CN101442013A - Circuit module and manufacturing method thereof - Google Patents

Circuit module and manufacturing method thereof Download PDF

Info

Publication number
CN101442013A
CN101442013A CNA200810177752XA CN200810177752A CN101442013A CN 101442013 A CN101442013 A CN 101442013A CN A200810177752X A CNA200810177752X A CN A200810177752XA CN 200810177752 A CN200810177752 A CN 200810177752A CN 101442013 A CN101442013 A CN 101442013A
Authority
CN
China
Prior art keywords
circuit module
mentioned
sealant
outside terminal
cob structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200810177752XA
Other languages
Chinese (zh)
Inventor
足立节哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsumi Electric Co Ltd
Original Assignee
Mitsumi Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsumi Electric Co Ltd filed Critical Mitsumi Electric Co Ltd
Publication of CN101442013A publication Critical patent/CN101442013A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Abstract

The invention is to provide a circuit module with miniaturization realizable COB structure. The invention provides a method for manufacturing a circuit module with COB structure of installing an electronic component including naked chip and a terminal for external connection connected to the electronic component on a substrate and sealing the electronic component with sealing agent, the method is characterized by comprising steps of: installing the electronic component and the terminal for external connection on the substrate; sealing the electronic component and the terminal for external connection with the sealing agent; and exposing the terminal for external connection.

