CN101465250A - Temperature fuse and method of manufacturing the same - Google Patents
Temperature fuse and method of manufacturing the same Download PDFInfo
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- CN101465250A CN101465250A CNA2008102053012A CN200810205301A CN101465250A CN 101465250 A CN101465250 A CN 101465250A CN A2008102053012 A CNA2008102053012 A CN A2008102053012A CN 200810205301 A CN200810205301 A CN 200810205301A CN 101465250 A CN101465250 A CN 101465250A
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- fusible alloy
- egative film
- adhesive
- flux
- thermal cutoffs
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Abstract
The invention relates to a thermal fuse for electronic circuit protection, in particular to a thermal fuse for lithium-ion battery protection, and a manufacturing method thereof. The thermal fuse comprises a plastic backing film; a pair of metal electrodes are arranged above the backing film; the metal electrodes are relatively linearly arranged and are provided with space among the end parts; the metal electrodes are welded through fusible alloy; wherein, the surface of the fusible alloy is covered with cosolvent which is coated by a layer of adhesive; the adhesive and the backing film form a closed space; the end parts of the metal electrodes, the fusible alloy and the cosolvent are sealed in the closed space; or, the surface of the fusible alloy is covered with cosolvent, and the backing film at the external side of the cosolvent is provided with an annular upper cover piece; the cosolvent is coated with a layer of adhesive; the adhesive, the upper cover piece and the backing film form a closed space; and the end parts of the metal electrodes, the fusible alloy and the cosolvent are sealed in the closed space.
Description
Technical field
The present invention relates to electronic circuit protection Thermal Cutoffs, especially for li-ion cell protection Thermal Cutoffs and manufacture method thereof.
Background technology
Lithium ion battery is to be widely used in small hand held devices such as mobile phone, digital camera, camcorder, MP3, MP4, game machine etc. at present.But because the inherent characteristics of lithium ion battery, in case lithium-ion electric core overcharges and surpass 4.35V, lithium ion can form dendritic brilliant metal in the carbon negative terminal surface, and may pierce through barrier film, cause the both positive and negative polarity internal short-circuit, thereby impel battery temperature to raise rapidly, again because lithium ion battery and NiCd battery, NiH battery difference, electrolyte also are combustibles, so the energy of blast is very big, along with portable equipment is more and more higher to the requirement of long-term use, also require the capacity of lithium ion battery increasing,, just may blast in case occurrence temperature is too high, its power jeopardizes the people's lives and property safety not less than in a bomblet.So generally adopt at present various technology to prevent the generation of lithium ion battery accident, usually with the once protection of PCM, with PTC or Thermal Cutoffs second protection as lithium ion battery as lithium ion battery.Thermal Cutoffs just can not use in case disconnect, so for the PTC thermistor, certain superiority is arranged because its operating characteristics is disposable.
Because the volume requirement for the Thermal Cutoffs that uses is more and more littler, thickness is more and more thinner, so traditional square shell or tubulose Thermal Cutoffs have not reached instructions for use.A kind of thin temperature fuse with the plastic film encapsulation arises at the historic moment, but the investment of the method for manufacturing of this Thermal Cutoffs is bigger, and cost is higher.
China utility model patent ZL00246178.1 discloses a kind of thin temperature fuse, two guide cards are in line and arrange and separate with a determining deviation, be connected with a fuse assembly between two guide cards, the two sides of guide card and fuse assembly is all by the two resin protective sheets formation closed state of combining closely mutually.
China Patent No. ZL03139720.4 discloses a kind of method of making alloy type temperature fuse, when heat pressure adhesive, adopt the base plate that constitutes by metal part and non-metallic part, film contacts with non-metallic part under the plastics, and at least a portion of metal connecting sheet contacts with the metal part branch.
Summary of the invention
Technical problem to be solved by this invention is to provide the thin temperature that a kind of technology is simple, cost of investment is little fuse.
Another technical problem to be solved by this invention is to provide a kind of manufacture method of above-mentioned thin temperature fuse.
The present invention solves the problems of the technologies described above the technical scheme of being taked: a kind of Thermal Cutoffs, comprise a plastics egative film, and the egative film top is provided with pair of metal electrodes, metal electrode be arranged in a linear relatively and the end between leave spacing, weld by fusible alloy between the metal electrode, wherein
Described fusible alloy surface coverage has flux, and cosolvent is coated by one deck adhesive, and this adhesive and egative film form a confined space, end, fusible alloy and the flux of metal electrode are sealed in the inside of this confined space; Perhaps,
Described fusible alloy surface coverage has flux, on the egative film in the cosolvent outside, be provided with a ring-type upper cover plate, cosolvent is coated by one deck adhesive, this adhesive and upper cover plate and egative film form a confined space, and end, fusible alloy and the flux of metal electrode is sealed in this confined space inside.
On the basis of such scheme, described egative film and upper cover plate are a kind of material in epoxy resin, polybutylene terephthalate (PBT), polyphenyl dioctyl phthalate glycol ester, polyimides, the phenolic resins etc. or two or more composite materials.
On the basis of such scheme, described adhesive is cold setting adhesive or curable adhesive.
A kind of manufacture method at above-mentioned Thermal Cutoffs is provided, may further comprise the steps:
High molecular film material is struck out the egative film of design size;
Bonding pair of metal electrodes above egative film, metal electrode be arranged in a linear relatively and the end between leave spacing;
Fusible alloy is welded between two metal electrodes;
At the surface-coated flux of fusible alloy, fusible alloy is coated, and heating is flowed and natural moulding flux slightly;
Above flux, drip cold setting adhesive or curable adhesive and make its natural flowing forming;
With low-temperature heat or apply ultraviolet light and make adhesive solidification, and form a confined space, end, fusible alloy and the flux of metal electrode is sealed in the inside of this confined space, make Thermal Cutoffs with egative film.
Another kind of manufacture method at above-mentioned Thermal Cutoffs is provided, may further comprise the steps:
High molecular film material is struck out the egative film of design size;
Bonding pair of metal electrodes above egative film, metal electrode be arranged in a linear relatively and the end between leave certain distance;
Fusible alloy is welded between two metal electrodes;
At the surface-coated flux of fusible alloy, fusible alloy is coated, and heating is flowed and natural moulding flux slightly;
(egative film top) drips cold setting adhesive or curable adhesive and circularizes around flux;
Place a ring-type upper cover plate, upper cover plate is located on the egative film in the cosolvent outside;
With low-temperature heat or apply ultraviolet light and make adhesive solidification, and form a confined space, end, fusible alloy and the flux of metal electrode is sealed in the inside of this confined space, make Thermal Cutoffs with upper cover plate and egative film.
On the basis of such scheme, the described method that fusible alloy is welded between two metal electrodes is hot weld, Laser Welding or infrared flush weld.
On the basis of such scheme, the sealing for the confined space that guarantees its formation can heat and/or pressurization the egative film outer ring of prepared Thermal Cutoffs, to increase its sealing.
The invention has the beneficial effects as follows:
Thermal Cutoffs of the present invention can low-cost be set up the production line of Thermal Cutoffs, and product size is thin, good leak tightness, and the product fusing performance is stable.
Description of drawings
Fig. 1 is that the part of the Thermal Cutoffs of embodiment 1 is formed structural representation.
Fig. 2 is the main TV structure schematic diagram of the Thermal Cutoffs of embodiment 1.
Fig. 3 is the main TV structure schematic diagram of the Thermal Cutoffs of embodiment 2.
Label declaration in the accompanying drawing
1-egative film 2,3-metal electrode 21,31-end
4-fusible alloy, 5-flux 6,6 '-adhesive
7-upper cover plate
Embodiment
See also Fig. 1 and form structural representation and Fig. 2 for shown in the main TV structure schematic diagram of the Thermal Cutoffs of embodiment 1 for the part of the Thermal Cutoffs of embodiment 1, a kind of manufacture method of Thermal Cutoffs may further comprise the steps:
The PBT thin-film material that 0.1mm is thick strikes out 4.5 * 3.2mm rectangle egative film 1;
Bonding a pair of 2.5 * 10mm above egative film 1, the nickel metal electrode 2,3 of termination width 1.4mm, nickel metal electrode 2,3 are arranged in a linear and 21,31 spacings that leave 0.5mm in end relatively;
Be welded between the two nickel metal electrodes 2,3 with the fusible alloy 4 of heat weldable method 0.8 * 2mm;
With the surface-coated flux 5 of the mode that heats dropping, fusible alloy 4 is coated, and heating makes fusible alloy 4 mobile also natural moulding slightly at fusible alloy 4;
Above flux 5, drip cold setting adhesive or curable adhesive 6 and make its natural flowing forming;
Low-temperature heat or apply ultraviolet light adhesive 6 is solidified, and form a confined space with egative film 1 is sealed in the inside of this confined space with end 21,31, fusible alloy 4 and the flux 5 of metal electrode 2,3, makes Thermal Cutoffs;
Heat egative film 1 outer ring to Thermal Cutoffs, pressurization.
