CN101442877A - Novel interconnection structure and method for creating electric through-hole - Google Patents
Novel interconnection structure and method for creating electric through-hole Download PDFInfo
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- CN101442877A CN101442877A CN 200810127522 CN200810127522A CN101442877A CN 101442877 A CN101442877 A CN 101442877A CN 200810127522 CN200810127522 CN 200810127522 CN 200810127522 A CN200810127522 A CN 200810127522A CN 101442877 A CN101442877 A CN 101442877A
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- electroporation
- perforation
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- syndeton
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention provides a novel interconnection structure and a method for forming electroporations. The novel interconnection structure is provided with at least two electroporations in a stacked electric layer which comprises at least two electric layer and a medium layer separated in the middle, and uses the electroporation to conduct different electric layers or is solely connected to the electric layer so as to electrically connect or form capacitance. The method for forming electroporations comprises the following steps: forming a perforation structure in a stacked electric layer; forming at least a perforation in the perforation structure; arranging an electroporation of a connection signal wire in the electroporation; arranging an electroporation in the electroporation of the connection signal wire; respectively arranging an electroporation in the perforation structure and at the periphery of the perforation structure. The invention can reduce crosstalk interference, improve signal integrity and reduce electromagnetic compatibility.
Description
Technical field
The present invention relates to hierarchy, relate in particular to a kind of method of innovating syndeton and setting up electroporation.
Background technology
The present invention is the patent application case (a kind of innovation perforation structure that can improve the signal integrity degree) examined an at present (application case number: continuous application case 200710198485.X).A kind of application case that can improve the innovation perforation structure of signal integrity degree is described in detail in the method for improving the signal integrity degree in the multilayer circuit board.And application of the present invention mainly is absorbed in the syndeton of utilizing connector or any pattern to come in conjunction with multilayer circuit board.
Integrated for integrated circuit in multilayer board (PCB), encapsulated integrated circuit and the chip has that holding wire need be transformed into another circuit board from this circuit board under many situations.Therefore, we need a good syndeton to improve the signal integrity degree of whole system.In general, connector of pin more than or integrated encapsulated circuit can be used to connect the signal of two circuit substrates.The connector of many pins connects printed circuit board (PCB) and printed circuit board (PCB); Integrated encapsulated circuit connection-core chip integration becomes circuit and printed circuit board (PCB).
Fig. 1 to Figure 12 shows the configuration of 4 kinds of existing syndetons.Fig. 1 to Fig. 3 shows first kind of existing syndeton, above the top layer of PCB 51 two signal line 60 and 62 are arranged, switch to two signal line 61 and 63 of the bottom of following PCB 52 respectively through signal perforation 70 and 71. Signal 70 and 71 is walked along perforation, can be through two metal flats 55 and 57 of the metal frame 75 of two metal flats 54 and 56 of top PCB 51, syndeton 53 and following PCB 52.Two PCB 51 and 52 metal flat can be power plane or ground plane up and down, and by ground connection perforation (or power supply perforation) 69, the metal frame 75 of syndeton 53 can be electrically connected with the metal flat of two PCB 51,52 up and down.When signal when perforation 70 and 71 is transmitted, they can generate electromagnetic waves, and electromagnetic wave can not penetrate two ground connection perforation (or power supply perforation) 65 and 67 and the metal frame 75 of syndeton 53 of two ground connection perforation (or power supply perforation) 64 and 66, the following PCB 52 of top PCB 51.Yet, because up and down two PCB 51 and 52 four grounded perforation (or power supply perforation) 64,65,66 and 67 and the metal frame 75 of syndeton 53 exist discontinuous structure, so electromagnetic wave can from two PCB 51 up and down and 52 and the junction of syndeton 53 spill.The electromagnetic wave of missing can reduce the integrity degree of signal.And it is different with the signal impedance of walking in the syndeton perforation to walk the signal impedance of boring a hole at the PCB circuit board, and Here it is, and so-called impedance is discontinuous, and such impedance is discontinuous also can to influence signal quality.Ground connection perforation (or power supply perforation) 69 combines the metal frame 75 of the ground plane (or power plane) of two PCB51 up and down and 52 with syndeton 53 electrically.So just, provide a current reflux path to signal, yet this current reflux path is not the shortest return flow path concerning walking the signal in the signal perforation, therefore, it is also little for the improvement of signal integrity degree.
Fig. 4 to Fig. 6 shows second kind of existing syndeton, above the top layer of PCB 110 two signal line 119 and 122 are arranged, respectively through signal perforation 120 and 123, switch to two signal line 121 and 124 of the bottom of following PCB 111. Signal 120 and 123 is walked along perforation, can be through two metal flats 114 and 116 of the metal frame 130 of two metal flats 113 and 115 of top PCB 110, syndeton 112 and following PCB 111.Two PCB 110 and 111 metal flat can be power plane or ground plane up and down, and by ground connection perforation (or power supply perforation) 126, the metal frame 130 of syndeton 112 can be electrically connected with the metal flat of two PCB 110 up and down and 111.When signal when perforation 120 and 123 is transmitted, they can generate electromagnetic waves.On the PCB circuit board because lack ground connection perforation or the power supply perforation is centered around around the signal perforation, so electromagnetic wave can be simultaneously between two metal flats 113 and 115 of PCB 110 with two metal flats 114 and 116 at PCB 111 between transmission.Electromagnetic wave transmission between metal flat can cause the disturbance of voltage and reduce the signal integrity degree.A same existing syndeton is the same, and it is different with the signal impedance of walking in the syndeton perforation to walk the signal impedance of boring a hole at the PCB circuit board, and Here it is, and so-called impedance is discontinuous, and such impedance is discontinuous also can to influence signal quality.Ground connection perforation (or power supply perforation) 126 combines the ground plane (or power plane) of two PCB 110 up and down and 111 and the metal frame 130 of syndeton 112 electrically, so just provides a current reflux path to signal.Similarly, this current reflux path is not the shortest return flow path for the signal of walking in the signal perforation, and therefore, it is also little for the improvement of signal integrity degree.
Fig. 7 to Fig. 9 shows the third existing syndeton, above the top layer of PCB 151 two signal line 160 and 163 are arranged, switch to two signal line 162 and 165 of the bottom of following PCB 152 respectively through signal perforation 161 and 164. Signal 161 and 164 is walked along perforation, can be through two metal flats 155 and 157 of the metal frame 172 of two metal flats 154 and 156 of top PCB 151, syndeton 153 and following PCB 152.Two PCB 151 and 152 metal flat can be power plane or ground plane up and down, and the metal frame 172 of syndeton 153 can't be electrically connected with the metal flat of two PCB 151 up and down and 152.When signal when perforation 161 and 164 is transmitted, they can generate electromagnetic waves.On the PCB circuit board because lack ground connection perforation or the power supply perforation is centered around around the signal perforation, so electromagnetic wave can be simultaneously between two metal flats 154 and 156 of PCB 151 with two metal flats 155 and 157 at PCB 152 between transmission.Electromagnetic wave transmission between metal flat can cause the disturbance of voltage and reduce the signal integrity degree.The same two existing syndetons are the same, electromagnetic wave can from two PCB 151 up and down and 152 and the junction of syndeton 153 spill, the electromagnetic wave of missing can reduce the signal integrity degree.It is different with the signal impedance of walking in syndeton 153 perforation to walk the signal impedance of boring a hole at the PCB circuit board, and Here it is, and so-called impedance is discontinuous, and such impedance is discontinuous also can to influence signal quality.Ground connection perforation (or power supply perforation) 167 combines the ground plane (or power plane) of two PCB 110 up and down and 111 electrically, but be not electrically connected with the metal frame 172 of syndeton 153, therefore, ground connection perforation (or power supply perforation) 167 provides a very long current reflux path and gives signal, and this very long current reflux path is very little for the improvement of signal integrity degree.
