CN101763983B - Thin temperature fuse of profile protective structure and preparing method thereof - Google Patents

Thin temperature fuse of profile protective structure and preparing method thereof Download PDF

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Publication number
CN101763983B
CN101763983B CN200910248047.9A CN200910248047A CN101763983B CN 101763983 B CN101763983 B CN 101763983B CN 200910248047 A CN200910248047 A CN 200910248047A CN 101763983 B CN101763983 B CN 101763983B
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China
Prior art keywords
carrier band
metal pins
fusible core
temperature fuse
lug
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CN200910248047.9A
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CN101763983A (en
Inventor
沈海波
钱朝勇
张子川
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Shanghai Weian Electronics Co ltd
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Shanghai Changyuan Wayon Circuit Protection Co Ltd
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Abstract

The invention relates to a thin temperature fuse of profile protective structure, which includes a pair of metal pins arranged in a straight line; a space is reserved between the end parts of the metal pins; a closing space is formed between an upper carrier tape and a lower carrier tape to seal the end parts of the metal pins, a fusible core and a fluxing agent; wherein, the fusible core consists of two broader ends and a narrow connection part in the middle to form an H-shape; and the two ends of the fusible core cover the whole end parts of the two metal pins. The thin temperature fuse of profile protective structure has the advantages of using the H-shaped fusible core to increase the contact size of the pins, increasing the wettability between the fusible core and the end parts of the metal pins under a high temperature condition when approaching to the fusing temperature of the fusible core, driving the fusible core to move more quickly and helping the fuse to fuse quickly, thereby playing the role of better protecting circuits, leading a coated part from being easily cracked through a lug structure when being pressed, being capable of bearing larger pressure, and leading the temperature fuse to be capable of playing the role of protection normally under extreme conditions.

