CN102191848A - Internal heat conduction type geothermal floor with intensified heat conduction - Google Patents
Internal heat conduction type geothermal floor with intensified heat conduction Download PDFInfo
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- CN102191848A CN102191848A CN 201110091391 CN201110091391A CN102191848A CN 102191848 A CN102191848 A CN 102191848A CN 201110091391 CN201110091391 CN 201110091391 CN 201110091391 A CN201110091391 A CN 201110091391A CN 102191848 A CN102191848 A CN 102191848A
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- thermal conductive
- heat
- conductive surface
- syndeton
- heat conduction
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- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000005034 decoration Methods 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 33
- 230000008719 thickening Effects 0.000 claims description 22
- 238000009413 insulation Methods 0.000 claims description 14
- 239000007937 lozenge Substances 0.000 claims description 10
- 238000007373 indentation Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The invention relates to an internal heat conduction type geothermal floor with intensified heat conduction, belonging to the technical field of building decoration materials. Both sides of a base plate are respectively provided with a first connecting structure and a second connecting structure; the first connecting structures and the second connecting structures of two adjacent floors can be connected in a mutually locking way; a heat conduction dielectric layer is arranged between the base plate and a decoration panel; one side of the heat conduction dielectric layer extends to the surface of the first connecting structure to form a first heat conduction surface connected with the surface of the first connecting structure, and the other side of the heat conduction dielectric layer extends to the surface of the second connecting structure to form a second heat conduction surface connected with the surface of the second connecting structure; the first heat conduction surface and the second heat conduction surface are continued along the length direction of the base plate; and when the two adjacent floors are connected in the mutually locking way, a containing cavity used for containing heating bodies is formed by the first heat conduction surface, the second heat conduction surface, the surface of the first connecting structure and the surface of the second connecting structure together.
Description
Technical field
The present invention relates to a kind of internal heat-conducting heating floor of reinforced heat conduction, belong to technical field of building and decoration materials.
Background technology
(notification number: CN101532332), described floor comprises: a floor body on a kind of floor of internal heat-conducting structure; A plurality of heat-conducting medium things, each described heat-conducting medium thing laterally is positioned at described floor body; One end of one floor heating pipe and each described heat-conducting medium thing contacts; Snap close piece on one is positioned at a side of described floor body, has defined the upper support chamber of an epirelief; And snap close piece once, be positioned at the opposite side of described floor body, defined a recessed lower support chamber, wherein said floor heating pipe lies in a horizontal plane in the described lower support chamber, like this, when the engagement of the following snap close piece location on the last snap close piece on a floor and adjacent floor, described upper support chamber and lower support chamber are complementary up and down and have formed a container cavity, described floor heating pipe is contained in wherein, thereby described floor heating pipe is embedded in the two adjacent described floors.In the technique scheme, contact area is less between floor heating pipe and the heat-conducting medium thing, and floor heating pipe and heat-conducting medium thing contact longitudinally along the floor discontinuous, thereby caused the firing rate on floor slower, floor surface heats problems such as inhomogeneous everywhere.
Summary of the invention
The object of the invention is to provide a kind of floor firing rate very fast, floor surface is the internal heat-conducting heating floor of the reinforced heat conduction of homogeneous heating everywhere, it is less to have solved between floor heating pipe that prior art exists and the heat-conducting medium thing contact area, and floor heating pipe contacts discontinuous with the heat-conducting medium thing longitudinally along the floor, thereby caused the firing rate on floor slower, floor surface heats problems such as inhomogeneous everywhere.