Figure 10 to Figure 12 shows the 4th kind of existing syndeton, above the top layer of PCB 201 two signal line 210 and 213 are arranged, switch to two signal line 212 and 215 of the bottom of following PCB 202 respectively through signal perforation 211 and 214. Signal 211 and 214 is walked along perforation, can be through two metal flats 205 and 207 of two metal flats 204 and 206, syndeton 203 and the following PCB 202 of top PCB 201.Two PCB 201 and 202 metal flat can be power plane or ground plane up and down, do not have metal frame in the syndeton 203.When signal when perforation 211 and 214 is transmitted, they can generate electromagnetic waves.On the PCB circuit board, because lacking ground connection perforation or power supply perforation is centered around around the signal perforation, so electromagnetic wave can be simultaneously between two metal flats 204 of PCB 201 and 206 with two metal flats 205 and 207 at PCB 202 between transmission, electromagnetic wave transmission between metal flat can cause the disturbance of voltage and reduce the signal integrity degree.And, because there is not metal frame in the syndeton 203,, makes signal perforation 211 and 214 electromagnetic waves that produced be easy to be coupled and reduce the signal integrity degree so electromagnetic wave can spread out from syndeton 203.In general, PCB 201 is different with the material parameter characteristic of syndeton 203 with 202, so it is different with the signal impedance of walking in syndeton 203 perforation to walk the signal impedance of boring a hole at the PCB circuit board, Here it is, and so-called impedance is discontinuous, and such impedance is discontinuous also can to influence signal quality.Ground connection perforation (or power supply perforation) 217 combines the ground plane (or power plane) of two PCB 201 up and down and 202 electrically, therefore, ground connection perforation (or power supply perforation) 217 provides a very long current reflux path and gives signal, and this very long current reflux path is very little for the improvement of signal integrity degree.
Along with advancing by leaps and bounds of electronics technology, various electronic products day by day popularly are applied in the middle of our work and life, electronic products such as the most common especially at present information and household electrical appliances.Electronic product nearly all has a motherboard, the IC encapsulated circuit, and with the IC circuit, it is constituted by many electronic components and with transmission line, and wherein these electronic components are assembled to circuit board, and are electrically connected by the circuit of printed circuit board (PCB).
Summary of the invention
The object of the present invention is to provide a kind of method of innovating syndeton and setting up electroporation, to reduce the cross-talk between perforation (via) and the perforation (via), reduce the discontinuous effect and the EMC radiation problem of impedance and improve signal quality, therefore the signal integrity degree of whole system can improve, and from the PCB circuit board, the IC encapsulated circuit, or electromagnetic wave that the edge of chip internal circuit radiates also can reduce because of the exploitation of innovation syndeton.
For reaching above-mentioned purpose, the invention provides a kind of innovation syndeton, it comprises:
One piles up electrical layer, and it from top to bottom comprises electrically layer of the first electrical layer, dielectric layer and second at least;
Enclose electroporation at least one, run through described and pile up electrical layer, and the conducting described first electrical layer and the described second electrical layer;
At least one peripheral electroporation runs through described and piles up electrical layer and enclose electroporation around in described, and described peripheral electroporation conducting described first is the layer and the described second electrical layer electrically;
One anti-pad encloses in described between electroporation and the described peripheral electroporation.
The present invention also provides a kind of method of setting up electroporation, and it comprises the following steps:
Pile up in the electrical layer one and to set up a perforation structure;
In described perforation structure, set up at least one electroporation:
With an electroporation that connects holding wire be arranged on described electroporation in enclose;
One electroporation is arranged on described connection holding wire electroporation in enclose;
In described perforation structure, enclose with the periphery electroporation is set respectively.
The present invention also provides a kind of innovation syndeton, and it comprises:
One piles up electrical layer, and it from top to bottom comprises electrically layer of the first electrical layer, dielectric layer and second at least;
Enclose electroporation at least one, be arranged in the described electrical layer of piling up, and enclose electroporation in described and do not contact the described first electrical electrical layer of layer or described second;
At least one peripheral electroporation, be arranged in and describedly pile up electrical layer and around the described electroporation that encloses, and described peripheral electroporation does not contact the described second electrical electrical layer of layer or described first, makes described two electrically to enclose electroporation in described between the layer and peripheral electroporation forms an electric capacity.
The present invention also provides a kind of innovation syndeton, and it comprises:
One piles up electrical layer, and it from top to bottom comprises electrically layer of the first electrical layer, dielectric layer and second at least;
At least two electroporations, be arranged in described electrical layer and the intermeshing of piling up, and described two electroporations connect different described electrical layers respectively, the wherein said first electrical layer is not connected to each other with described second electrical layer, makes described two electroporations between described two electrical layers form the slotting formula electric capacity of a finger.
Compared with prior art, the method for improving the innovation syndeton of signal integrity degree and setting up electroporation provided by the invention can reduce the cross-talk between perforation and the perforation, reduces the discontinuous effect and the EMC radiation problem of impedance and improves signal quality.
Description of drawings
Fig. 1 shows the whole system that comprises first kind of existing syndeton;
Fig. 2 shows first kind of discontinuous current return flow path that existing syndeton is detailed;
Fig. 3 shows the vertical view of the connecting interface between two PCB and syndeton;
Fig. 4 shows the whole system that comprises second kind of existing syndeton;
Fig. 5 shows second kind of discontinuous current return flow path that existing syndeton is detailed;
Fig. 6 shows the vertical view of the connecting interface between two PCB and syndeton;
Fig. 7 shows the whole system that comprises the third existing syndeton;
Fig. 8 shows the discontinuous current return flow path that the third existing syndeton is detailed;
Fig. 9 shows the vertical view of the connecting interface between two PCB and syndeton;
Figure 10 shows the whole system that comprises the 4th kind of existing syndeton;
Figure 11 shows the 4th kind of discontinuous current return flow path that existing syndeton is detailed;
Figure 12 shows the vertical view of the connecting interface between two PCB and syndeton 203;
Figure 13 demonstration comprises the whole system schematic diagram that the present invention innovates syndeton;
Figure 14 is the detailed structure schematic diagram of the 13rd figure;
Figure 15 shows that whole the present invention innovates the detailed and complete current reflux path of connected system;
Figure 16 shows the vertical view of the connecting interface between two PCB and syndeton;
Figure 17 innovates the partial structurtes cutaway view of connected system for the present invention;
Figure 18 a-Figure 18 d is respectively the perforation structure schematic diagram of different shape;
System's resulting insertion loss curve chart that Figure 19 and Figure 20 display simulation are all, wherein heavy line is represented the insertion loss of innovation syndeton of the present invention; The insertion loss of other the existing syndeton of curve representative;
System's resulting insertion loss curve chart that Figure 21 and Figure 22 display simulation are all, wherein heavy line is represented the insertion loss of innovation syndeton of the present invention; The insertion loss of other the existing syndeton of curve representative;
Figure 23 to Figure 31 shows each step structural representation of the processing of the metal frame of setting up innovation syndeton of the present invention;
Each step structural representation that the present invention innovates the processing that centers on the formula perforation of syndeton is set up in Figure 32 to Figure 38 demonstration.
Description of Reference Numerals: 1a PCB circuit board is located at the top signal layer; 1b-located above the PCB
The second layer of the circuit board ground plane (or power level); 1c-located at the third layer circuit board PCB ground
Layer (or power level); 1d-located at the fourth layer circuit board PCB signal layers; 1e-located above the PCB
A fifth layer of the circuit board to the signal layer; 1f-PCB circuit board located at the bottom of the ground layer (or power level);
1g-situated below the top of the PCB circuit board ground plane (or power level); 1h-PCB circuit board located in the following
The second layer signal layer; 1i-located in the following third layer PCB circuit board ground layer (or power level); 1j-
PCB circuit board is located below the fourth layer of the ground layer (or power level); 1k-PCB circuit board located in the following
The fifth layer, the signal layer; 1l-in circuit board PCB below the sixth layer, the ground layer (or power level); 1m-
PCB circuit board is located below the bottom signal layer; 1n-PCB circuit board located above the perforated Results Type A
Structure; 1o-in PCB circuit board at "B" type perforated structure; 1p-connecting structure A-type hole
Structure; 1q-PCB circuit board is located below the A-type perforated structure; 2a-top PCB circuit board; 2b-down
PCB circuit board surface; 2c-connection structure (The interconnection structure); 3a-PCB circuit board
Power plane; 3b-PCB circuit board ground plane; 3c-PCB signal layer circuit board or the power supply layer or the ground
Layer; 3d-PCB circuit board or the power supply layer or the signal layer of the ground layer; 3e-perforated inner peripheral power supply (The inner
power via); 3f-second class power punch (The second-level power via); 3g-grounded perforated inner circle
(The inner ground via); 3h-second class ground perforation (The second-level ground via);
3i-PCB circuit board signal layer; 3j-PCB circuit board signal layer; 3k-PCB circuit board or a signal layer
The power supply layer or the ground layer; 3l-PCB signal layer circuit board or the power supply layer or ground layer; 3m-perforated inner peripheral signal
(The inner signal via); 3n-second class signal perforation (The second-level signal via); 3o-within
Wai signal perforation (The inner signal via); 3p-second class signal perforation (The second-level signal
via); 3q-PCB circuit board signal layer; 3r-PCB circuit board ground plane (or power level); 3s-PCB electrical
The circuit board or the power supply layer or the signal layer ground layer; 3t-PCB signal layer circuit board or the power supply layer or ground layer;
3u-signal perforated inner circle (The inner signal via); 3v-second class signal perforation (The second-level
signal via); 3w-inner circle ground (or power) Piercing The inner ground (or power) via; 3x-second
Class ground (or power) Piercing The second-level ground (or power) via; P1-port 1 (Port 1);
P2-Port 2 (Port 2); P3-port 3 (Port 3); P4-port 4 (Port 4); 1 - above the PCB (or the substrate;
Or chip) China; - following PCB (or the substrate; or chip); 3 - Connecting the structure or connector; 4 - above the PCB (or base
Plate; or chip) the top ground layer (or the power supply layer); 5 - at PCB (or the substrate; or chip) the bottom ground layer
(Or power level); 6 - following PCB (or the substrate; or chip) the top ground layer (or the power supply layer); 7 - following PCB (or
A substrate; or chip) the bottom ground layer (or power level); 8 - above the PCB (or the substrate; or chip) in the middle of the power
Layer (or ground floor); 9 - The following PCB (or the substrate; or chip) intermediate power level (or ground floor); 10 - located on the
The top surface of the PCB a first signal line; 11 - the bottom of the PCB is located below a first signal line; 12 - in
Top of the PCB above the second signal line; 13 - situated below the bottom of the PCB, a second signal line; 14 - the
PCB surface ground around the first signal perforated perforation (perforation or power); 15 - The following PCB around the first signal
Ground perforated perforation (perforation or power); 16 - PCB above the ground around the second signal perforated perforation (or electric
Source perforation); 17 - The following PCB ground around the second signal perforated perforation (perforation or power); 18 - Power wear
Hole (perforation or ground); 19 - Ground perforation (perforation or power); 20 - connection with the PCB in the first signal
Perforation; 21 - connection with the PCB in the second signal perforation; 22 - the first signal connection structure intermediary wear
Holes and metal dielectric material between the wall; 23 - the second signal connection structure intermediary between the wall and the metal perforation
A dielectric material; 24 - connecting structure around the first signal perforated metal wall; 25 - connecting structure around the second
Signal perforated metal wall; 26 - Between Power perforation (perforation or ground) and the dielectric material between the metal frame;
27 - connecting structure of the metal frame; P1-port 1 (Port 1); P2-Port 2 (Port 2); P3-port 3 (Port
3); P4-port 4 (Port 4); 51 - above the PCB (or the substrate; or chip); 52 - The following PCB (or the substrate; or core
Film); 53 - connecting structure or connector; 54 - at PCB (or the substrate; or chip) the top ground layer (or the power supply
Layer); 55 - the following PCB (or the substrate; or chip) the bottom ground layer (or power level); 56 - above the PCB (or the group
Board; or chip) intermediate power level (or ground floor); 57 - The following PCB (or the substrate; or chip) intermediate power planes
(Or ground floor); 58 - above the PCB (or the substrate; or chip) of the underlying dielectric layer; 59 - The following PCB (or the substrate;
Or chip) of the top dielectric layer; 60 - located at the top of the PCB a first signal line; 61 - located at the following
The bottom of the PCB first signal line; 62 - located at the top of the PCB a second signal line; 63 - in the lower
The bottom surface of the PCB a second signal line; 64 - PCB at the ground around the first perforated hole signal (or
Power perforation); 65 - The following PCB ground around the first signal perforated perforation (perforation or power); 66 - above
PCB ground around the second signal perforated perforation (perforation or power); 67 - The following PCB around the second signal
Ground perforated perforation (perforation or power); 68 - Power perforations (or ground perforation); 69 - Ground perforation (or power
Perforation); 70 - connection with the PCB in the first signal perforation; 71 - connection with the PCB in the second letter
No. perforation; 72 - the first signal connection structure intermediary between the perforation and the metal dielectric material; 73 - Connection Junction
Intermediate structure to the second signal between the perforations and the metal dielectric material; 74 - connecting structure of the power supply hole Intermediary
(Or ground perforation) and the dielectric material between the metal frame; 75 - connecting structure of the metal frame; 76-PCB intermediary
Piercing the first signal and ground dielectric material between the perforations; 77-PCB intermediary perforation and connected to the second signal
Ground dielectric material between the perforations; P1-port 1 (Port 1); P2-Port 2 (Port 2); P3-port 3 (Port
3); P4-port 4 (Port 4); 110 - above the PCB (or the substrate; or chip); 111 - The following PCB (or the substrate;
Or chip); 112 - connection or connector; 113 - at PCB (or the substrate; or chip) the top ground layer (or
Power supply layers); 114 - Here PCB (or the substrate; or chip) the bottom ground layer (or power level); 115 - at
PCB (or the substrate; or chip) intermediate power level (or ground floor); 116 - The following PCB (or the substrate; or chip) of
Intermediate power level (or ground floor); 117 - above PCB (or the substrate; or chip) of the underlying dielectric layer; 118 - below
PCB (or the substrate; or chip) of the top dielectric layer; 119 - located in the top of the PCB above the first signal line;
120 - connection structure of the first signal and the PCB perforation; 121 - located below the bottom of the first signal PCB
Line; 122 - located above the top of the PCB to the second signal line; 123 - connection to the PCB, the second letter
No. perforation; 124 - located below the bottom of the PCB, a second signal line; 125 - Power perforations (or ground perforation);
126 - Ground perforation (perforation or power); 127 - the first signal connection structure intermediate between the perforation and the metal
Dielectric material; 128 - the second signal connection structure intermediary between the perforation and the metal dielectric material; 129 -
