CN101412163B - Ruthenium-vanadium binary alloy high-temperature brazing material - Google Patents
Ruthenium-vanadium binary alloy high-temperature brazing material Download PDFInfo
- Publication number
- CN101412163B CN101412163B CN2008102324758A CN200810232475A CN101412163B CN 101412163 B CN101412163 B CN 101412163B CN 2008102324758 A CN2008102324758 A CN 2008102324758A CN 200810232475 A CN200810232475 A CN 200810232475A CN 101412163 B CN101412163 B CN 101412163B
- Authority
- CN
- China
- Prior art keywords
- solder
- ruthenium
- cored solder
- vanadium
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Powder Metallurgy (AREA)
Abstract
The invention discloses a high-reliability cathode component for a vacuum electron device, wherein the ruthenium-vanadium binary alloy high-temperature cored solder taking refractory metal tungsten and molybdenum as base materials consists of the following materials in weight percentage: 23 to 40 percent of vanadium, and the balance being ruthenium and inevitable micro impurities; and the contents of Zn, Pb, Bi and Mg elements in the micro impurities are no more than 0.001 percent respectively. The cored solder can be used to braze-solder refractory metal w, Mo and alloy of w or Mo in the H2 or Ar gas atmosphere or in a vacuum state, the cored solder does not absorb hydrogen, can spread over base metal, and has good wettability; the wet angle is less than 10 degrees; and when a soldering piece is soldered under the vacuum working condition with a temperature of between 1,000 and 1,200 DEG C, the vapor pressure of the cored solder is lower than 1x10<-5>Pa; moreover, the cored solder islow in price, and is the first choice of solder replacing the Pt and Pt-based solder for the braze solder of the cathode component for the vacuum electron device, and the melting temperature of the cored solder is between 1,750 and 1,850 DEG C.
Description
Technical field
The present invention relates to a kind of alloy brazed material, particularly relate to a kind of highly reliable cathode assembly of vacuum electron device that is used for, is the ruthenium-vanadium binary alloy high-temperature brazing material of base material with refractory metals tungsten, molybdenum.
Background technology
At present, nearly tens kinds of the cored solder of energy soldering W, Mo have scolders such as Cu base, Ni base, Mo base, Pd base, Pt base, but fusion temperature is between 1750 ℃～1850 ℃, steam forces down, do not react with hydrogen, and can be in hydrogen soldering W, Mo solder seldom.At present, have only Pt and Pt base alloy can satisfy such instructions for use.But because Pt and Pt base alloy raw material cost an arm and a leg, production cost is more than 3 times of ruthenium-base alloy, so limited its extensive application.
Summary of the invention
The objective of the invention is in order to overcome the deficiencies in the prior art, a kind of low price is provided, wetting with refractory metal W, Mo, spreadability good, fusion temperature is between 1750 ℃～1850 ℃, steam forces down, do not react with hydrogen, and the ruthenium-vanadium binary alloy high-temperature brazing material that can in the highly reliable cathode environment of vacuum electron device, use.And the cathode weld part is under 1000 ℃～1200 ℃ vacuum work conditions, and the vapour pressure of this cored solder is lower than 1 * 10
-5Pa.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of ruthenium-vanadium binary alloy high-temperature brazing material, it is characterized in that its raw material is formed and percentage by weight is: vanadium 23%～40%, surplus is ruthenium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity; Described high-temperature brazing material is meant that the fusion temperature of cored solder is 1750 ℃～1850 ℃.
Be Powdered after the described cored solder moulding.
Described cored solder is that 1000 ℃～1200 ℃ vapour pressures under the vacuum condition are lower than 1 * 10 in temperature
-5Pa.
Material purity used in the present invention: Ru powder 〉=99.95%, V piece 〉=99.95%, the preparation of cored solder adopt the nominal composition batching of alloy, and the Ru powder is pressed behind the knot sintering degasification, arc melting alloy cast ingot again in 1100 ℃～1200 ℃ vacuum drying ovens more earlier.Ingot casting grinds through high energy ball mill through machine cut processing or Mechanical Crushing again, and final sizing, reduction, pickling make ruthenium-vanadium binary alloy powder brazing alloy of the present invention.
Ruthenium-vanadium binary alloy high-temperature brazing material of the present invention, alloy constituent element Ru, V all have low vapour pressure.Wherein add metal V among the Ru, reduced the fusing point of cored solder alloy, strengthened wetability and spreading property on mother metal W, Mo.V has good alloying action to W, Mo simultaneously, and is also little to parent metal corrosivity, and seam-filling ability strengthens, and the weld seam high-temperature behavior is further improved.Ru, V and refractory metal W, Mo all can melt admittedly, can form good diffusion layer on the composition surface like this, can further improve the bond strength of weld seam.
The present invention compared with prior art has the following advantages: cored solder alloy melting temperature of the present invention is 1750 ℃～1850 ℃, and brazing temperature is 1760 ℃～1950 ℃.After W, Mo soldering were connected, wetability was good, the good fluidity of scolder, and seam-filling ability is strong, and the weld seam elevated temperature strength is good.The cathode weld part is under 1000 ℃～1200 ℃ vacuum work conditions, and the vapour pressure of cored solder is lower than 1 * 10
-5Pa.
Below by embodiment, the present invention is described in further detail.
The specific embodiment
A kind of ruthenium-vanadium binary alloy high-temperature brazing material, its raw material is formed and percentage by weight is: vanadium 23-40%, surplus is ruthenium and inevitable trace impurity, but the content of high-vapor-pressure elements such as Zn, Pb, Bi, Mg all must not be greater than 0.001% in the trace impurity.
With the nominal composition batching that cored solder of the present invention is pressed alloy, the Ru powder press the knot back in vacuum drying oven in 1100 ℃～1200 ℃ sintering degasification.Adopt the arc melting alloy cast ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, and final sizing, reduction, pickling make ruthenium-vanadium binary alloy powder brazing alloy of the present invention.Then with cored solder of the present invention at H
2Carry out welding technological properties test in the steam stove, its on mother metal W, Mo wetting, spreading property is good, and parent metal is not had the erosion of melting, the spreading area of fusing back scolder is that former scolder is placed more than 4 times of area, angle of wetting is less than 10 °.
Embodiment 1
The cored solder alloy of present embodiment is pressed the 23wt%V batching, and surplus is ruthenium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity.Adopt arc melting to become ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, and final sizing, reduction, pickling make ruthenium-vanadium binary alloy powder brazing alloy of the present invention, then at H
2Carry out the welding procedure test of solder in the steam stove, its on mother metal wetting, spreadability is good, and parent metal is not had the erosion of melting, the spreading area of fusing back scolder is that former scolder is placed more than 4 times of area, angle of wetting is less than 10 °.
Embodiment 2
The cored solder alloy of present embodiment is pressed the 26wt%V batching, and surplus is ruthenium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity.Adopt arc melting to become ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, and final sizing, reduction, pickling make ruthenium-vanadium binary alloy powder brazing alloy of the present invention.Then at H
2Carry out the welding procedure test test of solder in the steam stove, ruthenium vanadium scolder on mother metal wetting, spreadability is good, and matrix is not had the erosion of melting, the spreading area of fusing back scolder is that former scolder is placed more than 4 times of area, angle of wetting is less than 10 °.
Embodiment 3
The cored solder alloy of present embodiment is pressed the 40wt%V batching, and surplus is ruthenium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity.Adopt arc melting to become ingot, ingot casting grinds through high energy ball mill by machine cut processing or Mechanical Crushing again, and final sizing, reduction, pickling make ruthenium-vanadium binary alloy powder brazing alloy of the present invention.Then at H
2Carry out the welding procedure test test of solder in the steam stove, ruthenium vanadium scolder on mother metal wetting, spreadability is good, and matrix is not had the erosion of melting, the spreading area of fusing back scolder is that former scolder is placed more than 4 times of area, angle of wetting is less than 10 °.
Claims (2)
1. ruthenium-vanadium binary alloy high-temperature brazing material, it is characterized in that its raw material is formed and percentage by weight is: vanadium 23%～40%, surplus is ruthenium and inevitable trace impurity, and the content of Zn, Pb, Bi and Mg element all must not be greater than 0.001% in the described trace impurity; Described high-temperature brazing material is meant that the fusion temperature of cored solder is 1750 ℃～1850 ℃.
2. a kind of ruthenium-vanadium binary alloy high-temperature brazing material according to claim 1 is characterized in that after the described cored solder moulding be Powdered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102324758A CN101412163B (en) | 2008-11-28 | 2008-11-28 | Ruthenium-vanadium binary alloy high-temperature brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102324758A CN101412163B (en) | 2008-11-28 | 2008-11-28 | Ruthenium-vanadium binary alloy high-temperature brazing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101412163A CN101412163A (en) | 2009-04-22 |
| CN101412163B true CN101412163B (en) | 2010-12-08 |
Family
ID=40593017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102324758A Active CN101412163B (en) | 2008-11-28 | 2008-11-28 | Ruthenium-vanadium binary alloy high-temperature brazing material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101412163B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102284807B (en) * | 2011-08-12 | 2013-04-17 | 西北有色金属研究院 | Niobium-boron binary alloy brazing material |
| CN102303197B (en) * | 2011-08-12 | 2013-03-20 | 西北有色金属研究院 | Boron-containing vanadium-base alloy brazing material |
| CN102847949B (en) * | 2012-09-27 | 2014-03-26 | 西北有色金属研究院 | Preparation method of spherical Ru-V powder brazing filler metal |
| CN113996796B (en) * | 2021-11-04 | 2022-10-14 | 北京航空航天大学 | Preparation method of nickel-based as-cast brazing powder |
-
2008
- 2008-11-28 CN CN2008102324758A patent/CN101412163B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101412163A (en) | 2009-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2019100445A1 (en) | Micro/nano particle reinforced composite solder and preparation method therefor | |
| Pal et al. | Investigation of microstructure and wetting behavior of Sn–3.0 Ag–0.5 Cu (SAC305) lead-free solder with additions of 1.0 wt% SiC on copper substrate | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| CN102601542B (en) | A kind of brazing solder alloy | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN101412163B (en) | Ruthenium-vanadium binary alloy high-temperature brazing material | |
| Bang et al. | Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint | |
| CN103639619A (en) | High-entropy alloy welding wire for TIG (tungsten inert gas) welding of titanium and steel and preparation method | |
| CN101412161B (en) | Ruthenium-niobium binary alloy high-temperature brazing material | |
| CN104480412A (en) | Amorphous high-entropy alloy solder for braze-welding tantalum and steel and preparation method | |
| WO2012077415A1 (en) | Pb-FREE SOLDER ALLOY HAVING Zn AS MAIN COMPONENT | |
| CN110303269A (en) | For the Sn-Cu-Ti solder of low temperature brazing diamond and application | |
| CN111037150A (en) | Composite brazing filler metal for brazing metal ceramic and alloy and preparation method thereof | |
| CN113001056A (en) | Preparation method of SnBi-based lead-free solder containing graphene and MAX phase | |
| CN109079363A (en) | A kind of sealing-in solder of low-vapor pressure low melting point | |
| CN106001980A (en) | High-temperature lead-free soldering lug for encapsulating power electronic module and preparation method thereof | |
| Du et al. | Impact of Ni-coated carbon fiber on the interfacial (Cu, Ni) 6Sn5 growth of Sn-3.5 Ag composite solder on Cu substrate during reflow and isothermal aging | |
| CN103170764A (en) | Brazing filler alloy powder and preparation method thereof | |
| CN100457370C (en) | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering | |
| CN114000028A (en) | NiCoFeCuSiB high-entropy alloy brazing filler metal and preparation method thereof | |
| JP2023524690A (en) | Lead-free solder paste for high temperature applications with mixed solder powders | |
| CN102303197B (en) | Boron-containing vanadium-base alloy brazing material | |
| CN101412162A (en) | Palladium-molybdenum binary alloy high-temperature brazing material | |
| CN109732238B (en) | Tin-silver based solder alloy for photovoltaic solder strip and preparation method thereof | |
| CN101653873A (en) | Method for welding beryllium-copper dissimilar metal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |