CN101465396B - Support device for LED and support thereof - Google Patents

Support device for LED and support thereof Download PDF

Info

Publication number
CN101465396B
CN101465396B CN2007103018473A CN200710301847A CN101465396B CN 101465396 B CN101465396 B CN 101465396B CN 2007103018473 A CN2007103018473 A CN 2007103018473A CN 200710301847 A CN200710301847 A CN 200710301847A CN 101465396 B CN101465396 B CN 101465396B
Authority
CN
China
Prior art keywords
bridge part
hole
support
emitting diode
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2007103018473A
Other languages
Chinese (zh)
Other versions
CN101465396A (en
Inventor
周大为
张嘉显
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everlight Electronics Co Ltd
Original Assignee
Everlight Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everlight Electronics Co Ltd filed Critical Everlight Electronics Co Ltd
Priority to CN2007103018473A priority Critical patent/CN101465396B/en
Publication of CN101465396A publication Critical patent/CN101465396A/en
Application granted granted Critical
Publication of CN101465396B publication Critical patent/CN101465396B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention discloses an LED stand device, which comprises a cooling block and a stand; wherein, the stand is combined with the cooling block and comprises a first half body and a second half body. The first half body comprises a first removable part, a first connection part and a first containing hole part, wherein, the first connection part is connected between the first removable part and the first containing hole part; the first connection part comprises a first bridging part and a second bridging part which are separated with each other; the first containing hole part comprises a first half sheet body and a second half sheet body which are separated with each other and respectively connected with the first bridging part and the second bridging part; the second bridging part is electrically connected with the cooling block; the second half sheet body comprises a second connection part and a second containing hole part; and the second connection part is connected to the second containing hole part.

Description

The holder device of light-emitting diode and support thereof
Technical field
The present invention relates to a kind of holder device of light-emitting diode, particularly relate to a kind of holder device of selecting the light-emitting diode in power delivery path.
Background technology
In the package design of light-emitting diode (especially high-power light-emitting diode), " the thermoelectric separation " is that one of technology of radiating efficiency is improved and improved to a kind of being suggested.Briefly, mainly be that bang path with electric power separates with the bang path of heat radiation heat energy thermoelectric the separation, makes unlikely being affected of bang path of heat radiation heat energy, and improve and improve radiating efficiency.
In general, the holder device of existing light-emitting diode mainly comprises a support and a radiating block.Support is in order to transmitting electric power, and radiating block is in order to transferring heat energy.Therefore at the light-emitting diode that uses " the thermoelectric separation " package design, its holder device must have its special design.
The holder device of existing light-emitting diode all only has simple function.Just, only can be applicable to the light-emitting diode of use " the thermoelectric separation " package design, or only can not be applicable to the light-emitting diode that uses " the thermoelectric separation " package design.Same holder device also can't have concurrently simultaneously applicable to the light-emitting diode that uses " the thermoelectric separation " or not use " the thermoelectric separation " package design.Therefore, cause not convenient in the application.
Light-emitting diode at different package design must design different holder devices, with regard to making, also can increase manufacturing cost.
Therefore, need a kind of holder device of improved light-emitting diode, with the problem of the holder device that solves existing light-emitting diode.
Summary of the invention
The object of the present invention is to provide a kind of holder device and support thereof of light-emitting diode, this holder device can increase the application of holder device applicable to the light-emitting diode of different package design.
Another object of the present invention is to provide a kind of holder device and support thereof of light-emitting diode, this holder device can reduce manufacturing cost applicable to the light-emitting diode of different package design.
To achieve these goals, the invention provides a kind of holder device of light-emitting diode, comprise radiating block and support.Support is incorporated into radiating block, and comprises the first half bodies and the second half bodies.
The first half bodies comprise first can remove portion, first connecting portion and first holds hole portion, and wherein first connecting portion is connected in first and can removes portion and first and hold between the portion of hole, and comprises first bridge part separated from one another and second bridge part.First holds hole portion comprises the first half lamellar bodies and the second half lamellar bodies, and the first half lamellar bodies and the second half lamellar bodies are separated from one another, and are connected to first bridge part and second bridge part.Second bridge part also electrically is connected in this radiating block.
The second half bodies comprise second connecting portion and second and hold hole portion, and second connecting portion is connected in second and holds hole portion.
In one embodiment, radiating block comprises matrix, joint portion and protuberance, and joint portion and protuberance are convexly set in respectively on the matrix, and protuberance is connected in second bridge part of first connecting portion.Support has the appearance hole, and the joint portion is located in Rong Kongzhong.
The effect that can reach according to embodiments of the invention is:
Can remove portion by removing first, and the bonding wire lead is linked optionally with first bridge part and second bridge part one of them, holder device can be applicable to respectively use thermoelectric separate package technology and not use on the light-emitting diode of thermoelectric separate package technology, thereby increase the application of holder device.
Simultaneously, because holder device applicable to the light-emitting diode of different package design, has therefore reduced manufacturing cost.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the vertical view according to the support of a kind of LED support device of a preferred embodiment of the present invention;
Fig. 2 is the schematic side view of the radiating block of this LED support device;
Fig. 3 is the cut-away section schematic diagram of this LED support device;
Fig. 4 is this LED support device, when being applied to not use thermoelectric separate package to design, and the schematic top plan view of support;
Fig. 5 is this LED support device, when being applied to use thermoelectric separate package to design, and the schematic top plan view of support.
Wherein, Reference numeral:
100: holder device can be removed portion at 221: the second
200: 222: the second connecting portions of support
2221: the three bridge parts of 210: the first half bodies
Can remove portion 2222: the four bridge part at 211: the first
Connecting portion held hole portion at 223: the second in 212: the first
Bridge part 230 in 2121: the first: hold the hole
Bridge part 300 in 2122: the second: radiating block
213: the first appearance hole portions 310: matrix
Lamellar body 320 in 214: the first half: the joint portion
Lamellar body 330 in 215: the second half: protuberance
Body 400 in 220: the second half: packing colloid
Execution mode
Please refer to Fig. 1, Fig. 2 and Fig. 3, the holder device 100 according to a kind of light-emitting diode of a preferred embodiment of the present invention comprises a support 200 and a radiating block 300.Wherein this support 200 is incorporated into this radiating block 300.
Support 200 comprises one the first half body 210 and one the second half body 220, and has one and hold hole 230.The first half bodies 210 comprise one first can remove portion 211, one first connecting portion 212 and one first holds hole portion 213.First connecting portion 212 comprises one first bridge part 2121 separated from one another and one second bridge part 2122, and the one end connects first respectively can remove portion 211, and end connects first respectively and holds hole portion 213 in addition.Wherein first holds hole portion 213 and comprises one the first half lamellar body 214 and one the second half lamellar body 215.The first half lamellar bodies 214 and the second half lamellar bodies 215 are separated from one another, and are connected to first bridge part 2121 and second bridge part 2122, and for arranging the lamellar body alignment arrangements (as shown in Figure 1) that is a semicircle.
The second half bodies 220 comprise one second can remove portion 221, one second connecting portion 222 and one second holds hole portion 223.Second connecting portion 222 comprises one the 3rd bridge part 2221 separated from one another and one the 4th bridge part 2222, and the one end connects second respectively can remove portion 221, and end connects second respectively and holds hole portion 223 in addition.The second appearance hole portion 223 is the lamellar body (as shown in Figure 1) of a semicircle, and cooperates the first appearance hole portion 213 to define this appearance hole 230.
Radiating block 300 comprises a matrix 310, a joint portion 320 and a protuberance 330.Joint portion 320 and protuberance 330 are convexly set in respectively on the matrix 310.When support 200 was incorporated on the radiating block 300, joint portion 320 was located in the hole 230, but the relative position of locating support 200 and matrix 310.Simultaneously, protuberance 330 can be connected in a wherein bridge part of first connecting portion 212.In the present embodiment, protuberance 330 electrically is connected in second bridge part 2122.
In the present embodiment, protuberance 330 via the second half lamellar bodies 215 from being connected in second bridge part 2122.Can directly contact between protuberance 330 and the second half lamellar bodies 215 and be connected, be welded to connect or other can reach the mode that electrically connects between the two.
Please refer to Fig. 3 and Fig. 4, after support 200 is incorporated on the radiating block 300, can fix both with a packing colloid 400.And luminescence chip is located on the joint portion 320 of radiating block 300.Luminescence chip can be by 200 one-tenth electric connections of lead and support of bonding wire manufacturing process.Embodiment shown in Fig. 4 is applied to not use the light-emitting diode of " the thermoelectric separation " package design when holder device 100.Second solder joint (2ndBond) of lead can be welded in the first half bodies 210 and the second half bodies 220 respectively.In the present embodiment, second solder joint is welded in second bridge part 2122 of first connecting portion 212 respectively; And the 3rd bridge part 2221 (shown in black elliptical point among the figure) of second connecting portion 222.Because can remove portion 211 and second and can remove portion 221 and still be connected to first connecting portion 212 and second connecting portion 222 this moment first, therefore, but the first half bodies 210 of support 200 are by being connected in protuberance 330 transmitting electric power with second bridge part 2122, make the radiating block 300 can be with the function of transferring heat energy and electric energy, just, be applied as thermoelectric unseparated package design at this.
Please refer to shown in Figure 5ly,, be applied to use the light-emitting diode of " the thermoelectric separation " package design when holder device 100 at present embodiment.Second solder joint of lead (shown in black elliptical point among the figure) can be welded in the 4th bridge part 2222 of second connecting portion 222 of first bridge part 2121 of first connecting portion 212 of the first half bodies 210 and the second half bodies 220 respectively.And can remove portion 211 and second with first and can remove portion's 212 removals or excision.Therefore, conducting electrically between first bridge part 2121 of first connecting portion 212 and second bridge part 2122, first bridge part 2121 can be provided as the bang path of electric energy, radiating block 300 can be provided as the bang path of heat energy but do not transmit electric energy (because of second bridge part 2122 that is connected with projection 330 non-conductive).Just, be applied as thermoelectric package design of separating at this.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.

