CN107741560A - A kind of application method of integrated circuit test device - Google Patents

A kind of application method of integrated circuit test device Download PDF

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Publication number
CN107741560A
CN107741560A CN201710963916.0A CN201710963916A CN107741560A CN 107741560 A CN107741560 A CN 107741560A CN 201710963916 A CN201710963916 A CN 201710963916A CN 107741560 A CN107741560 A CN 107741560A
Authority
CN
China
Prior art keywords
temperature
integrated circuit
micro
housing
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710963916.0A
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Chinese (zh)
Inventor
胡忠臣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Royal Semiconductor Technology Co Ltd
Original Assignee
Shanghai Royal Semiconductor Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Royal Semiconductor Technology Co Ltd filed Critical Shanghai Royal Semiconductor Technology Co Ltd
Priority to CN201710963916.0A priority Critical patent/CN107741560A/en
Publication of CN107741560A publication Critical patent/CN107741560A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Means for indicating or recording specially adapted for thermometers
    • G01K1/024Means for indicating or recording specially adapted for thermometers for remote indication
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02Means for indicating or recording specially adapted for thermometers
    • G01K1/026Means for indicating or recording specially adapted for thermometers arrangements for monitoring a plurality of temperatures, e.g. by multiplexing

Abstract

Disclose a kind of application method of integrated circuit test device, provided with temperature sensor, temperature sensor is distributed in the diverse location in housing, for sensing the temperature in integrated circuit, when the temperature of integrated circuit to be tested, collection port is placed on the relevant position of the integrated circuit to be tested, open switch, sensor can transmit the temperature of detection to each test module, the temperature of test can wirelessly real-time delivery on the monitor terminal of operating personnel, operating personnel can compare monitoring temperature, it ensure that security, low manufacture cost, protective effect significantly increases, also overall fastness and the reliability of connection are substantially increased.

