CN101394725A

CN101394725A - Electronic circuit mould

Info

Publication number: CN101394725A
Application number: CNA2008101656188A
Authority: CN
Inventors: 杉森善雄
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2007-09-19
Filing date: 2008-09-19
Publication date: 2009-03-25
Also published as: TWI372018B; KR20090030234A; JP2009076594A; TW200922439A; JP4890400B2

Abstract

The invention provides an electronic circuit module which is no need for sacrificing the tabling strength of a lower cover corresponding to a frame provided with installation pins, and has less restriction of installation position on a motherboard. The electronic circuit module (1) comprises: a frame (2) being arranged like a square frame and having side boards (21 to 24) formed of metal board; a circuit board (5) provided with a high frequency circuit and supported on the frame (2) surrounding by the side boards (21 to 24); and a lower cover (3) formed by metal board and nested on the lower terminal of the frame (2) for covering the lower opening part (2a). A plurality of L-shaped installation pins (6), which are extended inward and projected downward from a side board (21) or a side board (22), are arranged on the lower terminal of the frame (2), an upward elastic sheet (3c) is arranged along the whole periphery on the circumference part of the lower cover (3). Besides, projection part (6b) of each installation pin (6), penetrating a through hole (3d) arranged on the lower cover (3), are soldered to the motherboard (30).

Description

Electronic circuit module

Technical field

The circuit board that the present invention relates to be provided with high-frequency circuit is inserted in the space that the inner tegmentum of framework covers and carries out the electronic circuit modules such as tuner that electromagnetic shielding forms.

Background technology

Usually, this electronic circuit module will constitute housing by framework and the lid that metallic plate constitutes, and be provided with circuit board in the inner space of this housing.Outstanding in a plurality of places of housing be provided with installation foot downwards, when being installed to electronic circuit module on the mother board,, make housing play effect as screening can by these installation feet are soldered on the earthy circuit pattern of mother board.

In existing known electronic circuit module, though also have installation foot is arranged on the following module that covers as the housing base plate part, because lower cover is made of the relatively thinner metallic plate of thickness, installation foot causes the problem of distortion easily when therefore existing in assembling etc.And, when the installation foot with lower cover is soldered on the mother board, when also existing in the antenna connector dismounting etc., since the external force of effect, the problem that lower cover is thrown off easily.

Therefore, proposed by being that the scheme (for example with reference to patent documentation 1) that installation foot solves the electronic circuit module of the problems referred to above is set on the framework in side plate parts as housing in the past.Promptly, framework is mainly by being adapted to the square box shape, constituting around the side plate of circuit board, the side plate of the framework of mounting circuit boards forms than the metallic plate that thickness is thick, mechanical strength is strong of lower cover with thickness, therefore is arranged on installation foot on the framework side plate and is difficult to produce undesired deformation when assembling etc.And if be soldered on the mother board as the installation foot of a framework part, the external force of effect also strengthens during then for the antenna connector dismounting etc., so reliability improves.

[patent documentation 1] TOHKEMY 2002-290249 communique

But, in patent documentation 1 disclosed existing electronic circuit module, because from the straight prominent downwards installation foot of establishing of the lower limb of framework (side plate), therefore there is such restriction: must be to the bottom of framework with the lower cover setting-in, and must avoid forming necessary lower cover flexure strip on the position of interfering, influenced by it and exist lower cover to be inlaid in the easily not enough difficult point of intensity on the framework with installation foot.Promptly, because the upwards prominent flexure strip of establishing at a plurality of positions of lower cover circumference, thereby by on the bottom that is embedded in framework outside when making these flexure strip bendings lower cover being installed on the framework, if therefore flexure strip is set in the circumference of the lower cover part relative with the installation foot of framework, then this flexure strip easy and installation foot interference when assembling causes undesired deformation.Based on such reason, need the portion that dodges that installation foot is used in the circumference of the lower cover part relative with the installation foot of framework, by such portion of dodging the chimeric intensity of lower cover is reduced.And because set flexure strip can not produce big elastic force near the portion that dodges of lower cover, so this point also makes the chimeric undercapacity of lower cover easily.In addition, if the chimeric undercapacity of the relative framework of lower cover then is easy to generate the noise of click clatter click clatter, increased the danger that this lower cover breaks away from from framework.

And, above-mentioned existing electronic circuit module, owing to be not suitable for wearing the installing hole of interspersed framework installation foot at the circumference of mother board, the installation region that therefore must make the electronic circuit module on the mother board in advance is to the inside away from the certain distance of circumference, therefore the problem that also exists the installation site to be restricted.

Summary of the invention

The present invention finishes in view of the reality of prior art, and its purpose is to provide a kind of does not need to sacrifice lower cover with respect to the chimeric intensity of the framework that is provided with installation foot, and the yet less electronic circuit module of the restriction of the installation site on the mother board.