Description

The thin temperature fuse of profile protective structure and manufacture method thereof
Technical field
The present invention relates to the slim element of electrical type Related product overheat protector, thin temperature fuse and the manufacture method thereof of profile protective structure for especially a kind of battery of mobile phone.
Background technology
Be accompanied by the universal of the telecommunication equipments such as mobile phone, the application demand of the Miniature Power Unit take lithium battery as representative in daily life, production further expands.Especially the application of mobile phone, has substantially accomplished one of staff, but the accident such as battery of mobile phone blast, battery of mobile phone acid liquor leakage occurring in recent years allows the protection of battery of mobile phone more and more obtain the public's concern.For adaptive functions mobile phone from strength to strength, battery of mobile phone develops into present 3600mAh from the low capacity of 200mAh at first, several years are only used, strengthen by battery capacity the mobile phone potential safety hazard attracting also more and more obvious, the yield-to-weight ratio small-capacity cells that high capacity cell at high temperature explodes will go up greatly several times.
Still there is now defect in the manufacturing technology of lithium ion battery; the lithium ion battery overwhelming majority of circulation all also relies on overcurrent or overvoltage protection in the market; but for present battery; the not absolute means safe of stable voltage or electric current, under normal voltage current conditions, battery-heating is the weak place of this part lithium ion battery protection.
Therefore needing temperature fuse protects it.Temperature fuse has and is swift in motion, little between fuse area, disconnects advantage thoroughly.Progressively moving towards the main flow stage of battery of mobile phone protection.
In battery of mobile phone production process, need to stand the high temperature of 80 ℃ nearly, and in battery of mobile phone protection module, temperature fuse is injection-moulded in plastics, fuse is standing certain pressure, and in routine use afterwards, battery of mobile phone is often likely in the high temperature of 60 ~ 70 ℃, flux contained in temperature fuse is understood melting at this temperature, even present liquid state, when volume ratio is solid-state, expand to some extent, and some low boiling point component containing in flux at high temperature can volatilize, further cause the expansion of flux volume, this has just proposed requirements at the higher level to the compression strength of temperature fuse.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of thin temperature fuse of profile protective structure, and in the time approaching fusible core fusing-off temperature, fusible core can move more rapidly, thereby plays better circuit protection effect.
Another technical problem to be solved by this invention is the manufacture method of the thin temperature fuse that above-mentioned profile protective structure is provided.
The present invention solves the problems of the technologies described above taked technical scheme: a kind of thin temperature fuse of profile protective structure, comprise a pair of metal pins being arranged in a linear, between the end of metal pins, leave spacing, below metal pins end, be provided with lower carrier band, between both ends, be weldingly connected by fusible core, on fusible core, brushing has flux, upper carrier band covers from top, upper carrier band and lower carrier band form a confined space, by metal pins end, fusible core and flux are sealed in the inside of this confined space, wherein: fusible core forms " H " shape structure by the narrower connecting portion in two wider terminations and middle part, two terminations of fusible core cover the whole end of two metal pins.
The fusible core of temperature fuse of the present invention is made into " H " shape; increase fusible core and contacted volume with pin; in the time approaching fusible core fusing-off temperature; strengthen the wetability of fusible core and metal pins end under hot conditions; allow fusible core move more rapidly; help more quick fuse of fuse, thereby play better circuit protection effect.
On the basis of such scheme, the length of described fusible core connecting portion is less than the spacing of metal pins end.
On the basis of such scheme, the middle part of described thin temperature fuse is also provided with middle carrier band, middle carrier band is located at the top of metal pins end and supplies end to expose, the both sides of middle carrier band are respectively equipped with lug, the both sides of lower carrier band are also respectively equipped with lug, and the lug of lower carrier band and middle carrier band all welds mutually with two metal pins.
In the time that thin temperature fuse does not have lug, flux can level off to liquid state under higher temperature, some low boiling point component starts volatilization simultaneously, volume starts to expand, the pressure that wrapping portion bears strengthens, in the time arriving certain critical point, flux can let out by the welding portion of carrier band and pin, affects the fusing of Thermal Cutoffs.By the lower carrier band with lug and in bring protection fusible core and flux, increase the mechanical performance of temperature fuse, and prevent that flux from leaking under certain condition, improve the fusing performance of fusible core.
On the basis of such scheme, described lug is the semicircle that size is identical, and its thickness is identical with lower carrier band and middle carrier band;
On the basis of such scheme, after described lug and the welding of two metal pins, be positioned at same level with the height of lower carrier band; After described lug and the welding of two metal pins, be positioned at same level with the height of middle carrier band.
On the basis of such scheme, on described middle carrier band, be provided with two slotted holes side by side, expose from two slotted holes respectively two metal pins ends.
On the basis of such scheme, the gross thickness of thin temperature fuse is not more than 1.0mm.
On the basis of such scheme, the material of described middle carrier band is identical with upper and lower carrier band, or different, is the one in PEN, polybutylene terephthalate (PBT), Merlon, PETG.
For the manufacture method of the thin temperature fuse of above-mentioned profile protective structure, comprise the following steps:
The first step: plastic sheet punching press is made to the lower carrier band of design size, middle carrier band and upper carrier band, at the lug place of lower carrier band welding pair of metal pin, metal pins be relatively arranged in a linear and end between leave spacing, again the lug of middle carrier band is welded on metal pins, and for exposing two metal pins ends;
Second step: both ends are weldingly connected with " H " shape fusible core, and two terminations of fusible core cover the whole end of two metal pins;
The 3rd step: after brushing flux, upper carrier band is covered from top on fusible core, metal pins end, fusible core and flux are coated on to inside, and precise plastic is welded into sealing entirety;
The 4th step: make thin temperature fuse after cutting, cleaning, check.
The invention has the beneficial effects as follows:
Utilize the fusible core of " H " shape to increase the contact volume of pin, in the time approaching fusible core fusing-off temperature, strengthen the wetability of fusible core and metal pins end under hot conditions, allow fusible core move more rapidly, help more quick fuse of fuse, thereby play better circuit protection effect;
Make wrapping portion in the time being under pressure, be not easy to break by ledge arrangement, can bear larger pressure, make temperature fuse can normally bring into play protective effect under maximum conditions.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Fig. 2 is the side-looking structural representation of metal pins of the present invention.
Fig. 3 is the plan structure schematic diagram of Fig. 2.
Fig. 4 is the plan structure schematic diagram of carrier band under the present invention.
Fig. 5 is the plan structure schematic diagram of carrier band under comparative example.
Fig. 6 is the plan structure schematic diagram of carrier band in the present invention.
Fig. 7 is the plan structure schematic diagram of carrier band in comparative example.
Fig. 8 is the plan structure schematic diagram of the present invention " H " shape fusible core.
Fig. 9 is the plan structure schematic diagram of comparative example bar shaped fusible core.
Figure 10 is the plan structure schematic diagram of carrier band under the present invention, middle carrier band and metal pins welding.
Figure 11 is the plan structure schematic diagram that the present invention welds " H " shape fusible core.
Figure 12 is the plan structure schematic diagram of comparative example welding bar shaped fusible core.
Figure 13 is that the decomposition master of each several part of the present invention cuts open structural representation.
Figure 14 is that master of the present invention cuts open structural representation.
Attached number in the figure explanation
1,2-metal pins 11,21-end
3-fusible core 31,32-termination 33-connecting portion
3 '-fusible core
Carrier band 41,42-lug under 4-
4 '-lower carrier band
Carrier band 51,52-lug 53,54-slotted hole in 5-
5 '-middle carrier band
The upper carrier band 7-of 6-flux
Embodiment
Embodiment 1
The first step: refer to Fig. 1 and be process chart of the present invention, Fig. 5 and be shown in the plan structure schematic diagram that the plan structure schematic diagram of carrier band under comparative example and Fig. 7 are carrier band in comparative example, by polyethylene terephtalate sheet material, thickness is that square lower carrier band 4 ', middle carrier band 5 ' and upper carrier band (not shown) are made in 0.1~0.125mm punching press;
