CN101415502A - 在铜表面上制造图案的方法 - Google Patents
在铜表面上制造图案的方法 Download PDFInfo
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- CN101415502A CN101415502A CNA2007800117085A CN200780011708A CN101415502A CN 101415502 A CN101415502 A CN 101415502A CN A2007800117085 A CNA2007800117085 A CN A2007800117085A CN 200780011708 A CN200780011708 A CN 200780011708A CN 101415502 A CN101415502 A CN 101415502A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0058—Digital printing on surfaces other than ordinary paper on metals and oxidised metal surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
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- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
本发明涉及一种在铜表面上制造图案的方法,描述了具有增加的分辨率的用液滴喷射印刷装置在铜或铜合金表面上印刷墨水或有机抗蚀剂的方法。增加的分辨率通过在铜表面上印刷之前,优选首先微蚀刻表面,而后用能降低铜表面的表面能或能使铜表面更疏水的有机物质处理铜表面来达到。此方法可用于制造电子电路。
Description
技术领域
本发明涉及一种在铜或铜合金的表面上形成图像或图案的方法。尤其是本发明涉及在已经被处理以改善液滴喷射技术的分辨率的铜或铜合金表面上用液滴喷射技术形成此图案。本方法特别适于形成印刷电路。
背景技术
由压电法、热喷射法或连续液滴喷射技术代表的液滴喷射技术已经公知用于普通印刷和图像生成很长时间了。然而,这些技术在印刷电路或半导体的成像上的应用是很近的事。在这点上,近来的尝试在U.S.6,861,377和U.S.2005/0095356 A1中进行了说明,每一个教示在此全部并入作为参考。
应用液滴喷射技术形成电路部件需要一些分辨率目标达到微米或亚微米范围的非常精细的分辨率。这些分辨率目标已经难于匹配当前的液滴喷射技术和设备。因此,已经付出实质的努力以改善这些技术的分辨率,特别在形成电子电路必须的铜表面上。
多种变量已知能影响液滴喷射技术的分辨率,其包括:印刷头设计、液滴尺寸、驱动印刷头的软件、印刷头对要印刷的表面的紧密度和被印刷的液体的特性。已经研究过每个前述因素用以尝试获得最大分辨率。然而,用这些技术形成电子电路中的分辨率目标不能令人满意。
本发明的一个目的是提供一种方法,当在铜或铜合金表面上印刷时,可改善液滴喷射技术的分辨率。
发明内容
在此,发明人发现如果优选微蚀刻铜或铜合金的表面,然后在铜表面上印刷之前,用能够降低铜表面的表面能或能够使铜表面更疏水的有机物质处理,那么可改善后来的印刷的分辨率。因此,公开了用于在含铜的表面上印刷的方法,此方法包括:
1.非强制选择地,但是优选,将表面与微蚀刻剂接触;
2.将表面与能够降低铜表面的表面能或能够使铜表面更疏水的有机物质的水溶液接触;和
3.用液滴喷射装置在表面上印刷。
本发明包含一种用于在含铜的表面上印刷的方法,所述方法包含:
1.非强制选择地,但是优选,将表面与微蚀刻剂接触;
2.将表面与能够降低铜表面的表面能或能够使铜表面更疏水的有机物质的水溶液接触;和而后
3.用液滴喷射装置通过在表面上印刷墨水或有机抗蚀剂而在表面上产生图像。
通常,用于本发明的铜或铜合金表面包含用于印刷电路板生产的覆铜箔层压板。这些层压板通常具有环氧、聚酰胺或其他类似树脂的固化芯材(有时用玻璃纤维补强),而铜箔层压在芯材的相对两侧上。此覆铜箔层压板公知用于印刷电路的制造。层压板可以是刚性的或挠性的。
