CN101484966B - 电子束蒸发装置 - Google Patents

电子束蒸发装置 Download PDF

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Publication number
CN101484966B
CN101484966B CN2007800256069A CN200780025606A CN101484966B CN 101484966 B CN101484966 B CN 101484966B CN 2007800256069 A CN2007800256069 A CN 2007800256069A CN 200780025606 A CN200780025606 A CN 200780025606A CN 101484966 B CN101484966 B CN 101484966B
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CN
China
Prior art keywords
evaporation
retaining
distance
electron beam
evaporated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007800256069A
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English (en)
Chinese (zh)
Other versions
CN101484966A (zh
Inventor
G·马陶什
H·弗拉斯克
J·-S·利比格
V·柯克霍夫
J·-P·海因斯
L·克洛斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Publication of CN101484966A publication Critical patent/CN101484966A/zh
Application granted granted Critical
Publication of CN101484966B publication Critical patent/CN101484966B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
    • H01J37/3053Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/243Crucibles for source material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/28Vacuum evaporation by wave energy or particle radiation
    • C23C14/30Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/147Arrangements for directing or deflecting the discharge along a desired path
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/31Processing objects on a macro-scale
    • H01J2237/3132Evaporating
    • H01J2237/3137Plasma-assisted co-operation

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Physical Vapour Deposition (AREA)
CN2007800256069A 2006-07-06 2007-06-28 电子束蒸发装置 Expired - Fee Related CN101484966B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE200610031244 DE102006031244B4 (de) 2006-07-06 2006-07-06 Vorrichtung zum Verdampfen eines Materials mittels eines Elektronenstrahls und zum Abscheiden des Dampfes auf ein Substrat
DE102006031244.9 2006-07-06
PCT/EP2007/005715 WO2008003425A1 (de) 2006-07-06 2007-06-28 Vorrichtung zum elektronenstrahlverdampfen

Publications (2)

Publication Number Publication Date
CN101484966A CN101484966A (zh) 2009-07-15
CN101484966B true CN101484966B (zh) 2012-05-30

Family

ID=38421460

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800256069A Expired - Fee Related CN101484966B (zh) 2006-07-06 2007-06-28 电子束蒸发装置

Country Status (5)

Country Link
EP (1) EP2038912A1 (de)
JP (1) JP5150626B2 (de)
CN (1) CN101484966B (de)
DE (1) DE102006031244B4 (de)
WO (1) WO2008003425A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009014891B4 (de) 2009-03-25 2012-12-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Verdampfen eines Materials in einer Vakuumkammer
CN102315148A (zh) * 2010-06-30 2012-01-11 上方能源技术(杭州)有限公司 用于镀膜的基板传输装置和基板传输方法
KR20150114486A (ko) * 2013-01-30 2015-10-12 프라운호퍼-게젤샤프트 추르 푀르데룽 데어 안제반텐 포르슝 에 파우 에피택셜 반도체층을 제조하기 위한 방법
WO2014144189A1 (en) 2013-03-15 2014-09-18 United Technologies Corporation Deposition apparatus and methods
CN103983381B (zh) * 2014-05-30 2017-01-25 北京卫星环境工程研究所 真空条件下单颗粒粘附力和带电量的测试系统及测试方法
CN107620047A (zh) * 2017-08-25 2018-01-23 苏州安江源光电科技有限公司 一种用于pvd镀膜的反应腔室以及加工方法
US11603589B2 (en) * 2017-12-06 2023-03-14 Arizona Thin Film Research, LLC Systems and methods for additive manufacturing for the deposition of metal and ceramic materials
DE102018131904A1 (de) * 2018-12-12 2020-06-18 VON ARDENNE Asset GmbH & Co. KG Verdampfungsanordnung und Verfahren
CN110117772B (zh) * 2019-06-14 2024-03-15 费勉仪器科技(上海)有限公司 一种超稳定三电极电子束蒸发源

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3345059A (en) * 1965-03-12 1967-10-03 United States Steel Corp Crucible for holding molten metal
US4061871A (en) * 1975-05-02 1977-12-06 Leybold-Heraeus Gmbh & Co. Kg Electron gun for heating, melting and vaporizing purposes, with deflection systems
US4947404A (en) * 1987-11-16 1990-08-07 Hanks Charles W Magnet structure for electron-beam heated evaporation source
DE4225352C1 (de) * 1992-07-31 1993-11-18 Leybold Ag Vorrichtung zum reaktiven Aufdampfen von Metallverbindungen und Verfahren
DE4342574C1 (de) * 1993-12-14 1995-04-13 Hilmar Weinert Bandbedampfungsanlage
US5614273A (en) * 1993-10-27 1997-03-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung, E.V. Process and apparatus for plasma-activated electron beam vaporization

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1814142A1 (de) * 1967-12-13 1969-07-31 Lokomotivbau Elektrotech Einrichtung zum Bedampfen im Vakuum von grossen Flaechen
JPS63247358A (ja) * 1987-04-03 1988-10-14 Matsushita Electric Ind Co Ltd 金属薄膜の製造装置
JPH0294250U (de) * 1989-01-17 1990-07-26
DE4336680C2 (de) * 1993-10-27 1998-05-14 Fraunhofer Ges Forschung Verfahren zum Elektronenstrahlverdampfen

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3345059A (en) * 1965-03-12 1967-10-03 United States Steel Corp Crucible for holding molten metal
US4061871A (en) * 1975-05-02 1977-12-06 Leybold-Heraeus Gmbh & Co. Kg Electron gun for heating, melting and vaporizing purposes, with deflection systems
US4947404A (en) * 1987-11-16 1990-08-07 Hanks Charles W Magnet structure for electron-beam heated evaporation source
DE4225352C1 (de) * 1992-07-31 1993-11-18 Leybold Ag Vorrichtung zum reaktiven Aufdampfen von Metallverbindungen und Verfahren
US5614273A (en) * 1993-10-27 1997-03-25 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung, E.V. Process and apparatus for plasma-activated electron beam vaporization
DE4342574C1 (de) * 1993-12-14 1995-04-13 Hilmar Weinert Bandbedampfungsanlage

Also Published As

Publication number Publication date
WO2008003425A1 (de) 2008-01-10
CN101484966A (zh) 2009-07-15
EP2038912A1 (de) 2009-03-25
JP2009542900A (ja) 2009-12-03
JP5150626B2 (ja) 2013-02-20
DE102006031244A1 (de) 2008-01-10
DE102006031244B4 (de) 2010-12-16

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Granted publication date: 20120530

Termination date: 20130628