To achieve these goals, the invention provides a kind of electronic circuit module, it has: framework has the side plate that is adapted to the square box shape, is made of metallic plate; Circuit board is being supported under the state that is surrounded by above-mentioned side plate on the above-mentioned framework; With lid, the metallic plate that is provided with a plurality of flexure strips that project upwards by circumference constitutes, lives in to state at the state lower cover of the outer surface Elastic Contact that makes these flexure strips and above-mentioned side plate the open end, bottom of framework, this lid is installed on the mother board with downward posture uses, be provided with at a plurality of positions of the bottom of above-mentioned framework from above-mentioned side plate and extend to the inside and the installation foot of outstanding L word shape downwards, the ledge of these installation feet runs through above-mentioned and covers set through hole and be soldered on the above-mentioned mother board.

In the electronic circuit module of this structure, form the L word shape that extends to the inside, gives prominence to from side plate downwards owing to each installation foot on the bottom that is arranged on framework, therefore just passable as long as on the position that is offset to the inside from circumference of lower cover, offer the through hole of the protuberance that is used for interspersed installation foot in advance, so no matter whether have through hole that flexure strip can both be set on the circumference of lower cover.And even around the through hole of lower cover flexure strip is set, this flexure strip and installation foot are interfered when also worrying assembling, even and also form the flexure strip of the required elastic force of generation easily around this through hole.Therefore, can the flexure strip that produce required elastic force be set on the almost whole periphery of the circumference of lower cover, improve the chimeric intensity of lower cover with respect to framework.And because the installation foot that is arranged on the side plate is made of the thicker metallic plate of wall ratio, installation foot does not produce undesired deformation when therefore worrying assembling etc.; And if will be soldered on the mother board as the installation foot of the part of framework, the external force of effect also strengthens during then for the antenna connector dismounting etc.And, because the mounting hole site of the mother board that protuberance interted of the installation foot of this electronic circuit module is in the circumference inboard of the installation region of this electronic circuit module, even therefore electronic circuit module also can be installed without barrier at the circumference of mother board, the restriction of installation site seldom.

In the said structure,, then can make the stable posture of electronic circuit module by these 4 installation feet if installation foot is provided near 4 angles of open end, bottom of above-mentioned framework, therefore preferred.

And, in said structure, if constitute in installation foot from side plate extend to the inside, with the lid through hole near relative linking part, perhaps the lid through hole near the position relative with linking part, the side-prominent projection to the other side one is set, by these installation feet are contacted by projection with lid, then can make lower cover pass through installation foot positively with the earthy circuit pattern conducting of mother board, so can effectively lower cover be used as ground plate.

The effect of invention

According to electronic circuit module of the present invention, form the L word shape that extends to the inside, gives prominence to from side plate downwards owing to each installation foot on the bottom that is arranged on framework, therefore whether to be used for interting the through hole of protuberance of installation foot just passable as long as offer in advance on the position that is offset to the inside from circumference of the lid (lower cover) of the open end, bottom that covers framework, so have through hole that flexure strip can both be set regardless of on the circumference of lower cover.And even around the through hole of lower cover flexure strip is set, this flexure strip and installation foot are interfered when also worrying assembling, even and also form the flexure strip of the required elastic force of generation easily around through hole.Therefore, can the flexure strip that produce required elastic force be set on the almost whole periphery of the circumference of lower cover, improve the chimeric intensity of lower cover with respect to framework.And because the installation foot that is arranged on the side plate is made of the thicker metallic plate of wall ratio, installation foot does not produce undesired deformation when therefore worrying assembling etc.; And if will be soldered on the mother board as the installation foot of the part of framework, the opposing of the external force of effect also strengthens during then for the antenna connector dismounting etc.And, because the mounting hole site of the mother board that protuberance interted of the installation foot of this electronic circuit module is in the circumference inboard of the installation region of this electronic circuit module, even therefore electronic circuit module also can be installed without barrier at the circumference of mother board, the restriction of installation site seldom, so, improve the design freedom of the wires design of mother board, realized high-density installation easily.

Description of drawings

Fig. 1 is for seeing the stereogram of the electronic circuit module of example example of the present invention from the top.

Fig. 2 is the upward view of this module.

Fig. 3 is the A-A line side cross sectional view along Fig. 2.

Fig. 4 is the enlarged drawing of the B part of Fig. 3.

Fig. 5 is for seeing the stereogram of this module from the below.

Fig. 6 is the enlarged drawing of the C part of Fig. 5.

Fig. 7 is the stereogram of expression from the state of this module dismounting lower cover shown in Figure 5.

Symbol description

1. electronic circuit module; 2. housing; 2a. open end, bottom; 3. lower cover; 3c. flexure strip; 3d. through hole; 3e. projection; 4. loam cake; 5. circuit board; 6. installation foot; 6a. linking part; 6b. protuberance; 9. coaxial connector; 21～24. side plates; 30. mother board; 31. installing hole

Embodiment

The working of an invention form is described with reference to the accompanying drawings, Fig. 1 is for seeing the stereogram of the electronic circuit module of example example of the present invention from the top, Fig. 2 is the upward view of this module, Fig. 3 is the A-A line side cross sectional view along Fig. 2, Fig. 4 is the enlarged drawing of the B part of Fig. 3, Fig. 5 is for seeing the stereogram of this module from the below, Fig. 6 is the enlarged drawing of the C part of Fig. 5, and Fig. 7 is the stereogram of expression state of dismounting lower cover from this module shown in Figure 5.

Electronic circuit module 1 shown in these figure is for being installed in mother board 30 (with reference to Fig. 3) on the module as the tuner use of digital broadcasting etc.This electronic circuit module 1 constitutes housing with framework 2, lower cover 3 and loam cake 4, is provided with the circuit board 5 of high-frequency circuit in the inner space of this housing.

Framework 2 mainly will be adapted to square box shape shape by 4 blocks of

side plates

21,22,23 and 24 that the thicker metallic plate of wall ratio constitutes and constitute, and surround open end, bottom 2a by the lower end of these side plates 21～24, surround open end, top 2b by the upper end of side plate 21～24.And, near four angles of the open end, bottom of framework 2 2a, be provided with and amount to the installation foot 6 that 4 positions extend into the L word shape to the inside from the lower end of side plate 21,22.The curved tabs that each installation foot 6 is served as reasons the linking part 6a that extends to the inside from the lower end of side plate 21 (or 22) and constituted from the outstanding downwards protuberance 6b in the top of linking part 6a is for extending the member that the tongue piece that is arranged on the side plate 21 (or 22) forms in the stage Bending Processing of dismissing from the metallic plate upper punch.The protuberance 6b of these installation feet 6 passes lower cover 3 and interts the installing hole 31 (with reference to Fig. 3) of mother boards 30, is soldered among the figure of this mother board 30 not on the earthy circuit pattern of expression.In addition, as shown in Figure 3, on side plate 21～24, separate the dividing plate 7 of inner space and support support plate 8 one of coaxial connector 9 to constitute, these dividing plates 7 and support plate 8 also are made of metallic plate, constitute framework 2.

Lower cover 3 is made of wall ratio side plate 21～24 thin metallic plates, and this lower cover 3 is inlaid in the bottom of framework 2 with covering open end, bottom 2a.Lower cover 3 has the base plate 3a and a plurality of flexure strip 3cs of the banded bend allowance 3b of portion that links to each other from each limit with this base plate 3a to upper process of the rectangle relative with open end, bottom 2a, is equipped with flexure strip 3c along the almost whole circumference of base plate 3a.Outside when making these flexure strips 3c bending, be embedded on the bottom (bottom of side plate 21～24) of framework 2, thereby lower cover 3 is installed on the framework 2.And, near 4 angles of base plate 3a, offer through hole 3d, and upwards be equipped with protruding 3e at 2 positions adjacent with 2 through hole 3d that are configured in close side plate 23.And, when with lower cover 3 setting-ins to the bottom of framework 2 time, the protuberance 6b of each installation foot 6 of framework 2 is punctured among each through hole 3d, and each protruding 3e is relative with the linking part 6a that protuberance 6b is punctured into the installation foot 6 among the adjacent through hole 3d, with this linking part 6a butt (with reference to Fig. 4).In addition, dividing plate 7 contacts with lower cover 3 by the 3f of the portion of having cut (cut り and play こ portion) that base plate 3a goes up formation.

Loam cake 4 also constitutes with the lower cover 3 the same metallic plates that approached by wall ratio side plate 21～24, and this loam cake 4 covers the upper end of 2b ground, open end, top setting-in to framework 2.Loam cake 4 has the outstanding downwards a plurality of flexure strip 4c of the 4b of bend allowance portion of rectangular-shaped top plate 4a relative with open end, top 2b and the band shape that links to each other from each limit with this top board 4a, is equipped with flexure strip 4c along the almost whole circumference of top board 4a.Outside when making these flexure strips 4c bending, be embedded on the upper end (upper end of side plate 21～24) of framework 2, thereby loam cake 4 is installed on the framework 2.In addition, on the angle of top board 4a, be set be supported on the support plate 8, coaxial connector 9, outstanding upward.

Circuit board 5 is equipped with wired circuit pattern and the electronic devices and components and constitute high-frequency circuit that do not have expression among the figure, uprightly is provided with dividing plate 7 between for example RF circuit part and OSC circuit part.This circuit board 5 is being supported under the positioning states that is centered on by side plate 21～24 on the framework 2, and in one side end adjacent with side plate 24 of circuit board 5, a plurality of needle-like terminals 10 are connected with above-mentioned wired circuit pattern.And the center conductor of coaxial connector 9 also is connected with this wired circuit pattern.10 groups of outsides to framework 2 of needle-like terminal are given prominence to and are bent downwardly, and on the connection pads group that does not have expression among the figure that 10 groups of needle-like terminals is soldered to mother board 30, the high-frequency circuit of circuit board 5 is connected with the external circuit of mother board 30 1 sides.

Like this, the electronic circuit module 1 of this example example, because forming from side plate 21 (or 22), extends to the inside and outstanding downwards L word shape each installation foot 6 that the bottom of framework 2 is provided with, therefore just passable as long as offer the through hole 3d of the protuberance 6b that is used for interspersed installation foot 6 in the position from circumference is offset to the inside of lower cover 3, so no matter whether have through hole 3d that flexure strip 3c can both be set on the circumference of lower cover 3.And even around the through hole 3d of lower cover 3 flexure strip 3c is set, this flexure strip 3c interferes with installation foot 6 when also worrying assembling, even and also form the flexure strip 3c of the required elastic force of generation easily around through hole 3d.Therefore, in this electronic circuit module 1, the flexure strip 3c that produces required elastic force is set on the almost whole periphery of lower cover 3 circumferences, its result, the chimeric intensity of lower cover 3 relative frameworks 2 improves, be difficult to produce the noise of lower cover 3 caused click clatter click clatters, also avoid the case accident of lower cover 3 easily.In addition, owing to also almost be provided with the flexure strip 4c that produces required elastic force along whole periphery at the circumference of loam cake 4, so the chimeric intensity of loam cake 4 relative frameworks 2 also improves.

And, because the installing hole 31 of the mother board 30 of the protuberance 6b of the installation foot 6 of interspersed this electronic circuit module 1, be positioned at the inboard, edge of the installation region of this electronic circuit module 1, even therefore electronic circuit module 1 also can be installed without barrier at the circumference of mother board 30, the restriction of installation site is few.So, improved the design freedom of the wires design of mother board 30, realize high-density installation easily.

And this electronic circuit module 1 is because the installation foot 6 that is arranged on the

side plate

21,22 is made of the thicker metallic plate of wall ratio, and installation foot 6 does not produce undesired deformation when therefore worrying assembling etc.And owing to be soldered on the mother board 30 as the installation foot 6 of the part of framework 2, therefore, the opposing of the external force of effect strengthens during for the not shown antenna connector of dismounting on coaxial connector 9 etc., has guaranteed needed reliability.

And, in this electronic circuit module 1, owing near 2 through hole 3d of lower cover 3, protruding 3e is set, make these protruding 3e respectively with the linking part 6a butt of relative installation foot 6, therefore can make lower cover 3 by installation foot 6 positively with the earthy circuit pattern conducting of mother board 30.So, can effectively lower cover 3 be used as ground plate.But, also can be substituted in protruding 3e is set on the lower cover 3, near the butt through hole 3d that downward projection makes this projection and lower cover 3 is being set on the linking part 6a of installation foot 6.

In addition, the installation foot 6 of L word shape can be provided with needed number at the suitable position of side plate 21～24, but as above-mentioned example example, if near 4 angles of the open end, bottom of framework 2 2a, set installation foot 6, then just can make the stable posture of electronic circuit module 1 by this installation foot of 46, proper.

Claims

1. electronic circuit module has: framework has the side plate that is adapted to the square box shape, is made of metallic plate; Circuit board is being supported under the state that is surrounded by above-mentioned side plate on the above-mentioned framework; And lid, the metallic plate that is provided with a plurality of flexure strips that project upwards by circumference constitutes, live in to state the open end, bottom of framework at the state lower cover of the outer surface Elastic Contact that makes these flexure strips and above-mentioned side plate, this lid is installed to use on the mother board with downward posture it is characterized in that:

Be provided with at a plurality of positions of the bottom of above-mentioned framework from above-mentioned side plate and extend to the inside and the installation foot of outstanding L word shape downwards, the ledge of these installation feet runs through above-mentioned and covers set through hole and be soldered on the above-mentioned mother board.

2. electronic circuit module as claimed in claim 1 is characterized in that, above-mentioned installation foot is provided near 4 angles of open end, bottom of above-mentioned framework.

3. electronic circuit module as claimed in claim 1 or 2, it is characterized in that: constitute in above-mentioned installation foot from above-mentioned side plate extend to the inside, with the above-mentioned through hole of above-mentioned lid near relative linking part, near the perhaps position relative above-mentioned through hole of above-mentioned lid with above-mentioned linking part, the side-prominent projection to the other side one is set, contacts by this projection with lid by making these installation feet like this.