface normal so.Yet, for other wavelength, critical angle maybe be little many.With any light of bigger angle bombardment optical interface with complete internal reflection.
A kind of known solution that reduces undesirable reflection is to utilize the material of refractive index between the refractive index of the refractive index of LED tube core and air to cover said LED tube core, perhaps more generally adopts the material that provides low refractive indices at the optical interface place.For example, can one or more LED tube cores be placed the center of hemispherical lens and can utilize transparent sealant to fill the space between said tube core and the lens.Selection is used for the material of sealant and lens, makes except other require, and their common refractive index (for example 1.5) makes the refractive index (for example 2.65) of tube core and refractive index (it the is 1.0) coupling of surrounding medium gradually.Yet, in the time of under two or more LED tube cores accumulate in lens together, the lens sizes that this designing requirement is relatively large.But, mix for better color, possibly hope to have a plurality of LED tube cores in same package inside.
Some principles in these principles in some publications, have been approved.For example, United States Patent(USP) No. 6610598 has been described a kind of LED surface installing device (SMD LED), and its parts have the plane usually from the teeth outwards.Through the calculating of Si Nieer (Snell) law, most of light are because the difference between the refractive index (refractive index of light is 1 in the atmosphere, and the refractive index of epoxy resin is about 1.5) of epoxy resin and atmosphere former thereby can not directly from said parts, send.The LED surface installing device comprises some lenslets or the diffraction lens on the plane surface of this SMD LED, and the lens that wherein amplify critical angle can increase the chance of directly sending light from this luminescence chip, and this has increased the brightness of this LED again.
United States Patent(USP) No. 6590235 provides a kind of photoemissive LED parts that have in green arrives nearly UV wave-length coverage with No.6204523.This emitting semiconductor tube core seals with one or more silicon resin compounds, comprises hard coat, inner gel or elastic layer or both.Said silicone material is stable on the temperature and humidity scope, and is stable for being exposed to UV radiation on every side.As a result, these LED parts advantageously have the long life-span, and wherein it can not reduce green to nearly UV light output " yellowing " decay.
The heat radiation encapsulation that United States Patent(USP) No. 6639360 provides a kind of high power radiation transmitter device and has been used for electronic unit.This electronic component package is drawn together closed chamber; Be included in liquid or gel in the closed chamber; Be arranged in the closed chamber and contact with said liquid or gel physics and at least one electronic unit of thermo-contact; And be electrically coupled to said electronic unit and extend at least one electric conductor outside the said closed chamber.Said electronic unit can comprise any one or its combination in any in radiation transmitter, heat or optical pickocff, resistor and microprocessor or other semiconductor devices.
United States Patent(USP) No. 6867929 has been described a kind of for eye-safe and with the light source device of its switch of realization of High Speed.This light source device comprises: one or more LASER Light Sources that are used to send monochrome or multicolour light beam; Diffuser, it can be transmission, reflection or it mixes, and is used for the light beam that diffusion directly perhaps receives via optical focusing system from LASER Light Source; And optics collimator, it collimates to the diffusion light beam that sends from diffuser.
United States Patent(USP) No. 7015516 has been described a kind of luminous microelectronics Packaging that comprises light-emitting diode, and said light-emitting diode has the first area of first conduction type, the second area of second conduction type and the luminous p-n junction between first and second zones.The table top that this light-emitting diode defines lower contact surface and projects upwards from this lower contact surface.The first area of first conduction type is arranged on the table top and defines the end face of this table top, and the second area of second conduction type defines the said lower contact surface that surrounds this table top basically.Said table top is included at least one sidewall that extends between end face and the said lower contact surface of this table top, and said at least one sidewall has and is used to optimize the rough surface that extracts light from said encapsulation.
United States Patent(USP) No. 7023022 has been described a kind of light emitting package that comprises the substrate of substantial transparent, and this substrate has first surface and the second surface that comprises lens.Said encapsulation also comprises the light-emitting diode (LED) that is suitable for sending the light with predetermined wavelength, and this LED is fixed on the first surface of substrate of substantial transparent.The second surface of said substrate defines the main light emission surface of said encapsulation.The lens that are in second surface have grating mode with the predetermined wavelength coupling of the light that sends from said LED to be used to control the emission geometry of the light that is sent by said encapsulation.This grating mode has the radial configuration that comprises a series of concentric circles.
United States Patent(USP) No. 6921929 has been described a kind of light-emitting diode (LED) with amorphous (amorphous) fluoropolymer encapsulant and lens.These lens and sealant are processed by amorphous fluoropolymer, and it is used for LED or diode laser, for example ultraviolet LED.Semiconductor diode die forms through growth diode on the basalis such as sapphire.This diode is by upside-down mounting, thereby its face through said layer sends light.The amorphous fluoropolymer sealant seals the surface of emission of said diode chip, and can be shaped as lens so that form whole encapsulant/lens.Perhaps, the lens of amorphous fluoropolymer can combine with sealant.Also can use additional combination or separate lenses.Sealing agent/lens are transmissives for UV light and infrared light.This patent also provides encapsulating method.
The method that United States Patent(USP) No. 7026657 has been described a kind of high spoke brightness led chip and has been used to make high spoke brightness led chip.Light-emitting diode chip for backlight unit comprises radiated emission effective coverage and Window layer.In order to improve luminous efficiency, the sectional area of radiated emission effective coverage is less than the sectional area of the Window layer that can be used for de light.This invention is also to a kind of method that is used on the surface of luminous component, making lens arrangement.
United States Patent(USP) No. 6903380 has been described a kind of method and system of the LED of being used for encapsulation.This LED encapsulation can comprise having the lead frame that the annular contact contacts with base (base).The LED tube core can be coupled to annular and contact with the base, makes P-type material be electrically connected to partly that annular contacts and n type material partly is electrically connected to the base and contacts.Replacedly, n type material part can be electrically connected to the annular contact and the P-type material part can be electrically connected to the base contact.Lens can be coupled to lead frame, and optical material can place the contact of said lens, base and contacts in the chamber that limits with annular.This optical material can be gel, grease, elastomeric material, non-elastic material, rigid material, fluent material or non liquid materials.Said method and system can also comprise installing device, and wherein said LED encapsulation mechanically is coupled to installing device with socket, bayonet slot (bayonet) or threaded mode.Said method and system can also comprise band that comprises the annular contact array that is used for forming the LED array of packages and the carrier ribbon that comprises the containment device that holds said LED array of packages.But can comprise the light excitation material but the part of lens can be coated with or comprise light excitation material or this optical material, make said system send white light.
United States Patent(USP) No. 6480389 has been described a kind of light-emitting diode (LED) that comprises radiator structure; This radiator structure is characterised in that to have the heat radiation fluid coolant that is filled in the hermetically sealed housing, and at least one led chip that wherein is installed on the metallic substrates resides in this enclosure interior.This radiator structure is configured the metallic walls of erectting from metallic substrates, and it is used for the transparency cover of seal casinghousing is remained on correct position.In addition; The wall of this setting surrounds said at least one led chip contiguously; The Joule heat that the result therefrom produces can be out-diffusion to the wall of this setting apace through the heat radiation fluid coolant; Be diffused into downwards and be used for the metallic substrates of bigger external heat sink (heat sink) adjacency of heat extraction along this wall then, thereby prevented that said at least one LED is overheated.Other characteristics of this invention are that the transparency cover of seal casinghousing is processed by transparent material, wherein on the inner surface of this transparency cover, form the projection that contacts with the heat radiation fluid coolant.Therefore, if in enclosure interior since fill inadequate former thereby have any bubble, so since buoyancy function it will can not rest within the visual field.Therefore, avoided the possibility of the LED light scattering that the existence owing to bubble causes.
United States Patent(USP) No. 5077587 has been described a kind of light-emitting diode that anti-reflection layer is optimized that has.From the light output of the improvement of LED etc. is that outer rim place transmission diffusion mask layer and the combination thickness size of anti-reflection coating through revising the window that forms light-emitting zone obtains.
The open No.2006/0083000 of United States Patent (USP) has described a kind of lens that are used for light-emitting diode; These lens are that the material of n is processed by refractive index, flexural center edge surface that these lens comprise bottom, the first crooked peripheral edge surface of extending from this bottom, extend from the first crooked peripheral edge surface and the curved surface in the bosom of edge surface extension from the flexural center.Said bottom comprises the groove that is used for holding therein luminescence chip.In said lens, always be shorter than the radius of curvature of the said point of this flexural center edge surface from the distance of center point of edge surface of said bottom to said flexural center.The curved surface in said bosom has the concave shape with respect to the bottom.In addition; When the obtuse angle that forms between the tangent line of the point of the curved surface in the main shaft of lens and said bosom is the acute angle that forms between the main shaft of straight line and lens of said point of curved surface in A1 and center that connects the bottom and said bosom when being A2, these lens satisfy formula: A1+A2＜90+1/sin (1/n).
The method that the open No.2005/0221519 of United States Patent (USP) has described the light emitting semiconductor device that comprises luminescence conversion element and has been used to encapsulate said light emitting semiconductor device.The method that is used for encapsulating said light emitting semiconductor device comprises that the sealant material with first quantity is distributed to the cavity that comprises said luminescent device.The sealant material of first quantity is processed to form the hardened upper surface that it has selected shape in the said cavity.Luminescence conversion element is set on the upper surface of sealant material of said treated first quantity.This luminescence conversion element comprises material for transformation of wave length and has the thickness bigger than cavity wall close position at the zone line of cavity.
