CN201043343Y - Multi-layer plate heat-conduction enhanced ground-heating floor substrate - Google Patents
Multi-layer plate heat-conduction enhanced ground-heating floor substrate Download PDFInfo
- Publication number
- CN201043343Y CN201043343Y CNU2007201163213U CN200720116321U CN201043343Y CN 201043343 Y CN201043343 Y CN 201043343Y CN U2007201163213 U CNU2007201163213 U CN U2007201163213U CN 200720116321 U CN200720116321 U CN 200720116321U CN 201043343 Y CN201043343 Y CN 201043343Y
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- CN
- China
- Prior art keywords
- utility
- model
- heating floor
- base material
- backing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a multilayer board conductive enhancement mode heating floor backing, and relates to a heating floor backing. The utility model solves the problem that wood floor decorative material is poorly conductive and conducts heat slowly. The backing (1) provided by the utility model consists of a plurality of veneer layers (2) which are superposed and cemented in length and breadth. A plurality of lengthways holes (3) are uniformly provided on the backing (1). The utility model is in simple structure; the cost is low; the conduction efficiency of the utility model is high, and the utility model is maintained conveniently. The upper superficial layer and the bottom layer of the floor backing can be selected by users as required; and the upper superficial layer adopts rare thin wood plate in handsome color, and is compounded to produce floors.
Description
Technical field
The utility model relates to the wood geothermal floor base material.
Technical background
Adopt the wooden ground exterior material of geothermal heating mode,,, adopt this Design Conception of heat conduction enhancement mode heating floor base material to solve the bad problem of wood materials heat conduction in order to strengthen the heat-conducting effect of wood composite floor heating floorboard because wood materials has poor thermal conductivity.
The utility model content
The utility model is when solving geothermal heating, and wood floors poor thermal conductivity, the slow problem of conduction heat provide a kind of composite board heat conduction enhancement mode heating floor base material, address the above problem, and its concrete technical scheme is as follows:
The utility model comprises base material 1, and base material 1 is superposeed in length and breadth to glue together by multilayer veneer 2 and constitutes, and evenly has several vertical holes 3 on base material 1.
The utility model adopts composite board to make heat conduction enhancement mode heating floor base material, improved the heating floor heat-conducting effect, its architectural feature can design and leave the column type circular hole that diverse location, different aperture size and one-sided bottom surface keep one deck veneer according to the differently specification and the heat-conducting effect requirement of heating floor.The utlity model has simple in structure, cost is low, heat transfer efficiency is high and easy to maintenance.
Description of drawings
Fig. 1 is a structural representation of the present utility model, and Fig. 2 is the A-A sectional view of Fig. 1.
The specific embodiment
The specific embodiment one: describe present embodiment in conjunction with Fig. 1, Fig. 2, present embodiment is made up of base material 1, and base material 1 is superposeed in length and breadth by multilayer veneer 2 and bondingly constitutes, and evenly has several vertical circular holes 3 on the base material 1.
The specific embodiment two: the difference of the present embodiment and the specific embodiment one is that it also includes heat carrier (5), and heat carrier (5) places in vertical hole (3).
The upper epidermis of floor base material, bottom can be selected voluntarily according to user's needs, and upper epidermis selects for use color and luster wooden or composite floor board attractive in appearance all can; Bottom can adopt barrier material.
Claims (3)
1. composite board heat conduction enhancement mode heating floor base material, it comprises base material (1), it is characterized in that base material (1) by multilayer veneer (2) the bonding formation that superposes in length and breadth, evenly has several vertical holes (3) on the base material (1).
2. composite board heat conduction enhancement mode heating floor base material according to claim 1 is characterized in that it also includes heat carrier (5), and heat carrier (5) places in vertical hole (3).
3. composite board heat conduction enhancement mode heating floor base material according to claim 1 is characterized in that vertical hole (3) is circular hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201163213U CN201043343Y (en) | 2007-06-01 | 2007-06-01 | Multi-layer plate heat-conduction enhanced ground-heating floor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201163213U CN201043343Y (en) | 2007-06-01 | 2007-06-01 | Multi-layer plate heat-conduction enhanced ground-heating floor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201043343Y true CN201043343Y (en) | 2008-04-02 |
Family
ID=39258236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201163213U Expired - Fee Related CN201043343Y (en) | 2007-06-01 | 2007-06-01 | Multi-layer plate heat-conduction enhanced ground-heating floor substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201043343Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102003058A (en) * | 2010-11-12 | 2011-04-06 | 郭漫笳 | Low-temperature radiant heating floor |
| CN102581911A (en) * | 2012-03-29 | 2012-07-18 | 浙江福马地暖科技有限公司 | Double-layer solid wood heating floor production method |
| CN103328740A (en) * | 2011-11-03 | 2013-09-25 | 东和自然地板有限公司 | Floorboard capable of absorbing expansion and contraction |
-
2007
- 2007-06-01 CN CNU2007201163213U patent/CN201043343Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102003058A (en) * | 2010-11-12 | 2011-04-06 | 郭漫笳 | Low-temperature radiant heating floor |
| CN103328740A (en) * | 2011-11-03 | 2013-09-25 | 东和自然地板有限公司 | Floorboard capable of absorbing expansion and contraction |
| CN102581911A (en) * | 2012-03-29 | 2012-07-18 | 浙江福马地暖科技有限公司 | Double-layer solid wood heating floor production method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080402 |