Refer to Fig. 2 and be shown in the side-looking structural representation of metal pins of the present invention, plan structure schematic diagram that Fig. 3 is Fig. 2, two metal pins 1,2 are arranged in a linear, and the minimum spacing between its end 11,21 is 1.5mm, termination thickness 0.12mm;
Refer to Fig. 8 and be shown in the plan structure schematic diagram of the present invention " H " shape fusible core, fusible core 3 forms " H " shape by two narrower connecting portions 33 in wider termination 31,32 and middle part, the length of connecting portion 33 is 1.1mm, width is 0.8mm, two termination 31,32 length are 0.8mm, width is 1.4mm, and metal pins 1,2 is welded with middle carrier band 5 ' by precalculated position and lower carrier band 4 ';
Second step: press shown in the plan structure schematic diagram of carrier band under Figure 10 the present invention, middle carrier band and metal pins welding, press the structure of Figure 10, fusible core 3 and metal pins end 11,21 are weldingly connected, and two terminations 31,32 of fusible core 3 cover the whole end 11,21 of two metal pins;
The 3rd step: brushing flux 7 on fusible core 3, upper carrier band is covered on lower carrier band, by flux 7, fusible core 3 and metal pins end 11,21 parcels precise plastic welding;
The 4th step: make thin temperature fuse (50pcs) through cutting, cleaning, check.
Embodiment 2
Other structures and size are all identical with embodiment 1, the gabarit shape difference of just lower carrier band, refer to Fig. 4 and be shown in the plan structure schematic diagram of carrier band under the present invention, the both sides of lower carrier band 4 are differentiated and are provided with lug 41,42, the thickness of lug 41,42 is 0.1mm, radius is 0.5mm, and metal pins 1,2, by precalculated position and lower carrier band 4 and lug 41,42 welding thereof, makes thin temperature fuse (50pcs).
Embodiment 3
Other structures and size are all identical with embodiment 1, the gabarit shape difference of carrier band just, refer to Fig. 6 and be shown in the plan structure schematic diagram of carrier band in the present invention, the both sides of middle carrier band 5 are respectively equipped with lug 51,52, the thickness of lug 51,52 is 0.1mm, radius is 0.5mm, and metal pins 1,2, by precalculated position and middle carrier band 5 and lug 51,52 welding thereof, makes thin temperature fuse (50pcs).
Embodiment 4
Other structures and size are all identical with embodiment 1, the gabarit shape difference of just lower carrier band and middle carrier band, refer to Fig. 4 and be shown in the plan structure schematic diagram that the plan structure schematic diagram of carrier band under the present invention and Fig. 6 are carrier band in the present invention, the both sides of lower carrier band 4 are respectively equipped with lug 41, 42, lug 41, 42 thickness is 0.1mm, radius is 0.5mm, the both sides of middle carrier band 5 are respectively equipped with lug 51, 52, lug 51, 52 thickness is 0.1mm, radius is 0.5mm, metal pins 1, 2 by precalculated position and lower carrier band 4 and lug 41 thereof, 42 welding, and with middle carrier band 5 and lug 51 thereof, 52 welding, make thin temperature fuse (50pcs).
Embodiment 5:
Other structures are identical with embodiment 4, just fusible core is bar shaped fusible core, refer to Fig. 9 and be shown in the plan structure schematic diagram that the plan structure schematic diagram of comparative example bar shaped fusible core and Figure 12 are comparative example welding bar shaped fusible core, the length of fusible core 3 ' is 2mm, width is 0.8mm, fusible core 3 ' is weldingly connected metal pins end 11,21, and fusible core 3 ' can not cover the whole end 11,21 of two metal pins, make thin temperature fuse (50pcs).
The thin temperature fuse that embodiment 1~5 is made is tested, and test result is as shown in table 1.
Table 1
Classification Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Embodiment 5
Lower carrier band lug Nothing Have Nothing Have Have
Middle carrier band lug Nothing Nothing Have Have Have
" H " shape fusible core Be Be Be Be No
Average fusing-off temperature Tf (℃) 93.6 93.7 93.7 93.6 95.7
Maximum is born pressure (N) 3 4 4 10 10
As can be seen from Table 1; sample is in the time of 130 ℃; under the complete liquefaction condition of flux 7; there is lug 41,42,51,52 o'clock (embodiment 4) at lower carrier band 4 and middle carrier band 5 simultaneously; the pressure N ratio can bear only has lower carrier band 4 and middle carrier band, and one of them has in the situation that lug (embodiment 2,3) or both all do not have lug (embodiment 1) all high; such technique, by greatly improving the assembling capacity of sample in battery of mobile phone is produced, plays a very good protection to the leakage that prevents flux 7.
And when fusible core 3 is made to " H " shape ( embodiment 1,2,3,4), the fusing-off temperature of sample has reduced by 2 ℃ than bar shaped fusible core 3 ' (embodiment 5), illustrate that the two ends of " H " shape fusible core 3 are in the time that fusible core approaches fusing, obvious wetting action is played in metal pins termination 11,21, accelerated the action of fuse.

