CN101457580A - Direct heat conducting type solid wood keel ground heating floor - Google Patents
Direct heat conducting type solid wood keel ground heating floor Download PDFInfo
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- CN101457580A CN101457580A CNA2008102029511A CN200810202951A CN101457580A CN 101457580 A CN101457580 A CN 101457580A CN A2008102029511 A CNA2008102029511 A CN A2008102029511A CN 200810202951 A CN200810202951 A CN 200810202951A CN 101457580 A CN101457580 A CN 101457580A
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Abstract
The invention relates to a direct heat conducting solid wood joist ground heating floor. The floor is provided with a heat conducting media between two layers of floorboards, and the upper half part of a ground heating pipe is embedded into the heat conducting media, the lower half part is placed into a keel groove; heat enters the floor along the heat conducting media to realize the function of conducting heat quickly and directly; as the floor is laid on the keel groove, the floor is not directly contacted with the ground, the heat is not conducted into a floor slab and a wall body, therefore, the energy waste is reduced. Furthermore, a dovetail groove and a dovetail male are respectively arranged between a base plate and a panel, and the dovetail male is correspondingly embedded into the dovetail groove; the steadiness of the floor is strengthened by a heat pressing occlusion structure, so that the floor is not easy to deform.
Description
Technical field
The present invention relates to a kind of floor, relate in particular to a kind of floor that has conductive structure.
Background technology
Traditional heating technology is changed, ground heating has been fashion trend, thereby ground heating floor arises at the historic moment, solid wooden compound floor and consolidated floor mainly are to rely on timber body heat loss through conduction in the market, because the low heat-transfer rate of timber coefficient of thermal conductivity is slow, causing the thermal energy consumption of floor heating very high, go for floor heating and these floors only are materials own, is not heating floor exclusively truly.And these ground heating floors mainly are to be laid on the floor heating stratum, when being heating, its shortcoming at first needs surface water mud layer is heated, and then be transmitted on the floor on ground, do like this that to continue heat time heating time long, and need long-time cold operation, most heats are absorbed by floor and body of wall, and these all expend a large amount of energy.
So, someone develops a kind of ground heating floor of quick conductive, such as publication number is arranged is that " CN1693626 ", name are called the Chinese patent of " compound ground heating floor ", comprise dash board, inferior dash board, central layer and base plate, be provided with horizontal thermal trough in the central layer, vertical thermal trough is set in the base plate, laterally be filled with heat-conducting medium in thermal trough and the vertical thermal trough, vertically thermal trough is two, distance between two vertical thermal troughs is 20-35mm, laterally thermal trough is many, and the distance between two adjacent horizontal thermal troughs is 25-40mm, and described heat-conducting medium is aluminium or copper.
But there are some shortcomings in above-mentioned patent, one, deformation takes place easily when expanding with heat and contract with cold on the floor, cause the floor out-of-flatness; Two, be directly to contact between floor and the ground, the thermal loss rate is still very high; Three, plate thickness is big, does not save the space.
Therefore be necessary that a kind of heat loss rate newly developed is low, the ground heating floor of good stability.
Summary of the invention
Technical problem to be solved by this invention is, at existing direct heat-conducting ground heating floor heat loss rate height, shortcoming that structure is stable inadequately, provides a kind of heat loss rate low, and constitutionally stable ground heating floor.Its fluting by the bottom, floor and matrix keel groove fit are directly transferred to the ground intralamellar part with the heat of floor heating pipe, solved the problem that expends energy height, not environmental protection of traditional floor heating technology, suppress the modification warpage of top dash board simultaneously in the swallow limit part of utilizing dovetail groove up and down between the laminate, make this floor have the function of resistance type warpage.
In order to solve the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of direct heat conducting type solid wood keel ground heating floor, comprise substrate, panel, floor heating pipe and keel groove, between substrate and panel, be provided with heat-conducting medium, and the upper surface of substrate is respectively equipped with several parallel dovetail grooves and corresponding with it dovetail with the soffit of panel, the corresponding dovetail groove that embeds of dovetail; The first half of floor heating pipe longitudinally embeds the dual side-edge of substrate, and partly contacts with heat-conducting medium, and the Lower Half of floor heating pipe embeds in the keel groove groove.Heat-conducting medium conducts the heat in the floor heating pipe rapidly and is distributed in each position on floor, can avoid thermal loss outside the floor; Adopt dovetail groove and dovetail be connected substrate and panel, utilize the modification warpage of the swallow limit part inhibition upper panel of dovetail groove, make this floor have the function of resistance type warpage, alarmmed when avoiding the floor to be heated or cave in, bring the irregular worry in floor.
