CN101746096A - Plastic packaging material, thin temperature protection component with plastic packaging material and preparation process thereof - Google Patents
Plastic packaging material, thin temperature protection component with plastic packaging material and preparation process thereof Download PDFInfo
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- CN101746096A CN101746096A CN200810204348A CN200810204348A CN101746096A CN 101746096 A CN101746096 A CN 101746096A CN 200810204348 A CN200810204348 A CN 200810204348A CN 200810204348 A CN200810204348 A CN 200810204348A CN 101746096 A CN101746096 A CN 101746096A
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Abstract
The invention relates to a plastic packaging material of an electronic product, a thin temperature protection component with the plastic packaging material and a preparation method thereof. The plastic packaging material has a laminated structure which consists of an outer layer, an intermediate layer and an inner layer, wherein the outer layer is made of polybutylene terephthalate, polycarbonate or polyethylene glycol terephthalate; the intermediate layer is made of polyethylene, polypropylene or polyolefin with an ultra high molecular weight; and the inner layer is made of polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol. The thin temperature protection component packaged by the plastic packaging material consists of a fusible core, a pair of pins and the plastic packaging material, wherein the fusible core is in a dumbbell shape and has two circular ends, the ends of the pins are all provided with an arc-shaped gap, the circular ends of the fusible core are embedded in the arc-shaped gap of the ends of the pins and are in interference fit with each other, the surface of the fusible core is coated with a fluxing agent, and the plastic packaging material packages all the fusible core and the fluxing agent and the ends of the pins.
Description
Technical field
The present invention relates to the use for electronic products capsulation material, and utilize thin temperature protection component of this capsulation material encapsulation and preparation method thereof, especially a kind of battery of mobile phone thin temperature fuse and capsulation material thereof.
Background technology
In recent years, communications industry was flourishing day by day, and especially aspect radio communication, it almost is staff one machine that the market of mobile phone has spread to.Popularizing of mobile phone directly driven the especially expansion of battery of mobile phone market scale of mobile phone parts.With China is example, and by the end of on July 31st, 2007, the cellphone subscriber of China reached 50856.4 ten thousand families, than newly-increased 4748.2 ten thousand families at the end of last year.Estimate that 07 year China's mobile phone sales volume will reach 15139.9 ten thousand ones, increase by 26.9% on a year-on-year basis.Be equipped with 1.8 batteries with every mobile phone and calculate, 2007 annual requirements are 27251.82 ten thousand.
But in the market high speed development process intermediate frequency living quality problems that take place frequently, blast is hurted sb.'s feelings as all parts of the world battery of mobile phone, the Nokia whole world recalls battery that 4,600 ten thousand Panasonics make or the like, makes battery of mobile phone safety become focus.In addition, along with the development of 3G (third generation communication) technology makes mobile phone develop to the multifunction direction, multifunction requires the battery of mobile phone capacity further to increase, capacity is from the past the 200mAh maximum up till now 3600mAh (model DB736) that increases sharply, and so the brisance of high-capacity battery has some idea of.
The imperfection of lithium battery manufacturing technology is to cause the unsafe key factor of battery of mobile phone.The professor Wakihara of Tokyo Polytechnics just points out that all there is potential danger in the bottom technology of most of notebook and the employed lithium ion battery of mobile phone.
Is yet how the circuit protection situation of battery of mobile phone again? present most of battery of mobile phone just relies on overcurrent protection, that is to say to provide overcurrent protection, even but under the state of current stabilization, according to the Joule heat law, the rising that its temperature still can continue, temperature raises or directly sets off an explosion if continue; Cathode block in lithium battery precipitating metal lithium gradually touches the anode seat then, causes short circuit and produces danger.
Alloy type thermal fuse is developed very early as over-temperature protection element, but is subjected to the restriction of plastic packaging composite, can't miniaturization, and generally leaded, cadmium, rarely have battery of mobile phone can use temperature fuse.Therefore, plastic packaging composite and the environmental protection low melting point alloy that is used for thin temperature fuse demanded exploitation urgently.
The temperature fuse miniaturization, just great challenge has been proposed traditional packaging technology, traditional plastic packaging is a large scale, low precision, the at present domestic high accuracy annular plastic packaging that does not also have 3mm * 4mm, requirement to capsulation material is can keep good physical property in wider temperature range, excellent in cushion effect, rub resistance, good rigidly, hardness is big, hygroscopicity is little, dimensional stability is good, electrical property is good, nontoxic odorless, outward appearance cleaning easy to process, product are transparent, the corrosion of most organic solvents of ability and inorganic acid etc.The merocrystalline material is compared non-crystalline material more can satisfy above requirement, but its suitability for secondary processing many than the time processing poor performance; Realize plastic packaging, must solve the compoiste adhering of merocrystalline material and metal, the compoiste adhering of self, owing to the low-melting alloy fusing point in the fuse about 100 ℃, low-temperature welding preferably between the plastic-metal; Fig. 4 is pin and the heat weldable side-looking structural representation of fusible core in the prior art.Fusible core is overlapped on the pin.
The related polynary composite theory of this problem in sum, soldering theory, percolation theory, effectively MEDIUM THEORY, general effective MEDIUM THEORY, general application of mixture theory.The over-temperature protection element of the thin temperature fuse composite material of this subject study, the industrial applications of the over-temperature protection element of this type of composite be not expansion as yet.Compare with the conventional temperature fuse, have advantages such as precision height, size are little, environmental protection, the environmental protection low-melting alloy can be applied in temperature-sensitive element and temperature control element equally, will have broad application prospects at small-sized heat-generating units.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of capsulation material, can in wider temperature range, keep good physical property, excellent in cushion effect, rub resistance, good rigidly, hardness is big, hygroscopicity is little, dimensional stability is good, electrical property is good, nontoxic odorless, outward appearance cleaning easy to process, product are transparent, the corrosion of most organic solvents of ability and inorganic acid etc.
A technical problem more to be solved by this invention is to adopt the thin temperature fuse of novel mosaic texture technology and novel capsulation material.
Another technical problem to be solved by this invention is to provide a kind of manufacture craft of above-mentioned thin temperature fuse.
The present invention solves the problems of the technologies described above the technical scheme of being taked: a kind of capsulation material is provided, constitute layer structure by skin, middle level and internal layer, wherein, skin is polybutylene terephthalate (PBT), Merlon (PC) or PETG (PET); The middle level is ultra-high molecular weight polyethylene (UHMWPE), polypropylene (PP) or polyolefin (PO); Internal layer is polyurethane (TPU), polyolefin (PO), polyether sulfone (PES), polyamide (PA), polyurethane (PU), ethylene-vinyl acetate copolymer (EVA) or polyvinyl alcohol (PVA).
On the basis of such scheme, the thickness of cladding material is 80～100 μ m; The thickness of middle layer material is 1～3 μ m; The thickness of inner layer material is 2～4 μ m.
On the basis of such scheme, the preferred polybutylene terephthalate of cladding material (PBT); The middle preferred ultra-high molecular weight polyethylene of layer material, molecular weight is 200～6,000,000, density is 0.936～0.964g/cm
3, 85 ℃ of heat distortion temperatures (0.46MPa), 130～136 ℃ of fusing points; Inner layer material preferred polyamide (PA).
The invention provides a kind of thin temperature protection component that utilizes above-mentioned capsulation material; constitute by fusible core, pair of pins and capsulation material; wherein; described fusible core is a dumbbell shape; have two rounded ends, the end of described pin all is formed with circular arc cutaway, and two circular arc ends of fusible core are embedded in the interior interference fit mutually of circular arc cutaway of pin end; the surface-coated of fusible core has flux, and capsulation material coats the end of the whole and pin of fusible core and flux.
