RU2009103911A - Lighting device module - Google Patents

Lighting device module Download PDF

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Publication number
RU2009103911A
RU2009103911A RU2009103911/28A RU2009103911A RU2009103911A RU 2009103911 A RU2009103911 A RU 2009103911A RU 2009103911/28 A RU2009103911/28 A RU 2009103911/28A RU 2009103911 A RU2009103911 A RU 2009103911A RU 2009103911 A RU2009103911 A RU 2009103911A
Authority
RU
Russia
Prior art keywords
lighting device
device module
refractive index
emitting elements
light emitting
Prior art date
Application number
RU2009103911/28A
Other languages
Russian (ru)
Inventor
Иан ЭШДАУН (CA)
Иан ЭШДАУН
Шейн ХАРРА (US)
Шейн ХАРРА
Original Assignee
ТиАйАр ТЕКНОЛОДЖИ ЭлПи (CA)
ТиАйАр ТЕКНОЛОДЖИ ЭлПи
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US80669406P priority Critical
Priority to US60/806,694 priority
Application filed by ТиАйАр ТЕКНОЛОДЖИ ЭлПи (CA), ТиАйАр ТЕКНОЛОДЖИ ЭлПи filed Critical ТиАйАр ТЕКНОЛОДЖИ ЭлПи (CA)
Publication of RU2009103911A publication Critical patent/RU2009103911A/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

Abstract

 1. A lighting device module comprising! a) one or more light-emitting elements, in an active manner attached to the substrate,! b) a composite lens with a surface facing one or more light emitting elements, the composite lens includes at least an internal lens element and an external lens element, the internal lens element has a first refractive index, and the external lens element has a second refractive index, the first refractive index is greater than the second refractive index; a composite lens, one or more light-emitting elements, and a substrate define an enclosed space between them, and! c) a sealing material filling at least a portion of said space, the sealing material has a third refractive index that is equal to or greater than the first refractive index. ! 2. The lighting device module of claim 1, wherein the light emitting elements have a refractive index greater than the third refractive index. ! 3. The lighting device module according to claim 1, wherein the inner lens element comprises interlock elements for engaging the outer lens element. ! 4. The lighting device module according to claim 1, wherein the outer lens element comprises interlock elements for engaging the inner lens element. ! 5. The lighting device module according to claim 1, wherein the substrate has a surface on the side of the light emitting elements, which is reflective to at least the nearest light emitting elements. ! 6. The lighting device module according to claim 5, in which the substrate has

Claims (21)

1. A lighting device module comprising
a) one or more light emitting elements, in an active manner attached to the substrate,
b) a composite lens with a surface facing one or more light emitting elements, the composite lens includes at least an internal lens element and an external lens element, the internal lens element has a first refractive index, and the external lens element has a second refractive index, the first refractive index is greater than the second refractive index; a composite lens, one or more light emitting elements, and a substrate define an enclosed space between them, and
c) a sealing material filling at least a portion of said space, the sealing material has a third refractive index that is equal to or greater than the first refractive index.
2. The lighting device module of claim 1, wherein the light emitting elements have a refractive index greater than the third refractive index.
3. The lighting device module according to claim 1, wherein the inner lens element comprises interlock elements for engaging the outer lens element.
4. The lighting device module according to claim 1, wherein the outer lens element comprises interlock elements for engaging the inner lens element.
5. The lighting device module according to claim 1, wherein the substrate has a surface on the side of the light emitting elements, which is reflective to at least the nearest light emitting elements.
6. The lighting device module according to claim 5, in which the substrate has a reflective coating located on the side of the light emitting elements, at least to the nearest light emitting elements.
7. The lighting module of claim 1, wherein the composite lens is at least partially spherical in shape.
8. The lighting device module according to claim 1, wherein the composite lens comprises a plurality of elements having refractive indices that decrease with increasing distance from the light emitting elements.
9. The lighting device module of claim 8, wherein the plurality of elements have intermittently decreasing refractive indices.
10. The lighting device module of claim 8, wherein the plurality of elements have continuously decreasing refractive indices.
11. The lighting device module according to claim 1, wherein the composite lens is made by jet casting.
12. The lighting device module according to claim 1, wherein the composite lens is made by multi-jet casting.
13. The lighting device module according to claim 1, wherein the surface of the inner lens element is in a plane with the side of the substrate with light emitting elements.
14. The lighting device module according to claim 1, wherein the surface of the outer lens element is in a plane with the side of the substrate with light emitting elements.
15. The lighting device module according to claim 1, wherein the surface of the composite lens is in a plane with the side of the substrate with light emitting elements.
16. The lighting device module according to claim 1, wherein the light emitting elements are located in the recess of the substrate.
17. The lighting device module according to claim 1, wherein the interface between the sealing material and the inner lens element is substantially flat and in which the third refractive index is approximately equal to the first refractive index.
18. The lighting device module according to claim 1, wherein the third refractive index is greater than the first refractive index.
19. A lighting device module comprising
a) one or more light emitting elements, in an active manner attached to the substrate,
b) a composite lens positioned to interact with light emitted by one or more light emitting elements, the composite lens includes at least an internal lens element and an external lens element, where the internal lens element has a first refractive index and the external lens element has a second refractive index, the first refractive index is greater than the second refractive index; a composite lens, one or more light emitting elements, and a substrate define an enclosed space between them, and
c) a sealing material filling at least a portion of said space, the sealing material having a third refractive index that is equal to or greater than the first refractive index.
20. The lighting device module of claim 19, wherein the composite lens comprises a surface facing one or more light emitting elements, thereby providing a direct interaction between the composite lens and the light emitted by the light emitting elements.
21. The lighting device module according to claim 19, in which the composite lens is located for indirect interaction with the light emitted by the light-emitting elements through one or more optical elements.
RU2009103911/28A 2006-07-06 2007-07-06 Lighting device module RU2009103911A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US80669406P true 2006-07-06 2006-07-06
US60/806,694 2006-07-06

Publications (1)

Publication Number Publication Date
RU2009103911A true RU2009103911A (en) 2010-08-20

Family

ID=38894163

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2009103911/28A RU2009103911A (en) 2006-07-06 2007-07-06 Lighting device module

Country Status (7)

Country Link
EP (1) EP2041805A1 (en)
JP (1) JP5178714B2 (en)
KR (1) KR20090031446A (en)
CN (1) CN101485004B (en)
BR (1) BRPI0714026A2 (en)
RU (1) RU2009103911A (en)
WO (1) WO2008003176A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8727567B1 (en) 2012-12-18 2014-05-20 Jds Uniphase Corporation Semiconductor light source having a reflector

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US9793247B2 (en) * 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US7943952B2 (en) 2006-07-31 2011-05-17 Cree, Inc. Method of uniform phosphor chip coating and LED package fabricated using method
BRPI0718086A2 (en) 2006-10-31 2013-11-05 Tir Technology Lp Lighting device packaging
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US8232564B2 (en) 2007-01-22 2012-07-31 Cree, Inc. Wafer level phosphor coating technique for warm light emitting diodes
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
US8167674B2 (en) 2007-12-14 2012-05-01 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
CN102074638B (en) * 2009-11-25 2013-01-16 亿光电子工业股份有限公司 Light-emitting diode package and manufacturing method thereof
TW201145597A (en) * 2010-01-28 2011-12-16 Lg Innotek Co Ltd Light emitting device package
KR101064036B1 (en) 2010-06-01 2011-09-08 엘지이노텍 주식회사 Light emitting device package and lighting system
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
KR101704032B1 (en) * 2010-08-06 2017-02-22 엘지이노텍 주식회사 Light emitting device package and light emitting system
US8558161B2 (en) 2010-08-10 2013-10-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Lens having multiple conic sections for LEDs and proximity sensors
CN102255032A (en) * 2011-07-06 2011-11-23 深圳市顶点照明设备有限公司 Light distribution structure of high-power LED (light-emitting diode)
KR102014081B1 (en) * 2011-12-21 2019-08-27 엘지이노텍 주식회사 Member for controlling luminous flux and display device having the same
KR101369378B1 (en) 2012-05-31 2014-03-04 리엔리하이테크(주) Led
CN103727491A (en) * 2013-12-27 2014-04-16 苏州市启扬商贸有限公司 LED eye-protecting table lamp lens
WO2016084067A1 (en) * 2014-11-27 2016-06-02 A. B. Imaging Solutions Ltd Stereoscopic acquisition module for use in 3d scanners and/or displaying pseudo 3d video
WO2016123341A1 (en) * 2015-01-29 2016-08-04 Venntis Technologies, Llc Omni-directional light emitting device
US9752925B2 (en) 2015-02-13 2017-09-05 Taiwan Biophotonic Corporation Optical sensor
JP6296024B2 (en) * 2015-08-28 2018-03-20 日亜化学工業株式会社 Semiconductor laser device
CN105679923B (en) * 2016-04-11 2017-12-29 郑州中原显示技术有限公司 A kind of twin-core LED

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422352B2 (en) * 1984-10-17 1992-04-16 Stanley Electric Co Ltd
JPS6222491A (en) * 1985-07-23 1987-01-30 Toshiba Corp Semiconductor light-emitting device
JPH0233802A (en) * 1988-07-22 1990-02-05 Mitsubishi Cable Ind Ltd Led lighting fixture
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
JPH11214752A (en) * 1998-01-21 1999-08-06 Matsushita Electron Corp Semiconductor light-emitting device
US6717362B1 (en) * 2002-11-14 2004-04-06 Agilent Technologies, Inc. Light emitting diode with gradient index layering
JP4269790B2 (en) * 2003-06-11 2009-05-27 セイコーエプソン株式会社 Light emitting device, lighting device, projection display device
KR101080355B1 (en) * 2004-10-18 2011-11-04 삼성전자주식회사 Light emitting diode, lens for the same
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8727567B1 (en) 2012-12-18 2014-05-20 Jds Uniphase Corporation Semiconductor light source having a reflector

Also Published As

Publication number Publication date
JP5178714B2 (en) 2013-04-10
JP2009543321A (en) 2009-12-03
KR20090031446A (en) 2009-03-25
WO2008003176A1 (en) 2008-01-10
BRPI0714026A2 (en) 2012-12-18
CN101485004A (en) 2009-07-15
EP2041805A1 (en) 2009-04-01
CN101485004B (en) 2012-05-02

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Effective date: 20100707