CN202885081U - Dry-type mat formation heated floor - Google Patents
Dry-type mat formation heated floor Download PDFInfo
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- CN202885081U CN202885081U CN 201220503156 CN201220503156U CN202885081U CN 202885081 U CN202885081 U CN 202885081U CN 201220503156 CN201220503156 CN 201220503156 CN 201220503156 U CN201220503156 U CN 201220503156U CN 202885081 U CN202885081 U CN 202885081U
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- accommodating cavity
- conducting medium
- floor
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Abstract
The utility model relates to a dry-type mat formation heated floor, and belongs to the technical field of building and ornament materials. The dry-type mat formation heated floor comprises a floor body (1), and is characterized in that the floor body (1) comprises a base plate (2) and a heat-conducting medium layer (3) compounded on the lower surface of the base plate. A first connecting structure (21) and a second connecting structure (22) are respectively arranged on two sides of the base plate (2), wherein the first connecting structure (21) and the second connecting structure (22) can be connected with adjacent floor bodies. A heating element containing cavity (31) protruding upwards and a plurality of heat conduction protruding strips (32) are arranged on the heat-conducting medium layer (3), wherein the heat element containing cavity (31) is used for containing a heating element (4), and the plurality of heat conduction protruding strips (32) are used for increasing heat-conducting property. A first groove (23) and second grooves (24) are formed in the lower surface of the base plate (2), wherein the first groove (23) is matched with and closely attached to the outer wall of the heat element containing cavity (31), and the second grooves (24) are matched with and closely attached to the outer walls of the heat conduction protruding strips (32).
Description
Technical field
The utility model relates to a kind of dry type paved geothermal floor, belongs to the technical field of building and ornament materials.
Background technology
In the prior art, the heat-conducting medium of heating floor or heater element all divide with the floor and are arranged, or lay on the ground or be installed in the inside such as other members between ground and the floor such as base plate.For example, Chinese patent literature discloses a kind of composite floor for heating [application number: CN200510040599.2], solution be that existing heating floor thermal conductivity factor is low, distortion is large, the easy problem of be full of cracks in surface.It comprises dash board, inferior dash board, central layer, base plate, is provided with horizontal thermal trough in the central layer, and vertical thermal trough is set in the base plate, and laterally mutually vertical and perforation of thermal trough and vertical thermal trough laterally is filled with heat-conducting medium in thermal trough and the vertical thermal trough.In the technique scheme, heat-conducting medium needs first with heat transferred base plate and central layer, then passes to time dash board and dash board by base plate and central layer again, its heat conduction path is long, heat conduction efficiency is lower, and the manufacturing process more complicated, and heat is difficult to be passed to rapidly floor surface.
Summary of the invention
The utility model purpose is to provide a kind of floor surface to be heated evenly everywhere, heat conduction path is shorter, the thermal efficiency is higher, the less dry type paved geothermal floor of whole pavement thickness, solved floor surface that prior art the exists inequality of being heated everywhere, the problems such as heat conduction path is longer, and the thermal efficiency is lower.
Above-mentioned technical purpose of the present utility model mainly solves by the following technical programs: comprise floor body, it is characterized in that: described floor body comprises substrate and is compounded in the heat-conducting medium layer of base lower surface, the both sides of substrate are respectively equipped with syndeton one and the syndeton two that can be connected with adjacent floor body, described heat-conducting medium layer is formed with that being used for of raising up arranges the heater accommodating cavity of heater and for increasing some heat conduction raised lines of heat conductivility, described base lower surface is formed with described heater accommodating cavity outer wall and matches and the first groove that fits tightly and the second groove that matches and fit tightly with described heat conduction raised line outer wall.Because increase the design of some heat conduction raised lines, it is more quick to conduct heat, and has greatly shortened the heat pipeline, so that heat gos deep in the middle of the floor very soon, until floor surface is realized quick heating.Usually, the heat conduction raised line is by spaced set.The heat-conducting medium layer can whole covered substrate lower surface, also can reserve in the substrate both sides part and be uncovered.