Connect the power supply perforated intermediate structure (or ground perforation) and the dielectric material between the metal frame; 130 - connection structure
The metal frame; P1-port 1 (Port 1); P2-Port 2 (Port 2); P3-port 3 (Port 3); P4-end
Port 4 (Port 4); 151 - above the PCB (or the substrate; or chip); 152 - The following PCB (or the substrate; or chip);
153 - connection or connector; 154 - at PCB (or the substrate; or chip) the top ground layer (or power level);
155 - The following PCB (or the substrate; or chip) the bottom ground layer (or the power supply layer); 156 - at PCB (or the substrate;
Or chip) intermediate power level (or ground floor); 157 - The following PCB (or the substrate; or chip) intermediate power planes
(Or ground floor); 158 - above the PCB (or the substrate; or chip) of the underlying dielectric layer; 159 - The following PCB (or base
Plate; or chip) the top dielectric layer; 160 - located at the top of the PCB a first signal line; 161 - connection
Structure of the first signal and the PCB hole; 162 - at the bottom of the PCB beneath a first signal line; 163 -
Above the top of the PCB in a second signal line; 164 - connection of the second signal to the PCB hole;
165 - located below the bottom of the PCB, a second signal line; 166 - Power perforations (or ground perforation); 167 - Ground
Perforation (perforation or power); 168 - the first signal connection structure intermediary between the media and the metal perforated sheet
Material; 169 - the second signal connection structure intermediary between the perforation and the metal dielectric material; 170 - connection structure
Intermediaries on the power perforation (perforation or ground) and the dielectric material between the metal frame; 171 - connection structure of intermediaries in connection
To perforation (perforation or power) and the dielectric material between the metal frame; 172 - connection structure of the metal frame; P1-
Port 1 (Port 1); P2-Port 2 (Port 2); P3-port 3 (Port 3); P4-port 4 (Port 4); 201 -
Above the PCB (or the substrate; or chip); 202 - The following PCB (or the substrate; or chip); 203 - connection structure or connection
Device; 204 - at PCB (or the substrate; or chip) the top ground layer (or power level); 205 - Here PCB (or
A substrate; or chip) the bottom ground layer (or power level); 206 - above the PCB (or the substrate; or chip) of the intermediate electrode
Source layer (or ground floor); 207 - The following PCB (or the substrate; or chip) intermediate power level (or ground floor); 208 -
Above the PCB (or the substrate; or chip) of the underlying dielectric layer; 209 - The following PCB (or the substrate; or chip) top
Dielectric layer; 210 - located at the top of the PCB a first signal line; 211 - connection to the PCB of the first
A signal perforation; 212 - located below the bottom of the PCB first signal line; 213 - located above the PCB
Top of the second signal line; 214 - connection of the second signal to the PCB hole; 215 - located in the following PCB
The bottom of the second signal line; 216 - Power perforations (or ground perforation); 217 - Ground perforation (perforation or power).
...
Embodiment
For making purpose of the present invention, structural feature and function thereof there are further understanding, cooperate related embodiment and accompanying drawing to be described in detail as follows:
The invention provides a kind of method of innovating syndeton and setting up electroporation, can reduce cross-talk and EMC radiation problem, and raising signal quality, when connecting (interconnection) structure to reduce electronic device institute transmission signals process, in syndeton, produce cross-talk, or provide signal when the syndeton, a voltage reference plane or current reflux path are arranged, and the discontinuous signal reflex noise that causes of reduction impedance, and then the quality of inhibit signal transmission.
Below with the Circuits System of two circuit boards and a syndeton, consult Figure 13 to shown in Figure 17, for example illustrates design of the present invention, each circuit board all has one deck signals layer, three layers of dielectric layer, two-layer ground plane (or two-layer bus plane) and one deck bus plane (or one deck ground plane), two signal perforation structures, two structures around the ground connection perforation (or power supply perforation) of signal perforation, ground connection perforation structure and one a power supply perforation structure independently independently.Syndeton has a dielectric layer, two signals are bored a hole and a metal frame (or two peripheral ground connection perforation or two peripheral power supplies perforation).Those of ordinary skills' design of the present invention as can be known also can be applied on connector, motherboard, IC base plate for packaging, integrated circuit (IC) chip, the low-temperature co-fired ceramic substrate.
The syndeton that the embodiment of the invention provides can be a sandwich construction, for example PCB circuit board, IC encapsulated circuit and chip internal integrated circuit.Therefore, when being combined, different circuit structures will become a bigger syndeton system.Idea of the present invention can be applied in PCB circuit board, IC encapsulated circuit, chip internal integrated circuit or other different kenel circuit in conjunction with last.Note that for the syndeton in each multilayer circuit or the coupling system of at least two multilayer circuits, is not the bottom that must extend through whole system from the superiors one tunnel of whole system.Concerning some signal lines, the innovation syndeton can be applied in the Circuits System of circuit or whole combination to fragment.Give an example, see also Figure 18 a, holding wire can be from the top layer signals layer 1a of top circuit board 2a, go to the 4th layer signal layer 1d of top circuit board 2a through A type perforation structure 1n, then, holding wire the 4th layer signal layer 1d of circuit board 2a has in the above been walked one section transmission line, afterwards, go to the layer 5 signals layer 1e of top circuit board 2a again through Type B perforation structure 1o, then, holding wire is the layer 5 signals layer 1e of the circuit board 2a one section transmission line of going further in the above, again down through the second layer signals layer 1h of the A type perforation structure 1p among the syndeton 2c to following circuit board 2b, the holding wire second layer signals layer 1h of circuit board 2b is below walked one section transmission line, and then down through the bottom signals layer 1m of A type perforation structure 1q to following circuit board 2b.A type ground connection perforation structure 1q can connect all ground planes of following circuit board 2b, yet A type ground connection perforation structure 1q not necessarily will be connected with the 4th layer of ground plane 1j of following circuit board 2b, reason is A type ground connection perforation structure 1q as long as connect the 3rd layer of ground plane li of following circuit board 2b and the layer 6 ground plane 11 of following circuit board 2b, just enough provides a complete current circuit to signal.Therefore, the designer must determine all required ground planes, is connected to provide a complete current circuit to signal with A type ground connection perforation structure 1q.
For the application of C type perforation structure, electric capacity can be designed to refer to insert formula electric capacity.Figure 18 b shows the slotting formula electric capacity of the finger on one 4 rank.Refer to that the overlapping area of inserting formula electric capacity can be greater than the area of parallel plate capacitor, that is to say to refer to that the value of inserting formula electric capacity can be greater than the value of parallel plate capacitor.Certainly, refer to insert the slotting formula electric capacity of finger that formula electric capacity also can expand to the n rank easily.And, refer to insert formula electric capacity and not necessarily will build between power supply and the ground plane, it also can build in (consult Figure 18 c) between two holding wires or build holding wire in and ground connection (or power supply) plane between (consulting Figure 18 d).
Figure 13 to Figure 17 shows innovation syndeton 3 connecting circuit plates 1 and 2.Innovation syndeton 3 is used to explanation " a kind of innovation perforation structure that can improve the signal integrity degree " (application case number: 200710198485.X) the extension patent of the A type perforation structure in the application case.Innovation syndeton 3 can reduce the negative factor that those can influence the signal integrity degree, and for example: the coupling between perforation and the perforation, impedance is discontinuous with electromagnetic radiation etc.
Top circuit board by substrate 1, two signal line 10 and 20 and 21, two ground connection perforation of 8, two signals perforation of 4 and 5, bus planes (or ground plane) of 12, two ground planes (or two bus planes) (or power supply perforation) 14 and 16 respectively around 18 and one of 20 and 21, independently power supply perforation of two signals perforation (or ground connection perforation) independently ground connection perforation (or power supply perforation) 19 form.The composition structure of following circuit board is identical with top circuit board: substrate 2, two signal line 11 and 20 and 21, two ground connection perforation of 9, two signal perforation of 6 and 7, bus planes (or ground plane) of 13, two ground planes (or two bus planes) (or power supply perforation) 15 and 17 are respectively around 18 and independently ground connection perforation (or power supply perforation) 19 of 20 and 21, independently power supply perforation of two signal perforation (or ground connection perforation).Syndeton is by the substrate 3 with two-layer up and down electrical layer, two 20 and 21, metal frame 27[of signal perforation or two ground connection perforation (or two power supplys perforation) 24 and 25] around 18 and one of 20 and 21, independently power supply perforation of two signals perforation (or ground connection perforation) independently ground connection perforation (or power supply perforation) 19 form.Please pay special attention to: any two or more perforation are electrically connected and will form metal frame.The use of described metal frame mainly provides continuous current reflux path of signal perforation, and grounded metal frame (or power supply metal frame) 27 and power supply perforation (or ground connection perforation) 18 can form capacitance structure in syndeton.Yet if without metal frame, circuit designers can utilize ground connection perforation (or power supply perforation) (not shown) to set up an electric capacity around (the ground connection perforation) 18 of boring a hole of a power supply.
In embodiments of the present invention, ground connection perforation (or power supply perforation) 24 and 25 and metal frame 27 all be copper coating.Signal is bored a hole, ground connection is bored a hole and the power supply perforation is square and concentric.Yet they needn't be to want square or concentric, and for example, signal perforation 20 and 21 can be solid cylinder or hollow cylinder and not concentric with ground connection perforation (or power supply perforation) 24 and 25.And signal perforation 20 and 21 (or the power supply perforation) 24 and 25 of must boring a hole with ground connection keeps certain distances, and this distance is commonly referred to as anti-pad (anti-pad).(application case number: the thickness of once mentioning ground connection perforation (or power supply perforation) 24 and 25 200710198485.X) must be greater than skin depth, and described skin depth refers to the degree of depth corresponding to the charge concentration of signal frequency in the described signal perforation 20 and 21 at before patent application case " a kind of innovation perforation structure that can improve the signal integrity degree ".Yet the thickness of ground connection perforation (or power supply perforation) 24 and 25 need not be greater than skin depth, because the performance of whole system may be influenced by many other factors, for example, impedance is discontinuous, current reflux path, dielectric absorption etc.Therefore, inserting loss (S21) can be influenced by many factors, and just not relevant with skin depth.So the improvement of signal integrity degree can be reached by eliminating all possible negative factor.
(application case number: the extension of the Type B perforation structure 200710198485.X) is used for patent application case " a kind of innovation perforation structure that can improve the signal integrity degree ", the structure of metal frame also is not suitable for, because signal can not be by short circuit together, and the metal frame in the syndeton of passing by.Yet the signal perforation can be more suitable around interior kenel of enclosing ground connection perforation (or power supply perforation).Discontinuous effect of coupling, impedance between the innovation perforation structure also can reduce perforation and bore a hole and electromagnetic radiation etc.In the ground connection perforation (or power supply perforation) of enclosing a complete voltage reference plane and current reflux path can be provided, give away the signal on signal is bored a hole.And any electromagnetic wave that is produced by the signal perforation is concentrated between ground connection perforation (or power supply perforation) and the signal perforation, makes that the coupling energy between signal perforation and other perforation reduces widely.
In like manner, the perforation structure that penetrates syndeton can utilize the mode of machinery or Laser drill to create.Perforation is perforation, and at first, the signal perforation is worked it out to be electrically connected the signals layer of PCB circuit board.Then, around the signal perforation ground connection perforation (or power supply perforation) also worked it out ground plane (or bus plane) with the connection PCB circuit board.Ground connection perforation (or power supply perforation) can be to form square ring-type perforation with the coating mode, or forms square solid column perforation with the mode of metal filling casting.The material of ground connection perforation (or power supply perforation) can be any electrical conductivity alloy or metal, for example, and tin (Sn), silver (Ag), copper (Cu), gold (Au) etc.In enforcement of the present invention, the process technology of any standard, for example, modes such as mold, plating, electroless plating can be used to make any perforation.
In the present embodiment, the signal perforation is formed by copper facing.The signal perforation is a square and concentric with ground connection perforation (or power supply perforation).Yet they need not square ring-type or with one heart, for example, ground connection perforation (or power supply perforation) can be hollow annulated column, solid cylinder or polygon central column etc., they can with the signal perforation for one heart or decentraction.And, signal perforation must and ground connection bore a hole and keep at least one segment distance between (or power supply perforation), claim that generally this segment distance is the distance of anti-pad.Thickness as for ground connection perforation (or power supply perforation) does not have any restriction because the main function of ground connection perforation (or power supply perforation) provides voltage reference plane and bore a hole to signal in the current reflux path.Electromagnetic wave can concentrate between signal perforation and the ground connection perforation (or power supply perforation) tightly.Therefore, the electromagnetic coupled between perforation and perforation also can reduce widely, and final, the signal integrity degree also can be improved.
Figure 13 to Figure 17 is the syndeton of innovation of the present invention, represents the insertion loss (S21 and S43) of the signal path of innovation syndeton of the present invention at the heavy line A1 shown in Figure 19 and Figure 20 and A2; Other dotted line and fine line are represented the insertion loss (S21 and S43) of the signal path of four kinds of existing syndetons (as Fig. 1 to Figure 12) among Figure 19, Figure 20; Wherein, the insertion of heavy line A1 and A2 representative loss is greater than the insertion loss of other dotted lines and fine line representative, and the insertion loss (S21 and S43) of four kinds of existing syndetons is smaller, and just expression has more energy loss on signal path.These energy losses may be by electromagnetic radiation, impedance is discontinuous or institute such as dielectric absorption causes.
Heavy line A3 among Figure 21 and Figure 22 and A4 represent the insertion loss (S31 and S42) of the signal path of innovation syndeton of the present invention (Figure 13 to Figure 17).Other dotted line and fine line are represented the insertion loss (S31 and S42) of the signal path of four kinds of existing syndetons (Fig. 1 to Figure 12) among Figure 21, Figure 22.The insertion of heavy line A3 and A4 representative loss comes for a short time than the insertion loss of other dotted lines and fine line representative, and it is smaller that the present invention innovates the insertion loss (S31 and S42) of syndeton, just represents to have between the signal path less energy to be coupled.
The foundation of the innovation syndeton among Figure 13 to Figure 17 can utilize existing P CB process technology or connector process technology to finish.Figure 23 to Figure 31 shows each step structural representation of processing of the metal frame of the innovation syndeton in the foundation.Figure 32 to Figure 38 shows each step structural representation of setting up the processing that centers on the formula perforation of innovation syndeton among Figure 13-Figure 17.
Figure 23 shows the substrate of syndeton 230, and the dielectric material of pcb board generally adopts FR4, and the dielectric material of connector generally adopts plastic cement.Any suitable dielectric material, for example, LTCC or RogersDuroidTM can be used to do the dielectric material of pcb board or connector.
Figure 24 is presented at and sets up a perforation 232 in the syndeton 231, and machinery or Laser drill can be used to make this perforation.
Figure 25 shows that the perforation 232 among Figure 24 is filled up by conductive metal 233.
