CN101450858B - 一种降低单畴YBaCuO超导块成本的掺杂材料及其掺杂方法 - Google Patents

一种降低单畴YBaCuO超导块成本的掺杂材料及其掺杂方法 Download PDF

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CN101450858B
CN101450858B CN2007101784410A CN200710178441A CN101450858B CN 101450858 B CN101450858 B CN 101450858B CN 2007101784410 A CN2007101784410 A CN 2007101784410A CN 200710178441 A CN200710178441 A CN 200710178441A CN 101450858 B CN101450858 B CN 101450858B
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肖玲
焦玉磊
郑明辉
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GRIMN Engineering Technology Research Institute Co Ltd
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Abstract

一种降低单畴YBaCuO超导块成本的掺杂材料及其掺杂方法,该掺杂材料的化学式为BaCe1-xGdxO3,0≤x≤0.2。将BaCO3、CeO2和Gd2O3粉按Ba∶Ce∶Gd=1∶1-x∶x配比,经1400℃~1500℃焙烧5~10小时,反应生成BaCe1-xGdxO3掺杂材料。将BaCe1-xGdxO3按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.25wt%~1.00wt%的比例加入该Y1.8Ba2.4Cu3.4Oy先驱粉末中,在BaCe1-xGdxO3中,0≤x≤0.2,球磨混合均匀后,用单轴模压成型,采用顶部籽晶辅助熔融织构生长工艺生成单畴结构的YBaCuO超导块。用廉价的BaCe1-xGdxO3替代贵金属Pt掺杂在YBaCuO先驱粉中制备单畴YBaCuO超导块,在不降低材料性能的前提下降低单畴超导块成本。

Description

一种降低单畴YBaCuO超导块成本的掺杂材料及其掺杂方法
技术领域
本发明涉及一种降低单畴钇钡铜氧(YBaCuO)超导块成本的方法。
背景技术
YBaCuO超导块的成份以YBa2Cu3O7-y超导相(123相)为主,添加一定量的Y2BaCuO5-x非超导相(211相)。添加非超导的211相的主要目的是防止单畴超导块生长过程中液相的流失。YBaCuO超导块通过包晶反应生成c轴择优取向的晶体结构,最终产物中具有大量颗粒状的211相被俘获在层状123相基体中的特征。大量工艺研究的结果证实,细小的211相颗粒弥散分布在123相基体中可以增加超导材料的磁通钉扎能力,从而提高超导材料的性能。通常细化211相颗粒的方法是在YBaCuO的先驱粉末中掺杂0.2wt%~0.5wt%的铂粉(Pt)。由于Pt是价格昂贵的贵金属元素,Pt的掺杂增加了YBaCuO超导块的原材料成本。使用廉价的CeO2替代Pt有细化211相颗粒和提高性能的作用,但总体效果不如Pt。
发明内容
本发明的目的是提供一种降低单畴YBaCuO超导块成本的掺杂材料,该掺杂材料价格低廉,可以代替贵金属Pt,并不降低低单畴钇钡铜氧(YBaCuO)超导块材料性能。
本发明的另一个目的是提供一种制备降低单畴YBaCuO超导块成本的掺杂材料的方法。
本发明的再一个目的是提供一种用廉价材料替代贵金属Pt的掺杂,降低单畴钇钡铜氧(YBaCuO)超导块原材料成本的方法。
为了实现上述目的,本发明采用以下的技术方案
一种降低单畴YBaCuO超导块成本的掺杂材料,该掺杂材料的化学式为BaCe1-xGdxO3,其中,0≤x≤0.2。
一种制备降低单畴YBaCuO超导块成本的掺杂材料的方法,将BaCO3、CeO2和Gd2O3粉按Ba∶Ce∶Gd=1∶1-x∶x配比,其中,0≤x≤0.2,充分混合均匀后经1400℃~1500℃焙烧5~10小时,反应生成BaCe1-xGdxO3掺杂材料,其中,0≤x≤0.2。
一种降低单畴YBaCuO超导块成本的掺杂材料的掺杂方法,将BaCe1-xGdxO3按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.25wt%~1.00wt%的比例加入该Y1.8Ba2.4Cu3.4Oy先驱粉末中,在BaCe1-xGdxO3中,0≤x≤0.2,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴结构的YBaCuO超导块。
在BaCe1-xGdxO3中,0≤x≤0.2,且其相对于Y1.8Ba2.4Cu3.4Oy先驱粉的添加比例范围为0.25wt%~1.00wt%,在上述范围中能够取得好效果,超出此范围会引起性能的下降。
本发明所采用的球磨混合、单轴模压成型、顶部籽晶辅助熔融织构生长工艺(TSMTG)均为公知工艺。
采用顶部籽晶辅助熔融织构生长工艺(TSMTG),其中,TSMTG是顶部籽晶辅助熔融织构生长工艺英文Top Seeded Melt Textured Growth的缩写。本发明采用BaCe1-xGdxO3替代Pt掺杂在YBaCuO先驱粉中,采用顶部籽晶辅助熔融织构生长工艺(TSMTG)的工艺参数没有变化。
本发明的优点是:本发明用廉价的BaCe1-xGdxO3(0≤x≤0.2)替代贵金属Pt掺杂在YBaCuO先驱粉中制备单畴YBaCuO超导块,在不降低材料性能的前提下达到了降低单畴超导块成本的目的。
附图说明
图1为不同成分YBaCuO单畴超导块磁浮力F与悬浮间隙D之间的关系图。其中A是未掺杂超导块,B是掺0.2wt%Pt的超导块,C是掺杂0.5wt%BaCe3的超导块,D是掺杂0.5wt%BaCe0.9Gd0.1O3的超导块,E是掺杂0.5wt%BaCe0.8Gd0.2O3的超导块。
具体实施方式
BaCO3、CeO2和Gd2O3粉按Ba∶Ce∶Gd=1∶1-x∶x(0≤x≤0.2)配比,充分混合均匀后经1400℃~1500℃焙烧5~10小时,反应生成BaCe1-xGdxO3相。将BaCe1-xGdxO3按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.25wt%~1.00wt%的比例加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,在BaCe1-xGdxO3中,0≤x≤0.2,放入玛瑙罐中用玛瑙球研磨。按300~400目研磨粒度配球,球料重量比约为1∶1.2,研磨时间约4小时。经球磨混合均匀后,用150MPa的压强单轴模压成型。再采用顶部籽晶辅助熔融织构生长工艺(Top Seeded Melt Textured Growth,缩写为TSMTG工艺)生成单畴结构的YBaCuO超导块。TSMTG工艺过程和具体参数如下:将c轴取向的SmBaCuO或NdBaCuO小晶体放在模压成型的圆柱状YBaCuO块的顶表面中心位置,保持其c轴与园柱状材料的对称轴平行。将带有籽晶的成型块放入加热炉中,以250℃~350℃/小时的速率快速升温至1050℃±5℃,保温1~2小时后以400℃~600℃/小时的速率快速降温至1010℃~1015℃,再以0.3~0.5℃/小时的速率缓慢降温至975℃±5℃,然后以100~200℃/小时的速率冷却到室温,使YBaCuO块经历部分熔化后再凝固的过程,生成单畴结构的YBaCuO超导块。
实施例1
BaCO3、CeO2粉按Ba∶Ce=1∶1配比,充分混合均匀后经1400℃~1500℃焙烧5~10小时,生成BaCeO3相。将BaCeO3粉按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.25wt%,0.50wt%和1.00wt%的比例加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成三种不同成分的单畴YBaCuO超导块。
从上述三种不同成分的单畴超导块上取样,分别测量其在77K温度下的临界电流密度(Jc),其中掺杂0.50wt%BaCeO3的样品效果最好,Jc比未掺杂样品大幅度提高,达到掺0.2wt%Pt样品的同等水平,掺杂0.25wt%和1.00wt%BaCeO3的样品Jc虽然也比未掺杂样品提高,但低于掺0.2wt%Pt样品的水平。
测量了直径30mm厚17mm掺杂0.50wt%BaCeO3的单畴超导块的磁浮力性能。最大磁浮力达到103N,明显高于同等尺寸的未掺杂单畴超导块,与掺杂0.2wt%Pt粉的单畴超导块相当(见图1)。在图1中,掺杂0.5wt%BaCe3的超导块的C曲线,与掺0.2wt%Pt的超导块的B曲线相当,但明显高于同等尺寸的未掺杂单畴超导块的A曲线。
实施例2
BaCO3、CeO2和Gd2O3粉按Ba∶Ce∶Gd=1∶1-x∶x(x=0.1,0.2)配比,充分混合均匀后经1400℃~1500℃焙烧5~10小时,生成BaCe1-xGdxO3相。将BaCe1-xGdxO3粉按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.50wt%的比例加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴YBaCuO超导块。
分别测量了直径30mm厚17mm掺杂0.50wt%BaCe0.9Gd0.1O3(x=0.1)和掺杂0.50wt%BaCe0.8Gd0.2O3(x=0.2)的单畴超导块的磁浮力性能。最大磁浮力分别为105N和104N,明显高于同等尺寸的未掺杂单畴超导块,与掺杂0.2wt%Pt粉的单畴超导块相当(见图1)。在图1中,掺杂0.5wt%BaCe0.9Gd0.1O3的超导块的D曲线、掺杂0.5wt%BaCe0.8Gd0.2O3的超导块的E曲线与掺0.2wt%Pt的超导块的B曲线相当,但明显高于同等尺寸的未掺杂单畴超导块的A曲线。
比较例1
将Y1.8Ba2.4Cu3.4Oy粉末用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴YBaCuO超导块。
测量了直径30mm厚17mm的单畴超导块的磁浮力性能。最大磁浮力为75N(见图1)。在图1中,未掺杂单畴超导块的A曲线明显低于同等尺寸的掺杂0.5wt%BaCe3的超导块的C曲线、掺杂0.5wt%BaCe0.9Gd0.1O3的超导块的D曲线和掺杂0.5wt%BaCe0.8Gd0.2O3的超导块的E曲线。
比较例2
将Pt粉按按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.2wt%的比例加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴YBaCuO超导块。
测量了直径30mm厚17mm掺杂0.2wt%Pt粉的单畴超导块的磁浮力性能。最大磁浮力性能为103N(见图1)。在图1中,掺0.2wt%Pt的超导块的B曲线与掺杂0.5wt%BaCe3的超导块的C曲线、掺杂0.5wt%BaCe0.9Gd0.1O3的超导块的D曲线和掺杂0.5wt%BaCe0.8Gd0.2O3的超导块的E曲线相当。

Claims (1)

1.一种降低单畴YBaCuO超导块成本的掺杂材料的掺杂方法,其特征在于,将BaCe1-xGdxO3按相对于Y1.8Ba2.4Cu3.4Oy先驱粉的0.25wt%~1.00wt%的比例加入该Y1.8Ba2.4Cu3.4Oy先驱粉末中,在BaCe1-xGdxO3中,0≤x≤0.2,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴结构的YBaCuO超导块。
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