The open No.2004/0079957 of United States Patent (USP) has described a kind of power mounted on surface luminous die encapsulation.This die package comprises substrate, reflector panel and lens.But said substrate can be processed by the material of heat conduction electric insulation, is perhaps processed by the material that not only conducts heat but also conduct electricity.Among the embodiment that said therein substrate is processed by electric conducting material, this substrate also is included in the electric insulation heat conducting material that forms on the said electric conducting material.This substrate has the circuit (trace) that is used to be connected to the light-emitting diode (LED) that the liner place is installed.Said reflector panel is coupled to substrate and surrounds basically liner is installed.Said lens cover installs liner.Duration of work is discharged this LED by the heat that said LED produces through substrate (heat sink as the bottom) and reflector panel (heat sink as the top).Said reflector panel comprises along the direction guiding of hope surperficial from the reflection of light of said LED.
The open No.2004/0041222 of United States Patent (USP) has described a kind of power mounted on surface luminous die encapsulation.This die package comprises substrate, reflector panel and lens.But said substrate can be processed by the material of heat conduction electric insulation.This substrate has the circuit that is used for external power source is connected to the light-emitting diode (LED) that the liner place is installed.Said reflector panel is coupled to substrate and surrounds basically liner is installed.Said lens can freely move and can be raised or reduce through sealant with respect to this reflector panel, and said sealant is moistening and adhere on the lens, and place the optimum distance place with respect to said led chip.These lens can cover with the optical system that comprises the optics chemicals, and said optics chemicals influence the performance of said device.Duration of work is discharged this LED by the heat that said LED produces through substrate (heat sink as the bottom) and reflector panel (heat sink as the top).Said reflector panel comprises along the direction guiding of hope surperficial from the reflection of light of said LED.
The open No.2006/021837 of international monopoly has described the light-emitting diode system that comprises semiconductor diode, said semiconductor diode be configured to electrically contact, erecting device and optical coupler work synergistically; Wherein optical coupler comprises Fresnel (Fresnel) lens at least.Fresnel Lenses also is coupled to the additional optics such as concavees lens or " bearing " lens and also is coupled to the reflector of working through total internal reflection principle.In preferred scheme, the two right and wrong sphere all of said concavees lens and reflector.The cover element of single piece of plastic can be processed with moulding process, all these three optical elements wherein, and promptly Fresnel Lenses, negative lens and reflector are made into said plastic one-piece.In addition, this working of plastics can be configured to also hold auxiliary system, for example aims at indication and fastener and interlocking peripheral configurations.
The open No.2005/107420 of international monopoly has described a kind of luminaire, and it comprises: be used for luminous light source; Downward transition material, it receives the light launched and converts the light of being launched to transmitted light and back to transmitted light; And optics, it is configured to receive the back to transmitted light and should then be transferred to outside this optics to transmitted light.Said light source is a semiconductor light-emitting-diode, and it can comprise light-emitting diode, laser diode or resonant cavity light-emitting diode.Said downward transition material comprises one of the phosphor that is used for absorbing the light of a SPECTRAL REGION and launch the light in another SPECTRAL REGION or other materials.Said optics or lens comprise light transmitting material.
Yet, undesirable internal reflection that how can reduce in the illuminating device encapsulation is not described as yet.Therefore, need overcome the new package design of some defective of Known designs.
These background informations be provided to disclose the applicant believes maybe the information relevant with the present invention.Do not expect that the certain approval of applicant not will be understood that any information of front has constituted with respect to prior art of the present invention yet.
Summary of the invention
The purpose of this invention is to provide the illuminating device encapsulation.According to one aspect of the present invention, a kind of illuminating device encapsulation is provided, it comprises: one or more light-emitting components, it operationally is coupled to substrate; Compound lens; It has the surface in the face of said one or more light-emitting components; This compound lens comprises interior lens element and outer lens element at least; Said interior lens element has first refractive index, and said outer lens element has second refractive index, and first refractive index is greater than second refractive index; Said compound lens, said one or more light-emitting components and said substrate define the enclosure space between them; And encapsulant, it fills at least a portion in said space, and the sealing material has the third reflect rate that is equal to or greater than first refractive index.
According to another aspect of the present invention, a kind of illuminating device encapsulation is provided, it comprises: one or more light-emitting components, it operationally is coupled to substrate; Compound lens; Its light that is configured to send with said one or more light-emitting components is mutual; This compound lens comprises interior lens element and outer lens element at least; Said interior lens element has first refractive index, and said outer lens element has second refractive index, and first refractive index is greater than second refractive index; Said compound lens, said one or more light-emitting components and said substrate define the enclosure space between them; And encapsulant, it fills at least a portion in said space, and the sealing material has the third reflect rate that is equal to or greater than first refractive index.