非强制选择地,但是优选,将铜表面微蚀刻以在微尺度上粗化表面。微蚀刻剂通常是在印刷电路领域公知的。可用于本发明的典型的微蚀刻剂包括过氧化氢和硫酸的水溶液或过硫酸钠或过硫酸铵与硫酸的水溶液。微蚀刻剂的典型浓度为(i)过氧化氢10~100g/l、(ii)过硫酸钠25~250g/l和(iii)硫酸50~250g/l。也可应用其他已知的微蚀刻剂。
依据本发明,铜表面与能够降低铜表面的表面能或能够使铜表面更疏水的有机物质的水溶液接触。优选有机物质可以选自由脂肪酸、树脂酸和其混合物组成的组中。优选的脂肪酸包括妥尔油。优选的树脂酸包括由诸如松香酸的松木树脂得到的酸。这些脂肪酸和/或树脂酸溶于水中,将此溶液用于在印刷前涂布铜表面。优选以0.05~2.0g/l的浓度将有机表面溶于水中。优选将有机物质的水溶液的pH调节至7~14。在溶液中可包括多于一种有机物质。也可以将有机溶剂和有机的或无机的碱和酸添加到水溶液中。
可通过浸入、喷雾或溢流使铜表面与有机物质的水溶液接触。优选接触时间为15~30秒。接触温度优选为室温至170℉。一旦表面与有机物质接触,其优选用去离子水冲洗并鼓风干燥。此时,随时可在表面上印刷。
应用的印刷方法是液滴喷射技术,如压电法、热喷射法或连续液滴喷射。这些方法有时共同被称为喷墨印刷。对于这些不同的印刷技术的讨论,读者可参考美国第6,715,871号和第6,754,551号专利,其每一个教示在此全部并入作为参考。还可参考公开的美国第2005/0003645 A1号和第2005/0112906 A1号专利申请,其每一个教示在此全部并入作为参考。
发明人在此优选压电印刷技术,这利用MacDermid Colorspan,Inc.的印刷机,型号为Display Maker 72 UVR。用于上述型号的印刷头为压电喷墨头,规格如下:Ricoh Gen 3E1M96 Channel 30 pL滴体积,在80℃和20KHZ下操作,标称分辨率为600DPI。
可将喷墨打印机用于在表面上印刷墨水或有机抗蚀剂。墨水或有机抗蚀剂可以是热固化或对流固化类型,或者可以是光敏的并且用光化学辐射如紫外光固化。发明人在此优选紫外光可固化有机抗蚀剂。在任何情况下,待印刷的墨水或有机抗蚀剂优选在操作温度下具有5~15厘泊的粘度。
发明人在此优选用包含低聚物、单体和光引发剂的有机抗蚀剂印刷。
典型的低聚物包括聚氨酯丙烯酸酯、聚酯丙烯酸酯、环氧丙烯酸酯和酸性丙烯酸酯。
典型的单体包括单官能丙烯酸酯或多官能丙烯酸酯,如丙烯酸异冰片酯、二丙烯酸二缩三丙二醇酯、乙氧基化三羟甲基丙烯三丙烯酸酯和酸性酯。
可用的光引发剂包括苯乙酮如2-苄基-2-2(二甲氨基)-1-4-(4-吗啉基)苯基-1-丁酮、2-二甲氧基-2-苯基苯乙酮,噻吨酮如异丙基噻吨酮,和缩酮如苄基二甲基酮。在第6,322,952号、第6,475,702和第6,136,507号美国专利中公开了典型的光敏有机抗蚀剂组合物,其每一个教示在此全部并入。如果使用光敏有机抗蚀剂,通常优选将光化学辐射源,如紫外光,安装到支撑印刷头的支架上,以使固化过程在液滴被印刷后的短时间内发生。
发明人相信,在印刷之前,用本发明的方法处理铜表面可改变铜表面的表面性质,从而能使表面上具有较少散布的液滴的保持度增强,从而提高分辨率。
具体实施方式
下述实施例用以举例说明但不作为限制:
实施例1
取两片覆铜箔层压板。一片直接用MacDermid Colorspan型Display Maker 72 UVR印刷机和有机光敏抗蚀剂印刷成线和空间图案,其中所述抗蚀剂包含:
成分 重量百分比
Genomer 1122① 17.39
Sartomer SR454② 10.43
Sartomer SR306② 17.43
Sartomer SR506② 20.83
Sartomer CD9050② 9.57
Sartomer CN147② 13.51
Irgacure 369③ 1.74
Irgacure 907③ 6.96
Speedcure ITX④ 1.74
结晶紫染料 0.40
1.购自Rahn USA Corp.