On the technique scheme basis, described substrate two ends are provided with gap slot, substrate docks the floor heating tube seat that makes gap slot form a semicircular arc with substrate, in the floor heating tube seat floor heating pipe is set, correspondence is provided with a keel groove below the floor heating tube seat, thereby floor heating pipe is enclosed between floor heating tube seat and the keel groove.Adopt the keel groove that two beneficial effects are arranged: one, to avoid floor heating pipe directly to contact, further reduce thermal loss with ground; Two, the keel groove gets up base plate supports, has a slight space between floor and ground, and when the someone stepped down on the floor, the floor can produce a small elastic deformation, has avoided hard contact, made the people feel comfortable.
On the technique scheme basis, the longitudinal cross-section of described panel forms " L " type, and the L type cross section between the panel of butt joint suits mutually mutually.
On the technique scheme basis, described heat-conducting medium is the silk or the thin slice of nano aluminum nitride, carbon nano-fiber, adhesive or metal, alloy material, intersects with the arragement direction of floor heating pipe.Heat-conducting medium also can be the good material of other thermal conductivity.
On the technique scheme basis, described panel is the natural wood floor, finger plate, integrated timber that substrate material adopts fast growing wood to make, and the substrate benefit that adopts fast growing wood to make is that environmental protection connects, and saves the natural forest resource.
On the technique scheme basis, described metal is copper, aluminium or iron.Also can be the good metal of other thermal conductivity.
Technique effect of the present invention is embodied in: one, heat transfer efficiency height, thermal loss is few, gap slot and the middle floor heating pipe that embeds of keel groove at every floor, floor heating pipe directly conducts heat to the ground intralamellar part by the metal heat-conducting body in the floor, because floor covering layers are on the keel groove, directly do not contact between floor and the ground, thermal energy can not conduct in floor and the body of wall; Two, Stability Analysis of Structures is not easy distortion; Three, directly do not contact, use comfortable with the floor; Four, panel adopts natural timber, saves the heat-barrier material that benzene plate etc. contains chemical composition simultaneously, reduces the volatilization of hazardous substances, reduces the height of mating formation, and makes more health environment-friendly of the interior space, health environment-friendly.Five, dismounting and installation are all very convenient, are convenient to overhaul in the future and change.Six, mat formation highly lowly, mating formation of traditional floor highly generally is 7-8 centimetres, and mating formation of this product highly has only 3-4 centimetres; Seven, the number of plies is few, saves glue.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention;
Fig. 2 is substrate and panel annexation partial cutaway diagrammatic sketch;
Fig. 3 is a side schematic view of the present invention.
Description of symbols among the figure
1,1 ｀, 1 ｀ ｀, 1 ｀ ｀ ｀---substrate 11---dovetail groove
2,2 ｀---panel 21---dovetail
3,3 ｀, 3 ｀ ｀---heat-conducting medium 4,4 ｀, 4 ｀ ｀---floor heating pipe
5,5 ｀, 5 ｀ ｀---keel groove
The specific embodiment
As see Fig. 1, shown in Figure 2, comprise substrate 1, panel 2, floor heating pipe 4,4 ｀, 4 ｀ ｀ and keel groove 5,5 ｀, 5 ｀ ｀, be provided with heat-conducting medium 3,3 ｀, 3 ｀ ｀ at substrate 1 and 2 of panels, and the soffit of the upper surface of substrate 1 and panel 2 is respectively equipped with several parallel dovetail grooves 11 and corresponding with it dovetail 21, the dovetail 21 corresponding dovetail grooves 11 that embed; The first half of floor heating pipe 4,4 ｀, 4 ｀ ｀ longitudinally embeds the dual side-edge of substrate 1,1 ｀, 1 ｀ ｀, 1 ｀ ｀ ｀, and partly contact with heat-conducting medium 3,3 ｀, 3 ｀ ｀, the first half of floor heating pipe 4,4 ｀, 4 ｀ ｀ embeds in keel groove 5,5 ｀, the 5 ｀ ｀.Heat-conducting medium 3,3 ｀, 3 ｀ ｀ conduct and are distributed in each position on floor rapidly with the heat in floor heating pipe 4,4 ｀, the 4 ｀ ｀, can avoid thermal loss outside the floor; Adopt dovetail groove 11 and dovetail 21 be connected substrate 1 and panel 2, utilize the modification warpage of the swallow limit part inhibition upper panel of dovetail groove 11, make this floor have the function of resistance type warpage, alarmmed when avoiding the floor to be heated or cave in, bring the irregular worry in floor.
As shown in Figure 3, described substrate 1,1 ｀ two ends are provided with gap slot, substrate 1 docks the floor heating tube seat that makes gap slot form a semicircular arc with substrate 1 ｀, floor heating pipe 4 is set in the floor heating tube seat, correspondence is provided with a keel groove 5 below the floor heating tube seat, thereby floor heating pipe 4 is enclosed between floor heating tube seat and the keel groove 5.Adopt keel groove 5 that two beneficial effects are arranged: one, to avoid floor heating pipe 4 directly to contact, further reduce thermal loss with ground; Two, keel groove 5 gets up base plate supports, has a slight space between floor and ground, and when the someone stepped down on the floor, the floor can produce a small elastic deformation, has avoided hard contact, made the people feel comfortable.
As shown in Figure 1, substrate 1 docks successively with substrate 1 ｀ 1 ｀ ｀, 1 ｀ ｀ ｀, substrate 1 is a corresponding keel groove 5,5 ｀, the 5 ｀ ｀ of being provided with below substrate 1 ｀, 1 ｀ ｀, 1 ｀ ｀ ｀, thereby floor heating pipe 4,4 ｀, 4 ｀ ｀ are enclosed between floor heating tube seat and keel groove 5,5 ｀, the 5 ｀ ｀, heat-conducting medium 3 contacts with floor heating pipe 4,4 ｀, and heat-conducting medium 3 ｀ ｀ contact with floor heating pipe 4 ｀ ｀.
In the present embodiment, the longitudinal cross-section of described panel 2 forms " L " type, and the L type cross section between panel 2,2 ｀ of butt joint suits mutually mutually.
In the present embodiment, described heat-conducting medium 3,3 ｀, 3 ｀ ｀ are the silk or the thin slice of nano aluminum nitride, carbon nano-fiber, adhesive or metal, alloy material, intersect with the arragement direction of floor heating pipe.Heat-conducting medium 3,3 ｀, 3 ｀ ｀ also can be the good material of other thermal conductivity.
In the present embodiment, described substrate adopts fast growing wood to make, and benefit is that environmental protection connects, and saves the natural forest resource.
In the present embodiment, described metal is copper, aluminium or iron.Also can be the good metal of other thermal conductivity.
Claims (6)
1. a direct heat conducting type solid wood keel ground heating floor comprises substrate, panel, floor heating pipe and keel groove, it is characterized in that:
Between substrate and panel, be provided with heat-conducting medium, and the soffit of the upper surface of substrate and panel is respectively equipped with several parallel dovetail grooves and corresponding with it dovetail, the corresponding dovetail groove that embeds of dovetail;
The first half of floor heating pipe longitudinally embeds the dual side-edge of substrate, and partly contacts with heat-conducting medium, and the Lower Half of floor heating pipe embeds in the keel groove.
2. direct heat conducting type solid wood keel ground heating floor according to claim 1, it is characterized in that: described substrate two ends are provided with gap slot, substrate docks the floor heating tube seat that makes gap slot form a semicircular arc with substrate, in the floor heating tube seat floor heating pipe is set, correspondence is provided with a keel groove below the floor heating tube seat, thereby floor heating pipe is enclosed between floor heating tube seat and the keel groove.
3. direct heat conducting type solid wood keel ground heating floor according to claim 1 is characterized in that: the longitudinal cross-section of described panel forms " L " type, and the L type cross section between the panel of butt joint suits mutually mutually.
4. according to the described direct heat conducting type solid wood keel ground heating floor of one of claim 1 to 3, it is characterized in that: described heat-conducting medium is that nano silicon nitride aluminium powder, carbon nano-fiber powder and adhesive are formed, and also can be made up of the silk of metal, alloy material or thin slice and adhesive.
