CN101420213A - Quartz crystal oscillator encapsulation construction - Google Patents
Quartz crystal oscillator encapsulation construction Download PDFInfo
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- CN101420213A CN101420213A CNA2008102038879A CN200810203887A CN101420213A CN 101420213 A CN101420213 A CN 101420213A CN A2008102038879 A CNA2008102038879 A CN A2008102038879A CN 200810203887 A CN200810203887 A CN 200810203887A CN 101420213 A CN101420213 A CN 101420213A
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- quartz crystal
- resilient coating
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- crystal oscillator
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Abstract
The invention relates to a quartz crystal oscillator encapsulating structure, comprising an encapsulating bottom layer, a wire layout layer which is arranged on the encapsulating bottom layer and divided into a first area and a second area; the first area is provided with at least a hole; the second area is provided with a pair of buffer layers; the quartz crystal oscillator encapsulating structure also comprises a quartz crystal with two ends respectively fixed on the buffer layers, a system chip which is arranged in the hole, a supporting layer which is arranged along the buffer layer and the circumference of the wire layout layer, and a cover body which is arranged on the supporting layer. The quartz crystal oscillator encapsulating structure greatly reduces the dimension and weight of the quartz crystal by the buffer layers which have short separation distance and are arranged on the wire layout layer so as to lighten the weight of the quartz crystal oscillator and increase the anti-impact performance and to reduce the whole preparation cost, and is suitable for applied to a mobile electronic device.
Description
Technical field
The invention belongs to electronic technology field, particularly relate to and a kind ofly have shock-resistant and quartz oscillator cheaply.
Background technology
Along with electronic industry is flourish, the analog circuit epoch have been evolved into the accurate logic digital circuits epoch, and just become indispensable key component as the sequence circuit of logic digital circuits heart.In sequence circuit, quartz oscillator is necessary key component, its applicable scope is such as information products such as consumer products, computer, hard disk such as digital TV, Game device, digital camera, wrist-watch, communication products such as mobile phone, radio telephone etc.Therefore, when various electronic products carry out evolution along with the hommization demand, how to make quartz oscillator meet the development of trend and have better running effect, become everybody urgent the pursuit.
As shown in Figure 1, it is the schematic diagram of present quartz oscillator structure.Quartz oscillator 10 includes a rectangle packaging bottom layer 12; One is positioned at the configuration layer 14 on the packaging bottom layer, has the hole 18 of a delivery system chip 16 on it; And be divided into configuration layer 14 rear and front end; in order to the front end resilient coating 22 and rear end resilient coating 24 that cushions a quartz crystal 20 suffered impulsive forces; wherein quartz crystal 20 is to utilize conducting resinl to be attached to front end resilient coating 22, and front end resilient coating 22 and rear end resilient coating 24 are in order to guarantee that quartz crystal 20 stable vibration and protection quartz crystals 20 avoid external impact.
But as shown in the figure, quartz crystal 20 is under the design that reaches stable vibration by front end resilient coating 22 and rear end resilient coating 24, and the size of quartz crystal 20 integral body will be bigger and weight is heavier.In addition, the frequency and the thickness of well known quartz crystal are inversely proportional to, and therefore when the high-frequency quartz crystal of needs, will be processed into as existing large scale to the relatively thin quartz crystal of thickness is the suitable degree of difficulty of tool.
Person more, under the quartz oscillator structure of prior art, fabrication steps needs the 18 built-in System on Chip/SoCs 16 of putting in the hole earlier, subsequently System on Chip/SoC 16 is finished routing with configuration layer 14 and engages, and then quartz crystal 20 is cemented on front end resilient coating 22, carry out dependence test at last again.But must note, when quartz crystal 20 is defective products, also consume the cost of a System on Chip/SoC 16 simultaneously, cause the waste on the cost.
Summary of the invention
Technical problem to be solved by this invention provides a kind of weight that can alleviate whole quartz oscillator, increases mechanical strength, the quartz oscillator that bears higher impact force.
The technical solution adopted for the present invention to solve the technical problems is: a kind of quartz crystal oscillator encapsulation construction is provided, comprise a rectangle packaging bottom layer, the configuration layer, the hole of delivery system chip, quartz crystal, the front end resilient coating of configuration layer rear and front end and rear end resilient coating, described configuration layer is positioned on the packaging bottom layer, it is divided into nonoverlapping first area and second area, has at least one hole on the first area, be formed with a pair of resilient coating on the second area, the two ends of quartz crystal are fixed on the resilient coating, delivery system chip in the hole, and System on Chip/SoC is by being wired on the configuration layer, outer periphery along resilient coating and configuration layer is equipped with supporting layer, and a lid is arranged on the supporting layer.
One becket is arranged between described supporting layer and lid, and described lid is sealed on the becket via electric welding.
Described lid is made by conductive metal sheet, is coated with coating insulation material on it.
The two ends of described quartz crystal are done dotted region with conducting resinl and are attached on the resilient coating, and are connected to internal terminal on the resilient coating by circuit.
The quantity of described dotted region is at least a bit between resilient coating and this quartz crystal.
Have internal terminal on the described resilient coating, be connected with quartz crystal.
The bottom surface of described packaging bottom layer has outside terminal.
Beneficial effect
A kind of quartz oscillator provided by the invention, the hole of the resilient coating of quartz crystal and place system chip is divided into the second area and the first area of configuration layer, resilient coating hypotelorism is set, the size of quartz crystal is less relatively, weight is also lighter, has reduced the cost of quartz crystal.In addition, can see through the modification of procedure, detect quartz crystal in advance, after the quartz crystal rejecting that will be bad, carry out the processing of System on Chip/SoC again, avoided because of quartz crystal bad, the waste of caused unnecessary System on Chip/SoC.Under the prerequisite of small size and low weight, improved the percentage of the shared quartz crystal entire area of quartz crystal part that is fixed on the resilient coating relatively, increased mechanical strength, therefore can bear higher impact force, be applicable on the electronic apparatus.
Description of drawings
Fig. 1 is the schematic diagram of the quartz oscillator structure of prior art.
Fig. 2 is the schematic perspective view of quartz oscillator of the present invention.
Fig. 3 is the cutaway view of quartz oscillator of the present invention.
Fig. 4 is the embodiment schematic diagram of quartz oscillator of the present invention.
Among the figure: 20 quartz crystals, 22 front end resilient coatings, 24 rear end resilient coatings, 30 quartz oscillators, 32 rectangle packaging bottom layer, 34 configuration layer 34a first area 34b second areas, 36 holes 38,10 quartz oscillators, 12 rectangle packaging bottom layer, 14 configuration layers, 16 System on Chip/SoCs, 18 hole, 38 ' resilient coating, 40 System on Chip/SoCs, 42 quartz crystals, 44 conducting resinls, 46 supporting layers, 48 beckets
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after the content of having read the present invention's instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Shown in Fig. 2,3, be schematic perspective view and its cutaway view of quartz oscillator of the present invention.As shown in the figure, quartz oscillator 30 of the present invention includes a rectangle packaging bottom layer 32, and its bottom surface has outside terminal; One is positioned at the configuration layer 34 on the packaging bottom layer 32, it is divided into two zones that do not overlap, (cutaway view of Fig. 3 demonstrates the regional extent of first area 34a and second area 34b to be respectively first area 34a and second area 34b, its scope can be according to follow-up resilient coating and hole size, and suitably adjust), have a hole 36 on the 34a of first area, be formed with a pair of resilient coating 38,38 ' on the second area 34b, its surface is provided with internal terminal, to be electrically connected to outside terminal; Be placed in the System on Chip/SoC 40 in hole 36, it is electrically connected on the configuration layer 34 by electric connection line; Quartz crystal 42 two ends utilize conducting resinl 44 to be attached on the resilient coating 38,38 ', and be electrically connected to internal terminal on the resilient coating 38,38 ', guarantee that by resilient coating 38,38 ' quartz crystal 42 stable vibration and protection quartz crystals 42 avoid external impact; Along resilient coating 38,38 ' and the configuration layer 34 peripheral supporting layer 46 that is provided with; Be positioned at the becket 48 on the supporting layer; And one be sealed in lid 50 on the becket via electric welding, and it is made by sheet metal, has shield effectiveness.
Shown in Fig. 2,3, because the present invention's resilient coating 38,38 ' is to be divided on the relative edge of configuration layer 34 second area 34b, therefore therefore the quartz crystal 42 of required use can reduce the weight of quartz crystal in the whole quartz oscillator significantly compared to existing relative dimensionally little a lot of with the quartz crystal 20 of rear end resilient coating 24 across front end resilient coating 22.
When needing the quartz oscillator of upper frequency, the cost of manufacture of high-frequency small size quartz crystal large scale quartz crystal under the same frequency is also relatively low, and the mechanical strength of quartz crystal itself is also higher.
In addition, because the present invention is located at quartz crystal 42 and resilient coating 38,38 ' on the second area 34b of configuration layer 34, System on Chip/SoC 40 is arranged at 34a on the first area of configuration layer 34, therefore, in the packaging and testing process, can earlier quartz crystal 42 be utilized conducting resinl 44 to be fixed on the resilient coating 38,38 ', test earlier, after confirming quartz crystal 42 normal operations, carry out the electric connection line encapsulation of System on Chip/SoC 40 again.So, can avoid prior art because of quartz crystal when bad, caused high price System on Chip/SoC waste.
As shown in Figure 4, be another embodiment schematic diagram of the present invention's quartz oscillator.Universal day by day in view of mobile electronic products such as cars on hand usefulness, the suffered external impacts of mobile electronic product is a big strict test of mobile electronic product especially, and the quartz oscillator that is applied to wherein is unexceptional especially.Therefore, the present invention's quartz oscillator is except the overall weight and size that alleviate whole quartz oscillator, more can stick together the position by setting up several conducting resinls 44 as shown in FIG., be fixed in the percentage of the shared quartz crystal entire area of quartz crystal on the resilient coating with raising, increase mechanical strength.
Claims (7)
1. quartz crystal oscillator encapsulation construction, comprise a rectangle packaging bottom layer, be positioned at the configuration layer on the packaging bottom layer, the hole of delivery system chip, the quartz crystal of resilient coating is fixed at two ends, it is characterized in that: described configuration layer (34) is positioned on the packaging bottom layer (32), it is divided into nonoverlapping first area (34a) and second area (34b), has at least one hole (36) on the first area (34a), be formed with a pair of resilient coating (38 on the second area (34b), 38 '), resilient coating (38 is fixed at the two ends of quartz crystal (42), 38 ') on, delivery system chip (40) in the hole (36), System on Chip/SoC (40) is connected on the configuration layer (34) by electric connection line, along resilient coating (38,38 ') outer periphery with configuration layer (34) is equipped with supporting layer (46), and a lid (50) is arranged on the supporting layer.
2. a kind of quartz crystal oscillator encapsulation construction according to claim 1 is characterized in that: between described supporting layer (46) and lid (50) becket (48) is arranged, described lid (50) is sealed on the becket via electric welding.
3. a kind of quartz crystal oscillator encapsulation construction according to claim 1 is characterized in that: described lid (50) is made by conductive metal sheet, is coated with coating insulation material on it.
4. a kind of quartz crystal oscillator encapsulation construction according to claim 1, it is characterized in that: the two ends of described quartz crystal (42) are done dotted region with conducting resinl (44) and are attached on the resilient coating (38,38 '), and are connected to internal terminal on the resilient coating (38,38 ') by circuit.
5. a kind of quartz crystal oscillator encapsulation construction according to claim 4 is characterized in that: the quantity of described dotted region is at least a bit between resilient coating and quartz crystal.
6. a kind of quartz crystal oscillator encapsulation construction according to claim 1 is characterized in that: have internal terminal on the described resilient coating, be connected with quartz crystal.
7. a kind of quartz crystal oscillator encapsulation construction according to claim 1 is characterized in that: the bottom surface of described packaging bottom layer has outside terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102038879A CN101420213A (en) | 2008-12-02 | 2008-12-02 | Quartz crystal oscillator encapsulation construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102038879A CN101420213A (en) | 2008-12-02 | 2008-12-02 | Quartz crystal oscillator encapsulation construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101420213A true CN101420213A (en) | 2009-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102038879A Pending CN101420213A (en) | 2008-12-02 | 2008-12-02 | Quartz crystal oscillator encapsulation construction |
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| Country | Link |
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| CN (1) | CN101420213A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101913551A (en) * | 2010-08-20 | 2010-12-15 | 台晶(宁波)电子有限公司 | Vacuum and airtight system integration and packaging structure |
| CN107276583A (en) * | 2017-06-16 | 2017-10-20 | 广东昕海科技有限公司 | Constant-temperature crystal oscillator |
-
2008
- 2008-12-02 CN CNA2008102038879A patent/CN101420213A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101913551A (en) * | 2010-08-20 | 2010-12-15 | 台晶(宁波)电子有限公司 | Vacuum and airtight system integration and packaging structure |
| CN107276583A (en) * | 2017-06-16 | 2017-10-20 | 广东昕海科技有限公司 | Constant-temperature crystal oscillator |
| CN107276583B (en) * | 2017-06-16 | 2023-08-25 | 广东昕海科技有限公司 | Constant temperature crystal oscillator |
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Open date: 20090429 |