CN101452048A - Integrated circuit chip temperature test device and method - Google Patents
Integrated circuit chip temperature test device and method Download PDFInfo
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- CN101452048A CN101452048A CNA2007100943509A CN200710094350A CN101452048A CN 101452048 A CN101452048 A CN 101452048A CN A2007100943509 A CNA2007100943509 A CN A2007100943509A CN 200710094350 A CN200710094350 A CN 200710094350A CN 101452048 A CN101452048 A CN 101452048A
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Abstract
The present invention discloses an integrated circuit chip temperature tester which comprises four probes, wherein a third probe is connected with an analog signal input end of one analog-digital converter. The digital signal output by the analog-digital converter is transmitted to a sampled circuit. The fourth probe is connected with an exterior measuring device. The invention also discloses an integrated circuit chip temperature testing method. The third probe outputs a control signal with a mode of transmitting analog signal. The analog-digital converter converts the analog signal to a digital signal and transmits the converted digital signal to the tested circuit. The fourth probe collects the testing information in the tested circuit and outputs to an exterior testing instrument. The integrated circuit chip temperature tester according to the invention uses the third probe for outputting the analog signal. Then the analog signal is converted to the digital signal by the analog-digital converter. The integrated circuit chip temperature tester according to the invention settles the problem that the prior circuit requires a plurality of paths of signal input and has the advantages of low cost and short period of testing operation.
Description
Technical field
The present invention relates to a kind of proving installation, especially a kind of integrated circuit chip temperature test device.The invention still further relates to a kind of method of testing of integrated circuit (IC) chip.
Background technology
Current, if integrated circuit (IC) chip is carried out temperature test, must after to Chip Packaging, can carry out.General temperature test need be realized the evaluation of total temperature (40～170 ℃), has the shortcoming that the cycle is long, expense is high.Nowadays, probe station can be realized the evaluation of total temperature, but existing probe station has only four probes, and wherein two probes must connect power supply and ground, in addition Sheng Xia two probes can only one as input end, another is as output terminal.Yet present most solid-state circuit all needs multichannel input signal ability operate as normal, the regulating networks with multichannel selection that have.So proving installations such as existing probe station can't satisfy the requirement of integrated circuit chip temperature test.
Summary of the invention
Technical matters to be solved by this invention provides a kind of integrated circuit chip temperature test device, and a kind of integrated circuit chip temperature method of testing, it is with low cost, and the test job cycle is short, can be good at satisfying the requirement of existing integrated circuits chip temperature test.
For solving the problems of the technologies described above, the technical scheme of integrated circuit chip temperature test device of the present invention is, comprise four probes, wherein first probe and second probe are connected respectively to power end and earth terminal, the 3rd probe is connected to the input end of analog signal of an analog to digital converter, the digital signal of described analog to digital converter output sends to tested circuit, and four point probe connects externally measured instrument, gathers the detecting information in the tested circuit.
This people also provide a kind of integrated circuit chip temperature method of testing that adopts said apparatus to realize, its technical scheme is, described first probe and described second probe are tested circuit supply, described the 3rd probe is exported control signal in the mode that sends simulating signal, described analog to digital converter becomes digital signal with described analog signal conversion, and sending to described tested circuit, described four point probe is gathered the detecting information in the described tested circuit, and exports to externally measured instrument.
The present invention utilizes the 3rd probe output simulating signal, by analog to digital converter simulating signal is changed into digital signal then, has solved the problem that existing circuit needs the multiple signals input, and with low cost, and the test job cycle is short.
Description of drawings
The present invention is further detailed explanation below in conjunction with drawings and Examples:
Accompanying drawing is the structural representation of integrated circuit chip temperature test device of the present invention.
Embodiment
Integrated circuit chip temperature test device of the present invention, its structure as shown in drawings, comprise four probes, wherein first probe and second probe are connected respectively to power end and earth terminal, the 3rd probe is connected to the input end of analog signal of an analog to digital converter, the digital signal of described analog to digital converter output sends to tested circuit, and four point probe connects externally measured instrument, gathers the detecting information in the tested circuit.
The digital signal output end of described analog to digital converter is connected with a scrambler, after the encoding digital signals of described scrambler with described analog to digital converter, exports to described tested circuit.
The present invention also comprises a kind of integrated circuit chip temperature method of testing of utilizing said apparatus to realize, described first probe and described second probe are tested circuit supply, described the 3rd probe is exported control signal in the mode that sends simulating signal, described analog to digital converter becomes digital signal with described analog signal conversion, and send to described tested circuit, described four point probe is gathered the detecting information in the described tested circuit, and exports to externally measured instrument.
Described analog to digital converter becomes analog signal conversion after the digital signal, and through described scrambler recompile, the digital signal after will encoding then sends to described tested circuit.