Description

The manufacture method of circuit module and circuit module
Technical field
The present invention relates to have the circuit module and the manufacture method thereof of so-called COB structure.
Background technology
Up to now, in the circuit module that requires miniaturization of the battery protecting circuit module of the battery that protection is used as the power supply of carrying device etc., used the printed base plate of (chip on the plate) structure that has so-called COB.So-called COB structure, be the bare chip that IC, FET etc. directly are installed on the printed base plate and with the lead-in wire bonding with after wiring pattern on the printed base plate is connected with resin-sealed structure.By adopting the COB structure, can realize miniaturization, the slimming of circuit module.
Figure 22 is the profile that illustration has the circuit module of former COB structure.In Figure 22, the 10th, circuit module, 11a are substrates, the 12nd, wiring pattern, the 13rd, the scolder resist, the 14th, fixative, the 15th, IC bare chip, 15a are bonding wires, the 16th, paste scolding tin, the 17th, sheet component, the 18th, outside terminal for connecting, the 19th, resin.
In the circuit module of in Figure 22, representing 10, on substrate 11a, formed wiring pattern 12, formed on the wiring pattern 12 with part (hereinafter referred to as pad (pad)) that the institute mounted component is electrically connected in have the scolder resist 13 of peristome.On scolder resist 13, utilize fixative 14 to fix IC bare chip 15, utilize bonding wire 15a to be connected with corresponding bonding pad through the lead-in wire bond sequence.The paste scolding tin 16 that sheet component 17 and outside terminal for connecting 18 print on corresponding bonding pad through the reflow process utilization has carried out soldering.
Resin 19 has sealed IC bare chip 15 etc. in the mode of the integral body of exposing outside terminal for connecting 18.Have, L1 represents the interval of outside terminal for connecting 18 and the installing component of sheet component 17 grades that approach outside terminal for connecting 18 configurations most again.L1 for example is about 1.5mm.The interval of the part that approaches outside terminal for connecting 18 most of the resin 19 after L2 represents outside terminal for connecting 18 and solidifies.L2 for example is about 0.5mm.
Figure 23 is the vertical view that is illustrated in the circuit module with former COB structure that forms on the assembly substrate.In the figure, about with Figure 22 be same parts, attached with prosign, omit its explanation.In Figure 23, the 11st, assembly substrate, A and B are illustrated in the position of cutting apart assembly substrate in the operation of back.In addition, assembly substrate 11 be in manufacturing process described later by cutting the substrate that becomes substrate 11a in A and B punishment, on assembly substrate 11, formed a plurality of (27 in this case) circuit module 10.It is characterized in that: sealed installing component except that outside terminal for connecting 18 with sealant 19, whole part of outside terminal for connecting 18 is exposed from sealant 19.
Figure 24～Figure 27 is the figure of the manufacturing process of the circuit module of illustration with former COB structure.In the figure, about with Figure 22 and Figure 23 be same parts, attached with prosign, omit its explanation.Figure 24～Figure 27 be along form on the assembly substrate shown in Figure 23 11 have before the profile of E-E line of circuit module 10 of COB structure.In Figure 24, utilize bonding wire 15a to be connected in the pad portion that does not form scolder resist 13 of the wiring pattern 12 that on assembly substrate 11, forms to utilize on the scolder resist 13 the fixing IC bare chip 15 of fixative 14, utilize the paste scolding tin 16 that in pad portion, prints sheet component 17 and outside terminal for connecting 18 to be carried out soldering through reflow process.That is, be the state that carries out before the sealing that obtains by resin 19.
In the operation of in Figure 25, representing, the scraper plate 21 that is used to expose the mask 20 of outside terminal for connecting 18 when utilizing resin 19 to seal and is used for printing resin 19 is installed in the structure of representing in Figure 24.At this, as shown in Figure 25, mask 20 is installed in the installing component of sheet component 17 grades of utilizing resin 19 sealings in the operation of back and the outside terminal for connecting 18 that exposes from resin 19 between.Secondly, in the operation of in Figure 26, representing, scraper plate 21 is moved, in the direction of arrow from the upside printing resin 19 of mask 20.Secondly, in the operation of in Figure 27, representing, take off mask 20 and scraper plate 21.The interval of the part that approaches outside terminal for connecting 18 most of the resin 19 before L3 represents outside terminal for connecting 18 and solidifies is arranged again.
After the operation of representing among Figure 27, the structure of representing among heating Figure 27 solidifies resin 19, moreover, by closing substrate 11, make the circuit module of representing among Figure 22 10 (for example, with reference to patent documentation 1) at A and not shown B part cut set.Have again, till solidify to resin 19 after the operation of Figure 27, because the resin 19 before solidifying externally terminal for connecting 18 1 sides hangs down, so in the circuit module of in Figure 22, representing 10, outside terminal for connecting 18 with solidify after resin 19 the part that approaches outside terminal for connecting 18 most interval L2 than outside terminal for connecting 18 with solidify before the interval L3 (with reference to Figure 27) of the part that approaches outside terminal for connecting 18 most of resin 19 narrow.
[patent documentation 1] spy opens the 2004-304019 communique
But, in the manufacturing process of the circuit module of the COB structure before having, owing to be necessary between (with reference to Figure 25) such as installation masks 20 with the installing component of sheet component 17 grades of resin 19 sealing and the outside terminal for connecting 18 that exposes from resin 19, so consider the thickness of mask 20, offset during the installation of mask 20, hanging down etc. of resin 19 before the above-mentioned curing, the interval L1 of outside terminal for connecting 18 and the installing component of sheet component 17 grades that approach outside terminal for connecting 18 configurations most must be set at big fully value, have the problem of the miniaturization that hinders circuit module with COB structure.
Summary of the invention
The present invention carries out in view of the above-mentioned problems, and its purpose is to provide circuit module and the manufacture method thereof with the COB structure that can realize miniaturization.
In order to achieve the above object, the 1st aspect of the present invention be a kind of have at substrate (110) the outside terminal for connecting (180) that comprises the electronic unit (150 and 170) of bare chip (150) and is electrically connected with above-mentioned electronic unit (150 and 170) has also sealed the COB structure of above-mentioned electronic unit (150 and 170) with sealant (190) circuit module (100 go up to be installed, 300,400) manufacture method, it is characterized in that having following operation: go up the installation procedure that above-mentioned electronic unit (150 and 170) and said external terminal for connecting (180) are installed at aforesaid substrate (110); Seal the sealing process of above-mentioned electronic unit (150 and 170) and said external terminal for connecting (180) with sealant (190); And make the operation of exposing that said external terminal for connecting (180) exposes.
The 2nd aspect of the present invention is the manufacture method of the circuit module (100,300,400) relevant with the 1st aspect of the present invention, it is characterized in that: the above-mentioned operation of exposing exposes go up facial (180a) of said external terminal for connecting (180) by a part of removing above-mentioned sealant (190).
The 3rd aspect of the present invention is the manufacture method of the circuit module (100,300,400) relevant with the 1st aspect of the present invention, it is characterized in that: the above-mentioned operation of exposing exposes the side surface part (180b) of said external terminal for connecting (180) by cutting off above-mentioned sealant (190) and said external terminal for connecting (180).
The 4th aspect of the present invention is the manufacture method of the circuit module (100,300,400) relevant with the 1st aspect of the present invention, it is characterized in that: also had the covering process that covers said external terminal for connecting (180) with cladding material (310) before above-mentioned sealing process.
The 5th aspect of the present invention is the manufacture method of the circuit module (100,300,400) relevant with the 4th aspect of the present invention, it is characterized in that: an above-mentioned part and above-mentioned cladding material (310) go up facial (180a) that make said external terminal for connecting (180) of operation by removing above-mentioned sealant (190) that expose exposes.
The 6th aspect of the present invention is the manufacture method of the circuit module (100,300,400) relevant with the of the present invention the 4th or the 5th aspect, and it is characterized in that: above-mentioned cladding material (310) is an adhesive tape.
The 7th aspect of the present invention be a kind of have at substrate (110) the outside terminal for connecting (180) that comprises the electronic unit (150 and 170) of bare chip (150) and is electrically connected with above-mentioned electronic unit (150 and 170) has also sealed the COB structure of above-mentioned electronic unit (150 and 170) with sealant (190) circuit module (100,300,400) go up to be installed, it is characterized in that:, only expose the part of said external terminal for connecting (180) from above-mentioned sealant (190) with above-mentioned sealant (190) sealing said external terminal for connecting (180).
Have, understanding becomes adds the reference marks in the above-mentioned parantheses easily in order to make, but is an example, is not that the mode that is illustrated limits again.
According to the present invention, can provide circuit module and manufacture method thereof with the COB structure that can realize miniaturization.
Description of drawings
Fig. 1 is the profile that illustration has the circuit module of the COB structure relevant with the 1st execution mode of the present invention.
Fig. 2 is the vertical view that is illustrated in the circuit module with COB structure relevant with the 1st execution mode of the present invention that forms on the assembly substrate.
Fig. 3 is the figure (its 1) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Fig. 4 is the figure (its 2) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Fig. 5 is the figure (its 3) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Fig. 6 is the figure (its 4) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Fig. 7 is the figure (its 5) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Fig. 8 is the figure (its 6) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Fig. 9 is the figure (its 7) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Figure 10 is the figure (its 8) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Figure 11 is the figure (its 9) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Figure 12 is the figure (its 10) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.
Figure 13 is the profile that illustration has the circuit module of the COB structure relevant with the 2nd execution mode of the present invention.
Figure 14 is the figure (its 1) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 2nd execution mode of the present invention.
Figure 15 is the figure (its 2) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 2nd execution mode of the present invention.
Figure 16 is the figure (its 3) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 2nd execution mode of the present invention.
Figure 17 is the figure (its 4) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 2nd execution mode of the present invention.
Figure 18 is the profile that illustration has the circuit module of the COB structure relevant with the 3rd execution mode of the present invention.
Figure 19 is the vertical view that is illustrated in the circuit module with COB structure relevant with the 3rd execution mode of the present invention that forms on the assembly substrate.
Figure 20 is the figure (its 1) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 3rd execution mode of the present invention.
Figure 21 is the figure (its 2) of the manufacturing process of the circuit module of illustration with COB structure relevant with the 3rd execution mode of the present invention.
Figure 22 is that illustration has the profile with the circuit module of former COB structure.
Figure 23 is the vertical view that is illustrated in having of forming on the assembly substrate and the circuit module of former COB structure.
Figure 24 is that illustration has the figure (its 1) with the manufacturing process of the circuit module of former COB structure.
Figure 25 is that illustration has the figure (its 2) with the manufacturing process of the circuit module of former COB structure.
Figure 26 is that illustration has the figure (its 3) with the manufacturing process of the circuit module of former COB structure.
Figure 27 is that illustration has the figure (its 4) with the manufacturing process of the circuit module of former COB structure.
Embodiment
Following with reference to accompanying drawing, be used to implement the explanation of the mode of the best of the present invention.
(the 1st execution mode)
Fig. 1 is the profile that illustration has the circuit module of the COB structure relevant with the 1st execution mode of the present invention.In Fig. 1, the 100th, circuit module, 110a are substrates, the 120th, wiring pattern, the 130th, scolder resist, the 140th, fixative, the 150th, IC bare chip, the 160th, paste scolding tin, the 170th, sheet component, the 180th, outside terminal for connecting, 180a are that going up of outside terminal for connecting is facial, 190a is a sealant, and 190b is that sealant 190a is ground (hemisect) and becomes the part of the shape that reduces one deck.
In the circuit module of in Fig. 1, representing 100, on substrate 110a, formed wiring pattern 120, formed on the wiring pattern 120 with part (hereinafter referred to as pad) that the institute mounted component is electrically connected in have the scolder resist 130 of peristome.Utilize fixative 140 on scolder resist 130, to fix IC bare chip 150.Utilize bonding wire 150a IC bare chip 150 to be electrically connected with corresponding bonding pad through the lead-in wire bond sequence.The paste scolding tin 160 that sheet component 170 and outside terminal for connecting 180 print on corresponding bonding pad through the reflow process utilization carries out soldering.Sealant 190a has sealed IC bare chip 150 etc. in the mode of the last facial 180a that exposes outside terminal for connecting 180.
Have, L4 represents the interval of outside terminal for connecting 180 and the installing component of sheet component 170 grades that approach outside terminal for connecting 180 configurations most again.L4 for example is about 0.5mm, than in Figure 22, represent have before the circuit module 10 of COB structure in L1 (about 1.5mm) short.In addition, in the circuit module of representing in Fig. 1 100, the part of the 190b of sealant 190a is ground (hemisect), and the part of 190b becomes the shape that reduces one deck, and the last facial 180a of outside terminal for connecting 180 exposes from sealant 190.
Fig. 2 is the vertical view that is illustrated in the circuit module with COB structure relevant with the 1st execution mode of the present invention that forms on the assembly substrate.In the figure, about with Fig. 1 be same parts, attached with prosign, omit its explanation.In Fig. 2, the 110th, assembly substrate, A, a, B and b are illustrated in the split position of cutting apart assembly substrate 110 in the operation of back, and A and B are the outermost split positions that is positioned at assembly substrate 110.In addition, assembly substrate 110 is to cut the substrate that becomes substrate 110a by punishing in A, a, B and b portion in manufacturing process described later, has formed a plurality of (in this case, being 36) circuit module 100 on assembly substrate 110.If the vertical view of representing among the vertical view of representing among Fig. 2 and Figure 23 relatively, then it is characterized in that, sealed the whole installing component that comprises outside terminal for connecting 180 with sealant 190a, had only the last facial 180a of outside terminal for connecting 180 to expose from sealant 190a.
Fig. 3～Figure 12 is the figure of the manufacturing process of the circuit module of illustration with COB structure relevant with the 1st execution mode of the present invention.In Fig. 3～Figure 12, about with Fig. 1 be same parts, attached with prosign, omit its explanation.Fig. 3～Figure 12 is the profile along the C-C line of the circuit module 100 with COB structure relevant with the 1st execution mode of the present invention of formation on assembly substrate shown in Figure 2 110.Have again, in Fig. 3～Figure 12, between A portion and A portion, have 4 circuit modules 100, but for convenience's sake, only illustrate 1 and illustrate.
Beginning, in the operation of in Fig. 3, representing, preparation formed the wiring pattern 120 of regulation and formed with pad portion that mounted component in the operation in the back on wiring pattern 120 is electrically connected in have the assembly substrate 110 of the scolder resist 130 of peristome, with operation in the back in install in the position corresponding bonding pad part of sheet component 170 and outside terminal for connecting 180 and print paste scolding tin 160.As assembly substrate 110, for example can use glass epoxy substrate etc.The thickness of assembly substrate 110 for example can be decided to be 0.30mm～0.8mm.As wiring pattern 120, can use Cu etc.As the thickness of wiring pattern 120, for example can be decided to be 35 μ m.Also can plate Au etc. to each pad portion.
Secondly, in the operation of in Fig. 4, representing, in the part of having printed paste scolding tin 160, utilize the fitting machine of regulation that sheet component 170 and outside terminal for connecting 180 (installation procedure 1) are installed.Sheet component 170 for example is pellet resistance, chip capacitor, flake thermistor etc.Outside terminal for connecting 180 for example can use Ni etc.Put into the reflow ovens of regulation with the structure of representing among Fig. 4 of sheet component 170 and outside terminal for connecting 180 has been installed, utilize paste scolding tin 160 be electrically connected each pad portion with the corresponding sheet component 170 of each pad portion and the bonding land part of outside terminal for connecting 180.
Secondly, in the operation of in Fig. 5, representing, with the operation of back in coating fixative 140 on the corresponding scolder resist 130 in the position of IC bare chip 150 is installed.As fixative 140, for example can use heat-curing resin of epoxy resin etc. etc.Secondly, in the operation of in Fig. 6, representing, on fixative 140, utilize the fitting machine of regulation that IC bare chip 150 (installation procedures 2) are installed.After installation, use baking oven that fixative 140 is solidified.Secondly, in the operation of representing in Fig. 7, the bonding that goes between partly is electrically connected IC bare chip 150 with corresponding bonding pad with bonding wire 150a.As bonding wire 150a, for example can use Au lead-in wire etc.
Secondly, in the operation of in Fig. 8, representing, in the operation in the back of a side of the parts that the structure of representing among Fig. 7 has been installed, carry out the outside of the A portion that substrate cuts apart mask 200 is installed.In addition, at the upside of mask 200 scraper plate 210 (sealing process 1) that is used for printing and sealing agent 190 is installed.At this moment, different with the manufacturing process of circuit module with former COB structure, owing to comprise the mode printing and sealing agent 190 of whole parts of outside terminal for connecting 180 with covering, so between the installing component of sheet component 170 grades and outside terminal for connecting 180, there is no need to install mask 200, the outside terminal for connecting 180 and the interval L4 of the installing component of sheet component 170 grades that approach outside terminal for connecting 180 configurations are most narrowed down, can realize having the miniaturization of the circuit module of COB structure.
Secondly, in the operation of in Fig. 9, representing, scraper plate 210 is moved, in the direction of arrow from the upside printing and sealing agent 190 (sealing process 2) of mask 200.As sealant 190, for example can use the Hot curable resin of epoxy resin etc. or UV resin etc.Secondly, in the operation of in Figure 10, representing, take off mask 200 and scraper plate 210, make sealant 190 solidify (sealing process 3).Secondly, in the operation of representing in Figure 11, the part of using cutter, food slicer to grind the 190b of (hemisect) sealant 190 is exposed (exposing operation 1) up to the last facial 180a of outside terminal for connecting 180.Have, sealant 190a grinds (hemisect) sealant 190 and obtains again.In addition, H1 represents from the bottom of assembly substrate 110 to the height of the last facial 180a of outside terminal for connecting 180.
Secondly, in the operation of in Figure 12, representing, by using cutter, food slicer 220 to close substrate 110, be manufactured on the circuit module of representing among Fig. 1 100 with COB structure relevant with the 1st execution mode of the present invention in A portion and not shown a, B and b portion punishment cut set.The manufacturing process that represents in wishing carry out Fig. 6 to Figure 10 in clean room is arranged again.
Like this, manufacture method according to circuit module with COB structure relevant with the 1st execution mode of the present invention, owing to comprise the mode printing and sealing agent 190 of whole parts of outside terminal for connecting 180 with covering, terminal for connecting 180 and approach most to there is no need to install mask 200 between the installing component of sheet component 170 etc. of outside terminal for connecting 180 configurations externally, so can make outside terminal for connecting 180 narrower than the L1 in the manufacture method of circuit module, can realize having the miniaturization of the circuit module of COB structure with former COB structure with the interval L4 of the installing component of sheet component 170 grades that approach 180 configurations of outside terminal for connecting most.In addition, miniaturization according to circuit module with COB structure, owing to make the quantity of the circuit module that can make from a slice assembly substrate increase (with reference to Fig. 2 and Figure 23),, can realize having the cost degradation of the circuit module of COB structure so can reduce the circuit module unit price of (substrate is cut apart afterwards).
Moreover, in the manufacture method of the circuit module of the COB structure before having, the height of outside terminal for connecting 180 produces deviation because of the amount of the paste scolding tin 160 that outside terminal for connecting 180 carried out soldering or wetability etc., but manufacture method according to circuit module with COB structure relevant with the 1st execution mode of the present invention, the part on the top of outside terminal for connecting 180 comprises assembly substrate 110 so make easily owing to prune when the sealant 190 on the top of grinding (hemisect) outside terminal for connecting 180, wiring pattern 120, the total thickness of paste scolding tin 160 and outside terminal for connecting 180, promptly the height H 1 from the bottom of assembly substrate 110 to the last facial 180a of outside terminal for connecting 180 is constant.
(the 2nd execution mode)
Figure 13 is the profile that illustration has the circuit module of the COB structure relevant with the 2nd execution mode of the present invention.In the circuit module of in Figure 13, representing 300, about with Fig. 1 be same parts, attached with prosign, omit its explanation.The part different with Fig. 1 is that the last facial 180a of outside terminal for connecting 180 is positioned at than the low position of sealant 190a on every side that covers outside terminal for connecting 180.This is owing to after the part of the 190b that grinds (hemisect) sealant 190a, removed the cladding material 310 of the last facial 180a that covers outside terminal for connecting 180.
Vertical view and Fig. 2 of the circuit module 300 of the COB structure relevant with the 2nd execution mode of the present invention that forms on assembly substrate 110 are same.In addition, if compare with the vertical view of representing among Figure 23, also be same aspect following characteristics: sealed the whole installing component that comprises outside terminal for connecting 180 with sealant 190a, only exposed the last facial 180a of outside terminal for connecting 180 from sealant 190a.
Figure 14～Figure 17 is the figure of the manufacturing process of the circuit module of illustration with COB structure relevant with the 2nd execution mode of the present invention.In Figure 14～Figure 17, about with Fig. 1 and Figure 13 be same parts, attached with prosign, omit its explanation.Figure 14～Figure 17 and Fig. 2 are same, are the profiles of the part of the C-C line among edge and Fig. 2 of the circuit module 300 with COB structure relevant with the 2nd execution mode of the present invention that forms on assembly substrate 110.Have again, in Figure 14～Figure 17, between A portion and A portion, have 4 circuit modules 300, but for convenience's sake, only illustrate 1 and illustrate.In addition, about the manufacturing process of circuit module with COB structure relevant with the 2nd execution mode of the present invention, the different part of manufacturing process of explanation and circuit module only with COB structure relevant with the 1st execution mode of the present invention.
Beginning, by the same processing of carrying out representing among Fig. 3～Fig. 7 in the manufacturing process with circuit module of operation with COB structure relevant with the 1st execution mode of the present invention, the structure of representing among formation Fig. 7.Secondly, in the operation of in Figure 14, representing, with the last facial 180a (covering process) of the outside terminal for connecting 180 of the structure of representing in cladding material 310 coverage diagrams 7.As cladding material 310, for example can use and utilize UV irradiation to make the UV adhesive tape that bonding force disappears or utilize the UV irradiation to make UV resin that bonding force disappears etc.As the UV adhesive tape, for example can use the UHP1525M3 (total thickness 175 μ m, the thick 25 μ m of bonding agent) of all excellent your flag (transliteration, trade name: ト-ヨ-ア De テ ッ Network) etc.
Secondly, by the same processing of carrying out representing among Fig. 8～Figure 10 in the manufacturing process with circuit module of operation, the structure of representing among formation Figure 15 with COB structure relevant with the 1st execution mode of the present invention.Secondly, in the operation of representing in Figure 16, the part of using cutter, food slicer to grind the 190b of (hemisect) sealant 190 is exposed (exposing operation 1) up to cladding material 310.Have again, because the precision height of cutter, food slicer, can set by the unit of about 1 μ m and grind height,, for example can grind (hemisect) cladding material 310 exactly up to the such position of 100 μ m of pruning so be about under the situation of 200 μ m at the thickness of cladding material 310.
Secondly, in the operation of in Figure 17, representing, remove cladding material 310.Utilize UV (ultraviolet ray) to make under the situation of UV adhesive tape that bonding force disappears for example using, to carry out UV and shine and remove cladding material 310 (exposing operation 2) as cladding material 310.Secondly, by the same processing of carrying out representing among the Figure 12 in the manufacturing process with circuit module of operation, make circuit module 300 with COB structure relevant with the 2nd execution mode of the present invention represented among Figure 13 with COB structure relevant with the 1st execution mode of the present invention.
Like this, manufacture method according to circuit module with COB structure relevant with the 2nd execution mode of the present invention, owing to similarly comprise the mode printing and sealing agent 190 of whole parts of outside terminal for connecting 180 with covering with the manufacture method of circuit module with COB structure relevant with the 1st execution mode of the present invention, owing to externally there is no need to install mask 200 between terminal for connecting 180 and the installing component that approaches sheet component 170 that outside terminal for connecting 180 disposes etc. most, so can make outside terminal for connecting 180 narrower than the L1 in the manufacture method of circuit module, can realize having the miniaturization of the circuit module of COB structure with former COB structure with the interval L4 of the installing component of sheet component 170 grades that approach 180 configurations of outside terminal for connecting most.In addition, miniaturization according to circuit module with COB structure, owing to make the quantity of the circuit module that can make from a slice assembly substrate increase (with reference to Fig. 2 and Figure 23),, can realize having the cost degradation of the circuit module of COB structure so can reduce the circuit module unit price of (substrate is cut apart afterwards).
Moreover, manufacture method according to circuit module with COB structure relevant with the 2nd execution mode of the present invention, because it is different with the manufacture method of circuit module with COB structure relevant with the 1st execution mode of the present invention, covered the last facial 180a of outside terminal for connecting 180 with cladding material 310, when grinding (hemisect) sealant 190, do not grind outside terminal for connecting 180, so can prevent the formation abrasion of the last facial 180a of outside terminal for connecting 180.
(the 3rd execution mode)
Figure 18 is the profile that illustration has the circuit module of the COB structure relevant with the 3rd execution mode of the present invention.In the circuit module of in Figure 18, representing 400, about with Fig. 1 be same parts, attached with prosign, omit its explanation.The part different with Fig. 1 is that the side surface part 180b of outside terminal for connecting 180 exposes from the sealant 190 on every side that covers outside terminal for connecting 180.This be because, as described later, sealant 190 and outside terminal for connecting 180 have been carried out full cutting in A portion and a portion.
Figure 19 is the vertical view that is illustrated in the circuit module with COB structure relevant with the 3rd execution mode of the present invention that forms on the assembly substrate.In the figure, about with Figure 18 be same parts, attached with prosign, omit its explanation.In Figure 19, the 110th, assembly substrate, A, a, B and b are illustrated in the split position of cutting apart assembly substrate 110 in the operation of back, and A and B are the outermost split positions that is positioned at assembly substrate 110.In addition, assembly substrate 110 is to cut the substrate that becomes substrate 110a by punishing in A, a, B and b portion in manufacturing process described later, has formed a plurality of (in this case, being 45) circuit module 400 on assembly substrate 110.
If the vertical view of representing among vertical view that will represent among Figure 19 and Fig. 2 and Figure 23 is compared, it is characterized in that outside terminal for connecting 180 (yet comprising facial 180a) does not expose from sealant 190 fully.In the operation of back, by cut (full cutting) assembly substrate 110 in A portion and the punishment of a portion, the side surface part 180b of outside terminal for connecting 180 exposes from the sealant 190 on every side that covers outside terminal for connecting 180.