When thin degree protection device warm in nature (fuse) when being heated; the low-melting alloy of mid portion moves toward two ends; because the low-melting alloy area at two ends is bigger, pull to the more low-melting alloy in two ends by the pulling force low-melting alloy that the centre is less of self wetability.Compare by the wetting low-melting alloy of tin coating with traditional, the wetting power of low-melting alloy self is than strong many of tin layer; In addition, fusible core of the present invention and pin have been avoided thermal weld, solve the welding of fusible core and pin with interference fit.
On the basis of such scheme, the circular arc cutaway of described pin end is that the circle that cuts little one side of something lacks shape, and the width at gap opened place is less than the maximum inner diameter of breach.
On the basis of such scheme, described fusible core comprises following metal component by mole percentage:
Indium 64～70%
Bismuth 25～30%
Concrete, the passable content of indium can be 64,65,66,67,68,69 or 70mol%; The content of bismuth can be 25,26,27,28,29 or 30mol%; The content of zinc can be 2,2.5,3,3.5,4,4.5,5,5.5 or 6mol%.
On the basis of such scheme, described pin is the nickel metal, is electroplate with sn-bi alloy with the end of fusible core interference fit.
On the basis of such scheme, described flux comprises following component by weight percentage:
Rosin 60～70%
Silicone oil 0.5～10%, wherein,
Described rosin is one or more mixture of maleic rosin, newtrex, disproportionated rosin, Foral, common rosin; Described alcamines is monoethanolamine, diethanol amine, diglycolamine, triethanolamine, triisopropanolamine, the mixture of one or more of phenylpropanolamine; Described alcohols is one or several the mixture in methyl alcohol, ethanol, propyl alcohol, glycerine, n-butanol, the isobutanol; Described silicone oil is one or several the mixture in methyl-silicone oil, Methyl Hydrogen Polysiloxane Fluid, methyl phenyl silicone oil, ethyl silicon oil, the ethyl containing hydrogen silicone oil.
Concrete, the content of rosin can be 60,62,64,66,68 or 70wt%; The content of alcamines can be 10,12,14,16,18 or 20wt%; The content of alcohols can be 5,6,7,8,9 or 10wt%; The content of silicone oil can be 0.5,1,2,3,5,6,8 or 10wt%.
At the preparation technology of above-mentioned thin temperature protection component, adopt the fusible core mosaic technology to make, comprise the steps:
The first step: with the pair of pins carrier band heat pressure adhesive under setpoint distance and the capsulation material of being separated by, the end of pair of pins is formed with circular arc cutaway respectively, and breach is oppositely arranged;
Second step: two circular arc ends of dumbbell shape fusible core are embedded in the circular arc cutaway of pin, form the interference fit of fusible core and two pins;
The 3rd step: at fusible core surface-coated flux;
The 4th step: coat with the end of carrier band on the capsulation material, be pressed into thin temperature protection component through accurate transient heat with the whole and pin of fusible core and flux.
On the basis of such scheme, the preparation of described capsulation material comprises: earlier middle layer material is coated on the cladding material; On the layer material, make the capsulation material of three-decker through curing in applying inner layer material again after the material cured of middle level.
The invention has the beneficial effects as follows:
This capsulation material is owing to there is the intermediate layer transition material, can guarantee layer with layer between adhesion closely, can guarantee again this capsulation material can be under lower temperature the hot pressing plastic packaging.
Description of drawings
Fig. 1 is the structural representation of capsulation material of the present invention.
Fig. 2 is the structural representation of pin of the present invention and fusible core interference fit.
Fig. 3 is the side-looking structural representation of pin of the present invention and fusible core interference fit.
Fig. 4 is pin and the heat weldable side-looking structural representation of fusible core in the prior art.
Fig. 5 is the structural representation of pin of the present invention.
Fig. 6 is the part sectional structure schematic diagram of thin temperature protection component of the present invention.
