CN207601835U - A kind of compound password card integrated system - Google Patents
A kind of compound password card integrated system Download PDFInfo
- Publication number
- CN207601835U CN207601835U CN201721444557.XU CN201721444557U CN207601835U CN 207601835 U CN207601835 U CN 207601835U CN 201721444557 U CN201721444557 U CN 201721444557U CN 207601835 U CN207601835 U CN 207601835U
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- CN
- China
- Prior art keywords
- microwave
- chip
- battery
- integrated system
- password card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 150000001875 compounds Chemical class 0.000 title claims abstract description 19
- 238000004891 communication Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 239000007888 film coating Substances 0.000 abstract 1
- 238000009501 film coating Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 2
- LAHWLEDBADHJGA-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 LAHWLEDBADHJGA-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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- Credit Cards Or The Like (AREA)
Abstract
The utility model discloses a kind of compound password card integrated systems, are related to password card technical field, include systems-on-a-chip integrated chip module (chip-scale SOC)；Compared with prior art, the advantageous effects that this programme has are：The technical solution that this programme is formed by using system integrated chip+flexible PCB, system integrated chip (SOC) is formed using systems-on-a-chip integrated chip module making, the advanced technologies such as attachment or binding can be taken on flexible PCB, ensure product reliability and integral thickness；After using SOC schemes, board area is significantly reduced, so as to reserve design space in battery capacity and ultrathin design.Process aspect can use IC card piece to produce encapsulation technology using after SOC schemes, can also take structure design, film coating technique after embedded circuit plate, so as to fulfill card thickness at 0.76 2.6 millimeters.
Description
Technical field
The utility model is related to password card technical fields, and in particular to a kind of compound password card integrated system.
Background technology
CPC (compound password card) integrates 5.8GHz and 13.56MHz communication functions, supports access information and path letter
Read-write capability is ceased, is issued to vehicle in close toll toll station entrance lane, exit lane is withdrawn reusable
Traffic Medium.Requirement is made that the size of card (length and width 85.5mmx54mm, thickness are not more than 5mm) simultaneously, is also required
The service life of card should be no less than 5 years, and very high requirement is proposed to card electric power system or battery.
Current CPC cards designing scheme has 5.8GHz frequency microwaves substantially using individual chips designing scheme in scheme
Double interface chip schemes of communication chip, MCU central control systems and 13.56MHz, chip independence and quantity is more on the whole,
The area for occupying pcb board is larger, and the installation space for keeping for battery is limited.At present the thickness of CPC cards substantially 3-5mm it
Between, occupied space passes through volume with respect to body paper matter or card is significantly increased, entrance is received and dispatched storage CPC spaces propose it is new
It is required that it needs to re-start transformation；Another limited space, card highly require, and the capacity of battery cannot be very big, leads to CPC cards
Service life be extremely difficult to 5 years, wait charging modes even with wireless, it is also bigger in the input of charging, management etc..
Invention content
For defect in the prior art, the purpose of this utility model is to provide it is a kind of product can be effectively ensured can
Significantly reduce by property, card thickness and compound password card integrated system that production efficiency is high.
To achieve the above object, the technical solution adopted in the utility model is as follows：
A kind of compound password card integrated system, the compound password card integrated system use systems-on-a-chip integrated chip module
It is made, which includes flexible PCB, the single on the flexible PCB
Piece, external devices, 13.56MHz radio-frequency coils, battery and 5.8GHz microwave antennas, microwave wake up antenna, wherein described
13.56MHz radio-frequency coils, battery and 5.8GHz microwave antennas, microwave wake up antenna and are connected respectively with the single-chip, should
Single-chip is the chip structure that microwave communication chip, MCU central control systems and double-interface card chip are packaged as a whole.
Further, the 13.56MHz radio-frequency coils and 5.8GHz microwave antennas, microwave wake up antenna and flexible electrical
Road plate is separate design, wherein the flexible PCB its with 5.8GHz microwave antennas, microwave wakes up antenna and battery connects
It is attached between mouthful using a kind of mode in welding, conducting resinl crimping or laser welding.
Further, empty avoiding and reinforcing rib design knot are used for installing the region of the battery on the flexible PCB
Structure.
