CN101412162A - Palladium-molybdenum binary alloy high-temperature brazing material - Google Patents
Palladium-molybdenum binary alloy high-temperature brazing material Download PDFInfo
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- CN101412162A CN101412162A CNA2008102324743A CN200810232474A CN101412162A CN 101412162 A CN101412162 A CN 101412162A CN A2008102324743 A CNA2008102324743 A CN A2008102324743A CN 200810232474 A CN200810232474 A CN 200810232474A CN 101412162 A CN101412162 A CN 101412162A
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- solder
- palladium
- molybdenum
- cored solder
- temperature
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Abstract
The invention discloses a high-reliability cathode component for a vacuum electron device, wherein the palladium-molybdenum binary alloy high-temperature cored solder taking tungsten and molybdenum as base materials consists of the following materials in weight percentage: 30 to 60 percent of Mo, and the balance being palladium and inevitable micro impurities; and the contents of Zn, Pb, Bi and Mg elements in the micro impurities are no more than 0.001 percent respectively. The cored solder can be used to braze-solder tungsten, molybdenum and alloy of tungsten or molybdenum in the H2 gas atmosphere; the cored solder does not absorb hydrogen, can spread over base metal, and has good wettability; the wet angle is less than 10 degrees; and when a soldering piece is soldered under the vacuum working condition with the temperature of 1,200 DEG C, the vapor pressure of the cored solder is not higher than 1x10<-5>Pa; moreover, the cored solder is low in price, and is the first choice of solder replacing the Pt and Pt-based solder for the braze solder of the cathode component for the vacuum electron device, and the melting temperature of the cored solder is between 1,600 and 1,950 DEG C.
Description
Technical field
The present invention relates to a kind of alloy brazed material, particularly relate to a kind of highly reliable cathode assembly of vacuum electron device that is used for, is the palladium-molybdenum binary alloy high-temperature brazing material of base material with refractory metals tungsten, molybdenum.
Background technology
At present, nearly tens kinds of the cored solder of energy soldering W, Mo, but fusion temperature between 1600 ℃～1950 ℃, steam forces down, do not react with hydrogen, and can be in hydrogen soldering tungsten, molybdenum solder seldom, have only Pt and Pt base alloy to meet the demands at present.But because Pt and Pt base alloy raw material cost an arm and a leg, production cost is 4 times of Pd base alloy, so limited its extensive application.
Summary of the invention
The objective of the invention is in order to overcome the deficiencies in the prior art, a kind of low price is provided, wetting with refractory metal W, Mo, spreadability good, fusion temperature is between 1600 ℃～1950 ℃, steam forces down, do not react with hydrogen, and the ruthenium-vanadium binary alloy high-temperature brazing material that can in the highly reliable cathode environment of vacuum electron device, use.And weldment is under 1200 ℃ of vacuum work conditions, and the vapour pressure of cored solder must not be higher than 1 * 10
-5Pa.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of palladium-molybdenum binary alloy high-temperature brazing material, it is characterized in that its raw material is formed and percentage by weight is: Mo30%～60%, surplus is palladium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity; Described high-temperature brazing material is meant that the fusion temperature of cored solder is 1600 ℃～1950 ℃.
Be Powdered or thin ribbon shaped after the described cored solder moulding.
The vapour pressure of described cored solder under the vacuum condition of 1200 ℃ of temperature is not higher than 1 * 10
-5Pa.
Material purity used in the present invention: Pd 〉=99.95%, Mo 〉=99.95%, nominal composition batching is adopted in the preparation of cored solder, arc melting becomes ingot, ingot casting is by machine cut processing or Mechanical Crushing, grind through high energy ball mill again, final sizing, pickling make palladium-molybdenum binary alloy powder brazing alloy of the present invention.
Material purity used in the present invention: Pd 〉=99.95%, Mo 〉=99.95%, nominal composition batching is adopted in the preparation of cored solder, arc melting becomes ingot, make palladium-molybdenum binary alloy amorphous thin ribbon solder of the present invention with flash set technology again, strip thickness can reach 0.05～0.15mm, uniform ingredients has tough preferably, plasticity.
Palladium-molybdenum binary alloy high-temperature brazing material of the present invention owing to contain Pd in the cored solder alloy, has reduced the fusing point of cored solder, also Pd W, Mo are had extraordinary wetability and spreadability, and steam forces down; Pd has good alloying action to W, Mo simultaneously, and also little to parent metal corrosivity, seam-filling ability is strong, allows bigger joint gap, and the weld seam high-temperature behavior is further improved; Containing Mo in the cored solder is because Mo is molten admittedly to W, can improve the high-temperature behavior of weld seam.
The present invention compared with prior art has the following advantages: cored solder alloy melting temperature of the present invention is 1600 ℃～1950 ℃, and brazing temperature is 1650 ℃～2050 ℃.After W, Mo soldering were connected, wetability was good, and the weld seam elevated temperature strength is good, and weldment is under the vacuum work condition of 1200 ℃ of temperature, and the vapour pressure of cored solder must not be higher than 1 * 10
-5Pa.
Below by embodiment, the present invention is described in further detail.
The specific embodiment
A kind of palladium-molybdenum binary alloy high-temperature brazing material, its raw material is formed and percentage by weight is: Mo30-60%, surplus is palladium and inevitable trace impurity, but the content of high-vapor-pressure elements such as Zn, Pb, Bi, Mg must not be greater than 0.001% in the impurity.
By nominal composition batching, adopt arc melting to become ingot cored solder alloy of the present invention, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, final sizing, and pickling makes palladium-molybdenum binary alloy powder brazing alloy of the present invention.Then with cored solder of the present invention at H
2Carry out welding technological properties test in the steam stove, its on mother metal wetting, spreadability is good, the extension area is more than 3 times, angle of wetting is less than 10 °.
Embodiment 1
The cored solder alloy of present embodiment is pressed the 30wt%Mo batching, and surplus is palladium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity.Adopt arc melting to become ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, final sizing, and pickling makes palladium-molybdenum binary alloy powder brazing alloy of the present invention, then at H
2Test in the steam stove, its on mother metal wetting, spreadability is good, and matrix is not had the erosion of melting, the extension area is more than 3 times, angle of wetting is less than 10 °.
Embodiment 2
The cored solder alloy of present embodiment is pressed the 45wt%Mo batching, and surplus is palladium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity.Adopt arc melting to become ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, final sizing, and pickling makes palladium-molybdenum binary alloy powder brazing alloy of the present invention.Then at H
2Test in the steam stove, its on mother metal wetting, spreadability is good, and matrix is not had the erosion of melting, the extension area is more than 3 times, angle of wetting is less than 10 °.
Embodiment 3
The cored solder alloy of present embodiment is pressed the 60wt%Mo batching, and surplus is palladium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity.Adopt arc melting to become ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, final sizing, and pickling makes palladium-molybdenum binary alloy powder brazing alloy of the present invention.Then at H
2Test in the steam stove, and on mother metal wetting, spreadability is good, and matrix is not had the erosion of melting, the extension area is more than 3 times, angle of wetting is less than 10 °.
Claims (3)
1. palladium-molybdenum binary alloy high-temperature brazing material, it is characterized in that its raw material is formed and percentage by weight is: Mo 30%～60%, surplus is palladium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity; Described high-temperature brazing material is meant that the fusion temperature of cored solder is 1600 ℃～1950 ℃.
2. a kind of palladium-molybdenum binary alloy high-temperature brazing material according to claim 1 is characterized in that being Powdered or thin ribbon shaped after the described cored solder moulding.
3. a kind of palladium-molybdenum binary alloy high-temperature brazing material according to claim 1 is characterized in that the vapour pressure of described cored solder under the vacuum condition of 1200 ℃ of temperature is not higher than 1 * 10
-5Pa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102324743A CN101412162A (en) | 2008-11-28 | 2008-11-28 | Palladium-molybdenum binary alloy high-temperature brazing material |
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|---|---|---|---|
| CNA2008102324743A CN101412162A (en) | 2008-11-28 | 2008-11-28 | Palladium-molybdenum binary alloy high-temperature brazing material |
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| CN101412162A true CN101412162A (en) | 2009-04-22 |
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| CNA2008102324743A Pending CN101412162A (en) | 2008-11-28 | 2008-11-28 | Palladium-molybdenum binary alloy high-temperature brazing material |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110453105A (en) * | 2019-09-02 | 2019-11-15 | 贵研铂业股份有限公司 | A kind of palladium molybdenum precision electrical resistance alloy and preparation method thereof |
| CN113996796A (en) * | 2021-11-04 | 2022-02-01 | 北京航空航天大学 | Preparation method of nickel-based as-cast brazing powder |
-
2008
- 2008-11-28 CN CNA2008102324743A patent/CN101412162A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110453105A (en) * | 2019-09-02 | 2019-11-15 | 贵研铂业股份有限公司 | A kind of palladium molybdenum precision electrical resistance alloy and preparation method thereof |
| CN110453105B (en) * | 2019-09-02 | 2021-04-27 | 贵研铂业股份有限公司 | Palladium-molybdenum precision resistance alloy and preparation method thereof |
| CN113996796A (en) * | 2021-11-04 | 2022-02-01 | 北京航空航天大学 | Preparation method of nickel-based as-cast brazing powder |
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Open date: 20090422 |