As preferably, described heat-conducting medium layer is the integral type structure, and described heater accommodating cavity downside has opening, described heater accommodating cavity opening down.
As preferably, the cross section of described heater accommodating cavity is the C type.Such design increases the contact area with heater simultaneously so that opening less than the diameter of heater accommodating cavity, is convenient to self can be fixed on the inside after heater pushes into.
As preferably, described heat-conducting medium layer is put together by the first plates and second plates of split setting, and described heater accommodating cavity is encircled into by the arc side of the first plates and the arc side of the second plates.
As preferably, described heat-conducting medium layer is formed with at least one along the heater accommodating cavity of substrate longitudinal extension, and heater is arranged in the heater accommodating cavity, and described heater is heating cable.
As preferably, described floor body lower surface printing or be pasted with decorative layer and the opening of heater accommodating cavity exposes.
As preferably, described floor body lower surface is provided with the opening of decorating balance layer or muting pad and heater accommodating cavity and exposes.
As preferably, described heat-conducting medium layer is aluminium alloy extrusions.Such design so that extrusion bar of heat-conducting medium layer greatly reduces manufacturing cost and difficulty, has improved precision.
As preferably, be provided with thermal insulation layer below the described floor body, described thermal insulation layer is warming plate or keel strip.
Therefore, the utlity model has floor surface and be heated evenly everywhere, the characteristics such as heat conduction path is shorter, and the thermal efficiency is higher, and whole pavement thickness is less.
Description of drawings
Fig. 1 is a kind of structural representation of the utility model embodiment 1;
Fig. 2 is a kind of structural representation of the utility model embodiment 1 substrate;
Fig. 3 is a kind of perspective view of the utility model embodiment 1 heat-conducting medium layer;
Fig. 4 is a kind of structural representation of the utility model embodiment 2;
Fig. 5 is a kind of structural representations of the utility model embodiment 2 substrates;
Fig. 6 is a kind of perspective view of the utility model embodiment 2 heat-conducting medium layers;
Fig. 7 is a kind of structural section schematic diagram of the utility model embodiment 3 heat-conducting medium layers;
Fig. 8 is a kind of structural section schematic diagram of the utility model embodiment 4 heat-conducting medium layers.
Among the figure, floor body 1, substrate 2, heat-conducting medium layer 3, heating member 4, thermal insulation layer 6, decoration balance layer or muting pad 5, syndeton 1, syndeton 2 22, heating member accommodating cavity 13, arc side 311, arc side 312, heat conduction raised line 32, the first groove 23, the second groove 24, the first plates 301, the second plates 302
The specific embodiment is as follows:
The specific embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment 1: such as Fig. 1 and Fig. 2 and shown in Figure 3, floor body 1 comprises substrate 2 and is compounded in the heat-conducting medium layer 3 of base lower surface, the both sides of substrate 2 are respectively equipped with syndeton 1 and the syndeton 2 22 that can be connected with adjacent floor body, heat-conducting medium layer 3 is formed with that being used for of raising up arranges the heater accommodating cavity 31 of heater 4 and for increasing six heat conduction raised lines 32 of heat conductivility, substrate 2 lower surfaces are formed with heater accommodating cavity 31 outer walls and match and the first groove 23 that fits tightly and the second groove 24 that matches and fit tightly with heat conduction raised line 32 outer walls.Heat-conducting medium layer 3 is aluminium alloy extrusions, the lower surface of the whole covered substrate of heat-conducting medium layer.Heater accommodating cavity 31 downsides have opening 33, the opening 33 of heater accommodating cavity down and the cross section of heater accommodating cavity 31 be the C type.Heat-conducting medium layer 3 forms the heater accommodating cavity 31 along the substrate longitudinal extension, and heater 4 is arranged in the heater accommodating cavity 31, and heater 4 cross sections are circular heating cable.The opening 33 that floor body 1 lower surface is printed with decorative layer 5 and heater accommodating cavity 31 exposes.Floor body 1 below is provided with thermal insulation layer 6, and the thermal insulation layer 6 of present embodiment is the XPS warming plate.