Figure 20 and Figure 21 are the figure of the manufacturing process of the circuit module of illustration with COB structure relevant with the 3rd execution mode of the present invention.In Figure 20 and Figure 21, about with Figure 18 be same parts, attached with prosign, omit its explanation.Figure 20 and Figure 21 are the profiles along the part of D-D line of the circuit module 400 with COB structure relevant with the 3rd execution mode of the present invention that forms on the assembly substrate of representing in Figure 19 110.Have again, in Figure 20 and Figure 21, between A portion and A portion, have 5 circuit modules 400, but for convenience's sake, only illustrate 1 and illustrate.In addition, about the manufacturing process of circuit module with COB structure relevant with the 3rd execution mode of the present invention, the different part of manufacturing process of explanation and circuit module only with COB structure relevant with the 1st execution mode of the present invention.
Beginning, by the same processing of carrying out representing among Fig. 3～Figure 10 in the manufacturing process with circuit module of operation with COB structure relevant with the 1st execution mode of the present invention, the structure of representing among formation Figure 20.Secondly, in the operation of in Figure 21, representing, by using cutter, food slicer 220 partly to cut (full cutting) assembly substrate 110 in A portion and not shown a, B and b, be manufactured on the circuit module of representing among Figure 18 400 with COB structure relevant with the 3rd execution mode of the present invention.
As shown in Figure 21, in the manufacturing process of circuit module with COB structure relevant with the 3rd execution mode of the present invention, it is characterized in that, use cutter, food slicer 220 partly to cut (full cutting) assembly substrate 110 in A portion and not shown a, B and b, circuit module 400 is different with the 2nd execution mode with the 1st execution mode of the present invention, the last facial 180a of outside terminal for connecting 180 covers for sealed dose 190, and the side surface part 180b of outside terminal for connecting 180 exposes from sealant 190.Utilize the side surface part 180b of outside terminal for connecting 180 to be electrically connected with circuit module 400 and external circuit etc.
Like this, manufacture method according to circuit module with COB structure relevant with the 3rd execution mode of the present invention, owing to similarly comprise the mode printing and sealing agent 190 of whole parts of outside terminal for connecting 180 with covering with the manufacture method of circuit module with COB structure relevant with the 2nd execution mode with the 1st execution mode of the present invention, terminal for connecting 180 and approach most to there is no need to install mask 200 between the installing component of sheet component 170 etc. of outside terminal for connecting 180 configurations externally, so can make outside terminal for connecting 180 narrower than the L1 in the manufacture method of circuit module, can realize having the miniaturization of the circuit module of COB structure with former COB structure with the interval L4 of the installing component of sheet component 170 grades that approach 180 configurations of outside terminal for connecting most.
In addition, miniaturization according to circuit module with COB structure, owing to make the quantity of the circuit module that can make from a slice assembly substrate increase (with reference to Figure 19 and Figure 23),, can realize having the cost degradation of the circuit module of COB structure so can reduce the circuit module unit price of (substrate is cut apart afterwards).Moreover, owing to partly cut (full cutting) sealant 190 at A and a, so can cut down the use amount of the material that constitutes outside terminal for connecting 180, space efficiency improves simultaneously, so quantity (with reference to Fig. 2 and Figure 19) of the circuit module of can be further making from a slice assembly substrate, the unit price of circuit module (substrate cut apart back) can be further reduced, the further cost degradation of the circuit module of COB structure can be realized having.
Below understand preferred implementation of the present invention in detail, but the present invention is not restricted to above-mentioned execution mode,, can adds various distortion and displacement above-mentioned execution mode without departing from the scope of the invention.
For example; the present invention is as mentioned above applicable to the battery protecting circuit module of protection as the battery of the power supply use of carrying device; but so long as have the circuit module of the COB structure that possesses outside terminal for connecting; just be not limited to the battery protecting circuit module, also applicable to other circuit module.
In addition, in each execution mode, the example that mask 200 is installed in the outside of carrying out the A portion that substrate cuts apart for example has been described as shown in Figure 8 like that in the operation in the back of a side of the parts that the structure of representing among Fig. 7 has been installed, but also can be in the operation of back mask 200 be installed in the outside of carrying out the B portion that substrate cuts apart.
In addition, only in each execution mode, illustrated to have formed the example of the so-called single face substrate of wiring pattern, but the present invention can be applicable to similarly that also utilizing through hole to connect can become a plurality of layers so-called multilager base plate of wiring pattern as assembly substrate at single face.
In addition, the example that IC bare chip and sheet component are installed has been described on assembly substrate, but institute's mounted component is not limited to these parts in each execution mode, for example also can comprises FET or have the parts etc. of lead-in wire.
In addition, in each execution mode, illustrated and outside terminal for connecting has been installed and on the conductive part of corresponding bonding pad etc. by making outside terminal for connecting expose the example that is electrically connected that can carry out from sealant with the outside, but outside terminal for connecting is not necessarily necessary, for example, also can make following structures: in the 2nd execution mode, behind the conductive part that has covered pad that outside terminal for connecting is not installed etc. with cladding material, with sealant sealing and after sealant cures, remove sealant a part so that cladding material expose, and then conductive part is exposed by removing cladding material, can carry out and outside being electrically connected.At this moment, can be on the conductive part of pad etc. precoating solder flux, solder coating, plating Au etc.
In addition, example with facial 180a on the outside terminal for connecting of representing in cladding material 310 coverage diagrams 7 180 has been described in the 2nd execution mode in the operation of representing in Figure 14, but also following operation: before installation,, on assembly substrate 110, install face and be capped the outside terminal for connecting 180 that material 310 covers in advance with facial 180a on the outside terminal for connecting 180 of cladding material 310 coverings.
In addition, in the 2nd execution mode, also in the operation that can in Figure 14, represent externally terminal for connecting 180 on form film etc. on the facial 180a as cladding material 310, the part of using cutter, food slicer to grind the 190b of (hemisect) sealant 190 in the operation of in Figure 16, representing, expose up to cladding material 310, use the solvent to dissolve sealant 190a and can only dissolve cladding material 310 to remove cladding material 310 in the operation of in Figure 17, representing.

Claims (7)

1. the manufacture method of a circuit module, described circuit module has installs the COB structure that comprises the electronic unit and the outside terminal for connecting that is electrically connected with above-mentioned electronic unit of bare chip and sealed above-mentioned electronic unit with sealant on substrate, it is characterized in that having following operation:
The installation procedure of above-mentioned electronic unit and said external terminal for connecting is installed on aforesaid substrate;
Seal the sealing process of above-mentioned electronic unit and said external terminal for connecting with sealant; And
Make the operation of exposing that the said external terminal for connecting exposes.
2. the manufacture method of circuit module as claimed in claim 1 is characterized in that:
The above-mentioned operation of exposing exposes the last face of said external terminal for connecting by a part of removing above-mentioned sealant.
3. the manufacture method of circuit module as claimed in claim 1 is characterized in that:
The above-mentioned operation of exposing exposes the side surface part of said external terminal for connecting by cutting off above-mentioned sealant and said external terminal for connecting.
4. the manufacture method of circuit module as claimed in claim 1 is characterized in that:
Before above-mentioned sealing process, also has the covering process that covers the said external terminal for connecting with cladding material.
5. the manufacture method of circuit module as claimed in claim 4 is characterized in that:
An above-mentioned part and the above-mentioned cladding material last face that make said external terminal for connecting of operation by removing above-mentioned sealant that expose exposes.
6. as the manufacture method of claim 4 or 5 described circuit modules, it is characterized in that:
Above-mentioned cladding material is an adhesive tape.
7. circuit module has to install on substrate and comprises the electronic unit of bare chip and the outside terminal for connecting that is electrically connected with above-mentioned electronic unit and sealed the COB structure of above-mentioned electronic unit with sealant, it is characterized in that:
With above-mentioned sealant sealing said external terminal for connecting, only expose the part of said external terminal for connecting from above-mentioned sealant.
CNA200810177752XA 2007-11-19 2008-11-18 Circuit module and manufacturing method thereof Pending CN101442013A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007299763A JP2009129930A (en) 2007-11-19 2007-11-19 Circuit module, and manufacturing method of circuit module
JP2007299763 2007-11-19

