CN101474699B - Ultrasonic soldering method of aluminum or aluminum alloy - Google Patents
Ultrasonic soldering method of aluminum or aluminum alloy Download PDFInfo
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- CN101474699B CN101474699B CN2009100713012A CN200910071301A CN101474699B CN 101474699 B CN101474699 B CN 101474699B CN 2009100713012 A CN2009100713012 A CN 2009100713012A CN 200910071301 A CN200910071301 A CN 200910071301A CN 101474699 B CN101474699 B CN 101474699B
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Abstract
The invention relates to a method for the ultrasonic soldering of aluminum or an aluminum alloy, relating to methods for the welding of the aluminum or the aluminum alloy and solving the problems of ineffective matching of soldering flux and brazing filler metal, low shearing strength of a welded joint, high fusion temperature of the brazing filler metal and pressure force demand of the existing welding of the aluminum or the aluminum alloy. The method has the steps that: (1) the surfaces of the parts of the aluminum or an aluminum alloy plate, which need to be welded, are cleaned, the parts which need to be welded are connected together through related joint or abutting joint, and a welding seam interval is preformed; and (2) the brazing filler metal is arranged in the welding seam and is processed by the operations of heating and ultrasonic treatment, thereby completing the ultrasonic soldering of the aluminum or the aluminum alloy. The brazing filler metal of the invention is fusedat the low temperature ranging from 230 to 250 DEG C, the ultrasonic soldering of the aluminum or the aluminum alloy is carried out under the condition of normal pressure, the soldering flux is not used, the shearing strength of the welded joint can range from 90 to 110MPa, and the tensile-strength can range from 200 to 220MPa.
Description
Technical field
The present invention relates to the welding method of aluminum or aluminum alloy.
Background technology
Aluminum or aluminum alloy has that density is little, intensity is high and advantage such as corrosion-resistant, has wide practical use in industry such as aviation, boats and ships, electronics and chemistry be concise.Traditional copper alloy structural member is replaced by aluminium alloy, electronic product particularly, because soft soldering method is adopted in the connection of original copper alloy member usually, heating-up temperature there is certain restriction, so it is in demand exploring the soft soldering method of aluminium alloy, the solder difficulty of aluminum or aluminum alloy mainly shows as: one, the brazing flux that does not have the solder of suitable aluminum or aluminum alloy: because aluminium has finer and close oxide-film than the copper surface, so brazing flux used during the solder copper alloy can not effectively be removed the oxide-film on aluminum or aluminum alloy surface, it is general all than the temperature height of low-temperature brazing filler metal to remove the fusion temperature of brazing flux of aluminum or aluminum alloy surface film oxide, can not effectively cooperate with low-temperature brazing filler metal, and the use of brazing flux causes postwelding to pollute and corrosion easily; Two, the postwelding strength of joint is low: because the used solder of solder mostly is Sn base solder, solder intensity is lower, so cause the shearing strength of joint of postwelding not high, only is 20～40MPa.
At present, adopt the method for ultrasonic brazing to realize Sn base solder brazing aluminum or aluminum alloy, mode is that ultrasonic wave is warded off the tin aluminum or aluminum alloy and made its surface hang up one deck Sn base solder, and then butt joint realizes welding, but because solder intensity is lower, the shearing strength of joint of postwelding is still not high, and exists the solder fusion temperature up to 280～300 ℃, also need the problem of exerting pressure, can't realize solder truly.
Summary of the invention
The objective of the invention is that brazing flux can not effectively cooperate with solder in order to exist in the welding that solves existing aluminum or aluminum alloy, the shearing strength of joint of postwelding is low, the solder fusion temperature is high and the problem that need exert pressure, and provides the ultrasonic soldering method of aluminum or aluminum alloy.