Description

A kind of application method of integrated circuit test device
Technical field
The present invention relates to control technology field, more particularly, is related to a kind of application method of integrated circuit test device.
Background technology
Integrated circuit(IC)A kind of microelectronic device or part, due to integrated circuit be by required various elements and Wiring interconnection package just proposes suitable strict requirements in a less space, therefore to interior volume temperature.Work as collection Go out in into circuit arrangement temperature it is too high when, easily break down, once it is mishandling easily trigger serious safety, information or even Economic accident.And these problems are directed to, effective and reasonable temperature test equipment is lacked in current IC system, so as to Great hidden danger is caused to integrated circuit and its information security, it is therefore, a kind of integrated there is an urgent need to develop for this present situation The test equipment of circuit, to meet the needs of actual use.
The content of the invention
Therefore, in view of the shortcomings of the prior art, the example for providing the present invention is led with substantially solving due to related One or more problems, safety and reliability increase substantially caused by the limitation in domain and shortcoming, effectively play guarantor Protect the effect of equipment.
According to technical scheme provided by the invention, described integrated circuit test device includes housing, in described housing Provided with rechargeable battery, described housing is provided with 5 instructions and switched, and 5 temperature sensors are provided with described housing, described Temperature sensor and described instruction switch be in one-to-one relationship, described temperature sensor is distributed in the housing Diverse location, described temperature sensor are switched with described instruction and electrically connected by test lead, are set below described housing There are two collection ports, described housing is provided with five groups of temperature display dials, and described sensor is carved with described display Scale is connected one to one by test lead electricity, is provided with micro-controller system in the housing, the housing is externally provided with micro-controller system Switch, described micro-controller system is interior to be provided with memory module, and described temperature sensor is connected with described micro-controller system, described Micro-controller system is connected to monitor terminal via communication path, described communication path be WIFI, Zigbee, EnOcean and/or Bluetooth communication paths, described memory module is interior to be provided with multiple data spaces, and described data space is by record temperature in real time The space of erasable first for spending sensor temperature numerical value and the not erasable second space composition for having stored normal temperature threshold value, temperature Degree sensor and described memory module are electrically connected by test lead, and warning output mould is additionally provided with described micro-controller system Block, when the Temperature numerical of the temperature sensor of described real-time record is higher than described normal temperature threshold value, described alarm Output module sends alarm signal
Further, be additionally provided with signal amplification module in described micro-controller system, described signal amplification module respectively with it is described Temperature sensor and described memory module electrically connected by test lead.
Further, described integrated circuit test device has following use step:
A:Collection port is placed on the relevant position of the integrated circuit to be tested,
B:5 instruction switches are opened successively,
C:Five groups of temperature display dials are observed, confirm whether the course of work is normal,
D:Micro-controller system switch is opened,
E:Every the Temperature numerical that 5 minutes observation monitor terminals are received, compared with normal temperature threshold value, integrated circuit is confirmed State of temperature.
The present invention can detect collection in time by using memory module and alarm output module with address memory function Into the temperature in circuit, and can be in time by radioing to staff, low manufacture cost, protective effect significantly increases By force, overall fastness and the reliability of connection are also substantially increased.
Brief description of the drawings
Fig. 1 is the schematic diagram of the test equipment of integrated circuit of the present invention.
Fig. 2 is micro-controller system operating diagram of the present invention.
Embodiment
With reference to specific embodiment, the invention will be further described.
Below with reference to embodiment shown in the drawings, the present invention will be described in detail.But these embodiments are simultaneously The present invention is not limited, structure that one of ordinary skill in the art is made according to these embodiments, method or functionally Conversion is all contained in protection scope of the present invention.
Below in conjunction with the accompanying drawings and specific embodiment is further described to the application principle of the present invention.Such as accompanying drawing 1 to accompanying drawing Shown in 2, described integrated circuit test device includes housing 1, and rechargeable battery is provided with described housing(Not shown in figure), Described housing 1 is provided with 5 instructions and switchs 2, and 5 temperature sensors, described temperature sensor are provided with described housing 1 It is in one-to-one relationship with described instruction switch 2, described temperature sensor is distributed in the diverse location in the housing 1, Described temperature sensor is electrically connected with described instruction switch 2 by test lead, and the described lower section of housing 1 is adopted provided with two Collect port 3, described housing 1 is provided with five groups of temperature display dials 4, described sensor and described display scale disk 4 Connected one to one by test lead electricity, be provided with micro-controller system in the housing 1, the housing 1 is externally provided with micro-controller system and opened Close(Not shown in figure), described micro-controller system is interior to be provided with memory module, described temperature sensor and described micro-controller system Be connected, described micro-controller system is connected to monitor terminal via communication path, described communication path be WIFI, Zigbee, EnOcean and/or Bluetooth communication paths, described memory module is interior to be provided with multiple data spaces, described data space By the space of erasable first for recording temperature sensor Temperature numerical in real time and the not erasable for having stored normal temperature threshold value Two spaces are formed, and temperature sensor and described memory module are electrically connected by test lead, also set in described micro-controller system There is alarm output module, when the Temperature numerical of the temperature sensor of described real-time record is higher than described normal temperature threshold value When, described alarm output module sends alarm signal.
Be additionally provided with signal amplification module in described micro-controller system, described signal amplification module respectively with described temperature Sensor and described memory module are electrically connected by test lead.In addition, it is additionally provided with indicator lamp on the described outer surface of housing 1 5。
Described integrated circuit test device has following use step:
A:Collection port 3 is placed on the relevant position of the integrated circuit to be tested,
B:5 instruction switches 2 are opened successively,
C:Five groups of temperature display dials 4 are observed, confirm whether the course of work is normal,
D:Micro-controller system switch is opened,
E:Every the Temperature numerical that 5 minutes observation monitor terminals are received, compared with normal temperature threshold value, integrated circuit is confirmed State of temperature.
When the temperature of integrated circuit to be tested, collection port is placed on the relevant position of the integrated circuit to be tested, Switch is opened, sensor can transmit the temperature of detection to each test module, and the temperature of test can be wirelessly real When be delivered on the monitor terminal of operating personnel, operating personnel can compare monitoring temperature, once there is exception, equipment is alarmed at once Operating personnel are notified, ensure that security.
For those skilled in the art, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and do not carrying on the back In the case of spirit or essential attributes from the present invention, the present invention can be realized in other specific forms.Therefore, no matter from which From the point of view of a bit, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention will by appended right Ask rather than described above limits, it is intended that all changes in the implication and scope of the equivalency of claim will be fallen Include in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art It is appreciated that other embodiment.