Publications (1)

Publication Number Publication Date
CN101442013A true CN101442013A (en) 2009-05-27

Family

ID=40726372

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200810177752XA Pending CN101442013A (en) 2007-11-19 2008-11-18 Circuit module and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP2009129930A (en)
KR (1) KR100978552B1 (en)
CN (1) CN101442013A (en)
TW (1) TW200934332A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108695294A (en) * 2017-04-10 2018-10-23 株式会社京滨 Electronic control unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014462A (en) 2016-07-22 2018-01-25 キヤノン株式会社 Optical sensor, scanner unit, and image forming apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001024312A (en) * 1999-07-13 2001-01-26 Taiyo Yuden Co Ltd Manufacture of electronic device, the electronic device, and method for filling resin
JP4527991B2 (en) 2004-01-28 2010-08-18 株式会社日立製作所 Multi-chip module manufacturing method
JP4753642B2 (en) * 2005-07-04 2011-08-24 株式会社リコー Manufacturing method of electronic component mounting body
JP5458476B2 (en) * 2007-05-23 2014-04-02 株式会社デンソー Mold package and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108695294A (en) * 2017-04-10 2018-10-23 株式会社京滨 Electronic control unit

Also Published As

Publication number Publication date
KR20090051687A (en) 2009-05-22
KR100978552B1 (en) 2010-08-27
TW200934332A (en) 2009-08-01
JP2009129930A (en) 2009-06-11

Similar Documents

Publication Publication Date Title
TWI575670B (en) Semiconductor device including an independent film layer for embedding and/or spacing semiconductor die
US8012868B1 (en) Semiconductor device having EMI shielding and method therefor
CN1103499C (en) Radiation sheet for doing over again and replacing of lead-wire bonding chip and package structure thereof
US7851894B1 (en) System and method for shielding of package on package (PoP) assemblies
CN101221946B (en) Manufacture method of semiconductor package, system package module
CN101663926B (en) Component-incorporating module and its manufacturing method
CN100403544C (en) Camera module and mfg. method thereof
KR101177925B1 (en) Low profile wire bonded usb device
CN101192587B (en) Semiconductor device manufacturing method
CN102646606B (en) Packaging method of integrated circuit (IC) card module
CN102386106A (en) Partially patterned lead frames and methods of making and using the same in semiconductor packaging
US8508023B1 (en) System and method for lowering contact resistance of the radio frequency (RF) shield to ground
CN107195652A (en) Semiconductor device and its manufacture method
CN101083241A (en) Semiconductor device and its manufacturing method
EP0803901B1 (en) Method of mounting a plurality of semiconductor devices in corresponding supporters
CN101442013A (en) Circuit module and manufacturing method thereof
CN104241233A (en) A wafer level semiconductor package and a manufacturing method thereof
CN104347437A (en) Method of manufacturing semiconductor device
CN103165794B (en) Optical semiconductor device base station, its manufacture method and optical semiconductor device
CN217469903U (en) Embedded structure of filter module
CN104781925A (en) Discrete device mounted on substrate
CN1123931C (en) Manufacturing of electronic module
CN101728281A (en) Manufacturing method of circuit module
JP3793421B2 (en) Surface mount electronic circuit unit and method for manufacturing surface mount electronic circuit unit
TWI814839B (en) A multi-chip module (mcm) assembly and a printing bar

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090527