Claims (7)

1. the holder device of a light-emitting diode is characterized in that, comprises at least:
One radiating block comprises a matrix, a joint portion and a protuberance, and this joint portion and this protuberance are convexly set in respectively on this matrix; And
One support is incorporated into this radiating block, and comprises:
One the first half body, comprise one first and can remove portion, one first connecting portion and one first appearance hole portion, wherein this first connecting portion is connected in this and first can removes portion and this first and hold between the portion of hole, and comprises one first bridge part separated from one another and one second bridge part; This first holds hole portion and comprises one the first half lamellar body and one the second half lamellar body, and this first half lamellar body and this second half lamellar bodies are separated from one another, and are connected to this first bridge part and this second bridge part; This second bridge part also electrically is connected in this radiating block; This protuberance is connected in second bridge part of this first connecting portion; And
One the second half body, comprise one second connecting portion, one second and can remove portion and one second appearance hole portion, this second connecting portion is connected in this second appearance hole portion, this second connecting portion is connected in this and second can removes portion and this second and hold between the portion of hole, and comprises one the 3rd bridge part separated from one another and one the 4th bridge part.
2. the holder device of light-emitting diode according to claim 1 is characterized in that, is connected with welding manner between this protuberance and this second bridge part.
3. the holder device of light-emitting diode according to claim 1 is characterized in that, this support has one and holds the hole, and this joint portion is located in this Rong Kongzhong.
4. the holder device of light-emitting diode according to claim 3, it is characterized in that, this the first half lamellar body and this second half lamellar bodies have the alignment arrangements of a semicircular in shape, and second to hold hole portion be the lamellar body of a semicircle for this, and cooperate this first to hold hole portion and define this appearance hole.
5. the support of a light-emitting diode is characterized in that, comprises at least:
One the first half body comprises one first and can remove portion, one first and hold hole portion and one first connecting portion, and this first connecting portion is connected in this first can remove portion, and comprises one first bridge part separated from one another and one second bridge part; This second bridge part is for electrically being connected in a radiating block; This first connecting portion is connected in this and first can removes portion and this first and hold between the portion of hole, this first holds hole portion and comprises one the first half lamellar body and one the second half lamellar body, this the first half lamellar body and this second half lamellar bodies are separated from one another, and are connected to this first bridge part and this second bridge part;
One the second half body, comprise one second connecting portion, one second and can remove portion and one second appearance hole portion, this second connecting portion is connected in this and second can removes portion and this second and hold between the portion of hole, and comprises one the 3rd bridge part separated from one another and one the 4th bridge part; And
One radiating block comprises a matrix, a joint portion and a protuberance, and this joint portion and this protuberance are convexly set in respectively on this matrix, and this protuberance is connected in second bridge part of this first connecting portion.
6. the support of light-emitting diode according to claim 5 is characterized in that, this support has one and holds the hole, and this joint portion is located in this Rong Kongzhong.
7. the support of light-emitting diode according to claim 6, it is characterized in that, this the first half lamellar body and this second half lamellar bodies have the alignment arrangements of a semicircular in shape, and second to hold hole portion be the lamellar body of a semicircle for this, and cooperate this first to hold hole portion and define this appearance hole.
CN2007103018473A 2007-12-18 2007-12-18 Support device for LED and support thereof Expired - Fee Related CN101465396B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007103018473A CN101465396B (en) 2007-12-18 2007-12-18 Support device for LED and support thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007103018473A CN101465396B (en) 2007-12-18 2007-12-18 Support device for LED and support thereof

Publications (2)

Publication Number Publication Date
CN101465396A CN101465396A (en) 2009-06-24
CN101465396B true CN101465396B (en) 2010-09-29

Family

ID=40805846

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007103018473A Expired - Fee Related CN101465396B (en) 2007-12-18 2007-12-18 Support device for LED and support thereof

Country Status (1)

Country Link
CN (1) CN101465396B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
CN2534679Y (en) * 2002-04-25 2003-02-05 东贝光电科技股份有限公司 Light emitting diode module with improved radiating effect
CN2715351Y (en) * 2004-06-17 2005-08-03 光宝科技股份有限公司 Power type LED packaging module and supporting frame thereof
CN2781574Y (en) * 2005-02-07 2006-05-17 柯永清 Simple packaged semiconductor LED
CN1906773A (en) * 2004-01-29 2007-01-31 Acol技术公司 Light emitting diode with integral heat dissipation means

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
CN2534679Y (en) * 2002-04-25 2003-02-05 东贝光电科技股份有限公司 Light emitting diode module with improved radiating effect
CN1906773A (en) * 2004-01-29 2007-01-31 Acol技术公司 Light emitting diode with integral heat dissipation means
CN2715351Y (en) * 2004-06-17 2005-08-03 光宝科技股份有限公司 Power type LED packaging module and supporting frame thereof
CN2781574Y (en) * 2005-02-07 2006-05-17 柯永清 Simple packaged semiconductor LED

Also Published As

Publication number Publication date
CN101465396A (en) 2009-06-24

Similar Documents

Publication Publication Date Title
CN102313170B (en) Light emitting device and illumination apparatus
US20110073999A1 (en) Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method
TWM345342U (en) Light-emitting diode packaging structure and light-emitting diode packaging module
CN102244066A (en) Power semiconductor module
CN201757303U (en) Plug-in type LED lamp
TW201133961A (en) Pre-casting formation multi-die loading module of leadframe type
CN104600176A (en) Flip LED (light-emitting diode) substrate structure
CN201340853Y (en) SOP / MSOP / TSSOP lead frame structure
CN101465396B (en) Support device for LED and support thereof
US8545053B2 (en) Light device with multiple LED light sources
CN201992374U (en) Improved structure for LED (light-emitting) lamp
CN101859857A (en) LED device
CN207883721U (en) A kind of LED light bar with excellent heat dispersion performance
CN203038968U (en) LED illumination module
CN210006755U (en) Double-cup structure of LED bracket
CN201582619U (en) Plug-in type luminescent diode lamp
CN103378079A (en) Multiple-chip array type chip-on-board (COB) inversely-installed eutectic packaging structure and method
CN202042476U (en) Device packaging structure
CN100454536C (en) Semiconductor chip encapsulation structure and its application device
CN201345329Y (en) Replay assembled conveniently
CN208460753U (en) A kind of flip chip packaging structure
CN205488209U (en) LED packaging structure
CN201532947U (en) IC and LED lamp packages
CN214840626U (en) Packaging structure for stable light-emitting diode
CN203038916U (en) TO220 packaging lead frame

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100929

Termination date: 20161218