Description of drawings
Fig. 1 schematically shows the cross section according to the illuminating device encapsulation of one embodiment of the invention.
Fig. 2 schematically shows the cross section according to the illuminating device encapsulation of one embodiment of the invention.
Embodiment
Definition
Term " light-emitting component " (LEE) is used for limiting a kind of device; When through for example applying potential difference or electric current being received when encouraging through it at its two ends; Certain zone of this device emission electromagnetic spectrum or the radiation in the combination of zone, said zone is visible region, infrared and/or ultraviolet region for example.Therefore, light-emitting component can have monochrome, accurate monochrome, polychrome or broadband spectral emission characteristics.The instance of light-emitting component comprises other similar devices that semiconductor light-emitting-diode, Organic Light Emitting Diode or polymer/polymeric light-emitting diode, optical pumping phosphor coated light-emitting diode, optical pumping nanocrystal light-emitting diode or those skilled in the art understand easily.In addition, term " light-emitting component " is used for limiting the certain device of emitted radiation, for example LED tube core.
When using in this article, term " be similar to " refer to respect to nominal value+/-10% variation.Should be appreciated that no matter whether specially mention, this variation always is included in any set-point that provides here.
Only if qualification is arranged in addition, all technology that this paper uses and scientific terminology all have with the present invention under the implication of the same meaning of common sense in the field.
The invention provides a kind of illuminating device encapsulation; It comprises compound lens and one or more light-emitting component that operationally is coupled to substrate, this compound lens for example be configured to through in the face of the surface of this lens of said one or more light-emitting components directly or for example mutual with the light that said one or more light-emitting components send indirectly through one or more optical elements such as reflector, diffuser, window.
Usually, said compound lens can be made up of for example two or more lens elements, and each element can be to have evenly or the abundant thick lens jacket of non-uniform thickness.The refractive index of the outmost lens element of this compound lens is generally less than the refractive index of innermost lens element (promptly near the lens element of said LEE).Encapsulant is filled the enclosure space between said compound lens, said substrate and said one or more light-emitting component.The sealing material be selected to the refractive index that has be equal to or greater than said compound lens innermost lens element refractive index but less than the refractive index of said LEE.Usually, these refractive indexes are along with each parts reduces with respect to the increase of the distance of said light-emitting component, so that reduce the chance of (entirely) internal reflection of the light that said LEE sends in the said light-emitting component encapsulation.
The present invention can provide the illuminating device encapsulation that has the total internal reflection (TIR) of reduction than existing package design technology.In order to promote little TIR, this illuminating device encapsulation has some by the optics that provides suitable refractive index materials to process.These opticses can be by shapings and are configured to control usually light in the inner propagation of this illuminating device encapsulation and the propagation of controlling the light that said LEE sends especially.The encapsulation of this light-emitting component can have one or more light-emitting components, LED tube core for example, and it launches light under condition of work.These light-emitting components can be for dissimilar and can send nominal color or the different light of brightness.According to the present invention, the structure of said illuminating device encapsulation has determined how the light that derives from said one or more light-emitting components is directed into the outside that this light-emitting component encapsulates.
Many light-emitting components (for example LED tube core) are processed by the composite material that possibly have high refractive index.In one embodiment, a kind of effectively in the future the light of the self-emission device mode that is directed to the surrounding medium of said light-emitting component package outside be to let light propagate continuously have the less relatively material that is interrupted through between a series of its refractive indexes.The refractive index of optical interface place adjacent material is approaching more, and the solid angle of experiences total internal reflection is just more little therein at the interface at this so.
Light in the illuminating device encapsulation is propagated the influence that also possibly receive the type of light-emitting component, for example receives LED tube core how machinery and the influence that is connected electrically to substrate.Should be pointed out that and to use many different technologies as known in the art light-emitting component that is provided with and is operably connected.For example, LEE can be from the top of substrate by the bonding that goes between, perhaps through use be used for flip-chip ball formula grid and by mounted on surface.In addition, can for example there be one or more LED tube cores a light-emitting component inside.
As stated, if for example the refraction index profile of each element of compound lens is characterised in that little being interrupted or little gradient, can reduce the TIR at each optical interface place so.Same consideration is applicable to along the refraction index profile from said one or more light-emitting components to the whole optical path of surrounding medium.Said compound lens can have some elements, and each element has different refractive indexes, and wherein these refractive indexes are along with respect to the variation of the distance of said LEE and change, so that near the refractive index of surrounding medium.For many application, surrounding medium for example has as what air had and approaches 1.0 low-refraction.If the refractive index of surrounding medium is lower than the refractive index of said LEE, the element of so said compound lens can be designed to have the refractive index that reduces along with the increase of the distance of leaving said LEE.