Embodiment 2: such as Fig. 4 and Fig. 5 and shown in Figure 6, floor body 1 comprises substrate 2 and is compounded in the heat-conducting medium layer 3 of base lower surface, the both sides of substrate 2 are respectively equipped with syndeton 1 and the syndeton 2 22 that can be connected with adjacent floor body, heat-conducting medium layer 3 is formed with that being used for of raising up arranges the heater accommodating cavity 31 of heater 4 and for increasing six heat conduction raised lines 32 of heat conductivility, substrate 2 lower surfaces are formed with heater accommodating cavity 31 outer walls and match and the first groove 23 that fits tightly and the second groove 24 that matches and fit tightly with heat conduction raised line 32 outer walls.Heat-conducting medium layer 3 is aluminium alloy extrusions, the lower surface of the most of covered substrate of heat-conducting medium layer and and base lower surface flush.Heater accommodating cavity 31 downsides have opening 33, the opening 33 of heater accommodating cavity down and the cross section of heater accommodating cavity 31 be the C type.Heat-conducting medium layer 3 forms the heater accommodating cavity 31 along the substrate longitudinal extension, and heater 4 is arranged in the heater accommodating cavity 31, and heater 4 cross sections are circular heating cable.The opening 33 that floor body 1 lower surface is adhesive with decorative layer 5 and heater accommodating cavity 31 exposes.The decorative layer 5 of present embodiment is for having the muting pad of heat insulating function, and floor body 1 below is provided with thermal insulation layer 6, and the thermal insulation layer 6 of present embodiment is conventional keel strip.
Embodiment 3: shown in Fig. 7 or 8, heat-conducting medium layer 3 is put together by the first plates 301 and second plates 302 of split setting, and described heater accommodating cavity 31 is encircled into by the arc side 311 of the first plates and the arc side of the second plates 312.All the other and embodiment 1 or embodiment 2 roughly the same do not do at this and to give unnecessary details.
Specific embodiment described herein only is to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although this paper has more used the terms such as floor body 1, substrate 2, heat-conducting medium layer 3, heating member 4, thermal insulation layer 6, decoration balance layer or muting pad 5, syndeton 1, syndeton 2 22, heating member accommodating cavity 13, arc side 311, arc side 312, heat conduction raised line 32, the first groove 23, the second groove 24, the first plates 301, the second plates 302, do not get rid of the possibility of using other term.Using these terms only is in order to describe more easily and explain essence of the present utility model; They are construed to any additional restriction all is contrary with the utility model spirit.
Claims (9)
1. dry type paved geothermal floor, comprise floor body (1), it is characterized in that: described floor body (1) comprises substrate (2) and is compounded in the heat-conducting medium layer (3) of base lower surface, the both sides of substrate (2) are respectively equipped with syndeton one (21) and the syndeton two (22) that can be connected with adjacent floor body, described heat-conducting medium layer (3) is formed with that being used for of raising up arranges the heater accommodating cavity (31) of heater (4) and for increasing some heat conduction raised lines (32) of heat conductivility, described substrate (2) lower surface is formed with described heater accommodating cavity (31) outer wall and matches and the first groove (23) that fits tightly and the second groove (24) that matches and fit tightly with described heat conduction raised line (32) outer wall.
2. dry type paved geothermal floor according to claim 1, it is characterized in that described heat-conducting medium layer (3) is the integral type structure, described heater accommodating cavity (31) downside has opening (33), and the opening of described heater accommodating cavity (33) down.
3. dry type paved geothermal floor according to claim 2 is characterized in that the cross section of described heater accommodating cavity (31) is the C type.
4. dry type paved geothermal floor according to claim 1, it is characterized in that described heat-conducting medium layer (3) is put together by the first plates (301) and the second plates (302) that split arranges, described heater accommodating cavity (31) is encircled into by the arc side (311) of the first plates (301) and the arc side (312) of the second plates (302).
5. dry type paved geothermal floor according to claim 1 and 2, it is characterized in that described heat-conducting medium layer (3) is formed with at least one along the heater accommodating cavity (31) of substrate longitudinal extension, heater (4) is arranged in the heater accommodating cavity (31), and described heater (4) is heating cable.