2.购自Sartomer Company
3.购自Ciba-Geigy Company
4.购自Aceto Chemical Corp.
分辨率通过显微镜肉眼检视确定约为15mil。图1是在第一片铜表面上的印刷线的显微照片。
第二片覆铜箔层压板在用与第一片相同的装置和有机抗蚀剂以相同的方式在其上印刷前,先用下述方法处理:
1.在90℉下,25g/l过氧化氢和100g/l硫酸的水溶液中微蚀刻2分钟。
2.用去离子水冲洗。
3.浸入pH为12的0.5g/l妥尔油水溶液中。
4.用去离子水冲洗。
5.鼓风干燥。
分辨率通过显微镜肉眼检视确定约为3mil。图2是在第二片铜表面上的印刷线的显微照片。
Claims (7)
1.一种在含铜的表面上印刷的方法,所述方法包含:
a.将该表面与包含从由脂肪酸、树脂酸和前述酸的混合物构成的组中选出的有机物质的水溶液接触,和然后
b.在该表面上用液滴喷射装置印刷墨水或有机抗蚀剂。
2.依据权利要求1的方法,其中该有机物质包含妥尔油。
3.依据权利要求1的方法,其中该墨水或有机抗蚀剂包含光敏有机抗蚀剂。
4.依据权利要求3的方法,其中该有机抗蚀剂的粘度为5~15厘泊。
5.依据权利要求1、2、3或4的任一项的方法,其中该表面在与有机防锈剂水溶液接触之前先与微蚀刻剂接触。
6.依据权利要求1、2、3或4的任一项的方法,其中该液滴喷射装置包含安装在可移动支架上的印刷头,并且其中该印刷头是从由压电印刷头、热喷射印刷头和连续液滴喷射印刷头构成的组中选出的。
7.依据权利要求6的方法,其中光化学辐射源也安装在该可移动支架上。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/398,080 US20070237899A1 (en) | 2006-04-05 | 2006-04-05 | Process for creating a pattern on a copper surface |
US11/398,080 | 2006-04-05 | ||
PCT/US2007/005105 WO2007126516A2 (en) | 2006-04-05 | 2007-02-27 | Process for creating a pattern on a copper surface |
Publications (2)
Publication Number | Publication Date |
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CN101415502A true CN101415502A (zh) | 2009-04-22 |
CN101415502B CN101415502B (zh) | 2012-02-08 |
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Application Number | Title | Priority Date | Filing Date |
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CN2007800117085A Expired - Fee Related CN101415502B (zh) | 2006-04-05 | 2007-02-27 | 在铜表面上制造图案的方法 |
Country Status (6)
Country | Link |
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US (1) | US20070237899A1 (zh) |
EP (1) | EP2001603B1 (zh) |
JP (1) | JP4850282B2 (zh) |
CN (1) | CN101415502B (zh) |
ES (1) | ES2392274T3 (zh) |
WO (1) | WO2007126516A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113275229A (zh) * | 2017-10-23 | 2021-08-20 | Mec株式会社 | 膜形成基材的制造方法、膜形成基材及表面处理剂 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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US8337010B2 (en) | 2010-02-24 | 2012-12-25 | Geller Gary R | Method and apparatus for creating a graphic image on a reflective metal surface |
JP6324788B2 (ja) * | 2014-03-31 | 2018-05-16 | 太陽インキ製造株式会社 | 塗膜の形成方法 |
CN104046974B (zh) * | 2014-05-28 | 2017-02-15 | 合肥奥福表面处理科技有限公司 | 一种铜锌合金塑化处理方法 |
JP6482057B2 (ja) * | 2014-08-26 | 2019-03-13 | セイコーインスツル株式会社 | 油滴吐出器検査装置、及び油滴供給装置 |
WO2016111035A1 (ja) * | 2015-01-07 | 2016-07-14 | 太陽インキ製造株式会社 | 金属基材用表面処理剤 |
WO2016193978A2 (en) | 2015-06-04 | 2016-12-08 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
JP2017034256A (ja) * | 2015-08-05 | 2017-02-09 | 三洋化成工業株式会社 | レジスト基板前処理組成物及びレジスト基板の製造方法 |
WO2017025949A1 (en) | 2015-08-13 | 2017-02-16 | Jet Cu Pcb Ltd. | Methods for producing an etch resist pattern on a metallic surface |