Claims (3)

1. a kind of application method of integrated circuit test device, described integrated circuit test device includes housing, described shell Rechargeable battery is provided with vivo, described housing is provided with 5 instructions and switched, and 5 temperature sensors are provided with described housing, Described temperature sensor is in one-to-one relationship with described instruction switch, and described temperature sensor is distributed in the housing Interior diverse location, described temperature sensor is switched with described instruction and electrically connected by test lead, under described housing Side is provided with two collection ports, and described housing is provided with five groups of temperature display dials, and described sensor shows with described Show that dial is connected one to one by test lead electricity, be provided with micro-controller system in the housing, the housing is externally provided with micro-control System switching, described micro-controller system is interior to be provided with memory module, and described temperature sensor is connected with described micro-controller system, institute The micro-controller system stated is connected to monitor terminal via communication path, described communication path be WIFI, Zigbee, EnOcean and/ Or Bluetooth communication paths, described memory module is interior to be provided with multiple data spaces, and described data space by recording in real time The space of erasable first of temperature sensor Temperature numerical and the not erasable second space composition for having stored normal temperature threshold value, Temperature sensor and described memory module are electrically connected by test lead, and warning output mould is additionally provided with described micro-controller system Block, when the Temperature numerical of the temperature sensor of described real-time record is higher than described normal temperature threshold value, described alarm Output module sends alarm signal, it is characterised in that described integrated circuit test device has following use step:
A:Collection port is placed on the relevant position of the integrated circuit to be tested,
B:5 instruction switches are opened successively,
C:Five groups of temperature display dials are observed, confirm whether the course of work is normal,
D:Micro-controller system switch is opened,
E:Every the Temperature numerical that 5 minutes observation monitor terminals are received, compared with normal temperature threshold value, integrated circuit is confirmed State of temperature.
A kind of 2. test equipment for integrated circuit according to claim 1, it is characterised in that described monitor terminal For mobile phone, computer and/or single-chip microcomputer.
A kind of 3. test equipment for integrated circuit according to claim 1, it is characterised in that described micro-control system Be additionally provided with signal amplification module in system, described signal amplification module respectively with described temperature sensor and described memory mould Block is electrically connected by test lead.
CN201710963916.0A 2017-10-16 2017-10-16 A kind of application method of integrated circuit test device Pending CN107741560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201710963916.0A CN107741560A (en) 2017-10-16 2017-10-16 A kind of application method of integrated circuit test device

Publications (1)

Publication Number Publication Date
CN107741560A true CN107741560A (en) 2018-02-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110736862A (en) * 2019-09-16 2020-01-31 上海御渡半导体科技有限公司 voltage clamping protection structure based on switch mode

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2328993Y (en) * 1998-02-26 1999-07-14 宋珊珊 thermometer
CN101452048A (en) * 2007-11-30 2009-06-10 上海华虹Nec电子有限公司 Integrated circuit chip temperature test device and method
US20140341258A1 (en) * 2013-05-16 2014-11-20 National Cheng Kung University Multi-point temperature sensing method for integrated circuit chip and system of the same
CN204313884U (en) * 2014-12-23 2015-05-06 王煜 A kind of indoor environment monitoring device
CN204495485U (en) * 2015-04-10 2015-07-22 衡阳师范学院 The low-power consumption multi-point temp detection system of integrated circuit SOC (system on a chip)
CN205262635U (en) * 2015-12-28 2016-05-25 江苏希瑞干细胞技术有限公司 Novel temperature monitoring of biological sample transportation device
CN206114146U (en) * 2016-10-26 2017-04-19 陕西明图电气有限公司 Wireless temperature measuring device and wireless temperature measurement cubical switchboard

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2328993Y (en) * 1998-02-26 1999-07-14 宋珊珊 thermometer
CN101452048A (en) * 2007-11-30 2009-06-10 上海华虹Nec电子有限公司 Integrated circuit chip temperature test device and method
US20140341258A1 (en) * 2013-05-16 2014-11-20 National Cheng Kung University Multi-point temperature sensing method for integrated circuit chip and system of the same
CN204313884U (en) * 2014-12-23 2015-05-06 王煜 A kind of indoor environment monitoring device
CN204495485U (en) * 2015-04-10 2015-07-22 衡阳师范学院 The low-power consumption multi-point temp detection system of integrated circuit SOC (system on a chip)
CN205262635U (en) * 2015-12-28 2016-05-25 江苏希瑞干细胞技术有限公司 Novel temperature monitoring of biological sample transportation device
CN206114146U (en) * 2016-10-26 2017-04-19 陕西明图电气有限公司 Wireless temperature measuring device and wireless temperature measurement cubical switchboard

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110736862A (en) * 2019-09-16 2020-01-31 上海御渡半导体科技有限公司 voltage clamping protection structure based on switch mode

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Application publication date: 20180227

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