6. according to claim 1 and 2 or 4 described dry type paved geothermal floors, it is characterized in that the opening (33) that described floor body (1) lower surface is pasted with decorative layer (5) and heater accommodating cavity (31) exposes.
7. according to claim 1 and 2 or 4 described dry type paved geothermal floors, it is characterized in that described floor body (1) lower surface is provided with the opening (33) of decorating balance layer or muting pad (5) and heater accommodating cavity (31) and exposes.
8. according to claim 1 and 2 or 4 described dry type paved geothermal floors, it is characterized in that described heat-conducting medium layer (3) is aluminium alloy extrusions.
9. according to claim 1 and 2 or 4 described dry type paved geothermal floors, it is characterized in that described floor body (1) below is provided with thermal insulation layer (6), described thermal insulation layer (6) is warming plate or keel strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220503156 CN202885081U (en) | 2012-09-24 | 2012-09-24 | Dry-type mat formation heated floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220503156 CN202885081U (en) | 2012-09-24 | 2012-09-24 | Dry-type mat formation heated floor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202885081U true CN202885081U (en) | 2013-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220503156 Expired - Fee Related CN202885081U (en) | 2012-09-24 | 2012-09-24 | Dry-type mat formation heated floor |
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| Country | Link |
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| CN (1) | CN202885081U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014201908A1 (en) * | 2013-06-17 | 2014-12-24 | 无锡市寿德木业有限公司 | Energy-saving ground heating floor |
| CN106885291A (en) * | 2017-04-28 | 2017-06-23 | 四川翊森热能科技有限责任公司 | A kind of heat transfer efficiency lamination layer structure high |
| CN106978893A (en) * | 2017-04-18 | 2017-07-25 | 浙江长兴博塔建材有限公司 | A kind of composite floor brick |
| CN116717833A (en) * | 2023-05-17 | 2023-09-08 | 深圳万用房屋智造科技有限公司 | Geothermal ceramic tile and preparation method thereof |
-
2012
- 2012-09-24 CN CN 201220503156 patent/CN202885081U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014201908A1 (en) * | 2013-06-17 | 2014-12-24 | 无锡市寿德木业有限公司 | Energy-saving ground heating floor |
| CN106978893A (en) * | 2017-04-18 | 2017-07-25 | 浙江长兴博塔建材有限公司 | A kind of composite floor brick |
| CN106885291A (en) * | 2017-04-28 | 2017-06-23 | 四川翊森热能科技有限责任公司 | A kind of heat transfer efficiency lamination layer structure high |
| CN116717833A (en) * | 2023-05-17 | 2023-09-08 | 深圳万用房屋智造科技有限公司 | Geothermal ceramic tile and preparation method thereof |
| CN116717833B (en) * | 2023-05-17 | 2024-05-31 | 深圳万用房屋智造科技有限公司 | Geothermal ceramic tile and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI WARM UNIVERSE ENVIRONMENTAL TECHNOLOGY CO Free format text: FORMER OWNER: LI YUAN Effective date: 20141218 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 310012 HANGZHOU, ZHEJIANG PROVINCE TO: 201100 JINSHAN, SHANGHAI |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141218 Address after: Jin Zhang Road Jinshan District 201100 Shanghai Zhangyan town No. 248 Building 5 room B1008 Patentee after: Shanghai Nuan Yu environmental science and technology Co., Ltd Address before: 401 room 3, unit 2, two village 310012, Wen two road, Wen Wen Road, Zhejiang, Hangzhou Patentee before: Li Yuan |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160503 Address after: 202155, Shanghai County, Chongming Town Construction Road No. 4, building 379, room 2028 (Shanghai construction economic district) Patentee after: Shanghai warm environment Technology Co., Ltd. Address before: Jin Zhang Road Jinshan District 201100 Shanghai Zhangyan town No. 248 Building 5 room B1008 Patentee before: Shanghai Nuan Yu environmental science and technology Co., Ltd |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130417 Termination date: 20170924 |