US10398034B2 (en) | 2016-12-12 | 2019-08-27 | Kateeva, Inc. | Methods of etching conductive features, and related devices and systems |
WO2018116780A1 (ja) | 2016-12-22 | 2018-06-28 | 三洋化成工業株式会社 | レジスト基板前処理組成物及びレジスト基板の製造方法 |
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BE792737A (fr) * | 1972-05-26 | 1973-03-30 | Amchem Prod | Procedes en vue de maintenir la stabilite de compositions de revetementmetallique et composition utilisees dans ces procedes |
US4594111A (en) * | 1984-10-04 | 1986-06-10 | Coonan Edmund C | Liquid phase cleaner-solvent |
SU1281590A1 (ru) * | 1985-05-30 | 1987-01-07 | Днепропетровский химико-технологический институт им.Ф.Э.Дзержинского | Средство дл очистки поверхности из сплавов никел ,меди и цинка от полировальных паст |
US5958647A (en) * | 1997-05-20 | 1999-09-28 | Morgan; David A. | Thermosensitive etch resist for forming a mask |
GB2350321A (en) * | 1999-05-27 | 2000-11-29 | Patterning Technologies Ltd | Method of forming a masking or spacer pattern on a substrate using inkjet droplet deposition |
US20030177639A1 (en) * | 2002-03-19 | 2003-09-25 | Berg N. Edward | Process and apparatus for manufacturing printed circuit boards |
US6872321B2 (en) * | 2002-09-25 | 2005-03-29 | Lsi Logic Corporation | Direct positive image photo-resist transfer of substrate design |
KR100733920B1 (ko) * | 2004-09-17 | 2007-07-02 | 주식회사 엘지화학 | 에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법 |
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2006
- 2006-04-05 US US11/398,080 patent/US20070237899A1/en not_active Abandoned
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2007
- 2007-02-27 WO PCT/US2007/005105 patent/WO2007126516A2/en active Application Filing
- 2007-02-27 EP EP07751838A patent/EP2001603B1/en not_active Not-in-force
- 2007-02-27 ES ES07751838T patent/ES2392274T3/es active Active
- 2007-02-27 JP JP2009504187A patent/JP4850282B2/ja not_active Expired - Fee Related
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Publication number | Priority date | Publication date | Assignee | Title |
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CN113275229A (zh) * | 2017-10-23 | 2021-08-20 | Mec株式会社 | 膜形成基材的制造方法、膜形成基材及表面处理剂 |
Also Published As
Publication number | Publication date |
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WO2007126516A2 (en) | 2007-11-08 |
ES2392274T3 (es) | 2012-12-07 |
WO2007126516A3 (en) | 2008-01-10 |
JP4850282B2 (ja) | 2012-01-11 |
CN101415502B (zh) | 2012-02-08 |
EP2001603A2 (en) | 2008-12-17 |
US20070237899A1 (en) | 2007-10-11 |
JP2009532205A (ja) | 2009-09-10 |
EP2001603B1 (en) | 2012-09-26 |
EP2001603A4 (en) | 2011-11-16 |
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