Above-mentioned technical purpose of the present invention mainly solves by the following technical programs: it comprises the decoration dash board on substrate and the substrate, one side of described substrate is provided with first syndeton, the opposite side of substrate is provided with second syndeton, first syndeton on two adjacent floors can be mutually locked with second syndeton and be connected, be provided with the heat-conducting medium layer between described substrate and the decoration dash board, described heat-conducting medium layer one side extends to first syndeton surface and forms first thermal conductive surface that one and first syndeton surface links up on first syndeton surface, heat-conducting medium layer opposite side extends to the surface of second syndeton and forms second thermal conductive surface that one and second syndeton surface links up on second syndeton surface, described first thermal conductive surface and second thermal conductive surface are continuous along the length direction of substrate, when two adjacent floors are mutually locked connection, first thermal conductive surface, the surface of the surface of second thermal conductive surface and first syndeton and second syndeton is formed for the containing cavity of ccontaining heater jointly.Wherein, first syndeton and second syndeton can adopt as inferior mode: first syndeton is a link slot and the second syndeton joint tongue also can also comprise link slot and joint tongue for first syndeton comprises link slot and joint tongue second syndeton.As required, first syndeton and second syndeton can also all adopt link slot, and two both intermediate members by the band joint tongue connect; First syndeton and second syndeton also can all adopt joint tongue, adopt the intermediate member of band link slot to connect again.The both sides of heat-conducting medium layer of the present invention form first thermal conductive surface and second thermal conductive surface on first syndeton surface and second syndeton surface respectively, and first thermal conductive surface and second thermal conductive surface are all continuous along the length direction of substrate, when two adjacent floors are mutually locked connection, heater is arranged in the containing cavity, heater contacts with second thermal conductive surface with adjacent first thermal conductive surface simultaneously, thereby increased the contact area of heater and heat-conducting medium layer greatly, strengthened the conduction of heat between heater and the heat-conducting medium layer, thereby can make floor surface by Fast Heating; In addition, heat-conducting medium layer of the present invention is layer structure, and the decoration dash board is all contacted with the heat-conducting medium layer everywhere, can guarantee to decorate dash board and evenly be heated everywhere.
As preferably, described first syndeton is a link slot, described second syndeton is a joint tongue, the lateral depth of link slot is greater than the lateral length of joint tongue, inboard at link slot forms groove, the link slot on two adjacent floors can be mutually locked with joint tongue and be connected, described first thermal conductive surface and flute surfaces link up, described second thermal conductive surface and joint tongue surface link up, when two adjacent floors were mutually locked connection, the surface of first thermal conductive surface, second thermal conductive surface and groove and the surface of joint tongue were formed for the containing cavity of ccontaining heater jointly.The both sides of heat-conducting medium layer of the present invention form first thermal conductive surface and second thermal conductive surface in flute surfaces and joint tongue surface respectively, and first thermal conductive surface and second thermal conductive surface are all continuous along the length direction of substrate, when two adjacent floors are mutually locked connection, heater is arranged in the containing cavity, heater contacts with second thermal conductive surface with adjacent first thermal conductive surface simultaneously, thereby increased the contact area of heater and heat-conducting medium layer greatly, strengthened the conduction of heat between heater and the heat-conducting medium layer, thereby can make floor surface by Fast Heating; In addition, heat-conducting medium layer of the present invention is layer structure, and the decoration dash board is all contacted with the heat-conducting medium layer everywhere, can guarantee to decorate dash board and evenly be heated everywhere.
As preferably, the position of described heat-conducting medium layer between first thermal conductive surface and second thermal conductive surface forms the thin layer portion of thickness less than heat-conducting medium layer thickness of two sides, the both sides of heat-conducting medium layer then form first thickening part and second thickening part respectively, described first thermal conductive surface is positioned on first thickening part, and described second thermal conductive surface is positioned on second thickening part.Wherein, between first thermal conductive surface and second thermal conductive surface, form thin layer portion and can reduce heat gathering on the heat-conducting medium layer, heat can be delivered to fast decorate on the dash board, thin layer portion also can significantly reduce the material of using of heat-conducting medium layer on the other hand, especially when the heat-conducting medium layer adopts aluminium alloys to make, can reduce the manufacturing cost of heat-conducting medium layer greatly; But first thickening part and second thickening part be the heat transmission between reinforced heat conduction dielectric layer and the heater then.
As preferably, the thickness of described thin layer portion is 1/10 to 1/3 of the first thickening part thickness.
As preferably, on the described first thermal conductive surface short transverse and the second thermal conductive surface short transverse on all curved, described first thermal conductive surface flushes with flute surfaces, described second thermal conductive surface and joint tongue flush, thereby first thermal conductive surface can closely be contacted with heater with second thermal conductive surface, guarantee the good thermal conductivity between heater and the heat-conducting medium layer.
As preferably, described heat-conducting medium layer is provided with some through holes, is beneficial to viscose and sees through through hole, thereby strengthen decorating the reliability of fixation that bonds between dash board, heat-conducting medium layer and the substrate.
As preferably, described channel bottom is formed with the insulation part of cross section indentation structure, the insulation part of laciniation can reduce the contact area between heater and the channel bottom, thereby reduce heater in containing cavity with the conduction of heat of channel bottom, the heat of heater is conducted to the heat-conducting medium layer as much as possible, reduce heat waste, improve the heat energy utilization rate of heater.
As preferably, described channel bottom pad is provided with the heat insulation that some intervals are provided with, direct contact between heat insulation heater capable of blocking and the channel bottom, thereby reduce heater in containing cavity with the conduction of heat of channel bottom, the heat of heater is conducted to the heat-conducting medium layer as much as possible, reduce heat waste, improve the heat energy utilization rate of heater.
As preferably, described heat-conducting medium layer is formed with convex clip corresponding to the second thermal conductive surface upside, the soffit of described decoration dash board is formed with draw-in groove, convex clip and draw-in groove block mutually and join when adjacent floor is mutually locked, thereby can further strengthen the sealed connection between the adjacent floor, can guarantee also that on the other hand plate junction, adjacent two places can evenly be heated.
As preferably, be formed with the longitudinal hole of some horizontal longitudinal extensions on the described joint tongue, thereby the heat that can reduce corresponding to the heat-conducting medium layer at joint tongue place conducts downwards, make the heat of second thermal conductive surface can be passed to other position of heat-conducting medium layer smoothly, improved and decorated dash board homogeneous heating degree everywhere.
As preferably, the end downside of described joint tongue is formed with lozenges, when cooperating with link slot, joint tongue forms the V-arrangement heat-insulation chamber between described lozenges and the link slot surface, thereby having blocked heater contacts with link slot soffit and the direct of joint tongue soffit, heater is mainly contacted, with most of heat transferred heat-conducting medium layer with second thermal conductive surface with first thermal conductive surface.
Therefore, it is very fast that the present invention has the floor firing rate, and floor surface is characteristics such as homogeneous heating everywhere.
Description of drawings
Fig. 1 is a kind of structural representation of first embodiment of the invention;
Fig. 2 is a kind of structural representation that first embodiment of the invention two adjacent floors are mutually locked;
Fig. 3 is a kind of structural representation of second embodiment of the invention;
Fig. 4 is a kind of structural representation of second, third embodiment heat-conducting medium layer of the present invention;
Fig. 5 is a kind of structural representation that second embodiment of the invention two adjacent floors are mutually locked;
Fig. 6 is a kind of structural representation of third embodiment of the invention;
Fig. 7 is a kind of structural representation that third embodiment of the invention two adjacent floors are mutually locked.
The specific embodiment
Below by embodiment, and in conjunction with the accompanying drawings, technical scheme of the present invention is described in further detail.
Embodiment 1: as shown in Figure 1, comprise the decoration dash board 2 on substrate 1 and the substrate 1, one side of substrate 1 is provided with link slot 3, the opposite side of substrate 1 is provided with joint tongue 4, the lateral depth of link slot 3 is greater than the lateral length of joint tongue 4, inboard at link slot 3 forms groove 5, the link slot 3 on two adjacent floors can be mutually locked with joint tongue 4 and be connected, be provided with heat-conducting medium layer 6 between substrate 1 and the decoration dash board 2, first thermal conductive surface 7 that heat-conducting medium layer 6 one side extend to groove 5 surfaces and link up and flush in formation one of the surface of groove 5 and flute surfaces, heat-conducting medium layer 6 opposite side extend to the surface of joint tongue 4 and second thermal conductive surface 8 that links up and flush on joint tongue 4 surface formation one and joint tongue surface, and the end downside of joint tongue 4 is formed with lozenges 11.First thermal conductive surface 7 and second thermal conductive surface 8 are continuous along the length direction of substrate, on first thermal conductive surface, 7 short transverses and second thermal conductive surface, 8 short transverses on all curved.As shown in Figure 2, when two adjacent floors are mutually locked connection, the surface of first thermal conductive surface 7, second thermal conductive surface 8 and groove 5 and the surface of joint tongue 4 are formed for the containing cavity 10 of ccontaining heater 9 jointly, form V-arrangement heat-insulation chamber 12 between lozenges 11 and the link slot surface.
Embodiment 2: as shown in Figure 3, comprise the decoration dash board 2 on substrate 1 and the substrate 1, one side of substrate 1 is provided with link slot 3, the opposite side of substrate 1 is provided with joint tongue 4, the lateral depth of link slot 3 is greater than the lateral length of joint tongue 4, inboard at link slot 3 forms groove 5, the link slot 3 on two adjacent floors can be mutually locked with joint tongue 4 and be connected, be provided with heat-conducting medium layer 6 between substrate 1 and the decoration dash board 2, first thermal conductive surface 7 that heat-conducting medium layer 6 one side extend to groove 5 surfaces and link up and flush in formation one of the surface of groove 5 and flute surfaces, heat-conducting medium layer 6 opposite side extend to the surface of joint tongue 4 and second thermal conductive surface 8 that links up and flush on joint tongue 4 surface formation one and joint tongue surface, the end downside of joint tongue 4 is formed with lozenges 11, is formed with the longitudinal hole 19 of a plurality of horizontal longitudinal extensions on the joint tongue 4.The heat-conducting medium layer is formed with convex clip 17 corresponding to second thermal conductive surface, 8 upsides, and the soffit of decorating dash board 2 is formed with draw-in groove 18, and convex clip 17 and draw-in groove 18 mutual cards are joined when adjacent floor is mutually locked.First thermal conductive surface 7 and second thermal conductive surface 8 are continuous along the length direction of substrate, on first thermal conductive surface, 7 short transverses and second thermal conductive surface, 8 short transverses on all curved.As shown in Figure 4, the position of heat-conducting medium layer between first thermal conductive surface 7 and second thermal conductive surface 8 forms the thin layer portion 13 of thickness less than heat-conducting medium layer thickness of two sides, the both sides of heat-conducting medium layer then form first thickening part 14 and second thickening part 15 respectively, first thermal conductive surface 7 is positioned on first thickening part 14, and second thermal conductive surface 8 is positioned on second thickening part 15.The thickness of thin layer portion 13 is 1/7 of the first thickening part thickness.The thin layer portion of heat-conducting medium layer is provided with a plurality of through holes 16.
As shown in Figure 5, when two adjacent floors are mutually locked connection, the surface of first thermal conductive surface 7, second thermal conductive surface 8 and groove 5 and the surface of joint tongue 4 are formed for the containing cavity 10 of ccontaining heater 9 jointly, form V-arrangement heat-insulation chamber 12 between lozenges 11 and the link slot surface, the bottom pad of groove 5 is provided with the heat insulation 20 that a plurality of intervals are provided with.Heater is only directly contacted with second thermal conductive surface 8 with first thermal conductive surface 7 of heat-conducting medium layer, thereby make the heat of heater directly be passed to the heat-conducting medium layer to greatest extent, further again heating decorative dash board.
Embodiment 3: as shown in Figure 6, comprise the decoration dash board 2 on substrate 1 and the substrate 1, one side of substrate 1 is provided with link slot 3, the opposite side of substrate 1 is provided with joint tongue 4, the lateral depth of link slot 3 is greater than the lateral length of joint tongue 4, inboard at link slot 3 forms groove 5, and the bottom of groove 5 is formed with the insulation part 22 of cross section indentation structure.The link slot 3 on two adjacent floors can be mutually locked with joint tongue 4 and be connected, be provided with heat-conducting medium layer 6 between substrate 1 and the decoration dash board 2, first thermal conductive surface 7 that heat-conducting medium layer 6 one side extend to groove 5 surfaces and link up and flush in formation one of the surface of groove 5 and flute surfaces, heat-conducting medium layer 6 opposite side extend to the surface of joint tongue 4 and form on joint tongue 4 surface one with the joint tongue surface coherent and flush second thermal conductive surface 8, the end downside of joint tongue 4 is formed with lozenges 11, is formed with the longitudinal hole 19 of a plurality of horizontal longitudinal extensions on the joint tongue 4.The heat-conducting medium layer is formed with convex clip 17 corresponding to second thermal conductive surface, 8 upsides, and the soffit of decorating dash board 2 is formed with draw-in groove 18, and convex clip 17 and draw-in groove 18 mutual cards are joined when adjacent floor is mutually locked.First thermal conductive surface 7 and second thermal conductive surface 8 are continuous along the length direction of substrate, on first thermal conductive surface, 7 short transverses and second thermal conductive surface, 8 short transverses on all curved.As shown in Figure 4, the position of heat-conducting medium layer between first thermal conductive surface 7 and second thermal conductive surface 8 forms the thin layer portion 13 of thickness less than heat-conducting medium layer thickness of two sides, the both sides of heat-conducting medium layer then form first thickening part 14 and second thickening part 15 respectively, first thermal conductive surface 7 is positioned on first thickening part 14, and second thermal conductive surface 8 is positioned on second thickening part 15.The thickness of thin layer portion 13 is 1/7 of the first thickening part thickness.The thin layer portion of heat-conducting medium layer is provided with a plurality of through holes 16.
As shown in Figure 7, when two adjacent floors are mutually locked connection, the surface of first thermal conductive surface 7, second thermal conductive surface 8 and groove 5 and the surface of joint tongue 4 are formed for the containing cavity 10 of ccontaining heater 9 jointly, form V-arrangement heat-insulation chamber 12 between lozenges 11 and the link slot surface, the bottom pad of groove 5 is provided with the insulation part 22 that a plurality of intervals are provided with.Heater is only directly contacted with second thermal conductive surface 8 with first thermal conductive surface 7 of heat-conducting medium layer, thereby make the heat of heater directly be passed to the heat-conducting medium layer to greatest extent, further again heating decorative dash board.
Claims (10)
1. the internal heat-conducting heating floor of a reinforced heat conduction, comprise the decoration dash board on substrate and the substrate, it is characterized in that: a side of described substrate is provided with first syndeton, the opposite side of substrate is provided with second syndeton, first syndeton on two adjacent floors can be mutually locked with second syndeton and be connected, be provided with the heat-conducting medium layer between described substrate and the decoration dash board, described heat-conducting medium layer one side extends to first syndeton surface and forms first thermal conductive surface that one and first syndeton surface links up on first syndeton surface, heat-conducting medium layer opposite side extends to the surface of second syndeton and forms second thermal conductive surface that one and second syndeton surface links up on second syndeton surface, described first thermal conductive surface and second thermal conductive surface are continuous along the length direction of substrate, when two adjacent floors are mutually locked connection, first thermal conductive surface, the surface of the surface of second thermal conductive surface and first syndeton and second syndeton is formed for the containing cavity of ccontaining heater jointly.
2. the internal heat-conducting heating floor of reinforced heat conduction according to claim 1, it is characterized in that described first syndeton is a link slot, described second syndeton is a joint tongue, the lateral depth of link slot is greater than the lateral length of joint tongue, inboard at link slot forms groove, the link slot on two adjacent floors can be mutually locked with joint tongue and be connected, described first thermal conductive surface and flute surfaces link up, described second thermal conductive surface and joint tongue surface link up, when two adjacent floors are mutually locked connection, first thermal conductive surface, the surface of second thermal conductive surface and groove and the surface of joint tongue are formed for the containing cavity of ccontaining heater jointly.
3. the internal heat-conducting heating floor of reinforced heat conduction according to claim 1 and 2, it is characterized in that the position of described heat-conducting medium layer between first thermal conductive surface and second thermal conductive surface forms the thin layer portion of thickness less than heat-conducting medium layer thickness of two sides, the both sides of heat-conducting medium layer then form first thickening part and second thickening part respectively, described first thermal conductive surface is positioned on first thickening part, and described second thermal conductive surface is positioned on second thickening part.
4. the internal heat-conducting heating floor of reinforced heat conduction according to claim 3 is characterized in that the thickness of described thin layer portion is 1/10 to 1/3 of the first thickening part thickness.
5. the internal heat-conducting heating floor of reinforced heat conduction according to claim 1 and 2, it is characterized in that on the described first thermal conductive surface short transverse and the second thermal conductive surface short transverse on all curved, described first thermal conductive surface and the first syndeton flush, described second thermal conductive surface and the second syndeton flush.
6. the internal heat-conducting heating floor of reinforced heat conduction according to claim 1 and 2 is characterized in that described heat-conducting medium layer is provided with some through holes.
7. the internal heat-conducting heating floor of reinforced heat conduction according to claim 2 is characterized in that described channel bottom is formed with the insulation part of cross section indentation structure or the heat insulation that pad is provided with the setting of some intervals.
8. the internal heat-conducting heating floor of reinforced heat conduction according to claim 1 and 2, it is characterized in that described heat-conducting medium layer is formed with convex clip corresponding to the second thermal conductive surface upside, the soffit of described decoration dash board is formed with draw-in groove, and convex clip and draw-in groove block mutually and join when adjacent floor is mutually locked.
9. the internal heat-conducting heating floor of reinforced heat conduction according to claim 2 is characterized in that being formed with on the described joint tongue longitudinal hole of some horizontal longitudinal extensions.
10. the internal heat-conducting heating floor of reinforced heat conduction according to claim 2 is characterized in that the end downside of described joint tongue is formed with lozenges, forms the V-arrangement heat-insulation chamber when joint tongue cooperates with link slot between described lozenges and the link slot surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110091391 CN102191848B (en) | 2011-04-11 | 2011-04-11 | Internal heat conduction type geothermal floor with intensified heat conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110091391 CN102191848B (en) | 2011-04-11 | 2011-04-11 | Internal heat conduction type geothermal floor with intensified heat conduction |
Publications (2)
| Publication Number | Publication Date |
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| CN102191848A true CN102191848A (en) | 2011-09-21 |
| CN102191848B CN102191848B (en) | 2013-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110091391 Expired - Fee Related CN102191848B (en) | 2011-04-11 | 2011-04-11 | Internal heat conduction type geothermal floor with intensified heat conduction |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103673046A (en) * | 2013-11-09 | 2014-03-26 | 高月芳 | Heating solid wood floor |
| CN106765756A (en) * | 2016-12-15 | 2017-05-31 | 重庆元云联科技有限公司 | A kind of changes in temperature wood flooring systems |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004250892A (en) * | 2003-02-18 | 2004-09-09 | Matsushita Electric Works Ltd | Floor material for heating |
| CN101457580A (en) * | 2008-11-19 | 2009-06-17 | 上海溢邦装饰建材有限公司 | Direct heat conducting type solid wood keel ground heating floor |
| CN101509311A (en) * | 2009-01-06 | 2009-08-19 | 上海溢邦装饰建材有限公司 | Internal heat conducting structure floor |
| CN101858134A (en) * | 2010-06-10 | 2010-10-13 | 李增清 | Composite veneer |
| CN202064595U (en) * | 2011-04-11 | 2011-12-07 | 李渊 | Internal heat-conducting type floor heating board with reinforced heat conduction function |
-
2011
- 2011-04-11 CN CN 201110091391 patent/CN102191848B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004250892A (en) * | 2003-02-18 | 2004-09-09 | Matsushita Electric Works Ltd | Floor material for heating |
| CN101457580A (en) * | 2008-11-19 | 2009-06-17 | 上海溢邦装饰建材有限公司 | Direct heat conducting type solid wood keel ground heating floor |
| CN101509311A (en) * | 2009-01-06 | 2009-08-19 | 上海溢邦装饰建材有限公司 | Internal heat conducting structure floor |
| CN101858134A (en) * | 2010-06-10 | 2010-10-13 | 李增清 | Composite veneer |
| CN202064595U (en) * | 2011-04-11 | 2011-12-07 | 李渊 | Internal heat-conducting type floor heating board with reinforced heat conduction function |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103673046A (en) * | 2013-11-09 | 2014-03-26 | 高月芳 | Heating solid wood floor |
| CN106765756A (en) * | 2016-12-15 | 2017-05-31 | 重庆元云联科技有限公司 | A kind of changes in temperature wood flooring systems |
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| Publication number | Publication date |
|---|---|
| CN102191848B (en) | 2013-01-09 |
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