CN101763983B - Thin temperature fuse of profile protective structure and preparing method thereof - Google Patents
Thin temperature fuse of profile protective structure and preparing method thereof Download PDFInfo
- Publication number
- CN101763983B CN101763983B CN200910248047.9A CN200910248047A CN101763983B CN 101763983 B CN101763983 B CN 101763983B CN 200910248047 A CN200910248047 A CN 200910248047A CN 101763983 B CN101763983 B CN 101763983B
- Authority
- CN
- China
- Prior art keywords
- carrier band
- metal pins
- fusible core
- temperature fuse
- lug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 230000004907 flux Effects 0.000 claims description 19
- 238000003466 welding Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000001680 brushing effect Effects 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 2
- -1 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 8
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004023 plastic welding Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Abstract
Description
| Embodiment | 1 | |
|
|
|
Lower carrier band lug | Nothing | Have | Nothing | Have | Have | |
Middle carrier band lug | Nothing | Nothing | Have | Have | Have | |
" H " shape fusible core | Be | Be | Be | Be | No | |
Average fusing-off temperature Tf (℃) | 93.6 | 93.7 | 93.7 | 93.6 | 95.7 | |
Maximum is born pressure (N) | 3 | 4 | 4 | 10 | 10 |
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910248047.9A CN101763983B (en) | 2009-12-31 | 2009-12-31 | Thin temperature fuse of profile protective structure and preparing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910248047.9A CN101763983B (en) | 2009-12-31 | 2009-12-31 | Thin temperature fuse of profile protective structure and preparing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101763983A CN101763983A (en) | 2010-06-30 |
CN101763983B true CN101763983B (en) | 2014-06-25 |
Family
ID=42495083
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910248047.9A Active CN101763983B (en) | 2009-12-31 | 2009-12-31 | Thin temperature fuse of profile protective structure and preparing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101763983B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103072008B (en) * | 2012-12-26 | 2015-06-03 | 浙江茗熔电器保护系统有限公司 | Melt preparation device and application method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1509486A (en) * | 2001-02-20 | 2004-06-30 | ���µ�����ҵ��ʽ���� | Thermal fuse |
CN101197230A (en) * | 2006-12-05 | 2008-06-11 | 比亚迪股份有限公司 | Low-melting point alloy wire and temperature fuse adopting the same |
CN101197224A (en) * | 2006-12-08 | 2008-06-11 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
CN101465250A (en) * | 2008-12-31 | 2009-06-24 | 上海长园维安电子线路保护股份有限公司 | Temperature fuse and method of manufacturing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4610807B2 (en) * | 2001-07-30 | 2011-01-12 | 内橋エステック株式会社 | Thin fuse |
JP4207686B2 (en) * | 2003-07-01 | 2009-01-14 | パナソニック株式会社 | Fuse, battery pack and fuse manufacturing method using the same |
JP5181846B2 (en) * | 2008-06-05 | 2013-04-10 | パナソニック株式会社 | Thermal fuse |
-
2009
- 2009-12-31 CN CN200910248047.9A patent/CN101763983B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1509486A (en) * | 2001-02-20 | 2004-06-30 | ���µ�����ҵ��ʽ���� | Thermal fuse |
CN101197230A (en) * | 2006-12-05 | 2008-06-11 | 比亚迪股份有限公司 | Low-melting point alloy wire and temperature fuse adopting the same |
CN101197224A (en) * | 2006-12-08 | 2008-06-11 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
CN101465250A (en) * | 2008-12-31 | 2009-06-24 | 上海长园维安电子线路保护股份有限公司 | Temperature fuse and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN101763983A (en) | 2010-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant after: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
|
COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SHANGHAI CHANGYUAN WEIAN ELECTRONIC LINE PROTECTION CO., LTD. TO: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., LTD. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Patentee after: Shanghai Wei'an Electronic Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Patentee before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Patentee before: Shanghai Wei'an Electronic Co.,Ltd. |