See also Fig. 3 for shown in the main TV structure schematic diagram of the Thermal Cutoffs of embodiment 2, the PBT thin-film material that 0.1mm is thick strikes out 4.5 * 3.2mm rectangle egative film 1;
Bonding a pair of 2.5 * 10mm above egative film 1, the nickel metal electrode 2,3 of termination width 1.4mm, nickel metal electrode 2,3 are arranged in a linear and 21,31 spacings that leave 0.5mm in end relatively;
Be welded between the two nickel metal electrodes 2,3 with the fusible alloy 4 of heat weldable method 0.8 * 2mm;
With the surface-coated flux 5 of the mode that heats dropping, fusible alloy 4 is coated, and heating makes fusible alloy 4 mobile also natural moulding slightly at fusible alloy 4;
Above flux 5, drip cold setting adhesive or curable adhesive 6 ' and make its natural flowing forming;
Place a ring-type upper cover plate 7, upper cover plate 7 is located on the egative film 1 in cosolvent 5 outsides;
With low-temperature heat or apply ultraviolet light adhesive 6 ' is solidified, and form a confined space, end 21,31, fusible alloy 4 and the flux 5 of metal electrode 2,3 is sealed in the inside of this confined space, make Thermal Cutoffs with upper cover plate 7 and egative film 1;
Heat egative film 1 outer ring to Thermal Cutoffs, pressurization.
Claims (7)
1, a kind of Thermal Cutoffs, comprise a plastics egative film (1), egative film (1) top is provided with pair of metal electrodes (2,3), metal electrode (2,3) be arranged in a linear relatively and end (21,31) between leave spacing, by fusible alloy (4) welding, it is characterized in that between the metal electrode (2,3):
Described fusible alloy (4) surface coverage has flux (5), cosolvent (5) is coated by one deck adhesive (6), this adhesive (6) forms a confined space with egative film (1), end (21,31), fusible alloy (4) and the flux (5) of metal electrode (2,3) is sealed in the inside of this confined space; Perhaps,
Described fusible alloy (4) surface coverage has flux (5), is provided with a ring-type upper cover plate (7) on the egative film (1) in cosolvent (5) outside, and cosolvent (5) is by one deck adhesive
(6 ') coats, and this adhesive (6 ') forms a confined space with upper cover plate (7) and egative film (1), and end (21,31), fusible alloy (4) and the flux (5) of metal electrode (2,3) is sealed in this confined space inside.
2, Thermal Cutoffs according to claim 1 is characterized in that: described egative film (1) and upper cover plate (7) are a kind of material in epoxy resin, polybutylene terephthalate (PBT), polyphenyl dioctyl phthalate glycol ester, polyimides, the phenolic resins etc. or two or more composite materials.
3, Thermal Cutoffs according to claim 1 is characterized in that: described adhesive is cold setting adhesive or curable adhesive.
4, at the manufacture method of claim 1 or 2 or 3 described Thermal Cutoffs, according to the following steps:
High molecular film material is struck out the egative film (1) of design size;
In egative film (1) top bonding pair of metal electrodes (2,3), metal electrode (2,3) be arranged in a linear relatively and end (21,31) between leave spacing;
Fusible alloy (4) is welded between two metal electrodes (2,3); Wherein,
At the surface-coated flux (5) of fusible alloy (4), fusible alloy (4) is coated, and heating is flowed and natural moulding fusible alloy (4) slightly;
Drip cold setting adhesive or curable adhesive (6) in flux (5) top and make its coating flux (5) that flows naturally;
With low-temperature heat or apply ultraviolet light adhesive (6) is solidified, and form a confined space with egative film (1), end (21,31), fusible alloy (4) and the flux (5) of metal electrode (2,3) is sealed in the inside of this confined space, makes Thermal Cutoffs.