Further, the battery is installed in parallel on the flexible PCB, itself and flexible circuit after battery is installed in place
Plate is in approximately the same plane or battery is covered to form integral planar by flexible board.
Further, the battery realizes that the two is in approximately the same plane with flexible PCB partially over filling leveling
On.
Further, the 13.56MHz radio-frequency coils are arranged in the battery circumferential periphery.
Further, the 5.8GHz microwave antennas and microwave wake up antenna to be designed to an overall structure.
Further, the 13.56MHz radio-frequency coils, 5.8GHz microwave antennas, microwave wake up antenna with it is described soft
Property circuit board is integrated design.
Compared with prior art, the advantageous effects that this programme has are：This programme by using system integrated chip+
The technical solution that flexible PCB is formed, system integrated chip (SOC) are formed using systems-on-a-chip integrated chip module making,
The advanced technologies such as attachment or binding can be taken on flexible PCB, ensure product reliability and integral thickness；Using SOC
After scheme, board area is significantly reduced, so as to reserve design space in battery capacity and ultrathin design.Process aspect exists
After SOC schemes, IC card piece can be used to produce encapsulation technology, can also take structure design, overlay film after embedded circuit plate
Technology, so as to fulfill card thickness at 0.76-2.6 millimeters.
Description of the drawings
Fig. 1 is the operation principle structure diagram of the systems-on-a-chip integrated chip module in the utility model.
Fig. 2 is that the compound password card in the utility model uses traditional assembling production technology production process schematic diagram.
Reference sign in figure：
100- systems-on-a-chip integrated chip modules, 101- flexible PCBs, 102- single-chips, 103- external devices,
104-5.8GHz microwave antennas, 105- batteries, 106-13.56MHz radio-frequency coils.
Specific embodiment
The utility model is described in further detail with specific embodiment with reference to the accompanying drawings of the specification.
The present embodiment provides a kind of compound password card integrated system, which uses systems-on-a-chip
Integrated chip module 100 (chip-scale SOC).Referring to shown in attached drawing 1, systems-on-a-chip integrated chip module 100 includes flexible
Circuit board 101, the single-chip 102 on the flexible PCB 101, external devices 103,13.56MHz radio-frequency coils 106,
Battery 105 and 5.8GHz microwave antennas 104, microwave wake up antenna, wherein 13.56MHz radio-frequency coils, 105 and of battery
5.8GHz microwave antennas 104, microwave wake up antenna and are connected respectively with single-chip 102, which is will be existing micro-
The chip structure that wave communication chip, MCU central control systems and double-interface card chip encapsulation design are integrated.Above-mentioned 5.8GHz
Microwave antenna 104 and microwave wake up antenna can also use integral structure during actual fabrication.
The design of existing individual chips is encapsulated on single-chip 102, can equally realize the various functions of CPC cards, outside
Electronic component in portion's device 103 is seldom, such as only needs a small amount of crystal, charging circuit and power supply circuit etc..Due to that will show
Some individual chip packages designs are on single-chip 102, therefore CPC is stuck in the card length and width requirement basis for meeting system design
On, understand and installed there are the space of bigger for battery, in order to which battery increases capacity and thinness design.In addition ensureing
In the case of 13.56MHz radio-frequency coils 106 and microwave receiving or wake-up 104 superperformance of antenna, it can increase as far as possible
105 size of 13.56MHz radio-frequency coils 106 and battery, so as to ensure making for the sound dealing of card, card recognition and card
Use the service life.
It should be noted that said chip grade SOC design scheme can be carried out according to follow-up different production technology
External interface encapsulates or integrated design.
13.56MHz radio-frequency coils 106,5.8GHz microwave antennas 104, microwave wake up antenna and flexible PCB can
To use integrated design, separation design structure can also be used.
