JP2008311134A - Shield structure of connector - Google Patents

Shield structure of connector Download PDF

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JP2008311134A
JP2008311134A JP2007159003A JP2007159003A JP2008311134A JP 2008311134 A JP2008311134 A JP 2008311134A JP 2007159003 A JP2007159003 A JP 2007159003A JP 2007159003 A JP2007159003 A JP 2007159003A JP 2008311134 A JP2008311134 A JP 2008311134A
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connector
shield
shield case
substrate
contact
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JP4476311B2 (en
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Nariyasu Kitamura
成康 北村
Minoru Shinmyo
稔 新明
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Japan Aviation Electronics Industry Ltd
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Japan Aviation Electronics Industry Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a shield structure of a connector with high contact stability of a contact portion and having a wide contact area. <P>SOLUTION: The connector has a plurality of signal contacts, an inner housing of insulation property to hold each signal contact inside, an inner shield case to cover the outer periphery of the inner housing, an outer housing 5 of insulation property which is arranged on the outer periphery of the inner shield case, and an outer shield case 6 to cover the outer periphery and the back face of the outer housing. The connector is surface mounted on a substrate 11 by solder. In this case, each connector 4a of the inner shield case and each connector 6a of the outer shield case are mounted and connected to an identical grand pattern 11a, and the connector 2a of each signal contact is mounted and connected to each signal pattern 11b of the substrate, and each fixing piece 6c of the outer shield case is mounted and connected to a fixing pattern 11c of the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、コネクタのシールドの向上をグランド機能の強化によって行う構造に関する。   The present invention relates to a structure in which a shield of a connector is improved by strengthening a ground function.

従来のＩＣソケットのシールド構造について、本出願前に頒布された刊行物を引用して説明する（例えば、特許文献１参照。）。   A conventional IC socket shield structure will be described with reference to publications distributed before the present application (see, for example, Patent Document 1).

図５と図６に示すように、ＩＣ５１を搭載するソケット５３の下面側には、下側シールドケース５５が設けられている。この下側シールドケース５５は、ＩＣソケット５３の形状にしたがって長方形状に構成されている。そして、下側シールドケース５５の底板部５５ａの周囲には、縁部５５ｂが上方に向けて突出するように形成されている。また、底板部５５ａには、ソケット５３のコンタクト５３ｃが挿通される挿通穴５５ｃが形成されている。   As shown in FIGS. 5 and 6, a lower shield case 55 is provided on the lower surface side of the socket 53 on which the IC 51 is mounted. The lower shield case 55 is configured in a rectangular shape according to the shape of the IC socket 53. An edge 55b is formed around the bottom plate 55a of the lower shield case 55 so as to protrude upward. Further, an insertion hole 55c through which the contact 53c of the socket 53 is inserted is formed in the bottom plate portion 55a.

また、下側シールドケース５５の裏面側には、基板のグランドと接続されるグランド端子５５ｄが形成されている。このグランド端子５５ｄは、図５から分るように、上記挿通穴５５ｃを形成した切欠き残部をもって構成されている。   A ground terminal 55d connected to the ground of the substrate is formed on the back side of the lower shield case 55. As can be seen from FIG. 5, the ground terminal 55d has a notch remaining portion in which the insertion hole 55c is formed.

ＩＣソケット５３は、ＩＣ５１を載置する基部５３ａを有している。この基部５３ａには、ＩＣ５１の各端子５１ａを挿通支受する挿通穴５３ｂが、ＩＣ５１の端子５１ａと等ピッチに形成されている。この挿通穴５３ｂは、図６から分るようにテーパ状に形成されている。そして、挿通穴５３ｂには、ＩＣ５１の端子５１ａを押圧保持して電気的に接続させるコンタクト５３ｃがそれぞれ設けられている。コンタクト５３ｃは、ＩＣソケット５３の挿通穴５３ｂから下方向に突出して基板５２に接続固定されるものである。   The IC socket 53 has a base 53a on which the IC 51 is placed. In the base 53a, insertion holes 53b for inserting and receiving the respective terminals 51a of the IC 51 are formed at the same pitch as the terminals 51a of the IC 51. The insertion hole 53b is formed in a tapered shape as can be seen from FIG. Each insertion hole 53b is provided with a contact 53c that presses and holds the terminal 51a of the IC 51 for electrical connection. The contact 53 c protrudes downward from the insertion hole 53 b of the IC socket 53 and is connected and fixed to the substrate 52.

上側シールドケース５７は長方形状の上面部５７ａと、この周囲から垂下する側壁部５７ｂから構成されている。各側壁部５７ｂの下端側には、上下方向に延在する切欠き部５７ｃが所定の間隔をおいて形成されている。切欠き部５７ｃによって挟まれた部分には、内側に向かって湾曲するような部分が形成されており、この部分はばね片５７ｄに構成されている。すなわち、図６に示すように、上側シールドケース５７を下側シールドケース５５に被せたときに、ばね片５７ｄが下側シールドケース５５の縁部５５ｂの周囲を押圧して、上側シールドケース５７は下側シールドケース５５に保持される。   The upper shield case 57 includes a rectangular upper surface portion 57a and a side wall portion 57b that hangs from the periphery. On the lower end side of each side wall portion 57b, a notch portion 57c extending in the vertical direction is formed at a predetermined interval. A portion that is curved inward is formed in the portion sandwiched between the notches 57c, and this portion is configured as a spring piece 57d. That is, as shown in FIG. 6, when the upper shield case 57 is put on the lower shield case 55, the spring pieces 57 d press around the edge 55 b of the lower shield case 55, and the upper shield case 57 is It is held by the lower shield case 55.

実開平６−４８１９１号公報Japanese Utility Model Publication No. 6-48191

前記従来のＩＣソケットのシールド構造においては、上側シールドケース５７の４つの側壁部５７ｂに設けられる多数のばね片５７ｄが下側シールドケース５５の４つの縁部５５ｂを押圧することによって、シールドが行われる。しかし、接触部分の接触安定性が不十分で、しかも、広い接触面積が得られない。   In the shield structure of the conventional IC socket, the shield is performed by the large number of spring pieces 57d provided on the four side wall portions 57b of the upper shield case 57 pressing the four edge portions 55b of the lower shield case 55. Is called. However, the contact stability of the contact portion is insufficient, and a wide contact area cannot be obtained.

そこで、本発明は、前記従来のＩＣソケットのシールド構造の欠点を改良し、接触部分の接触安定性が高く、しかも、接触面積が広いコネクタのシールド構造を提供しようとするものである。   SUMMARY OF THE INVENTION Accordingly, the present invention aims to provide a connector shield structure that improves the drawbacks of the shield structure of the conventional IC socket, has high contact stability at the contact portion, and has a wide contact area.

本発明は、前記課題を解決するため、次の手段を採用する。   The present invention employs the following means in order to solve the above problems.

１．第１のシールド６，２６と第２のシールド４を有し、前記第１のシールドと前記第２のシールドは、それぞれ基板１１，３１に対する接続端子６ａ，２６ａ，４ａ，２４ａを有するコネクタ１，２１において、前記第１のシールドの接続端子６ａ，２６ａと前記第２のシールドの接続端子４ａ，２４ａは、互いに隣り合う位置に設けられ、前記基板上の同一のパターン１１ａ，３１ａに接続するように構成されるコネクタのシールド構造。   1. The first shield 6 and 26 and the second shield 4, the first shield and the second shield are connectors 1 and 6 having connection terminals 6 a, 26 a, 4 a and 24 a for the substrates 11 and 31, respectively. 21, the first shield connection terminals 6a and 26a and the second shield connection terminals 4a and 24a are provided at positions adjacent to each other so as to be connected to the same patterns 11a and 31a on the substrate. Connector shield structure configured in

２．前記第１のシールドは外部シールドケース６，２６で、前記第２のシールドは内部シールドケース４である前記１記載のコネクタのシールド構造。   2. 2. The connector shield structure according to claim 1, wherein the first shield is an outer shield case 6 and 26, and the second shield is an inner shield case 4.