5, at the manufacture method of claim 1 or 2 or 3 described Thermal Cutoffs, may further comprise the steps:
High molecular film material is struck out the egative film (1) of design size;
In egative film (1) top bonding pair of metal electrodes (2,3), metal electrode (2,3) be arranged in a linear relatively and end (21,31) between leave certain distance;
Fusible alloy (4) is welded between two metal electrodes (2,3); Wherein,
At the surface-coated flux (5) of fusible alloy (4), fusible alloy (4) is coated, and heating is flowed and natural moulding fusible alloy (4) slightly;
Drip cold setting adhesive or curable adhesive (6 ') and make its natural flowing forming in flux (5) top;
Place a ring-type upper cover plate (7), upper cover plate (7) is located on the egative film (1) in cosolvent (5) outside;
With low-temperature heat or apply ultraviolet light adhesive (6 ') is solidified, and form a confined space with upper cover plate (7) and egative film (1), end (21,31), fusible alloy (4) and the flux (5) of metal electrode (2,3) is sealed in the inside of this confined space, makes Thermal Cutoffs.
6, according to the manufacture method of claim 4 or 5 described Thermal Cutoffs, it is characterized in that: the described method that fusible alloy (4) is welded between two metal electrodes (2,3) is hot weld, Laser Welding or infrared flush weld.
7, according to the manufacture method of claim 4 or 5 described Thermal Cutoffs, it is characterized in that: heat and/or pressurization egative film (1) outer ring to prepared Thermal Cutoffs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102053012A CN101465250A (en) | 2008-12-31 | 2008-12-31 | Temperature fuse and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102053012A CN101465250A (en) | 2008-12-31 | 2008-12-31 | Temperature fuse and method of manufacturing the same |
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| Publication Number | Publication Date |
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| CN101465250A true CN101465250A (en) | 2009-06-24 |
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|---|---|---|---|
| CNA2008102053012A Pending CN101465250A (en) | 2008-12-31 | 2008-12-31 | Temperature fuse and method of manufacturing the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101763983A (en) * | 2009-12-31 | 2010-06-30 | 上海长园维安电子线路保护股份有限公司 | Thin temperature fuse of profile protective structure and preparing method thereof |
| WO2011157230A1 (en) * | 2010-06-18 | 2011-12-22 | Xu Zhonghou | Large-current alloy type temperature fuse |
| CN108630834A (en) * | 2017-03-20 | 2018-10-09 | 陈葆萱 | Composite protection element and battery pack |
| CN108879814A (en) * | 2017-04-06 | 2018-11-23 | 陈葆萱 | protection element and battery pack |
-
2008
- 2008-12-31 CN CNA2008102053012A patent/CN101465250A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101763983A (en) * | 2009-12-31 | 2010-06-30 | 上海长园维安电子线路保护股份有限公司 | Thin temperature fuse of profile protective structure and preparing method thereof |
| CN101763983B (en) * | 2009-12-31 | 2014-06-25 | 上海长园维安电子线路保护有限公司 | Thin temperature fuse of profile protective structure and preparing method thereof |
| WO2011157230A1 (en) * | 2010-06-18 | 2011-12-22 | Xu Zhonghou | Large-current alloy type temperature fuse |
| CN108630834A (en) * | 2017-03-20 | 2018-10-09 | 陈葆萱 | Composite protection element and battery pack |
| CN108630834B (en) * | 2017-03-20 | 2021-09-07 | 陈葆萱 | Composite protection element and battery pack |
| CN108879814A (en) * | 2017-04-06 | 2018-11-23 | 陈葆萱 | protection element and battery pack |
| CN108879814B (en) * | 2017-04-06 | 2021-05-04 | 陈葆萱 | Protection element and battery pack |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Seven road 201202 Shanghai Shiwan No. 1001 Applicant after: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Address before: Seven road 201202 Shanghai Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. |
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| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTION CO., LTD. TO: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., LTD. |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20090624 |