The ultrasonic soldering method of aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum or aluminum alloy sheet material, then with position to be welded overlap joint or be docking together, weld gap is 50～500 μ m; Two, solder is placed the commissure, being heated to solder under 230～250 ℃ condition is liquid phase, the ultrasonic soldering of aluminum or aluminum alloy is promptly finished in insulation and be that 20～100KHz, amplitude are to be cooled to room temperature behind ultrasonic processing 10～60s under the condition of 1～50 μ m in frequency then; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 57%～98.9% Sn, 1%～25% Zn, 0%～5% Al, 0%～5% Cu, 0.1%～5% Ag, 0%～1% Mn, 0%～1% Si and 0%～1% Ni form.
The ultrasonic soldering method of aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum or aluminum alloy sheet material, then with position to be welded overlap joint or be docking together, weld gap is 50～500 μ m; Two, solder is placed the commissure, being heated to solder under 230～250 ℃ condition is liquid phase, insulation and be that 20～100KHz, amplitude are ultrasonic processing 0.1～10s under the condition of 1～50 μ m then in frequency, continue to be cooled to room temperature behind insulation 1～120min, promptly finish the ultrasonic soldering of aluminum or aluminum alloy; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 57%～98.9% Sn, 1%～25% Zn, 0%～5% Al, 0%～5% Cu, 0.1%～5% Ag, 0%～1% Mn, 0%～1% Si and 0%～1% Ni form.
Solder melts under 230～250 ℃ low temperature among the present invention, and carries out the ultrasonic brazing of aluminum or aluminum alloy under the condition of normal pressure, does not use brazing flux, and energy-conserving and environment-protective are easy to operate, easily are automated welding.Long-time ultrasonic wave is handled among the present invention, can promote the mother metal dissolving of nearly seam district to enter brazed seam, make the Al element in the mother metal enter weld seam, change the alloy composition of brazed seam, and then the microstructure of change brazed seam, make a large amount of dendritic AlSn solid solution of appearance in the brazed seam, can be used as wild phase and improve the brazed seam mechanical property, the shearing strength of joint of postwelding reaches 90～110MPa, and hot strength reaches 200～220MPa; The short time ultrasonic wave makes joint be incubated a period of time under brazing temperature after handling among the present invention, replaced long ultrasonic vibration, make the mother metal dissolving of nearly seam district enter brazed seam, make the Al element in the mother metal enter weld seam, change the alloy composition of brazed seam, and then the microstructure of change brazed seam, make a large amount of dendritic AlSn solid solution of appearance in the brazed seam, can be used as wild phase and improve the brazed seam mechanical property, the shearing strength of joint of postwelding reaches 90～110MPa, and hot strength reaches 200～220MPa.
Description of drawings
Fig. 1 is the operation chart of ultrasonic soldering in the specific embodiment 15, and wherein 1 is ultrasonic head, and 2 is aluminum alloy plate materials, and 3 is laminar solder, and 4 is thermal source.Fig. 2 is the operation chart of ultrasonic soldering in the specific embodiment 16, and wherein 1 is ultrasonic head, and 2 is aluminum alloy plate materials, and 3 is bar-shaped solder, and 4 is thermal source.Fig. 3 is the operation chart of ultrasonic soldering in the specific embodiment 17, and wherein 1 is ultrasonic head, and 2 is aluminum alloy plate materials, and 3 is laminar solder, and 4 is thermal source.Fig. 4 is the operation chart of ultrasonic soldering in the specific embodiment 18, and wherein 1 is ultrasonic head, and 2 is aluminum alloy plate materials, and 3 is brazing wire, and 4 is thermal source.Fig. 5 is the micro-organization chart of brazed seam after the ultrasonic soldering in the specific embodiment 15.
The specific embodiment
The specific embodiment one: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum or aluminum alloy sheet material, with position to be welded overlap joint or be docking together, weld gap is 50～500 μ m then; Two, solder is placed the commissure, being heated to solder under 230～250 ℃ condition is liquid phase, the ultrasonic soldering of aluminum or aluminum alloy is promptly finished in insulation and be that 20～100KHz, amplitude are to be cooled to room temperature behind ultrasonic processing 10～60s under the condition of 1～50 μ m in frequency then; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 57%～98.9% Sn, 1%～25% Zn, 0%～5% Al, 0%～5% Cu, 0.1%～5% Ag, 0%～1% Mn, 0%～1% Si and 0%～1% Ni form.