For example, a circuit is carried out temperature test, and the output voltage of definite optimum temperature characteristic.Power supply is made voltage scanning at test input after powering on ground, makes analog to digital converter export 4 coding, has 2
4=16 kinds of conditioning signals, these conditioning signals are adjusted the internal resistance network of voltage reference, change output voltage, do above-mentioned test in the total temperature scope, can get 16 temperature curves, determine that at last suitable resistance value obtains the curve of output of optimum temperature characteristic.Realize 7 functions that probe could be realized by 4 probes like this.
In sum, the present invention utilizes the 3rd probe output simulating signal, by analog to digital converter simulating signal is changed into digital signal then, has solved the problem that existing circuit needs the multiple signals input, and with low cost, and the test job cycle is short.
Claims (4)
1. integrated circuit chip temperature test device, it is characterized in that, comprise four probes, wherein first probe and second probe are connected respectively to power end and earth terminal, the 3rd probe is connected to the input end of analog signal of an analog to digital converter, the digital signal of described analog to digital converter output sends to tested circuit, and four point probe connects externally measured instrument, gathers the detecting information in the tested circuit.
2. integrated circuit chip temperature test device according to claim 1, it is characterized in that, the digital signal output end of described analog to digital converter is connected with a scrambler, after the encoding digital signals of described scrambler with described analog to digital converter, exports to described tested circuit.
3. integrated circuit chip temperature method of testing of utilizing device as claimed in claim 1 or 2 to realize, it is characterized in that, described first probe and described second probe are tested circuit supply, described the 3rd probe is exported control signal in the mode that sends simulating signal, described analog to digital converter becomes digital signal with described analog signal conversion, and sending to described tested circuit, described four point probe is gathered the detecting information in the described tested circuit, and exports to externally measured instrument.
4. integrated circuit chip temperature method of testing according to claim 3, it is characterized in that, described analog to digital converter becomes analog signal conversion after the digital signal, and through described scrambler recompile, the digital signal after will encoding then sends to described tested circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100943509A CN101452048B (en) | 2007-11-30 | 2007-11-30 | Integrated circuit chip temperature test device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100943509A CN101452048B (en) | 2007-11-30 | 2007-11-30 | Integrated circuit chip temperature test device and method |
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| Publication Number | Publication Date |
|---|---|
| CN101452048A true CN101452048A (en) | 2009-06-10 |
| CN101452048B CN101452048B (en) | 2011-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2007100943509A Active CN101452048B (en) | 2007-11-30 | 2007-11-30 | Integrated circuit chip temperature test device and method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101995301B (en) * | 2009-08-20 | 2012-08-01 | 上海华虹Nec电子有限公司 | Temperature detection circuit of integrated circuit and calibration method thereof |
| CN103765234A (en) * | 2011-07-11 | 2014-04-30 | 密克罗奇普技术公司 | Temperature measurement of active device under test on strip tester |
| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
| CN107741560A (en) * | 2017-10-16 | 2018-02-27 | 上海御渡半导体科技有限公司 | A kind of application method of integrated circuit test device |
| WO2018192182A1 (en) * | 2017-04-19 | 2018-10-25 | 深圳市中兴微电子技术有限公司 | Chip surface temperature measuring system and method, and computer storage medium |
| CN111256857A (en) * | 2020-02-25 | 2020-06-09 | 上海华力集成电路制造有限公司 | Method for monitoring temperature of chuck of probe station by testing voltage of BJT emission junction |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5260668A (en) * | 1992-06-11 | 1993-11-09 | Prometrix Corporation | Semiconductor surface resistivity probe with semiconductor temperature control |
| US5592422A (en) * | 1995-06-07 | 1997-01-07 | Sgs-Thomson Microelectronics, Inc. | Reduced pin count stress test circuit for integrated memory devices and method therefor |
| TW369692B (en) * | 1997-12-26 | 1999-09-11 | Samsung Electronics Co Ltd | Test and burn-in apparatus, in-line system using the apparatus, and test method using the system |
-
2007
- 2007-11-30 CN CN2007100943509A patent/CN101452048B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101995301B (en) * | 2009-08-20 | 2012-08-01 | 上海华虹Nec电子有限公司 | Temperature detection circuit of integrated circuit and calibration method thereof |
| CN103765234A (en) * | 2011-07-11 | 2014-04-30 | 密克罗奇普技术公司 | Temperature measurement of active device under test on strip tester |
| CN106371001A (en) * | 2016-09-27 | 2017-02-01 | 上海华岭集成电路技术股份有限公司 | Device and method for controlling test temperature of chip to be tested |
| WO2018192182A1 (en) * | 2017-04-19 | 2018-10-25 | 深圳市中兴微电子技术有限公司 | Chip surface temperature measuring system and method, and computer storage medium |
| CN107741560A (en) * | 2017-10-16 | 2018-02-27 | 上海御渡半导体科技有限公司 | A kind of application method of integrated circuit test device |
| CN111256857A (en) * | 2020-02-25 | 2020-06-09 | 上海华力集成电路制造有限公司 | Method for monitoring temperature of chuck of probe station by testing voltage of BJT emission junction |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101452048B (en) | 2011-08-24 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |