CN101415502A - 在铜表面上制造图案的方法 - Google Patents

在铜表面上制造图案的方法 Download PDF

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CN101415502A
CN101415502A CNA2007800117085A CN200780011708A CN101415502A CN 101415502 A CN101415502 A CN 101415502A CN A2007800117085 A CNA2007800117085 A CN A2007800117085A CN 200780011708 A CN200780011708 A CN 200780011708A CN 101415502 A CN101415502 A CN 101415502A
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copper
organic
printing
print head
aqueous solution
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CN101415502B (zh
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戴维·萨沃西卡
安德鲁·M·克罗尔
史蒂文·A·卡斯塔尔迪
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MacDermid Inc
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041Digital printing on surfaces other than ordinary paper
    • B41M5/0047Digital printing on surfaces other than ordinary paper by ink-jet printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0041Digital printing on surfaces other than ordinary paper
    • B41M5/0058Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/18Acidic compositions for etching copper or alloys thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013Inkjet printing, e.g. for printing insulating material or resist
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本发明涉及一种在铜表面上制造图案的方法,描述了具有增加的分辨率的用液滴喷射印刷装置在铜或铜合金表面上印刷墨水或有机抗蚀剂的方法。增加的分辨率通过在铜表面上印刷之前,优选首先微蚀刻表面,而后用能降低铜表面的表面能或能使铜表面更疏水的有机物质处理铜表面来达到。此方法可用于制造电子电路。

Description

在铜表面上制造图案的方法
技术领域
本发明涉及一种在铜或铜合金的表面上形成图像或图案的方法。尤其是本发明涉及在已经被处理以改善液滴喷射技术的分辨率的铜或铜合金表面上用液滴喷射技术形成此图案。本方法特别适于形成印刷电路。
背景技术
由压电法、热喷射法或连续液滴喷射技术代表的液滴喷射技术已经公知用于普通印刷和图像生成很长时间了。然而,这些技术在印刷电路或半导体的成像上的应用是很近的事。在这点上,近来的尝试在U.S.6,861,377和U.S.2005/0095356 A1中进行了说明,每一个教示在此全部并入作为参考。
应用液滴喷射技术形成电路部件需要一些分辨率目标达到微米或亚微米范围的非常精细的分辨率。这些分辨率目标已经难于匹配当前的液滴喷射技术和设备。因此,已经付出实质的努力以改善这些技术的分辨率,特别在形成电子电路必须的铜表面上。
多种变量已知能影响液滴喷射技术的分辨率,其包括:印刷头设计、液滴尺寸、驱动印刷头的软件、印刷头对要印刷的表面的紧密度和被印刷的液体的特性。已经研究过每个前述因素用以尝试获得最大分辨率。然而,用这些技术形成电子电路中的分辨率目标不能令人满意。
本发明的一个目的是提供一种方法,当在铜或铜合金表面上印刷时,可改善液滴喷射技术的分辨率。
发明内容
在此,发明人发现如果优选微蚀刻铜或铜合金的表面,然后在铜表面上印刷之前,用能够降低铜表面的表面能或能够使铜表面更疏水的有机物质处理,那么可改善后来的印刷的分辨率。因此,公开了用于在含铜的表面上印刷的方法,此方法包括:
1.非强制选择地,但是优选,将表面与微蚀刻剂接触;
2.将表面与能够降低铜表面的表面能或能够使铜表面更疏水的有机物质的水溶液接触;和
3.用液滴喷射装置在表面上印刷。
本发明包含一种用于在含铜的表面上印刷的方法,所述方法包含:
1.非强制选择地,但是优选,将表面与微蚀刻剂接触;
2.将表面与能够降低铜表面的表面能或能够使铜表面更疏水的有机物质的水溶液接触;和而后
3.用液滴喷射装置通过在表面上印刷墨水或有机抗蚀剂而在表面上产生图像。
通常,用于本发明的铜或铜合金表面包含用于印刷电路板生产的覆铜箔层压板。这些层压板通常具有环氧、聚酰胺或其他类似树脂的固化芯材(有时用玻璃纤维补强),而铜箔层压在芯材的相对两侧上。此覆铜箔层压板公知用于印刷电路的制造。层压板可以是刚性的或挠性的。
非强制选择地,但是优选,将铜表面微蚀刻以在微尺度上粗化表面。微蚀刻剂通常是在印刷电路领域公知的。可用于本发明的典型的微蚀刻剂包括过氧化氢和硫酸的水溶液或过硫酸钠或过硫酸铵与硫酸的水溶液。微蚀刻剂的典型浓度为(i)过氧化氢10~100g/l、(ii)过硫酸钠25~250g/l和(iii)硫酸50~250g/l。也可应用其他已知的微蚀刻剂。
依据本发明,铜表面与能够降低铜表面的表面能或能够使铜表面更疏水的有机物质的水溶液接触。优选有机物质可以选自由脂肪酸、树脂酸和其混合物组成的组中。优选的脂肪酸包括妥尔油。优选的树脂酸包括由诸如松香酸的松木树脂得到的酸。这些脂肪酸和/或树脂酸溶于水中,将此溶液用于在印刷前涂布铜表面。优选以0.05~2.0g/l的浓度将有机表面溶于水中。优选将有机物质的水溶液的pH调节至7~14。在溶液中可包括多于一种有机物质。也可以将有机溶剂和有机的或无机的碱和酸添加到水溶液中。
可通过浸入、喷雾或溢流使铜表面与有机物质的水溶液接触。优选接触时间为15~30秒。接触温度优选为室温至170℉。一旦表面与有机物质接触,其优选用去离子水冲洗并鼓风干燥。此时,随时可在表面上印刷。
应用的印刷方法是液滴喷射技术,如压电法、热喷射法或连续液滴喷射。这些方法有时共同被称为喷墨印刷。对于这些不同的印刷技术的讨论,读者可参考美国第6,715,871号和第6,754,551号专利,其每一个教示在此全部并入作为参考。还可参考公开的美国第2005/0003645 A1号和第2005/0112906 A1号专利申请,其每一个教示在此全部并入作为参考。
发明人在此优选压电印刷技术,这利用MacDermid Colorspan,Inc.的印刷机,型号为Display Maker 72 UVR。用于上述型号的印刷头为压电喷墨头,规格如下:Ricoh Gen 3E1M96 Channel 30 pL滴体积,在80℃和20KHZ下操作,标称分辨率为600DPI。
可将喷墨打印机用于在表面上印刷墨水或有机抗蚀剂。墨水或有机抗蚀剂可以是热固化或对流固化类型,或者可以是光敏的并且用光化学辐射如紫外光固化。发明人在此优选紫外光可固化有机抗蚀剂。在任何情况下,待印刷的墨水或有机抗蚀剂优选在操作温度下具有5~15厘泊的粘度。
发明人在此优选用包含低聚物、单体和光引发剂的有机抗蚀剂印刷。
典型的低聚物包括聚氨酯丙烯酸酯、聚酯丙烯酸酯、环氧丙烯酸酯和酸性丙烯酸酯。
典型的单体包括单官能丙烯酸酯或多官能丙烯酸酯,如丙烯酸异冰片酯、二丙烯酸二缩三丙二醇酯、乙氧基化三羟甲基丙烯三丙烯酸酯和酸性酯。
可用的光引发剂包括苯乙酮如2-苄基-2-2(二甲氨基)-1-4-(4-吗啉基)苯基-1-丁酮、2-二甲氧基-2-苯基苯乙酮,噻吨酮如异丙基噻吨酮,和缩酮如苄基二甲基酮。在第6,322,952号、第6,475,702和第6,136,507号美国专利中公开了典型的光敏有机抗蚀剂组合物,其每一个教示在此全部并入。如果使用光敏有机抗蚀剂,通常优选将光化学辐射源,如紫外光,安装到支撑印刷头的支架上,以使固化过程在液滴被印刷后的短时间内发生。
发明人相信,在印刷之前,用本发明的方法处理铜表面可改变铜表面的表面性质,从而能使表面上具有较少散布的液滴的保持度增强,从而提高分辨率。
具体实施方式
下述实施例用以举例说明但不作为限制:
实施例1
取两片覆铜箔层压板。一片直接用MacDermid Colorspan型Display Maker 72 UVR印刷机和有机光敏抗蚀剂印刷成线和空间图案,其中所述抗蚀剂包含:
成分                                  重量百分比
Genomer 1122①                        17.39
Sartomer SR454②                      10.43
Sartomer SR306②                      17.43
Sartomer SR506②                      20.83
Sartomer CD9050②                     9.57
Sartomer CN147②                      13.51
Irgacure 369③                        1.74
Irgacure 907③                        6.96
Speedcure ITX④                       1.74
结晶紫染料                            0.40
1.购自Rahn USA Corp.
2.购自Sartomer Company
3.购自Ciba-Geigy Company
4.购自Aceto Chemical Corp.
分辨率通过显微镜肉眼检视确定约为15mil。图1是在第一片铜表面上的印刷线的显微照片。
第二片覆铜箔层压板在用与第一片相同的装置和有机抗蚀剂以相同的方式在其上印刷前,先用下述方法处理:
1.在90℉下,25g/l过氧化氢和100g/l硫酸的水溶液中微蚀刻2分钟。
2.用去离子水冲洗。
3.浸入pH为12的0.5g/l妥尔油水溶液中。
4.用去离子水冲洗。
5.鼓风干燥。
分辨率通过显微镜肉眼检视确定约为3mil。图2是在第二片铜表面上的印刷线的显微照片。

Claims (7)

1.一种在含铜的表面上印刷的方法,所述方法包含:
a.将该表面与包含从由脂肪酸、树脂酸和前述酸的混合物构成的组中选出的有机物质的水溶液接触,和然后
b.在该表面上用液滴喷射装置印刷墨水或有机抗蚀剂。
2.依据权利要求1的方法,其中该有机物质包含妥尔油。
3.依据权利要求1的方法,其中该墨水或有机抗蚀剂包含光敏有机抗蚀剂。
4.依据权利要求3的方法,其中该有机抗蚀剂的粘度为5~15厘泊。
5.依据权利要求1、2、3或4的任一项的方法,其中该表面在与有机防锈剂水溶液接触之前先与微蚀刻剂接触。
6.依据权利要求1、2、3或4的任一项的方法,其中该液滴喷射装置包含安装在可移动支架上的印刷头,并且其中该印刷头是从由压电印刷头、热喷射印刷头和连续液滴喷射印刷头构成的组中选出的。
7.依据权利要求6的方法,其中光化学辐射源也安装在该可移动支架上。
CN2007800117085A 2006-04-05 2007-02-27 在铜表面上制造图案的方法 Expired - Fee Related CN101415502B (zh)

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US11/398,080 US20070237899A1 (en) 2006-04-05 2006-04-05 Process for creating a pattern on a copper surface
US11/398,080 2006-04-05
PCT/US2007/005105 WO2007126516A2 (en) 2006-04-05 2007-02-27 Process for creating a pattern on a copper surface

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KR100733920B1 (ko) * 2004-09-17 2007-07-02 주식회사 엘지화학 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법

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ES2392274T3 (es) 2012-12-07
WO2007126516A3 (en) 2008-01-10
JP4850282B2 (ja) 2012-01-11
CN101415502B (zh) 2012-02-08
EP2001603A2 (en) 2008-12-17
US20070237899A1 (en) 2007-10-11
JP2009532205A (ja) 2009-09-10
EP2001603B1 (en) 2012-09-26
EP2001603A4 (en) 2011-11-16

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