Figure 26 shows that four perforations 234,235,236 and 237 bored the conducting metal 233 among Figure 25.
Figure 27 shows that two perforations 234 and 235 among Figure 26 are filled conducting metal 238 and 239.
Figure 28 shows that two perforations 240 and 241 bored the conducting metal 238 and 239 among Figure 27.
Figure 29 shows that three perforations 242,243 and 244 are filled dielectric material.Perforation 242 and 243 dielectric material can suitably be selected, and come the impedance of control signal perforation; The dielectric material of perforation 244 can suitably be selected, and comes the value of control capacitance.Chemical vapour deposition (CVD) can be used to fill up perforation, and many other possible technology also can be used to fills up perforation, at this in detail these known process technologies is not described in detail.
Figure 30 shows that three perforations 245,246 and 247 bored the medium perforation 242,243 and 244 of Figure 29.
Figure 31 shows that four perforations 245,246,247 and 248 among Figure 30 are filled conducting metal 249,250,251 and 252.
Figure 32 to Figure 38 shows each step structural representation of setting up the processing that centers on the formula perforation of innovation syndeton among Figure 13 to Figure 17.
Figure 32 shows the substrate of syndeton 260, and the dielectric material of pcb board generally adopts FR4, and the dielectric material of connector generally adopts plastic cement.Any suitable dielectric material, for example, LTCC or RogersDuroidTM can be used to do the dielectric material of pcb board or connector.
Figure 33 shows that four perforations 261,262,263 and 264 bored the dielectric material 260 of Figure 32, and machinery or Laser drill can be used to make this perforation.
Figure 34 shows that two perforations 261 and 262 among Figure 33 are filled conducting metal 265 and 266.
Figure 35 shows that two perforations 267 and 268 bored the conducting metal 265 and 266 among the 34th figure.
Figure 36 shows that three perforations 269,270 and 271 are filled dielectric material.Perforation 269 and 270 dielectric material can suitably be selected, and come the impedance of control signal perforation; The dielectric material of perforation 271 can suitably be selected, and comes the value of control capacitance.Chemical vapour deposition (CVD) can be used to fill up perforation, and many other possible technology also can be used to fills up perforation, at this in detail these known process technologies is not described in detail.
Figure 37 shows the medium perforation 269,270 and 271 that three perforations 272,273 and 274 bored Figure 36.
Figure 38 shows that four perforations 272,273,274 and 275 among Figure 37 are filled conducting metal 276,277,278 and 279.
The combine performance of syndeton of simplation verification innovation of two pcb boards and syndeton, the syndeton of this innovation comprises several structures: the perforation structure and the capacitance structure of metal frame, A type.Figure 19-Figure 22 is the analog result that two PCBs plates and syndeton combine, Figure 19-Figure 20 is the integrated system of simulation innovation syndeton and the resulting insertion loss S21 of integrated system and the S43 of 4 existing syndetons, Figure 19 is S21, and Figure 22 is S43.The insertion loss S21 and the S43 of heavy line A1 and A2 representative innovation syndeton; Fine line B1 and B2 represent the insertion loss S21 and the S43 of first kind of existing syndeton; Thick dashed line C1 and C2 represent the insertion loss S21 and the S43 of second kind of existing syndeton; Fine dotted line D1 and D2 represent the insertion loss S21 and the S43 of the third existing syndeton; Fine and closely woven dotted line E1 and E2 represent the insertion loss S21 and the S43 of the 4th kind of existing syndeton.Clearly, the insertion loss S21 of the syndeton of innovation and S43 are greater than the insertion loss S21 and the S43 of other existing syndeton, the syndeton of this expression innovation can allow the signal transmission more efficient, and in other words, the signal integrity degree is improved widely.
In like manner, Figure 21-Figure 22 is the integrated system of simulation innovation syndeton and the resulting insertion loss S31 of integrated system and the S42 of 4 existing syndetons, and Figure 21 is S31, and Figure 22 is S42.The insertion loss S31 and the S42 of heavy line A3 and A4 representative innovation syndeton; Fine line B3 and B4 represent the insertion loss S31 and the S42 of first kind of existing syndeton; Thick dashed line C3 and C4 represent the insertion loss S31 and the S42 of second kind of existing syndeton; Fine dotted line D3 and D4 represent the insertion loss S31 and the S42 of the third existing syndeton; Fine and closely woven dotted line E3 and E4 represent the insertion loss S31 and the S42 of the 4th kind of existing syndeton.Clearly, the insertion loss S31 of the syndeton of innovation and S42 come for a short time than the insertion loss S31 and the S42 of other existing syndeton, the syndeton of this expression innovation can allow signal between port one and the port 3 and the energy of coupling between port 2 and the port 4 diminish, in other words, the signal integrity degree is improved widely.
The specific embodiment of the present invention comprises metal frame and A type, Type B and C type innovation perforation structure.The structure of these innovations can realize that metal frame can be connected with the ground plane (or power plane) of pcb board with ground connection perforation (or power supply perforation) (perforation structure of A type) that centers on identical processing mode.Two or more arbitrarily the electrical connection around perforation structure (perforation structure of A type) will form metal frame.The structure of these innovations can provide the shortest current circuit and reduce the discontinuous effect of impedance, and electromagnetic wave is concentrated between signal perforation and the ground connection perforation (or power supply perforation or metal frame).Therefore, the signal perforation can reduce with the coupling energy of any other perforation, the result, and the signal integrity degree can improve.For the Type B perforation structure, be based on also that (application case number: the identical idea of Type B perforation structure 200710198485.X), the result does not go through at this with patent application case " a kind of innovation perforation structure that can improve the signal integrity degree ".For C type perforation structure, electric capacity or refer to inserts that type electric capacity can suitably be designed and the signal integrity degree that helps whole system.
In addition, belong to copline waveguide pipe (coplanar waveguide) with three layers of circuit structure idea that also but application of aforementioned is identical and adopt the perforation structure of distortion to reach identical purpose about two-layer.
Moreover, no matter be the innovation syndeton of which kind of form, the distance of enclosing wherein between electroporation (can be above-mentioned signal perforation, ground connection perforation or power supply perforation) and the peripheral electroporation (can be above-mentioned signal perforation, ground connection perforation or power supply perforation) can suitably be adjusted, control the impedance of electroporation, in addition, also can select to control the impedance of electroporation between the interior dielectric material that encloses between electroporation (can be above-mentioned signal perforation, ground connection perforation or power supply perforation) and the peripheral electroporation (can be above-mentioned signal perforation, ground connection perforation or power supply perforation).Therefore, with peripheral electroporation be used as ground connection perforation with in enclose the example that the signal perforation is used as in the ground connection perforation, impedance Z can following formula (1) expression:
Z＝(138/e^(1/2))*log(D/d)..................................(1)
Wherein, enclose the diameter of electroporation in the d representative, D represents the diameter of peripheral electroporation, and e represents dielectric constant (dielectric constant of air is 1).In general, resistance value is usually between 20～150 ohm.
Enclose perforation and lack structure that peripheral perforation is used as the plane of reference partly for interior, then can replace with lumped circuit model or other equivalent models.
Enclosing electroporation and described peripheral electroporation in described can be circle, square, rectangle or polygon.
In sum, the present invention illustrates the effectiveness of the syndeton of innovation with a syndeton that four perforation (perforation of two signals, a power supply perforation and a ground connection perforation) are arranged.Identical idea can be used in any multiple punching and the multilayer syndeton (for example PCB, IC encapsulated circuit, or IC chip internal circuit).Perforation with electric characteristics also can be added in the syndeton of these four basic perforation and become the syndeton of multiple punching.For single perforation (single signal perforation or single power supply perforation), two perforation (a signal perforation and ground connection perforation; Or a signal perforation and a power supply perforation) and three perforation (signal perforation, the perforation of ground connection and a power supply are bored a hole) syndeton, also can reach the reduction cross-talk, improve the signal integrity degree and reach the effect that reduces EMC based on identical idea.