For control card thickness, said chip grade SOC design scheme needs to be designed using flexible PCB, and outer
The connection of the peripheral components such as portion's interface antenna, battery may be used the technologies such as welding, conducting resinl crimping, laser welding and be attached
Or integrated design (not including battery).Card in process of production, using existing IC card piece batch production process for encapsulating, carries
High efficiency reduces production cost.Can certainly by the way of traditional assembling production technology (circuit board+assembling),
Referring to shown in attached drawing 2.It should be noted that；A, it needs to be designed according to flexible PCB in card structure design, battery position
Putting needs to carry out necessary empty avoiding and reinforcing rib design, should ensure that card integral thickness in the range of 0.76-2.6 millimeters；b、
The one side that the circuit board tested has device is directly tipped upside down in flexible circuit board structure, and fixed form can be positioning viscose glue etc.
Mode；C, battery install, the battery after installation should be in the one side without device on flexible PCB in approximately the same plane or
Battery covers to form integral planar by flexible board, and part also needs to be filled leveling in practice, to ensure the two
In approximately the same plane；D, buckle lid (soft, rigid film etc.) by modes such as viscose glue, ultrasounds, thickness at 0.1 millimeter or so,
To ensure integral thickness requirement within 0.76-2.6 millimeters.
Obviously, those skilled in the art can carry out the utility model various modification and variations without departing from this practicality
Novel spirit and scope.If in this way, these modifications and variations of the present invention belong to the utility model claims and
Within the scope of its equivalent technology, then the utility model is also intended to include these modifications and variations.
Claims (8)
1. a kind of compound password card integrated system, it is characterised in that：The compound password card integrated system uses systems-on-a-chip collection
It is formed into chip module making, which includes flexible PCB, mounted on the flexible circuit
Single-chip, external devices, 13.56MHz radio-frequency coils, battery and 5.8GHz microwave antennas, microwave on plate wake up day
Line, wherein the 13.56MHz radio-frequency coils, battery and 5.8GHz microwave antennas, microwave wake up antenna respectively with the list
Chip is connected, which is packaged as a whole microwave communication chip, MCU central control systems and double-interface card chip
Chip structure.
2. a kind of compound password card integrated system according to claim 1, it is characterised in that：The 13.56MHz radio frequency lines
It is separate design that circle and 5.8GHz microwave antennas, microwave, which wake up antenna and flexible PCB, wherein the flexible PCB
It is 5.8GHz microwave antennas, microwave is waken up between antenna and battery interface using welding, conducting resinl crimps or Laser Welding
A kind of mode in connecing is attached.
3. a kind of compound password card integrated system according to claim 1, it is characterised in that：It is used on the flexible PCB
Empty avoiding and reinforcing rib design structure are used in the region for installing the battery.
4. a kind of compound password card integrated system according to claim 1, it is characterised in that：The battery is installed in parallel in
On the flexible PCB, it is in flexible PCB in approximately the same plane after battery is installed in place or battery is covered by flexible board
Lid forms integral planar.
5. a kind of compound password card integrated system according to claim 4, it is characterised in that：The battery and flexible circuit
Plate realizes the two in approximately the same plane partially over filling leveling.
6. a kind of compound password card integrated system according to claim 1, it is characterised in that：The 13.56MHz radio frequency lines
Circle is arranged in the battery circumferential periphery.
7. a kind of compound password card integrated system according to claim 1, it is characterised in that：The 5.8GHz microwave receivings
Antenna and microwave wake up antenna to be designed to an overall structure.
8. a kind of compound password card integrated system according to claim 1, it is characterised in that：The 13.56MHz radio frequency lines
Circle, 5.8GHz microwave antennas, microwave wake up antenna and are integrated design with the flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721444557.XU CN207601835U (en) | 2017-11-02 | 2017-11-02 | A kind of compound password card integrated system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721444557.XU CN207601835U (en) | 2017-11-02 | 2017-11-02 | A kind of compound password card integrated system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207601835U true CN207601835U (en) | 2018-07-10 |
Family
ID=62757746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721444557.XU Expired - Fee Related CN207601835U (en) | 2017-11-02 | 2017-11-02 | A kind of compound password card integrated system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207601835U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11295982B2 (en) | 2019-06-11 | 2022-04-05 | International Business Machines Corporation | Forming ultra-thin chips for flexible electronics applications |
-
2017
- 2017-11-02 CN CN201721444557.XU patent/CN207601835U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11295982B2 (en) | 2019-06-11 | 2022-04-05 | International Business Machines Corporation | Forming ultra-thin chips for flexible electronics applications |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180710 |