Claims (8)

1. a thin temperature fuse for profile protective structure, comprises a pair of metal pins being arranged in a linear (1), (2), metal pins (1), (2) end (11), (21) between, leave spacing, in metal pins end (11), (21) below is provided with lower carrier band (4), both ends (11), (21) between, be weldingly connected by fusible core (3), have flux (7) in the upper brushing of fusible core (3), upper carrier band (6) covers from top, and under carrier band on plastics (6) and plastics, carrier band (4) forms a confined space, by metal pins end (11), (21), fusible core (3) and flux (7) are sealed in the inside of this confined space, it is characterized in that: fusible core (3) is by two wider terminations (31), (32) and the narrower connecting portion (33) in middle part form " H " shape structure, two terminations (31) of fusible core (3), (32) the whole end (11) of two metal pins of covering, (21), wherein, the middle part of described thin temperature fuse is also provided with middle carrier band (5), and middle carrier band (5) is located at metal pins end (11), (21) top and confession end (11), (21) expose, the both sides of middle carrier band (5) are respectively equipped with lug (51), (52), the both sides of lower carrier band (4) are also respectively equipped with lug (41), (42), the lug (41) of lower carrier band (4) and middle carrier band (5), (42), (51), (52) all with two metal pins (1), (2) welding mutually.
2. the thin temperature fuse of profile protective structure according to claim 1, is characterized in that: the length of described fusible core connecting portion (33) is less than the spacing of metal pins end (11), (21).
3. the thin temperature fuse of profile protective structure according to claim 1; it is characterized in that: described lug (41), (42), (51), (52) are the semicircle that size is identical, and its thickness is identical with lower carrier band (4) and middle carrier band (5).
4. the thin temperature fuse of profile protective structure according to claim 3, is characterized in that: lug (41), (42) of described lower carrier band (4) are positioned at same level with two metal pins (1), (2) welding height rear and lower carrier band; Lug (51), (52) of described middle carrier band (5) are positioned at same level with two metal pins (1), (2) welding height rear and middle carrier band (5).
5. the thin temperature fuse of profile protective structure according to claim 1; it is characterized in that: on described middle carrier band (5), be provided with two slotted hole (53), (54) side by side, expose from two slotted holes (53), (54) respectively two metal pins ends (11), (21).
6. the thin temperature fuse of profile protective structure according to claim 1, is characterized in that: the gross thickness of thin temperature fuse is not more than 1.0mm.
7. the thin temperature fuse of profile protective structure according to claim 1; it is characterized in that: the material of described middle carrier band (5) and upper carrier band, lower carrier band are identical or different, are the one in PEN, polybutylene terephthalate (PBT), Merlon, PETG.
8. for the manufacture method of the thin temperature fuse of the profile protective structure one of claim 1 to 7 Suo Shu, it is characterized in that comprising the following steps:
The first step: plastic sheet punching press is made to the lower carrier band (4) of design size, middle carrier band (5) and upper carrier band (6), pair of metal pin (1), (2) are located to weld in lug (41), (42) in lower carrier band (4), metal pins (1,2) is relatively arranged in a linear and end (11), (21) between leave spacing, again the lug of middle carrier band (5) (51), (52) are welded on to metal pins (1), (2) above, and expose for two metal pins ends (11), (21);
Second step: both ends (11), (21) are weldingly connected with " H " shape fusible core (3), and two terminations (31) of fusible core (3), (32) cover whole end (11), (21) of two metal pins;
The 3rd step: after the upper brushing flux (7) of fusible core (3), upper carrier band (6) is covered from top, metal pins end (11), (21), fusible core (3) and flux (7) are coated on to inside, and be welded into sealing entirety;
The 4th step: make thin temperature fuse after cutting, cleaning, check.
CN200910248047.9A 2009-12-31 2009-12-31 Thin temperature fuse of profile protective structure and preparing method thereof Active CN101763983B (en)

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103072008B (en) * 2012-12-26 2015-06-03 浙江茗熔电器保护系统有限公司 Melt preparation device and application method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1509486A (en) * 2001-02-20 2004-06-30 ���µ�����ҵ��ʽ���� Thermal fuse
CN101197230A (en) * 2006-12-05 2008-06-11 比亚迪股份有限公司 Low-melting point alloy wire and temperature fuse adopting the same
CN101197224A (en) * 2006-12-08 2008-06-11 比亚迪股份有限公司 Fusing agent and temperature fuse containing the same
CN101465250A (en) * 2008-12-31 2009-06-24 上海长园维安电子线路保护股份有限公司 Temperature fuse and method of manufacturing the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4610807B2 (en) * 2001-07-30 2011-01-12 内橋エステック株式会社 Thin fuse
JP4207686B2 (en) * 2003-07-01 2009-01-14 パナソニック株式会社 Fuse, battery pack and fuse manufacturing method using the same
JP5181846B2 (en) * 2008-06-05 2013-04-10 パナソニック株式会社 Thermal fuse

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1509486A (en) * 2001-02-20 2004-06-30 ���µ�����ҵ��ʽ���� Thermal fuse
CN101197230A (en) * 2006-12-05 2008-06-11 比亚迪股份有限公司 Low-melting point alloy wire and temperature fuse adopting the same
CN101197224A (en) * 2006-12-08 2008-06-11 比亚迪股份有限公司 Fusing agent and temperature fuse containing the same
CN101465250A (en) * 2008-12-31 2009-06-24 上海长园维安电子线路保护股份有限公司 Temperature fuse and method of manufacturing the same

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