Label declaration in the accompanying drawing
Fig. 1, in 2,3,5,6:
Layer material 3-inner layer material among the 1-cladding material 2-
4,4 '-pin 5,5 '-end 51,51 '-circular arc cutaway
6-fusible core 61, the 62-rounded ends
Carrier band 9-sn-bi alloy under the carrier band 8-capsulation material on the 7-capsulation material
The 10-flux
Among Fig. 4:
4 ", 4 " '-pin 6 '-fusible core
The specific embodiment
See also the structural representation of Fig. 1 for capsulation material of the present invention; Fig. 2 is the structural representation of pin of the present invention and fusible core interference fit; Fig. 3 is the side-looking structural representation of pin of the present invention and fusible core interference fit; Fig. 5 is shown in the part sectional structure schematic diagram of thin temperature protection component of the present invention for structural representation and Fig. 6 of pin of the present invention; a kind of thin temperature protection component; described thin temperature protection component is by fusible core 6; pair of pins 4; 4 ' and capsulation material under carrier band 8; carrier band 7 constitutes on the capsulation material, and wherein, described fusible core 6 is a dumbbell shape; have two rounded ends 61; 62, the end 5 of described pin 4,4 '; 5 ' all are formed with circular arc cutaway 51; 51 ', two circular arc ends 61,62 of fusible core 6 are embedded in pin end 5; 5 ' circular arc cutaway 51; mutual interference fit in 51 ', the surface-coated of fusible core 6 has flux 10, and carrier band 8 under the capsulation material; carrier band 7 coats the whole and pin 4 of fusible core 6 and flux 10 on the capsulation material; 4 ' end 5,5 '.
In the capsulation material, cladding material is selected polybutylene terephthalate (PBT) (PBT) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; After the curing polyurethane (TPU) is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material (A) of three-decker through curing.
The manufacture craft of thin temperature protection component adopts the fusible core mosaic technology to make, and comprises the steps:
The first step: with pair of pins 4,4 ' carrier band 8 heat pressure adhesives under setpoint distance and the capsulation material of being separated by, pair of pins 4,4 ' end 5,5 ' is formed with circular arc cutaway 51 respectively, and 51 ', and breach 51,51 ' is oppositely arranged;
Second step: the circular arc cutaway 51 that two circular arc ends 61,62 of dumbbell shape fusible core 6 is embedded in pin end 5,5 ', in 51 ', wherein the composition mole percentage of fusible core (6) is: In 68%, Bi 29%, Zn 3%, the interference fit of formation fusible core 6 and two pins 4,4 ';
The 3rd step: at fusible core 6 surface-coated fluxs 10; Wherein the flux percentage by weight is: rosin 67%, hydramine 18%, ethanol 10%, silicone oil 5%;
The 4th step: coat with the end 5,5 ' of carrier band on the capsulation material 7, be pressed into thin temperature protection component through accurate transient heat with the whole and pin of fusible core 6 and flux 10.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; PO (polyolefin) is coated on the PBT control thickness 1～3 μ m with the pouring film device; After the curing TPU is coated on the PO, controls thickness 2～4 μ m, make the compound capsulation material B of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; PP (polypropylene) is coated on the PBT control thickness 1～3 μ m with the pouring film device; After the curing TPU is coated on the PP, controls thickness 2～4 μ m, make the compound capsulation material C of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; After the curing PO is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material D of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; After the curing PES is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material E of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; After the curing PA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material F of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; After the curing EVA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material G of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PU is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material H of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PBT (polybutylene terephthalate (PBT)) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PBT with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PVA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material I of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; High molecular weight polyethylene is coated on the PC control thickness 1～3 μ m with the pouring film device; Then TPU is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material J of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 11
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PC with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PO is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material K of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 12
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PC with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PES is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material L of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 13
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PC with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material M of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 14
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PC with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then EVA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material N of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 15
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PC with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PU is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material O of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 16
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PC (Merlon) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PC with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PVA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material P of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Embodiment 17
The structure of thin temperature protection component is identical with embodiment 1.