Compound lens
Said compound lens is placed with respect to substrate, make its can be effectively to carry out optics mutual with the light that is sent by said one or more light-emitting components.In one embodiment, this compound lens can be configured to directly carry out alternately with the light that is sent, promptly through carrying out alternately in the face of the surface of this lens of said one or more light-emitting components and the light that is sent.In one embodiment of the invention, said compound lens can be configured to carry out alternately with the light that is sent indirectly, promptly carries out alternately through one or more reflectors, diffuser, window and other such optical elements and the light that is sent.In one embodiment of the invention, said compound lens can be configured to directly and carry out alternately with the light that is sent indirectly.
Said compound lens can be made up of two or more elements with material of different refractivity.The refractive index of the outmost element of this compound lens is generally less than the refractive index of one or more inner members of said material.
In one embodiment of the invention, said compound lens comprises one of solid material, gel rubber material, fluent material, encapsulant etc. or its combination.
In one embodiment of the invention, the outer surface of said light-emitting component encapsulation has semi-spherical shape and can be limited compound lens.But compare with the monolithic optical element that has similar size and dimension have even component or uniform optical attribute, this compound lens can perhaps provide better light extraction for large area light emitting element (for example LED tube core) for the illuminating device encapsulation with two or more light-emitting components.Therefore, the light extraction of improvement can allow the illuminating device encapsulation to have higher light-emitting component density.
In one embodiment, hemispherical lens can be used for making and can encapsulate with the radiative illuminating device of lambert (Lambertian) emission mode.Can send light if hope this illuminating device encapsulation with pattern different with lambert's emission mode; The optics of so said compound lens can be by suitable shaping, and perhaps the thickness of these opticses or the relative distance between them can suitably be adjusted to the optical interface that provides different with spherical form.
In one embodiment of the invention; In order to realize approaching the incidence angle of normal for the light of the inner surface of the inner member of the said compound lens of bombardment, the inside radius of said lens cavity can be approximate three times or more times of the size of the interior border circular areas that connects said one or more light-emitting components.In one embodiment of the invention, can said hemispherical lens be set, make these light-emitting components be positioned at position near the centre of sphere of said hemispherical lens cavity with respect to said substrate.
Exemplary lens and encapsulant with suitable refractive index can for example comprise PMMA, Merlon, nylon, COC, BK7 glass and silicones, and it usually absorbs seldom visible light and some ultraviolets (UV) light only.In the material of these types some can be resisted the suitable refractive index that time expand is exposed to fading of causing under the UV light and certain limit is provided.
Can make said compound lens with some different modes, for example make through injection moulding or other suitable manufacturing process well known by persons skilled in the art.
In one embodiment of the invention, can make two, three or the lens of multicomponent more through using many injection molding techniques.For example, the double injection moulding can be used for making the dual-element compound lens.The double injection moulding can be used for making the parts of the mechanical interlocked element that provides additional.These interlocking members can be made into during moulding process and through two parts that relative to each other lock said compound lens follow-up mechanical stability are provided.The type of interlocking can be destructiveness or the releasable bonding of non-destructive, and this depends on the shape of interlocking member, the character of material therefor and the character of moulding process.
Generally speaking, injection-molded parts is that the order that the complex-shaped degree according to its part or subassembly increases forms.As everyone knows, the factors such as the effect of going bonding or other undesirable stress to cause that cause owing to the for example difference of the thermal coefficient of expansion between the moulding material during the manufacturing can determine interchangeable manufacturing sequence.For the refractive index of hope is provided to independent part, can for example make compound lens from the same type of material (for example some silicones or the like) of change of rank.
The manufacturing that is known that composite optical component requires to control undesirable type at the interface and the inclusion of quantity between inner and these elements of composite component.
The moulding process that should be pointed out that other types can be used for making independent part, and these independent parts can be assembled into composite component or for example bonded to one another through the use optically clear adhesive.Said adhesive can be selected to the refractive index that provides specific.The refractive index of this adhesive can be for example between the refractive index of proximate portion.
The typical compound lens materials that is applicable to illuminating device encapsulation can have about 1.40 or bigger refractive index, has other refractive index materials but can use.
Encapsulant
Encapsulant is filled all or part of of space between said one or more light-emitting component and the said compound lens.According to the present invention, the sealing material is selected to that the refractive index that has is equal to or greater than the refractive index of the innermost element of said compound lens and less than the refractive index of said LEE.Generally speaking, encapsulant will have approximate 1.55 refractive index.
When for example do not exist be included at the interface or said encapsulant in undesirable vacuum (void) time, can reduce total internal reflection.In one embodiment, the sealing material can have and the similar refractive index of the refractive index of said LEE.Encapsulant with suitable refractive index slightly littler than the refractive index of said LEE can reduce the chance of the optical interface place experience TIR of light between LEE and said encapsulant.