Aluminium alloy is the aluminium alloy of existing various models in the present embodiment step 1.
Removing surface is with 500 in the present embodiment step 1
#The position to be welded of sand papering aluminum or aluminum alloy sheet material is cleaned with acetone then.
The specific embodiment two: what present embodiment and the specific embodiment one were different is that weld gap is 100～400 μ m in the step 1.Other step and parameter are identical with the specific embodiment one.
The specific embodiment three: what present embodiment and the specific embodiment one were different is that weld gap is 200～300 μ m in the step 1.Other step and parameter are identical with the specific embodiment one.
The specific embodiment four: what present embodiment and the specific embodiment one were different is that weld gap is 250 μ m in the step 1.Other step and parameter are identical with the specific embodiment one.
The specific embodiment five: what present embodiment and the specific embodiment one, two, three or four were different is that solder is laminar, bar-shaped or thread in the step 2.Other step and parameter are identical with the specific embodiment one, two, three or four.
When solder was bar-shaped or thread in the present embodiment, solder placed the gap end of commissure, utilized capillarity to fill weld seam.
The specific embodiment six: present embodiment and the specific embodiment five are different is that to be heated to solder in the step 2 under 235～245 ℃ condition be liquid phase, then insulation and be that 30～90KHz, amplitude are ultrasonic processing 20～50s under the condition of 5～45 μ m in frequency.Other step and parameter are identical with the specific embodiment five.
The specific embodiment seven: present embodiment and the specific embodiment five are different is that to be heated to solder in the step 2 under 240 ℃ condition be liquid phase, then insulation and be that 60KHz, amplitude are ultrasonic processing 45s under the condition of 35 μ m in frequency.Other step and parameter are identical with the specific embodiment five.
The specific embodiment eight: present embodiment and the specific embodiment five are different is that to be heated to solder in the step 2 under 250 ℃ condition be liquid phase, then insulation and be that 50KHz, amplitude are ultrasonic processing 55s under the condition of 40 μ m in frequency.Other step and parameter are identical with the specific embodiment five.
The specific embodiment nine: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum or aluminum alloy sheet material, with position to be welded overlap joint or be docking together, weld gap is 50～500 μ m then; Two, solder is placed the commissure, being heated to solder under 230～250 ℃ condition is liquid phase, insulation and be that 20～100KHz, amplitude are ultrasonic processing 0.1～10s under the condition of 1～50 μ m then in frequency, continue to be cooled to room temperature behind insulation 1～120min, promptly finish the ultrasonic soldering of aluminum or aluminum alloy; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 57%～98.9% Sn, 1%～25% Zn, 0%～5% Al, 0%～5% Cu, 0.1%～5% Ag, 0%～1% Mn, 0%～1% Si and 0%～1% Ni form.
Aluminium alloy is the aluminium alloy of existing various models in the present embodiment step 1.
Removing surface is with 500 in the present embodiment step 1
#The position to be welded of sand papering aluminum or aluminum alloy sheet material is cleaned with acetone then.
The specific embodiment ten: what present embodiment and the specific embodiment nine were different is that weld gap is 300 μ m in the step 1.Other step and parameter are identical with the specific embodiment nine.
The specific embodiment 11: what present embodiment was different with the specific embodiment nine or ten is that solder is laminar, bar-shaped or thread in the step 2.Other step and parameter are identical with the specific embodiment nine or ten.
When solder was bar-shaped or thread in the present embodiment, solder placed the gap end of commissure, utilized capillarity to fill weld seam.
The specific embodiment 12: present embodiment and the specific embodiment 11 are different is that to be heated to solder in the step 2 under 230 ℃ condition be liquid phase, insulation and be that 80KHz, amplitude are ultrasonic processings 10s under the condition of 40 μ m in frequency then continues to be incubated 30min.Other step and parameter are identical with the specific embodiment 11.
The specific embodiment 13: present embodiment and the specific embodiment 11 are different is that to be heated to solder in the step 2 under 240 ℃ condition be liquid phase, insulation and be that 30KHz, amplitude are ultrasonic processings 0.5s under the condition of 30 μ m in frequency then continues to be incubated 10min.Other step and parameter are identical with the specific embodiment 11.
