CN101458453A - Projection aligner - Google Patents
Projection aligner Download PDFInfo
- Publication number
- CN101458453A CN101458453A CNA2007100944268A CN200710094426A CN101458453A CN 101458453 A CN101458453 A CN 101458453A CN A2007100944268 A CNA2007100944268 A CN A2007100944268A CN 200710094426 A CN200710094426 A CN 200710094426A CN 101458453 A CN101458453 A CN 101458453A
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- filter plate
- light source
- projection aligner
- line
- filter
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a projection photoetching machine. An optical system comprises a light source, a mask plate plane and a lens set; wherein, a filter plate set is arranged between the light source and the mask plate plane, the filter plate set comprises a plurality of filter plates, and rays emitted from the light source are irradiated onto a mask plate by one filter plate in the filter plate set and finally projected to the surface of a silicon chip by the lens set. The filter plate set is arranged between the light source and the mask plate plane of the photoetching machine, so as to carry out photoetching for different wavelengths on the same photoetching machine. When the filter plate set is arranged on a disc, the projection photoetching machine not only can change the working wavelength of the photoetching machine by rotating the disc, but also can reduce uneven distribution of light beam energy caused by the problems such as the inclination of the filter plate and the like.
Description
Technical field
The present invention relates to SIC (semiconductor integrated circuit) and make the photoetching technique in field, particularly design a kind of projection aligner.
Background technology
Existing litho machine optical system comprises light source, traditional G line litho machine (wavelength is 436nm), and the litho machine (wavelength is 365nm) of H line litho machine (wavelength is 406nm) and I line has all adopted high-pressure mercury arc lamp light modulation or high-pressure mercury-xenon arc lamp as light source.This is because high-pressure mercury arc lamp light modulation or high-pressure mercury-xenon arc lamp all are wide spectrum light sources, has covered the G line, H line and I line wave band.By filter plate filtering, just can adjust the output wave band.
As shown in Figure 1, the high-pressure mercury arc lamp light modulation of existing projection aligner optical system or the light source of high-pressure mercury-xenon arc lamp shine on the mask by filter plate, and the light of outgoing projects on the silicon plane through lens combination again on the mask, and carries out photoetching.But litho machine in the past all is single wave band to expose.The litho machine of G line for example, its service band are just just at G-band.Yet, when the different technology of photoetching lithographic dimensioned, may need the litho machine of different operating wavelength.Many different litho machines of general now employing wavelength carry out the photoetching of different size, but it is very high adopting the cost of many litho machines, are unfavorable for the scale growth.
Summary of the invention
Technical matters to be solved by this invention provides a kind of projection aligner, only adopts a litho machine just can carry out the photoetching of different size.
For solving the problems of the technologies described above, the technical scheme of projection aligner of the present invention is, its optical system comprises light source, mask plane, lens combination, between light source and mask plane, also comprise a filter plate group, comprise a plurality of filter plates on this filter plate group, from the light of light source outgoing after filtration a filter plate the wave plate group shine on the mask, and the scioptics group projects on the silicon chip plane at last.
Be as a further improvement on the present invention, described filter plate group comprises three filter plates, can obtain G line, H line and I line respectively by these three filter plates.
As another kind of further improvement of the present invention be, described filter plate group is arranged on the rotatable disk, the centre distance of the centre distance disk of three filter plates equates, and disc centre equates with the distance that project to disc centre of light source center on disk to the distance at filter plate center.
The present invention can obtain G line, H line and I line respectively by three filter plates are set on a disk, thereby is implemented in the photoetching of carrying out several different sizes on the litho machine.
Description of drawings
The present invention is further detailed explanation below in conjunction with drawings and Examples:
Fig. 1 is projection aligner's optical system rough schematic of prior art;
Fig. 2 is a projection aligner of the present invention optical system synoptic diagram;
Fig. 3 is the position view of filter plate group of the present invention and light source;
Fig. 4 is filter plate group of the present invention distribution schematic diagram on disk.
Embodiment
As shown in Figure 2, the optical system of projection aligner comprises light source, mask plane, lens combination, between light source and mask plane, also comprise a filter plate group, comprise a plurality of filter plates on this filter plate group, from the light of light source outgoing after filtration a filter plate the wave plate group shine on the mask, and the scioptics group projects on the silicon chip plane at last.
As shown in Figure 4, G refers to G line filter plate, and H refers to H line filter plate, and I refers to I line filter plate, and the filter plate group comprises three filter plates, and these three filter plates can be the circle that shows among the figure, also can be other shapes.When filter plate when being circular, become 120 to spend angles between the line at the center of three filter plates and the center of disk.Can obtain G line, H line and I line respectively by these three filter plates.The filter plate group is embedded to be arranged on the rotatable disk, and the filter plate group also can be arranged on the disk by additive method.In Fig. 2, the dotted line on the wheel disc is for placing the hole of three filter plates, and the center in hole is at the center of light path, and the center in three holes equates to the distance of wheel disk center.Promptly the centre distance of the centre distance disk of three filter plates equates, as shown in Figure 3, disc centre equates with the distance that project to disc centre of light source center on disk to the distance at filter plate center.This makes and can make the center of filter plate at the center of light path by rotating circular disk.
When utilizing projection aligner of the present invention, as long as rotary disk turns to the light path place with needed filter plate, its center is overlapped with the light path center, just can utilize this size filtering sheet to carry out corresponding photoetching.When the photoetching of another kind of size was carried out in the needs replacing, rotary disk found corresponding filter plate to enter light path once more, just can realize the replacing of lithographic wavelength.
The present invention adds the filter plate group between the light source of litho machine and mask, thereby reaches the photoetching of carrying out different wave length on a litho machine.When the filter plate group was arranged on the disk, not only rotary disk just changed the operation wavelength of litho machine, and can reduce because problems such as filter plate inclination cause the skewness of beam energy.
Claims (6)
1. projection aligner, its optical system comprises light source, mask plane, lens combination, it is characterized in that, between light source and mask plane, also comprise a filter plate group, comprise a plurality of filter plates on this filter plate group, from the light of light source outgoing after filtration a filter plate the wave plate group shine on the mask, and the scioptics group projects on the silicon chip plane at last.
2. projection aligner according to claim 1 is characterized in that, described filter plate group comprises three filter plates, can obtain G line, H line and I line respectively by these three filter plates.
3. projection aligner according to claim 1 and 2, it is characterized in that, described filter plate group is arranged on the rotatable disk, the centre distance of the centre distance disk of three filter plates equates, and disc centre equates with the distance that project to disc centre of light source center on disk to the distance at filter plate center.
4. projection aligner according to claim 3 is characterized in that, described filter plate group is embedded to be arranged on the rotatable disk.
5. projection aligner according to claim 4 is characterized in that, described filter plate is circular.
6. projection aligner according to claim 3 is characterized in that, becomes 120 degree angles between the line at the center of described three filter plates and the center of disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100944268A CN101458453A (en) | 2007-12-11 | 2007-12-11 | Projection aligner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100944268A CN101458453A (en) | 2007-12-11 | 2007-12-11 | Projection aligner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101458453A true CN101458453A (en) | 2009-06-17 |
Family
ID=40769398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100944268A Pending CN101458453A (en) | 2007-12-11 | 2007-12-11 | Projection aligner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101458453A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842485A (en) * | 2011-06-23 | 2012-12-26 | 上海微电子装备有限公司 | Silicon wafer processing device and the processing method thereof |
| CN109031891A (en) * | 2018-07-20 | 2018-12-18 | 深圳市华星光电技术有限公司 | The lighting mechanism and its exposure method of exposure machine |
| CN110928145A (en) * | 2019-11-18 | 2020-03-27 | Tcl华星光电技术有限公司 | Cut-off filter |
| CN112130269A (en) * | 2020-09-27 | 2020-12-25 | 浙江华疆科技有限公司 | Automatic filter replacing device of exposure machine |
-
2007
- 2007-12-11 CN CNA2007100944268A patent/CN101458453A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102842485A (en) * | 2011-06-23 | 2012-12-26 | 上海微电子装备有限公司 | Silicon wafer processing device and the processing method thereof |
| CN102842485B (en) * | 2011-06-23 | 2016-01-20 | 上海微电子装备有限公司 | Silicon chip processing unit and processing method thereof |
| CN109031891A (en) * | 2018-07-20 | 2018-12-18 | 深圳市华星光电技术有限公司 | The lighting mechanism and its exposure method of exposure machine |
| CN109031891B (en) * | 2018-07-20 | 2020-10-27 | 深圳市华星光电技术有限公司 | Illuminating mechanism of exposure machine and exposure method thereof |
| CN110928145A (en) * | 2019-11-18 | 2020-03-27 | Tcl华星光电技术有限公司 | Cut-off filter |
| CN112130269A (en) * | 2020-09-27 | 2020-12-25 | 浙江华疆科技有限公司 | Automatic filter replacing device of exposure machine |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090617 |