In one embodiment; Said encapsulant is processed by the material of for example fluid or highly flexible, and it can help to control optical interface place or near heat-induced stress so that alleviate different heat expansion coefficient and undesirable influence of the temperature condition of work of fluctuation.Fluid encapsulation material can also provide thermal diffusion through convection current.
In one embodiment of the invention, can be for example such as compound lens in abutting connection with sealing between solid light optic and other elements such as substrate soft or fluid encapsulation material or optical silicone.Should be pointed out that encapsulant can with or do not carry out direct heat and contact with one or more light-emitting components.
Typical encapsulant for example comprises some silicones and synthetic rubber or has the clear gel of low ionic impurity (for example Cl, K, Na).Many encapsulants are known in the art, and for example such as Dow Corning
TM, Nye
TMOr Nusil
TMAnd so on brand name under be obtainable.
Substrate
Said one or more light-emitting component operationally is coupled to substrate.This substrate can be a ceramic wafer, for example the LTCC on AIN, clad PC plate, the cermet, be used to attached liner that inserts formed lead framework LED or the like, this is as known in the art.Said basal surface can for example be the perhaps direct reflection of diffusion to surperficial or its some zone of cavity.Reflecting attribute can be from for example aluminium or silver coating and the reflectance coating that is for example applied.
The estimation of refractive index
In one embodiment, can prove the refractive index n of a series of materials A, B and C
A, n
B, n
CCan according to
Select, so that reduce the chance of generation TIR when light is crossed two adjacent flat collimating optics interface A B and BC and advanced.Reducing the combination of refractive indices of TIR can control by being used for the perhaps non-parallel different formulas in abutting connection with optical interface of on-plane surface.For example, for collimating optics interface, ideal plane, based on the refractive index of A and C and the refractive index of the medium B that obtains can provide the reasonable estimation for the refractive index of the medium B that also is used for on-plane surface or non-parallel interface.
Those skilled in the art understand other theory or experimental techniques of being used for confirming according to the refractive index of the material around of said compound lens and said LEE the refractive index of encapsulant easily.Should be understood that equally the refractive index of the parts of said illuminating device encapsulation can be selected to the one or more optical characteristics of optimization with other parameters, said optical characteristics can comprise for example spectrum and space radiation distribution.
Coating
In one embodiment of the invention, the inner reflection of illuminating device encapsulation can be through adopting thin anti-reflection coating further to reduce on some surface of some parts of this illuminating device encapsulation.Such coating can comprise multilayer material or the material film with different optical characteristic.Each additional coating is introduced another optical interface and can be suitable for improving this at the interface and the optical transmission property of whole illuminating device encapsulation.The coating that generally speaking, can suppress undesirable reflection is characterised in that homogeneous thickness.This thickness can be littler, but be approximately practical light wavelength.Corresponding film can have suitable refractive index.For example, the outer surface of said compound lens can coatedly have refractive index less than the refractive index of the material that forms outermost layer but the layer material of the refractive index of projecting air.The sufficient viscosity that the general requirement of coating material has high transmissivity, preventing sheding tintability and adheres to the parts of coating.
In one embodiment of the invention, for example can utilize that the antireflection conformal coating applies said LEE, for example said LED tube core, said conformal coating have the refractive index between the refractive index of the refractive index of the medium around this coating and said light-emitting component.Similarly, coating material has the good good viscosity that particularly is directed against visible light transmittance, preventing sheding tintability and adheres to light-emitting component.
Anti-reflection coating can comprise one or more layers different materials, perhaps as known by microscopic patternization.And many coatings can be configured to the light of specific wavelength or polarization and be that for example specific incidence angle provides best purposes.Yet, should be pointed out that the plural layers of suitable design can provide high-transmission rate under the incidence angle on a large scale.
To combine particular instance to describe the present invention now.Should be appreciated that following instance expection is used for describing embodiments of the invention, never is to be used for limiting the present invention.
Instance
Instance 1:
Fig. 1 schematically shows the cross section according to the LED encapsulation 100 of one embodiment of the invention.This LED encapsulation comprises double layer lens 110, and it defines the cavity 120 with the hemispherical interface between hemispherical inside and outer surface and two layers 132 and 134.Should be appreciated that said inner surface and outer surface and double-deck interface can have the shape of other shape and said inner surface and outer surface can be different for various embodiment.