３．前記第１のシールドは外部シールドケースで、前記第２のシールドはグランドコンタクトである前記１記載のコネクタのシールド構造。   3. 2. The connector shield structure according to claim 1, wherein the first shield is an outer shield case, and the second shield is a ground contact.

４．前記両接続端子はサーフェスマウント端子である前記１，２又は３記載のコネクタのシールド構造。   4). 4. The connector shield structure according to the above 1, 2, or 3, wherein the both connection terminals are surface mount terminals.

明細書の説明から明らかなように、本発明は、次の効果を奏する。   As is apparent from the description of the specification, the present invention has the following effects.

１．２つのシールドを基板上の同一のパターンに半田接続することができるので、接続信頼性が高く、かつ、広い接触面積を容易に確保することができる。したがって、グランドラインを大きく形成できるから、シールド性を安定化できるので、輻射ノイズを抑止することができる。   1. Since the two shields can be soldered to the same pattern on the substrate, the connection reliability is high and a wide contact area can be easily secured. Therefore, since the ground line can be formed large, the shielding property can be stabilized, and radiation noise can be suppressed.

２．２つのシールド間を接続する多数のばね片が不要になるので、この種のコネクタを小型化することができる。   2. Since many spring pieces for connecting the two shields are not required, this type of connector can be miniaturized.

３．２つのシールド間の接続と基板上の同一のパターンへの接続を同時に行えるので、トータルとして組立が簡素である。   3. Since the connection between the two shields and the connection to the same pattern on the substrate can be performed simultaneously, the assembly is simple as a whole.

本発明の２つの実施例のコネクタのシールド構造について説明する。   The shield structure of the connector according to two embodiments of the present invention will be described.

本発明の実施例１について図１と図２を参照して説明する。図１はコネクタ１が基板１１に搭載接続されている状態の斜視図、図２は図１における矢印方向に見たＡ−Ａ線によるコネクタ１の断面図である。   A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a state in which the connector 1 is mounted and connected to the substrate 11, and FIG. 2 is a cross-sectional view of the connector 1 taken along the line AA in the direction of the arrow in FIG.

コネクタ１は、複数の信号用コンタクト２と、各信号用コンタクト２を内部に保持する絶縁性の内部ハウジング３と、内部ハウジング３の外周面を被覆する内部シールドケース４と、内部シールドケース４の外周面に配置されている絶縁性の外部ハウジング５と、外部ハウジング５の外周面及び背面を被覆する外部シールドケース６とを有する。   The connector 1 includes a plurality of signal contacts 2, an insulating inner housing 3 that holds each signal contact 2 inside, an inner shield case 4 that covers the outer peripheral surface of the inner housing 3, and an inner shield case 4. It has an insulating outer housing 5 disposed on the outer peripheral surface, and an outer shield case 6 that covers the outer peripheral surface and the back surface of the outer housing 5.

外部ハウジング５には、相手側コネクタ（図示せず）の嵌合部を受け入れる嵌合開口部５ａが設けられる。内部ハウジング３の嵌合開口部３ａは、外部ハウジング５の嵌合開口部５ａ内に配置される。相手側コネクタの嵌合部が外部ハウジング５の嵌合開口部５ａを介して内部ハウジング３の嵌合開口部３ａに嵌合したとき、相手側コネクタの各信号用コンタクトの接触部はコネクタ１の各信号用コンタクト２の接触部２ｂと接触する。各信号用コンタクト２は、折曲されて、接触部２ｂと反対側に接続端子２ａを有する。   The outer housing 5 is provided with a fitting opening 5a for receiving a fitting portion of a mating connector (not shown). The fitting opening 3 a of the inner housing 3 is disposed in the fitting opening 5 a of the outer housing 5. When the mating part of the mating connector is fitted into the mating opening 3a of the internal housing 3 via the mating opening 5a of the external housing 5, the contact part of each signal contact of the mating connector is the connector 1 It contacts the contact portion 2b of each signal contact 2. Each signal contact 2 is bent and has a connection terminal 2a on the side opposite to the contact portion 2b.

外部シールドケース６の背面下端の左右両側には、Ｌ字状に形成されて後方に延びるサーフェス・マウント・テクノロジィ（ＳＭＴ）タイプの接続端子６ａが設けられ、両接続端子６ａの間に切り欠け部６ｂが設けられる。外部シールドケース６の左右両面の下端には、コネクタ１を基板１１のパターン１１ｃに半田接続によって固定するための固定片６ｃが設けられ、また、外部シールドケース６の上面には、コネクタ１が取り付けられる電子機器の筐体と接続するための弾性接片６ｄが設けられる。   Surface mount technology (SMT) type connection terminals 6a that are formed in an L shape and extend rearward are provided on the left and right sides of the lower end of the rear surface of the outer shield case 6, and a notch is formed between the connection terminals 6a. 6b is provided. Fixing pieces 6 c for fixing the connector 1 to the pattern 11 c of the substrate 11 by solder connection are provided at the lower ends of the left and right sides of the outer shield case 6. The connector 1 is attached to the upper surface of the outer shield case 6. An elastic contact piece 6d is provided for connection to a housing of the electronic device.

内部シールドケース４の背面下端の左右両側には、クランク状に形成されて後方に延びるＳＭＴタイプの接続端子４ａが設けられ、両接続端子４ａは、外部シールドケース６の各接続端子６ａと隣り合って切り欠け部６ｂから後方に突出する。   SMT type connection terminals 4 a formed in a crank shape and extending rearward are provided on both the left and right sides of the lower end of the back surface of the inner shield case 4, and both connection terminals 4 a are adjacent to the connection terminals 6 a of the outer shield case 6. And protrudes rearward from the notch 6b.

各信号用コンタクト２は、略クランク状に形成されて、後方に延びるＳＭＴタイプの接続端子２ａを有し、各接続端子２ａは、内部シールドケース４の両接続端子４ａの間で切り欠け部６ｂから後方に突出する。   Each signal contact 2 has an SMT type connection terminal 2 a formed in a substantially crank shape and extending rearward. Each connection terminal 2 a is notched between the connection terminals 4 a of the inner shield case 4. Project backwards from

以上に述べたように構成されるコネクタ１は、図１に示されるように、基板１１に半田で表面実装される。このときに、内部シールドケース４の各接続端子４ａと外部シールドケース６の各接続端子６ａは基板１１の同一のグランドパターン１１ａに搭載接続され、各信号用コンタクト２の接続端子２ａは基板１１の各信号用パターン１１ｂに搭載接続され、外部シールドケース６の各固定片６ｃは基板１１の固定パターン１１ｃに搭載接続される。   The connector 1 configured as described above is surface-mounted on the substrate 11 with solder as shown in FIG. At this time, the connection terminals 4a of the inner shield case 4 and the connection terminals 6a of the outer shield case 6 are mounted and connected to the same ground pattern 11a of the substrate 11, and the connection terminals 2a of the signal contacts 2 are connected to the substrate 11. Each fixed piece 6 c of the outer shield case 6 is mounted and connected to the fixed pattern 11 c of the substrate 11.

本発明の実施例２について図３を参照して説明する。実施例２についての説明は、実施例１と同様な点の説明を省略し、相違する点の説明を行う。図３は、コネクタ２１が基板３１に搭載接続されている状態の斜視図である。   A second embodiment of the present invention will be described with reference to FIG. In the description of the second embodiment, description of the same points as in the first embodiment will be omitted, and different points will be described. FIG. 3 is a perspective view showing a state in which the connector 21 is mounted and connected to the substrate 31.

コネクタ２１は、実施例１のコネクタ１から内部シールドケース４を除去し、複数の信号用コンタクト２のうち左右両側の各信号用コンタクト２をグランドコンタクトとして利用するものである。また、実施例１の外部シールドケース６の各接続端子６ａの幅を広くして、実施例２の外部シールドケース２６の各接続端子２６ａを構成する。各接続端子２６ａと各グランドコンタクトの接続端子２４ａを隣り合うように配置して、基板３１上のグランドパターン３１ａに半田で表面実装する。このときに、各接続端子２６ａと各接続端子２４ａは基板３１の同一のグランドパターン３１ａに搭載接続され、各信号用コンタクトの接続端子２２ａは基板３１の各信号用パターン３１ｂに搭載接続され、外部シールドケース２６の各固定片２６ｃは基板３１の固定パターン３１ｃに搭載接続される。   The connector 21 removes the inner shield case 4 from the connector 1 of the first embodiment, and uses the signal contacts 2 on the left and right sides of the plurality of signal contacts 2 as ground contacts. In addition, each connection terminal 26a of the outer shield case 26 of the second embodiment is configured by increasing the width of each connection terminal 6a of the outer shield case 6 of the first embodiment. The connection terminals 26a and the connection terminals 24a of the ground contacts are arranged so as to be adjacent to each other, and are surface-mounted on the ground pattern 31a on the substrate 31 with solder. At this time, each connection terminal 26a and each connection terminal 24a are mounted and connected to the same ground pattern 31a of the substrate 31, and each connection terminal 22a of each signal contact is mounted and connected to each signal pattern 31b of the substrate 31. Each fixed piece 26 c of the shield case 26 is mounted and connected to the fixed pattern 31 c of the substrate 31.

図４は、実施例１，２のコネクタ１，２１と基板１１，３１が電子機器の筐体４１内に取り付けられている状態の断面図である。   FIG. 4 is a cross-sectional view illustrating a state where the connectors 1 and 21 and the substrates 11 and 31 according to the first and second embodiments are mounted in the housing 41 of the electronic device.

コネクタ１，２１は、電子機器の筐体４１内に取り付けられ、このとき、外部シールドケース６，２６の弾性接片６ｄ，２６ｄが、金属製の筐体４１の内面に接触することによって、グランドラインを形成する。   The connectors 1 and 21 are mounted in the casing 41 of the electronic device. At this time, the elastic contact pieces 6d and 26d of the outer shield cases 6 and 26 come into contact with the inner surface of the metal casing 41, thereby grounding. Form a line.

本発明の実施例１のコネクタが基板に搭載接続されている状態の斜視図である。It is a perspective view in the state where the connector of Example 1 of the present invention is mounted and connected to a substrate. 図１における矢印方向に見たＡ−Ａ線によるコネクタの断面図である。It is sectional drawing of the connector by the AA line seen in the arrow direction in FIG. 本発明の実施例２のコネクタが基板に搭載接続されている状態の斜視図である。It is a perspective view in the state where the connector of Example 2 of the present invention is mounted and connected to the substrate. 本発明の実施例１，２のコネクタと基板が電子機器の筐体内に取り付けられている状態の断面図である。It is sectional drawing of the state in which the connector and board | substrate of Example 1, 2 of this invention were attached in the housing | casing of an electronic device. 従来のＩＣソケットの分解斜視図である。It is a disassembled perspective view of the conventional IC socket. 同ＩＣソケットの組立状態における矢印方向に見たＢ−Ｂ線による拡大断面図である。It is the expanded sectional view by the BB line seen in the arrow direction in the assembly state of the IC socket.

符号の説明Explanation of symbols

１ コネクタ
２ 信号用コンタクト
２ａ 接続端子
２ｂ 接触部
３ 内部ハウジング
３ａ 嵌合開口部
４ 内部シールドケース
４ａ 接続端子
５ 外部ハウジング
５ａ 嵌合開口部
６ 外部シールドケース
６ａ 接続端子
６ｂ 切り欠け部
６ｃ 固定片
６ｄ 弾性接片
１１ 基板
１１ａ グランドパターン
１１ｂ 信号用パターン
１１ｃ 固定パターン
２１ コネクタ
２２ａ 接続端子
２４ａ 接続端子
２６ 外部シールドケース
２６ａ 接続端子
２６ｃ 固定片
２６ｄ 弾性接片
３１ 基板
３１ａ グランドパターン
３１ｂ 信号用パターン
３１ｃ 固定パターン
４１ 筐体 DESCRIPTION OF SYMBOLS 1 Connector 2 Signal contact 2a Connection terminal 2b Contact part 3 Internal housing 3a Fitting opening part 4 Internal shield case 4a Connection terminal 5 External housing 5a Fitting opening part 6 External shield case 6a Connection terminal 6b Notch part 6c Fixed piece 6d Elastic contact piece 11 Substrate 11a Ground pattern 11b Signal pattern 11c Fixed pattern 21 Connector 22a Connection terminal 24a Connection terminal 26 External shield case 26a Connection terminal 26c Fixed piece 26d Elastic contact piece 31 Substrate 31a Ground pattern 31b Signal pattern 31c Fixed pattern 41 Enclosure

Claims (4)

第１のシールドと第２のシールドを有し、前記第１のシールドと前記第２のシールドは、それぞれ基板に対する接続端子を有するコネクタにおいて、前記第１のシールドの接続端子と前記第２のシールドの接続端子は、互いに隣り合う位置に設けられ、前記基板上の同一のパターンに接続するように構成されることを特徴とするコネクタのシールド構造。   A connector having a first shield and a second shield, wherein the first shield and the second shield each have a connection terminal for a substrate, and the connection terminal of the first shield and the second shield The connector shielding structure is characterized in that the connection terminals are provided adjacent to each other and are connected to the same pattern on the substrate. 前記第１のシールドは外部シールドケースで、前記第２のシールドは内部シールドケースであることを特徴とする請求項１記載のコネクタのシールド構造。   2. The connector shield structure according to claim 1, wherein the first shield is an outer shield case, and the second shield is an inner shield case. 前記第１のシールドは外部シールドケースで、前記第２のシールドはグランドコンタクトであることを特徴とする請求項１記載のコネクタのシールド構造。   2. The connector shield structure according to claim 1, wherein the first shield is an outer shield case, and the second shield is a ground contact. 前記両接続端子はサーフェスマウント端子であることを特徴とする請求項１，２又は３記載のコネクタのシールド構造。   4. The connector shield structure according to claim 1, wherein the both connection terminals are surface mount terminals.
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JP2012513077A (en) * 2008-12-22 2012-06-07 モレックスインターコネクト（シャンハイ） カンパニーリミテド Small electrical connector
JP2013242971A (en) * 2012-05-17 2013-12-05 Daiichi Seiko Co Ltd Connector device
CN104241972A (en) * 2013-06-14 2014-12-24 广濑电机株式会社 Electrical connector for circuit board and electrical connector installation body
JP2017216419A (en) * 2016-06-02 2017-12-07 パナソニックＩｐマネジメント株式会社 Electronic device and manufacturing method of electronic device
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Cited By (11)

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Publication number Priority date Publication date Assignee Title
JP2012513077A (en) * 2008-12-22 2012-06-07 モレックスインターコネクト（シャンハイ） カンパニーリミテド Small electrical connector
JP2013242971A (en) * 2012-05-17 2013-12-05 Daiichi Seiko Co Ltd Connector device
CN104241972A (en) * 2013-06-14 2014-12-24 广濑电机株式会社 Electrical connector for circuit board and electrical connector installation body
JP2015002081A (en) * 2013-06-14 2015-01-05 ヒロセ電機株式会社 Electrical connector for circuit board and electrical connector mounting body
JP2017216419A (en) * 2016-06-02 2017-12-07 パナソニックＩｐマネジメント株式会社 Electronic device and manufacturing method of electronic device
WO2018211791A1 (en) * 2017-05-18 2018-11-22 株式会社村田製作所 Mobile electronic apparatus
JPWO2018211791A1 (en) * 2017-05-18 2019-11-14 株式会社村田製作所 Portable electronic devices
US20200044396A1 (en) 2017-05-18 2020-02-06 Murata Manufacturing Co., Ltd. Portable electronic device
US10790621B2 (en) 2017-05-18 2020-09-29 Murata Manufacturing Co., Ltd. Portable electronic device
JP2019129039A (en) * 2018-01-23 2019-08-01 京セラ株式会社 Connector and electronic apparatus
JP7100983B2 (en) 2018-01-23 2022-07-14 京セラ株式会社 Connectors and electronic devices

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