The specific embodiment 14: present embodiment and the specific embodiment 11 are different is that to be heated to solder in the step 2 under 250 ℃ condition be liquid phase, insulation and be that 70KHz, amplitude are ultrasonic processings 3s under the condition of 50 μ m in frequency then continues to be incubated 60min.Other step and parameter are identical with the specific embodiment 11.
The specific embodiment 15: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum alloy plate materials, then position to be welded is overlapped, weld gap is 300 μ m; Two, solder is placed the commissure, being heated to solder under 230 ℃ condition is liquid phase, and the ultrasonic soldering of aluminium alloy is promptly finished in insulation and be that 90KHz, amplitude are to be cooled to room temperature behind the ultrasonic processing 50s under the condition of 40 μ m in frequency then; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 70% Sn, 21% Zn, 4% Al, 3% Ag, 1% Mn, 0.5% Si and 0.5% Ni form.
The ultrasonic soldering of aluminium alloy in the present embodiment, by among Fig. 5 as can be seen, a large amount of AlSn solid solution appears in the brazed seam, it improves the brazed seam mechanical property as wild phase; After tested, the shearing strength of joint of postwelding reaches 110MPa, and hot strength reaches 210MPa.
The specific embodiment 16: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum alloy plate materials, then position to be welded is overlapped, weld gap is 350 μ m; Two, solder is placed the commissure, being heated to solder under 250 ℃ condition is liquid phase, and the ultrasonic soldering of aluminium alloy is promptly finished in insulation and be that 80KHz, amplitude are to be cooled to room temperature behind the ultrasonic processing 55s under the condition of 30 μ m in frequency then; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 66% Sn, 25% Zn, 4% Cu, 3% Ag, 1% Mn, 0.5% Si and 0.5% Ni form.
The ultrasonic soldering of aluminium alloy in the present embodiment, after tested, the shearing strength of joint of postwelding reaches 100MPa, and hot strength reaches 220MPa.
The specific embodiment 17: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum alloy plate materials, with position to be welded overlap joint or be docking together, weld gap is 250 μ m then; Two, solder is placed the commissure, being heated to solder under 230 ℃ condition is liquid phase, insulation and be that 80KHz, amplitude are ultrasonic processings 5s under the condition of 30 μ m in frequency then is cooled to room temperature after continuing to be incubated 60min, promptly finishes the ultrasonic soldering of aluminum or aluminum alloy; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight by: 70% Sn, 18% Zn, 4% Al, 5% Cu, 1% Ag, 1% Si and 1% Ni form.
The ultrasonic soldering of aluminium alloy in the present embodiment, after tested, the shearing strength of joint of postwelding reaches 100MPa, and hot strength reaches 220MPa.
The specific embodiment 18: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum alloy plate materials, with position to be welded overlap joint or be docking together, weld gap is 300 μ m then; Two, solder is placed the commissure, being heated to solder under 250 ℃ condition is liquid phase, insulation and be that 90KHz, amplitude are ultrasonic processings 8s under the condition of 40 μ m in frequency then is cooled to room temperature after continuing to be incubated 50min, promptly finishes the ultrasonic soldering of aluminum or aluminum alloy; Wherein solder is a Sn base alloy in the step 2, in the Sn base alloy by weight ratio by: 98.5% Sn, 1% Zn and 0.5% Ag form.
The ultrasonic soldering of aluminium alloy in the present embodiment, after tested, the shearing strength of joint of postwelding reaches 110MPa, and hot strength reaches 210MPa.
The specific embodiment 19: the ultrasonic soldering method of present embodiment aluminum or aluminum alloy is realized according to the following steps: one, removing surface is carried out at the position to be welded of aluminum alloy plate materials, with position to be welded overlap joint or be docking together, weld gap is 320 μ m then; Two, solder is placed the commissure, being heated to solder under 240 ℃ condition is liquid phase, insulation and be that 85KHz, amplitude are ultrasonic processings 10s under the condition of 45 μ m in frequency then is cooled to room temperature after continuing to be incubated 50min, promptly finishes the ultrasonic soldering of aluminum or aluminum alloy; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 75.2% Sn, 16% Zn, 2% Al, 2% Cu, 3% Ag, 0.5% Mn, 0.8% Si and 0.5% Ni form.
The ultrasonic soldering of aluminium alloy in the present embodiment, after tested, the shearing strength of joint of postwelding reaches 105MPa, and hot strength reaches 213MPa.
Claims (10)
1. the ultrasonic soldering method of aluminum or aluminum alloy, the ultrasonic soldering that it is characterized in that aluminum or aluminum alloy realizes according to the following steps: one, removing surface is carried out at the position to be welded of aluminum or aluminum alloy sheet material, with position to be welded overlap joint or be docking together, weld gap is 50～500 μ m then; Two, solder is placed the commissure, being heated to solder under 230～250 ℃ condition is liquid phase, the ultrasonic soldering of aluminum or aluminum alloy is promptly finished in insulation and be that 20～100KHz, amplitude are to be cooled to room temperature behind ultrasonic processing 10～60s under the condition of 1～50 μ m in frequency then; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 57%～98.9% Sn, 1%～25% Zn, 0%～5% Al, 0%～5% Cu, 0.1%～5% Ag, 0%～1% Mn, 0%～1% Si and 0%～1% Ni form.
2. the ultrasonic soldering method of aluminum or aluminum alloy according to claim 1 is characterized in that weld gap is 100～400 μ m in the step 1.
3. the ultrasonic soldering method of aluminum or aluminum alloy according to claim 1 is characterized in that weld gap is 250 μ m in the step 1.
4. according to the ultrasonic soldering method of claim 1,2 or 3 described aluminum or aluminum alloy, it is characterized in that solder is laminar, bar-shaped or thread in the step 2.
5. the ultrasonic soldering method of aluminum or aluminum alloy according to claim 4 is characterized in that being heated to solder in the step 2 under 240 ℃ condition is liquid phase, then insulation and be that 60KHz, amplitude are ultrasonic processing 45s under the condition of 35 μ m in frequency.
6. the ultrasonic soldering method of aluminum or aluminum alloy, the ultrasonic soldering that it is characterized in that aluminum or aluminum alloy realizes according to the following steps: one, removing surface is carried out at the position to be welded of aluminum or aluminum alloy sheet material, with position to be welded overlap joint or be docking together, weld gap is 50～500 μ m then; Two, solder is placed the commissure, being heated to solder under 230～250 ℃ condition is liquid phase, insulation and be that 20～100KHz, amplitude are ultrasonic processing 0.1～10s under the condition of 1～50 μ m then in frequency, continue to be cooled to room temperature behind insulation 1～120min, promptly finish the ultrasonic soldering of aluminum or aluminum alloy; Wherein solder is a Sn base alloy in the step 2, Sn base alloy by weight percentage by: 57%～98.9% Sn, 1%～25% Zn, 0%～5% Al, 0%～5% Cu, 0.1%～5% Ag, 0%～1% Mn, 0%～1% Si and 0%～1% Ni form.
7. the ultrasonic soldering method of aluminum or aluminum alloy according to claim 6 is characterized in that weld gap is 300 μ m in the step 1.
8. according to the ultrasonic soldering method of claim 6 or 7 described aluminum or aluminum alloy, it is characterized in that solder is laminar, bar-shaped or thread in the step 2.
9. the ultrasonic soldering method of aluminum or aluminum alloy according to claim 8, it is characterized in that being heated to solder in the step 2 under 230 ℃ condition is liquid phase, insulation and be that 80KHz, amplitude are ultrasonic processings 10s under the condition of 40 μ m in frequency then continues to be incubated 30min.
10. the ultrasonic soldering method of aluminum or aluminum alloy according to claim 6, it is characterized in that being heated to solder in the step 2 under 240 ℃ condition is liquid phase, insulation and be that 30KHz, amplitude are ultrasonic processings 0.5s under the condition of 30 μ m in frequency then continues to be incubated 10min.
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