Lens 110 comprise the double layer material that different refractivity is provided.For example, the skin 134 of these lens can be made with the refractive index less than internal layer 132.Hemispherical lens cavity in internal layer 132 forms.These lens can have the overall dimension that is suitable for said encapsulation, the wall thickness between every layer of approximate 0.2mm and approximate 1mm thickness for example.In order to help to realize approaching the incidence angle of normal for the light of the inner surface of these lens of bombardment, approximate three times or more times and the said LED tube core of size that the inside radius of this hemispherical lens cavity connects the border circular areas of said LED tube core in can being should be positioned adjacent to said in the centre of sphere of hemispherical lens cavity.As stated, can prove the refractive index n of a series of materials A, B and C
A, n
B, n
CCan according to
Select, so that reduce the chance of generation TIR when light is crossed two adjacent flat collimating optics interface A B and BC and advanced.For example, if the refractive index of lens jacket 134 be approximately 1.40 and the refractive index of encapsulant 120 be approximately 1.55, being used for so, the material of lens jacket 132 should provide approximate
Refractive index.
Can make said double layer lens with many injection molding techniques.For example, the double injection moulding can be used for making the two-layer compound lens.The double injection moulding can be used for making the parts of the interlocking member that provides additional.Fig. 1 shows an instance of the double layer lens with interlocking member 150.These interlocking members can be made into during moulding process and through relative to each other locking said two parts follow-up mechanical stability are provided.The type of interlocking can be destructiveness or the releasable bonding of non-destructive, and this depends on the shape of interlocking member, the character of material therefor and the character of moulding process.Generally speaking, injection-molded parts is that the order that the complex-shaped degree according to its part or subassembly increases forms.For example, maybe be easier be to lens jacket 132 moulding and deposition lens jacket 134 in second moulding injection subsequently.
Instance 2:
Fig. 2 schematically shows the cross section according to another LED encapsulation 200 of another embodiment of the present invention.Embodiment is similar shown in this embodiment and Fig. 1, but comprises the compound lens 210 with solid hemi-spherical interior lens element 232, and said interior lens element 232 is covered by outer lens layer 234.This outer lens layer 234 is attached to solid hemi-spherical interior lens element 232 through interlocking member 250.
In order below said compound lens, to hold LED tube core 290 and 291, they are arranged in the recess 220 of substrate 240.This recess defines the cavity between compound lens 210 and the substrate 240.The surface of the contiguous said LED tube core of this solid hemispherical lens element can be smooth basically, but can be by veining or structuring so that improve light gets into said lens element from said cavity penetrability.Can utilize sealant to fill this cavity with suitable refractive index.
Compare with the embodiment of front, in this embodiment, because the difformity and the geometry of said encapsulant-lens optical interface are considered to be suitable for to the difference of refractive index.For example, said encapsulant can have approximate 1.55 refractive index, and said solid hemi-spherical interior lens element can have approximate 1.55 refractive index.Should be pointed out that the emission characteristics according to said LED tube core, the inappropriate selection of the solid hemi-spherical interior lens element of LED encapsulation 200 and the refractive index of encapsulant possibly cause undesirable TIR.If for example said encapsulating material and said solid hemi-spherical interior lens element provide equal refractive index, the overall light extraction efficiency of LED encapsulation 200 can be improved so.
In one embodiment, the formation of the radiation mode of hope (for example batswing tab emission mode) can promote through the reflector element (not shown) of said one or more LED tube cores being arranged to contiguous suitable shaping.For example, can utilize high reflecting material to apply basal surface described in recess or the Fig. 1 among Fig. 2 the surface of said cavity is formed reflector element, perhaps additional reflecting element can be set in said cavity.Can in said LED encapsulation, adopt can be as some above-mentioned parts or other additional parts of reflector element.Reflector element can be processed by the parts of suitable coating or shaping, said parts for example in the metal heat sink, in the substrate or the cavity in the lead frame.Replacedly, reflector element also can provide refractive index materials to realize with such order through using, and said order can cause the total internal reflection of a large amount of light.
Should be understood that the above embodiment of the present invention is exemplary and can changes with many modes.Current or following modification so should not be regarded as and depart from the spirit and scope of the present invention, and all obvious to those skilled in the art such modification expections are included within the scope of accompanying claims.
Claims (20)
1. illuminating device encapsulation comprises:
A) one or more light-emitting components, it operationally is coupled to substrate;
B) compound lens; It has the surface in the face of said one or more light-emitting components; This compound lens comprises interior lens element and outer lens element at least; Said interior lens element has first refractive index, and said outer lens element has second refractive index, and first refractive index is greater than second refractive index; Said compound lens, said one or more light-emitting components and said substrate define the enclosure space between them; And
C) encapsulant, it fills at least a portion in said space, and the sealing material has the third reflect rate that is equal to or greater than first refractive index.
2. according to the illuminating device encapsulation of claim 1, wherein said light-emitting component has the refractive index greater than the third reflect rate.
3. according to the illuminating device encapsulation of claim 1, wherein said interior lens element comprises the interlocking member that is used to engage said outer lens element.