The syndeton of these four perforation contains covers three main electric characteristics: impedance Control, electric capacity and differential signal transmission are described below:
Impedance Control: the top layer signals line of PCB and the bottom layer signal line of following PCB above two signal perforation connect, a ground connection perforation is bored a hole with a power supply and is connected respectively to ground plane and the bus plane of two PCB, the signal perforation connects the transmission line that is positioned at the PCB signals layer, has two kinds of methods can be used for the signal perforation is separated: a kind of metal frame that is to use; In being to use, encloses another kind or peripheral around perforation (providing metal wall to work as the plane of reference).Metal frame is to be made between the perforation of syndeton, when ground connection perforation (power supply perforation) is connected with the metal frame contact, metal frame just becomes grounded metal frame (power supply metal frame), ground connection perforation (or power supply perforation) is connected with metal frame can provide a plane of reference to bore a hole to signal, and grounded metal frame (or power supply metal frame) is designed to the signal perforation concentric.Need to separate some distance between grounded metal frame (or power supply metal frame) and the signal perforation to avoid short circuit, the impedance of signal perforation can reach suitable purpose of design by the distance of adjusting between signal perforation and the grounded metal frame (or power supply metal frame).In the present embodiment, copper is used to do metal frame, and grounded metal frame (or power supply metal frame) is connected with ground connection perforation (or power supply perforation) contact, and ground connection perforation (or power supply perforation) is connected with the ground plane (bus plane) of PCB circuit board.Please note that the ground plane (or voltage plane) on the PCB circuit board must have identical electrical characteristic.Utilize this framework, the signal perforation in the syndeton can be separated each other in case the electromagnetic coupled between the stop signal perforation.And grounded metal frame (or power supply metal frame) provides voltage reference plane of signal and the complete current reflux path in the signal perforation.At last, signal perforation in the circuit board and the discontinuous effect of impedance between the signal perforation in the syndeton can be lowered, and therefore, reflection effect and return loss can and then reduce.Because use grounded metal frame (or power supply metal frame) to come the isolation signals perforation, the cross-talk between the signal perforation also can reduce thereby improve signal quality.Therefore, also can reduce from the electromagnetic wave (EMC/EMI problem) that connector edge radiated.As for enclose in the syndeton or peripheral just look like to be in the PCB circuit board around perforation (metal wall) around the extension of the ground connection perforation (or power supply perforation) of signal perforation.They provide complete voltage reference plane of signal perforation and complete current reflux path, and they also can reduce the cross-talk between the signal perforation.
Electric capacity: with top described, above-mentioned two kinds of methods can be used to insulating power supply perforation (or ground connection perforation): a kind of metal frame that is to use; In being to use, encloses another kind or peripheral around perforation (metal wall).Power supply perforation and grounded metal frame or ground connection perforation and power supply metal frame can form the capacitor architecture element of store electrical energy (can be used for).Capacitance can be between power supply perforation and grounded metal frame or between ground connection perforation and power supply metal frame, by filling selected good material (selected dielectric coefficient), or adjust between power supply perforation and grounded metal frame, or the distance between ground connection perforation and power supply metal frame reaches the purpose of design.Adding electric capacity helps the power supply integrity degree of circuit, because the voltage disturbance between voltage plane and ground plane can be lowered.At last, because the voltage disturbance between voltage plane and the ground plane reduces, so the signal integrity degree of whole system also and then improves.Enclose or peripheral structure around perforation (metal wall) as for interior, they just look like to be the extension that centers on the ground connection perforation (or power supply perforation) of power supply perforation (or ground connection perforation) in the PCB circuit board.They also can form capacitor architecture and help the power supply integrity degree of circuit board.
Differential wave: if peripheral perforation connects with the holding wire of PCB different layers and be opposite with the polarity of interior signal perforation of enclosing, it is right that then whole perforation structure can become differential wave.For the application of differential wave, be not suitable for using metal frame, can be proper around the independent perforation of signal perforation.The application of differential perforation helps the signal integrity degree of system, because energy can be coupled tightly interior enclosing between signal perforation and peripheral signal perforation.
The present invention also provides a kind of method of setting up electroporation, and it comprises the following steps:
Pile up in the electrical layer one and to set up a perforation structure;
In described perforation structure, set up at least one electroporation:
With an electroporation that connects holding wire be arranged on described electroporation in enclose;
One electroporation is arranged on described connection holding wire electroporation in enclose;
In described perforation structure, enclose with the periphery electroporation is set respectively.
Wherein, the electroporation of described connection holding wire is provided with described electroporation is concentric.
Wherein, the electroporation of described connection holding wire and described electroporation pile up electrical layer perpendicular to described.
Wherein, the electroporation of described connection holding wire and described electroporation are arranged in the described dielectric material that piles up electrical layer.
More than explanation is just illustrative for the purpose of the present invention, and nonrestrictive, those of ordinary skills understand; under the situation of the spirit and scope that do not break away from following claims and limited, can make many modifications, change; or equivalence, but all will fall within the scope of protection of the present invention.
Claims (35)
1, a kind of innovation syndeton is characterized in that it comprises:
One piles up electrical layer, and it from top to bottom comprises electrically layer of the first electrical layer, dielectric layer and second at least;
Enclose electroporation at least one, run through described and pile up electrical layer, and the conducting described first electrical layer and the described second electrical layer;
At least one peripheral electroporation runs through described and piles up electrical layer and enclose electroporation around in described, and described peripheral electroporation conducting described first is the layer and the described second electrical layer electrically;
One anti-pad encloses in described between electroporation and the described peripheral electroporation.
2, innovation syndeton as claimed in claim 1 is characterized in that, the described first electrical layer is signals layer, ground plane or bus plane; The described second electrical layer is signals layer, ground plane or bus plane.
3, innovation syndeton as claimed in claim 1 is characterized in that, enclosing electroporation in described is signal perforation, ground connection perforation or power supply perforation; Described peripheral electroporation is signal perforation, ground connection perforation or power supply perforation.
4, innovation syndeton as claimed in claim 1 is characterized in that, encloses electroporation in described and build described piling up in the electrical layer in directly, or pile up electrical layer and form mutual connect-disconnect structure with described.
5, innovation syndeton as claimed in claim 1 is characterized in that, the described first electrical layer has identical electrical characteristic with the described second electrical layer.
6, innovation syndeton as claimed in claim 2 is characterized in that, described bus plane or described ground plane in an integrated circuit (IC) chip, are respectively power grid or earth grid.
7, innovation syndeton as claimed in claim 1 is characterized in that, encloses electroporation and concentric setting of described peripheral electroporation in described.
8, innovation syndeton as claimed in claim 1 is characterized in that, encloses electroporation or described peripheral electroporation in described, with the signal perforation of another ic substrate with in enclose electroporation or the formation of peripheral electroporation is electrically connected.
9, innovation syndeton as claimed in claim 1 is characterized in that, describedly piles up electrical layer and also comprises more than one the 3rd electrical layer, separates with dielectric layer between the adjacent electrical layer, to form sandwich construction.
10, innovation syndeton as claimed in claim 1 is characterized in that, encloses electroporation and described peripheral electroporation in described and be circular, square, rectangle or polygon.