In the capsulation material, cladding material is selected PET (PETG) for use, and thickness is 80～100 μ m; (UHMWPE) is coated on the PET with the pouring film device with ultra-high molecular weight polyethylene, control thickness 1～3 μ m; Then PA is coated on the polyethylene, controls thickness 2～4 μ m, make the compound capsulation material Q of three-decker through curing.
The manufacture craft of thin temperature protection component is identical with embodiment 1.
Table 1
| Capsulation material | Room temperature tensile strength (kg) | 140 ℃ of anti-infiltrations |
| ??A | ??1.1 | Leak |
| ??B | ??0.6 | Leak |
| ??C | ??0.7 | Leak |
| ??D | ??1.2 | Leak |
| ??E | ??1.5 | Do not leak |
| ??F | ??2.0 | Do not leak |
| ??G | ??1.7 | Do not leak |
| ??H | ??1.4 | Leak |
| ??I | ??1.8 | Do not leak |
| ??J | ??0.6 | Leak |
| ??K | ??1.3 | Leak |
| ??L | ??1.4 | Leak |
| ??M | ??1.8 | Do not leak |
| ??N | ??1.7 | Do not leak |
| ??O | ??1.5 | Do not leak |
| Capsulation material | Room temperature tensile strength (kg) | 140 ℃ of anti-infiltrations |
| ??P | ??1.0 | Leak |
| ??Q | ??1.9 | Do not leak |
From table we as can be seen, cladding material uses PBT, ultra-high molecular weight polyethylene, thickness 1～3 μ m are adopted in the intermediate layer; Internal layer is selected PA for use, during thickness 2～4 μ m, and the plastic packaging best results.
See also Fig. 5 for shown in the structural representation of pin of the present invention, pin 4,4 ' (not shown) are the nickel metal, end 5, and 5 ' (5 is not shown in the figures) is electroplate with sn-bi alloy 9, and 9 '
(9 is not shown in the figures).See also shown in Figure 4, in the prior art, fusible core 6 ' and pair of pins 4 ", 4 " ' adopt thermal weld.
Determining under the prerequisite that capsulation material is formed, fusible core interference fit technology more of the present invention and traditional fusible core welding procedure and pin end plating Sn-Bi alloy and the influence of the pure Sn of plating to slim fuse, test resistance respectively, fusing-off temperature, comparative result is as shown in table 2.
Table 2
As can be seen from Table 2; under same heating rate; interference fit of the present invention than the fusing-off temperature of simple stacked welding low 0.9 degree; illustrate that the thin temperature protection device action of making under the interference fit is faster; coating " the wetting pulling force " of fusible core contraction less than fusible core self is pulled, also " the wetting pulling force " not as the Sn-Bi alloy layer is big for pure Sn coating simultaneously.
Claims (10)
1. a capsulation material constitutes layer structure by skin, middle level and internal layer, and it is characterized in that: described skin is polybutylene terephthalate, Merlon or PETG; The middle level is ultra-high molecular weight polyethylene, polypropylene or polyolefin; Internal layer is polyurethane, polyolefin, polyether sulfone, polyamide, polyurethane, ethylene-vinyl acetate copolymer or polyvinyl alcohol.
2. capsulation material according to claim 1 is characterized in that: the thickness of cladding material is 80～100 μ m; The thickness of middle layer material is 1～3 μ m; The thickness of inner layer material is 2～4 μ m.
3. capsulation material according to claim 1 and 2 is characterized in that: layer material is a ultra-high molecular weight polyethylene in described, and molecular weight is 200～6,000,000, and density is 0.936～0.964g/cm
3
4. thin temperature protection component that utilizes one of claim 1 to 3 capsulation material encapsulation; constitute by fusible core, pair of pins and capsulation material; it is characterized in that; described fusible core is a dumbbell shape; have two rounded ends, the end of described pin all is formed with circular arc cutaway, and two circular arc ends of fusible core are embedded in the interior interference fit mutually of circular arc cutaway of pin end; the surface-coated of fusible core has flux, and capsulation material coats the end of the whole and pin of fusible core and flux.
5. thin temperature protection component according to claim 4 is characterized in that: the circular arc cutaway of described pin end is that the circle that cuts little one side of something lacks shape, and the width at gap opened place is less than the maximum inner diameter of breach.
6. thin temperature protection component according to claim 4 is characterized in that: described fusible core comprises following metal component by mole percentage:
Indium 64～70%
Bismuth 25～30%
Zinc 2～6%.
7. thin temperature protection component according to claim 4 is characterized in that: described pin is the nickel metal, is electroplate with sn-bi alloy with the end of fusible core interference fit.
8. thin temperature protection component according to claim 4 is characterized in that: described flux comprises following component by weight percentage:
Rosin 60～70%
Alcamines 10～20%
Alcohols 5～10%
Silicone oil 0.5～10%, wherein,
Described rosin is one or more mixture of maleic rosin, newtrex, disproportionated rosin, Foral, common rosin; Described alcamines is monoethanolamine, diethanol amine, diglycolamine, triethanolamine, triisopropanolamine, the mixture of one or more of phenylpropanolamine; Described alcohols is one or several the mixture in methyl alcohol, ethanol, propyl alcohol, glycerine, n-butanol, the isobutanol; Described silicone oil is one or several the mixture in methyl-silicone oil, Methyl Hydrogen Polysiloxane Fluid, methyl phenyl silicone oil, ethyl silicon oil, the ethyl containing hydrogen silicone oil.
9. at the manufacture craft of the described thin temperature protection component of one of claim 4 to 8, adopt the fusible core mosaic technology to make, comprise the steps:
The first step: with the pair of pins carrier band heat pressure adhesive under setpoint distance and the capsulation material of being separated by, the end of pair of pins is formed with circular arc cutaway respectively, and breach is oppositely arranged;
Second step: two circular arc ends of dumbbell shape fusible core are embedded in the circular arc cutaway of pin, form the interference fit of fusible core and two pins;
The 3rd step: at fusible core surface-coated flux;
The 4th step: coat with the end of carrier band on the capsulation material, be pressed into thin temperature protection component through accurate transient heat with the whole and pin of fusible core and flux.
10. the manufacture craft of thin temperature protection component according to claim 9, it is characterized in that: the preparation of described capsulation material comprises: earlier middle layer material is coated on the cladding material; After the material cured of middle level inner layer material is coated on the middle layer material, makes the capsulation material of three-decker through curing.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623271A (en) * | 2012-03-31 | 2012-08-01 | Aem科技(苏州)股份有限公司 | Thin film type fuse and production method |
| CN103203568A (en) * | 2013-03-03 | 2013-07-17 | 石盛华 | Rapidly shrinking fusing auxiliary |
| CN108140508A (en) * | 2015-10-27 | 2018-06-08 | 迪睿合株式会社 | Fuse element |
-
2008
- 2008-12-10 CN CN200810204348A patent/CN101746096A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102623271A (en) * | 2012-03-31 | 2012-08-01 | Aem科技(苏州)股份有限公司 | Thin film type fuse and production method |
| CN102623271B (en) * | 2012-03-31 | 2014-09-10 | Aem科技(苏州)股份有限公司 | Thin film type fuse and production method |
| CN103203568A (en) * | 2013-03-03 | 2013-07-17 | 石盛华 | Rapidly shrinking fusing auxiliary |
| CN108140508A (en) * | 2015-10-27 | 2018-06-08 | 迪睿合株式会社 | Fuse element |
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Address after: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant after: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. |
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Application publication date: 20100623 |