4. according to the illuminating device encapsulation of claim 1, wherein said outer lens element comprises the interlocking member that is used to engage said interior lens element.
5. according to the illuminating device encapsulation of claim 1, wherein said substrate has the surface on said light-emitting component one side, and this surface is reflexive in the position of contiguous said light-emitting component at least.
6. according to the illuminating device encapsulation of claim 5, wherein said substrate has the reflectance coating that is arranged on said light-emitting component one side in the position of contiguous said light-emitting component at least.
7. according to the illuminating device encapsulation of claim 1, wherein said compound lens passes through spherical shaping at least in part.
8. according to the encapsulation of the illuminating device of claim 1, wherein said compound lens comprises a plurality of elements, and said element has the refractive index that reduces along with respect to the increase of the distance of said light-emitting component.
9. according to the illuminating device encapsulation of claim 8, wherein said a plurality of elements have the refractive index that reduces discontinuously.
10. according to the illuminating device encapsulation of claim 1, wherein said compound lens is made through injection moulding.
11. according to the illuminating device encapsulation of claim 1, wherein said compound lens is made through many injection mouldings.
12. illuminating device encapsulation, the surface of wherein said interior lens element and a side coplane with said substrate of said light-emitting component according to claim 1.
13. illuminating device encapsulation, the surface of wherein said outer lens element and a side coplane with said substrate of said light-emitting component according to claim 1.
14. illuminating device encapsulation, the surface of wherein said compound lens and a side coplane with said substrate of said light-emitting component according to claim 1.
15. according to the illuminating device encapsulation of claim 1, wherein said light-emitting component is set in the recess of said substrate.
16. according to the illuminating device encapsulation of claim 1, the interface between wherein said encapsulant and the said interior lens element is smooth, and wherein the third reflect rate is approximately equal to first refractive index.
17. according to the illuminating device encapsulation of claim 1, wherein the third reflect rate is greater than first refractive index.
18. an illuminating device encapsulation comprises:
A) one or more light-emitting components, it operationally is coupled to substrate;
B) compound lens; Its light that is configured to send with said one or more light-emitting components is mutual; This compound lens comprises interior lens element and outer lens element at least; Said interior lens element has first refractive index, and said outer lens element has second refractive index, and first refractive index is greater than second refractive index; Said compound lens, said one or more light-emitting components and said substrate define the enclosure space between them; And
C) encapsulant, it fills at least a portion in said space, and the sealing material has the third reflect rate that is equal to or greater than first refractive index.
19. according to the encapsulation of the illuminating device of claim 18, said compound lens comprises the surface, this surface is to said one or more light-emitting components, thus provide between this compound lens and the light that sends by said light-emitting component directly not alternately.
20. according to the illuminating device encapsulation of claim 18, wherein said compound lens is configured to carry out alternately with the light that said light-emitting component sends indirectly through one or more optical elements.
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| US60/806,694 | 2006-07-06 | ||
| PCT/CA2007/001196 WO2008003176A1 (en) | 2006-07-06 | 2007-07-06 | Lighting device package |
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| CN101485004A CN101485004A (en) | 2009-07-15 |
| CN101485004B true CN101485004B (en) | 2012-05-02 |
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| CN2007800256853A Expired - Fee Related CN101485004B (en) | 2006-07-06 | 2007-07-06 | Lighting device package |
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| EP (1) | EP2041805A1 (en) |
| JP (1) | JP5178714B2 (en) |
| KR (1) | KR20090031446A (en) |
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-
2007
- 2007-07-06 JP JP2009516847A patent/JP5178714B2/en not_active Expired - Fee Related
- 2007-07-06 KR KR1020097002434A patent/KR20090031446A/en not_active Application Discontinuation
- 2007-07-06 EP EP07763859A patent/EP2041805A1/en not_active Withdrawn
- 2007-07-06 RU RU2009103911/28A patent/RU2009103911A/en not_active Application Discontinuation
- 2007-07-06 CN CN2007800256853A patent/CN101485004B/en not_active Expired - Fee Related
- 2007-07-06 WO PCT/CA2007/001196 patent/WO2008003176A1/en active Application Filing
- 2007-07-06 BR BRPI0714026-6A patent/BRPI0714026A2/en not_active Application Discontinuation
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| KR20090031446A (en) | 2009-03-25 |
| JP2009543321A (en) | 2009-12-03 |
| BRPI0714026A2 (en) | 2012-12-18 |
| RU2009103911A (en) | 2010-08-20 |
| CN101485004A (en) | 2009-07-15 |
| JP5178714B2 (en) | 2013-04-10 |
| WO2008003176A1 (en) | 2008-01-10 |
| EP2041805A1 (en) | 2009-04-01 |
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