CN101450859B - 用BaCeO3掺杂提高YBaCuO超导体性能的方法 - Google Patents
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Abstract
一种用BaCeO3掺杂提高YBaCuO超导体性能的方法,其特征在于,将平均粒度为1nm~100nm的BaCe1-xGdxO3粉末加入Y1.8Ba2.4Cu3.4Oy粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴结构的YBaCuO超导块,其中,BaCe1-xGdxO3粉末加入量为Y1.8Ba2.4Cu3.4Oy粉末的0.25wt%~1.00wt%。用本发明的方法制备的单畴YBaCuO超导块的临界电流密度均高于未掺杂的单畴YBaCuO超导块。掺杂量为0.50wt%的超导块的临界电流密度达到了掺杂0.2wt%贵金属Pt样品的同等水平。
Description
技术领域
本发明涉及一种通过纳米颗粒掺杂提高钇钡铜氧(YBaCuO)超导块材性能的方法。
背景技术
YBaCuO超导块的成份以YBa2Cu3O7-y超导相(123相)为主,添加一定量的Y2BaCuO5-x非超导相(211相)。添加非超导的211相的主要目的是防止单畴超导块生长过程中液相的流失。YBaCuO超导块通过包晶反应生成c轴择优取向的晶体结构,最终产物中具有大量颗粒状的211相被俘获在层状123相基体中的特征。大量工艺研究的结果证实,细小的211相颗粒弥散分布在123相基体中可以增加超导材料的磁通钉扎能力,从而提高超导材料的性能。通常细化211相颗粒的方法是在YBaCuO的先驱粉末中掺杂0.2wt%~0.5wt%的铂粉(Pt)。由于Pt是价格昂贵的贵金属元素,Pt的掺杂增加了YBaCuO超导块的成本。
发明内容
本发明的目的是提供一种用BaCeO3掺杂提高YBaCuO超导体性能的方法,可以进一步细化单畴YBaCuO超导块中211颗粒,从而提高超导材料临界电流密度。
为实现上述目的,本发明采取以下技术方案:
一种用BaCeO3掺杂提高YBaCuO超导体性能的方法,将平均粒度为1nm~100nm的BaCeO3粉末加入Y1.8Ba2.4Cu3.4Oy粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴结构的YBaCuO超导块,其中,BaCeO3粉末加入量为Y1.8Ba2.4Cu3.4Oy粉末的0.25wt%~1.00wt%。
本发明所采用的球磨混合、单轴模压成型、顶部籽晶辅助熔融织构生长工艺(TSMTG)均为公知工艺。
采用顶部籽晶辅助熔融织构生长工艺(TSMTG),其中,TSMTG是顶部籽晶辅助熔融织构生长工艺英文Top Seeded Melt Textured Growth的缩写。本发明采用纳米数量级粒度的BaCeO3替代Pt掺杂在YBaCuO先驱粉中,采用顶部籽晶辅助熔融织构生长工艺(TSMTG)的工艺参数没有变化。
使用微米数量级粒度的BaCeO3替代Pt可以取得良好的效果,有细化211相颗粒和提高性能的作用,但总体效果不如Pt。纳米级粒度即平均粒度为1nm~100nm的BaCeO3掺杂在YBaCuO先驱粉中制备单畴YBaCuO超导块,可以进一步细化211相颗粒从而进一步提高超导块的性能。
本发明的优点为:本发明用纳米粒度的BaCeO3掺杂在YBaCuO先驱粉中,掺杂量为0.25wt%~1.00wt%。用其制备的单畴YBaCuO超导块的临界电流密度均高于未掺杂的单畴YBaCuO超导块。掺杂量为0.50wt%的超导块的临界电流密度达到了掺杂0.2wt%贵金属Pt样品的同等水平。
附图说明
图1为不同含量BaCeO3掺杂样品(A、B、C)的临界电流Jc与磁场B的关系及其与未掺杂样品D和掺Pt样品E的比较图。
具体实施方式
将相对于Y1.8Ba2.4Cu3.4Oy先驱粉末的0.25wt%~1.00wt%的平均粒度为1nm~100nm的BaCeO3加入Y1.8Ba2.4Cu3.4Oy粉末中,放入玛瑙罐中用玛瑙球研磨。按300~400目研磨粒度配球,球料重量比约为1∶1.2,研磨时间约4小时。经球磨混合均匀后,用150MPa的压强单轴模压成型。再采用顶部籽晶辅助熔融织构生长工艺(Top Seeded Melt Textured Growth,缩写为TSMTG工艺)生成单畴结构的YBaCuO超导块。TSMTG工艺过程和具体参数如下:将c轴取向的SmBaCuO或NdBaCuO小晶体放在模压成型的圆柱状YBaCuO块的顶表面中心位置,保持其c轴与园柱状材料的对称轴平行。将带有籽晶的成型块放入加热炉中,以250℃~350℃/小时的速率快速升温至1050℃±5℃,保温1~2小时后以400℃~600℃/小时的速率快速降温至1010℃~1015℃,再以0.3~0.5℃/小时的速率缓慢降温至975℃±5℃,然后以100~200℃/小时的速率冷却到室温,使YBaCuO块经历部分熔化后再凝固的过程,生成单畴结构的YBaCuO超导块。
实施例1
将平均粒度为60nm的BaCeO3粉按相对于Y1.8Ba2.4Cu3.4Oy先驱粉末0.25wt%,0.50wt%和1.00wt%的比例分别加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,BaCeO3粉的经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成三种不同成分的单畴YBaCuO超导块A、B和C。
从A、B和C三种超导块上取样,分别测量其在77K温度下的临界电流密度(Jc),结果显示于图1。在0~2T的测量磁场范围内,样品B(掺杂量为0.50wt%)的Jc最高,样品A(掺杂量为0.25wt%)次之,样品C(掺杂量为1.00wt%)最低。在1.0T磁场下A、B样品的Jc均为1.3×104A/cm2,C样品为1.0×104A/cm2;在2.0T磁场下B样品的Jc仍然接近1.0×104A/cm2,而A样品和C样品分别下降为0.4×104A/cm2和0.2×104A/cm2。上述3种样品的Jc与未掺杂样品D相比,均有不同程度的提高。其中掺杂0.50wt%BaCeO3的效果最好,达到掺杂0.2wt%Pt样品E的同等水平。
实施例2
采用和实施例1相同的方法,将平均粒度为20nm的BaCeO3粉按相对于Y1.8Ba2.4Cu3.4Oy先驱粉末0.25wt%,0.50wt%和1.00wt%的比例分别加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,BaCeO3粉的经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成三种不同成分的单畴YBaCuO超导块A’、B’和C’。平均粒度为20nm的BaCeO3掺杂效果与上述平均粒度为60nm的掺杂效果相当。
实施例3
采用和实施例1相同的方法,将平均粒度为90nm的BaCeO3粉按相对于Y1.8Ba2.4Cu3.4Oy先驱粉末0.25wt%,0.50wt%和1.00wt%的比例分别加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,BaCeO3粉的经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成三种不同成分的单畴YBaCuO超导块A”、B”和C”。平均粒度为90nm的BaCeO3掺杂效果与上述平均粒度为60nm的掺杂效果相当。
比较例1
将Y1.8Ba2.4Cu3.4Oy粉末用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴YBaCuO超导块D。
从D超导块上取样,测量其在77K温度下的临界电流密度(Jc),结果也显示于图1。在1.0T磁场下Jc为0.7×104A/cm2,在2.0T磁场下Jc下降至0.1×104A/cm2以下。在0~2T的测量磁场范围内,样品D的Jc均低于掺杂纳米BaCeO3的样品。
比较例2
将Pt粉按0.2wt%的比例加入Y1.8Ba2.4Cu3.4Oy先驱粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺(TSMTG)生成单畴YBaCuO超导块E。
从E超导块上取样,测量其在77K温度下的临界电流密度(Jc),结果也显示于图1。在1.0T磁场下Jc为1.3×104A/cm2,在2.0T磁场下Jc为1.0×104A/cm2以下。在0~2T的测量磁场范围内,样品E的Jc均高于未掺杂样品D,与掺杂0.50wt%内米BaCeO3的样品B相同。
本发明用纳米粒度的BaCeO3掺杂在YBaCuO先驱粉中,掺杂量为0.25wt%,0.50wt%和1.00wt%。用其制备的单畴YBaCuO超导块的临界电流密度均高于未掺杂的单畴YBaCuO超导块。掺杂量为0.50wt%的超导块的临界电流密度达到了掺杂0.2wt%贵金属Pt样品的同等水平。因此,本发明的方法提高超导块材性能同时降低单畴超导块成本。
Claims (1)
1.一种用BaCeO3掺杂提高YBaCuO超导体性能的方法,其特征在于,将平均粒度为1nm~100nm的BaCeO3粉末加入Y1.8Ba2.4Cu3.4Oy粉末中,经球磨混合均匀后,用单轴模压成型,再采用顶部籽晶辅助熔融织构生长工艺生成单畴结构的YBaCuO超导块,其中,BaCeO3粉末加入量为Y1.8Ba2.4Cu3.4Oy粉末的0.25wt%~1.00wt%。
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