11, innovation syndeton as claimed in claim 1 is characterized in that, adjusts the distance of enclosing in described between electroporation and the described peripheral electroporation, controls the impedance of enclosing electroporation and described peripheral electroporation in described.
12, innovation syndeton as claimed in claim 1 is characterized in that, selects to enclose in described dielectric material between electroporation and the described peripheral electroporation, controls the impedance of enclosing electroporation and described peripheral electroporation in described.
13, innovation syndeton as claimed in claim 1 is characterized in that, encloses electroporation and described peripheral electroporation in described and piles up electrical layer perpendicular to described.
14, as claim 1 or 9 described innovation syndetons, it is characterized in that, it also comprises plural described peripheral electroporation, and plural described peripheral electroporation is electrically connected and forms a metal frame, and described metal frame is located on and encloses the electroporation periphery in described.
15, innovation syndeton as claimed in claim 6 is characterized in that, enclosing electroporation in described is that filled circles column type or open circles are ring-like.
16, innovation syndeton as claimed in claim 14 is characterized in that, described metal frame and described in enclose the dielectric material that electroporation is arranged in described sandwich construction.
17, a kind of method of setting up electroporation is characterized in that it comprises the following steps:
Pile up in the electrical layer one and to set up a perforation structure;
In described perforation structure, set up at least one electroporation:
With an electroporation that connects holding wire be arranged on described electroporation in enclose;
One electroporation is arranged on described connection holding wire electroporation in enclose;
In described perforation structure, enclose with the periphery electroporation is set respectively.
18, the method for setting up electroporation as claimed in claim 17 is characterized in that, the electroporation of described connection holding wire is provided with described electroporation is concentric.
19, the method for setting up electroporation as claimed in claim 17 is characterized in that, the electroporation of described connection holding wire and described electroporation pile up electrical layer perpendicular to described.
20, the method for setting up electroporation as claimed in claim 17 is characterized in that, the electroporation of described connection holding wire and described electroporation are arranged in the described dielectric material that piles up electrical layer.
21, a kind of innovation syndeton is characterized in that it comprises:
One piles up electrical layer, and it from top to bottom comprises electrically layer of the first electrical layer, dielectric layer and second at least;
Enclose electroporation at least one, be arranged in the described electrical layer of piling up, and enclose electroporation in described and do not contact the described first electrical electrical layer of layer or described second;
At least one peripheral electroporation, be arranged in and describedly pile up electrical layer and around the described electroporation that encloses, and described peripheral electroporation does not contact the described second electrical electrical layer of layer or described first, makes described two electrically to enclose electroporation in described between the layer and peripheral electroporation forms an electric capacity.
22, innovation syndeton as claimed in claim 21 is characterized in that, the described first electrical layer is a signals layer, ground plane or bus plane; The described second electrical layer is a signals layer, ground plane or bus plane.
23, innovation syndeton as claimed in claim 21 is characterized in that, enclosing electroporation in described is signal perforation, ground connection perforation or power supply perforation; Described peripheral electroporation is signal perforation, ground connection perforation or power supply perforation.
24, innovation syndeton as claimed in claim 21, it is characterized in that, adjust the distance and the dielectric material that enclose in described between electroporation and the described peripheral electroporation, and enclose in described electroporation and described peripheral electroporation overlapping area, control the value of described electric capacity.
25, innovation syndeton as claimed in claim 21 is characterized in that, enclosing electroporation in described is column type or circular ring type.
26, innovation syndeton as claimed in claim 22 is characterized in that, described bus plane or described ground plane in an integrated circuit (IC) chip, are respectively power grid or earth grid.
27, innovation syndeton as claimed in claim 21 is characterized in that, describedly piles up electrical layer and also comprises more than one the 3rd electrical layer, and separate with dielectric layer between the adjacent electrical layer, to form sandwich construction; Enclose in described electroporation with wherein one electrically layer is connected, described peripheral electroporation is connected with other electrical layer, encloses electroporation in described not to be connected each other with described peripheral electroporation.
28, innovation syndeton as claimed in claim 27 is characterized in that, encloses the dielectric material that electroporation and described peripheral electroporation are arranged in sandwich construction in described.
29, a kind of innovation syndeton is characterized in that it comprises:
One piles up electrical layer, and it from top to bottom comprises electrically layer of the first electrical layer, dielectric layer and second at least;
At least two electroporations, be arranged in described electrical layer and the intermeshing of piling up, and described two electroporations connect different described electrical layers respectively, the wherein said first electrical layer is not connected to each other with described second electrical layer, makes described two electroporations between described two electrical layers form the slotting formula electric capacity of a finger.
30, innovation syndeton as claimed in claim 29 is characterized in that, the described first electrical layer is a signals layer, ground plane or bus plane; The described second electrical layer is a signals layer, ground plane or bus plane.
31, innovation syndeton as claimed in claim 29 is characterized in that, described electroporation is signal perforation, ground connection perforation or power supply perforation.
32, innovation syndeton as claimed in claim 29 is characterized in that, described electroporation is circle, square, rectangle or polygon.
33, innovation syndeton as claimed in claim 29 is characterized in that, described electroporation is arranged in the dielectric material of described syndeton.
34, innovation syndeton as claimed in claim 29, it is characterized in that, describedly pile up electrical layer and also comprise the more than one the 3rd electrical layer, and separate with dielectric layer between the adjacent electrical layer, to form sandwich construction, and have at least two described electroporations to connect with different electrical layers respectively, and described at least two electroporations do not connect each other.
35, as claim 29 or 34 described innovation syndetons, it is characterized in that, adjust between distance, dielectric material and described at least two electroporations between described at least two electroporations overlapping area, control the value that described finger is inserted formula electric capacity.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/986,323 US8153906B2 (en) | 2007-01-10 | 2007-11-20 | Interconnection structure for improving signal integrity |
| US11/986,323 | 2007-11-20 |
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| CN101442877A true CN101442877A (en) | 2009-05-27 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194895A (en) * | 2010-03-16 | 2011-09-21 | 炬力集成电路设计有限公司 | Integrated circuit and capacitor therein |
| CN112074080A (en) * | 2019-06-11 | 2020-12-11 | 佳能株式会社 | Printed circuit board, printed wiring board, electronic device, and image forming apparatus |
| TWI805166B (en) * | 2021-12-30 | 2023-06-11 | 創意電子股份有限公司 | Circuit board device |
| DE102022213006A1 (en) | 2022-12-02 | 2024-06-13 | Zf Friedrichshafen Ag | Power module for a converter with separate circuit board for control signal routing |
-
2008
- 2008-04-29 TW TW097115657A patent/TWI372491B/en active
- 2008-06-25 CN CN 200810127522 patent/CN101442877B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194895A (en) * | 2010-03-16 | 2011-09-21 | 炬力集成电路设计有限公司 | Integrated circuit and capacitor therein |
| CN112074080A (en) * | 2019-06-11 | 2020-12-11 | 佳能株式会社 | Printed circuit board, printed wiring board, electronic device, and image forming apparatus |
| CN112074080B (en) * | 2019-06-11 | 2023-07-18 | 佳能株式会社 | Printed circuit board, printed wiring board, electronic device, and image forming apparatus |
| TWI805166B (en) * | 2021-12-30 | 2023-06-11 | 創意電子股份有限公司 | Circuit board device |
| DE102022213006A1 (en) | 2022-12-02 | 2024-06-13 | Zf Friedrichshafen Ag | Power module for a converter with separate circuit board for control signal routing |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI372491B (en) | 2012-09-11 |
| CN101442877B (en) | 2011-05-18 |
| TW200924300A (en) | 2009-06-01 |
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