5. according to the described direct heat conducting type solid wood keel ground heating floor of one of claim 1 to 3, it is characterized in that: described panel is the natural wood floor.
6. direct heat conducting type solid wood keel ground heating floor according to claim 1 is characterized in that: described substrate grain direction intersects with last dash board line direction Cheng Zhidu angle, and substrate material comprises finger plate, integrated timber that fast growing wood is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102029511A CN101457580A (en) | 2008-11-19 | 2008-11-19 | Direct heat conducting type solid wood keel ground heating floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102029511A CN101457580A (en) | 2008-11-19 | 2008-11-19 | Direct heat conducting type solid wood keel ground heating floor |
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| Publication Number | Publication Date |
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| CN101457580A true CN101457580A (en) | 2009-06-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNA2008102029511A Pending CN101457580A (en) | 2008-11-19 | 2008-11-19 | Direct heat conducting type solid wood keel ground heating floor |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102191848A (en) * | 2011-04-11 | 2011-09-21 | 李渊 | Internal heat conduction type geothermal floor with intensified heat conduction |
| CN102661023A (en) * | 2011-03-01 | 2012-09-12 | 海宁伊满阁太阳能科技有限公司 | Metal heat-conduction enhanced floor |
| WO2014201908A1 (en) * | 2013-06-17 | 2014-12-24 | 无锡市寿德木业有限公司 | Energy-saving ground heating floor |
| CN105401709A (en) * | 2015-11-30 | 2016-03-16 | 福建省乐普陶板制造有限公司 | Recyclable floor heating brick integration system and rapid installation process thereof |
| CN105605658A (en) * | 2016-01-13 | 2016-05-25 | 肖玉化 | Method for installing heating module on foundation surface |
| CN107642214A (en) * | 2017-09-11 | 2018-01-30 | 宁波市镇海捷登应用技术研究所 | A kind of installation method of ground heating floor and the ground heating floor |
| CN108115798A (en) * | 2017-12-04 | 2018-06-05 | 杨舜轲 | A kind of process equipment and processing method of floor heating multi-layer solid wood composite floor |
| CN110512825A (en) * | 2019-08-30 | 2019-11-29 | 天津安其居建筑科技有限公司 | The interior decoration system of modularization installation |
-
2008
- 2008-11-19 CN CNA2008102029511A patent/CN101457580A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102661023A (en) * | 2011-03-01 | 2012-09-12 | 海宁伊满阁太阳能科技有限公司 | Metal heat-conduction enhanced floor |
| CN102191848A (en) * | 2011-04-11 | 2011-09-21 | 李渊 | Internal heat conduction type geothermal floor with intensified heat conduction |
| CN102191848B (en) * | 2011-04-11 | 2013-01-09 | 杭州暖捷环境科技有限公司 | Internal heat conduction type geothermal floor with intensified heat conduction |
| WO2014201908A1 (en) * | 2013-06-17 | 2014-12-24 | 无锡市寿德木业有限公司 | Energy-saving ground heating floor |
| CN105401709A (en) * | 2015-11-30 | 2016-03-16 | 福建省乐普陶板制造有限公司 | Recyclable floor heating brick integration system and rapid installation process thereof |
| CN105401709B (en) * | 2015-11-30 | 2017-12-12 | 福建省乐普陶板制造有限公司 | The floor heating tiles integrated system and its rapid installation process that can be recycled |
| CN105605658A (en) * | 2016-01-13 | 2016-05-25 | 肖玉化 | Method for installing heating module on foundation surface |
| CN107642214A (en) * | 2017-09-11 | 2018-01-30 | 宁波市镇海捷登应用技术研究所 | A kind of installation method of ground heating floor and the ground heating floor |
| CN108115798A (en) * | 2017-12-04 | 2018-06-05 | 杨舜轲 | A kind of process equipment and processing method of floor heating multi-layer solid wood composite floor |
| CN110512825A (en) * | 2019-08-30 | 2019-11-29 | 天津安其居建筑科技有限公司 | The interior decoration system of modularization installation |
| CN110512825B (en) * | 2019-08-30 | 2021-05-18 | 天津安其居建筑科技有限公司 | Modularly mounted interior trim system |
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Open date: 20090617 |