JP2000196256A - Electronic equipment and its manufacture - Google Patents

Electronic equipment and its manufacture

Info

Publication number
JP2000196256A
JP2000196256A JP10369564A JP36956498A JP2000196256A JP 2000196256 A JP2000196256 A JP 2000196256A JP 10369564 A JP10369564 A JP 10369564A JP 36956498 A JP36956498 A JP 36956498A JP 2000196256 A JP2000196256 A JP 2000196256A
Authority
JP
Japan
Prior art keywords
frame
terminal
circuit board
side wall
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP10369564A
Other languages
Japanese (ja)
Inventor
Hideki Watanabe
英樹 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP10369564A priority Critical patent/JP2000196256A/en
Publication of JP2000196256A publication Critical patent/JP2000196256A/en
Ceased legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide electronic equipment which can be reduced in manufacturing cost and a method for manufacturing the equipment. SOLUTION: Electronic equipment is provided with a frame 2 which is formed of a sheet metal and holds a circuit board 8 and a terminal 10 for outside connection fixed to the board 8. The terminal 10 is constituted of a connecting section 10a which is formed by extending part of the side wall section 4 of the frame 2 and cutting off the extended part from the side wall section 4 and a terminal section 10b which is formed continuously from the connecting section 10a and the terminal section 10b is fixed to the circuit board 8.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、例えば携帯電話機
用送受信ユニットやTVチュ−ナ又はモジュレ−タ等の
電子機器並びにその製造方法に係り、さらに詳しくは、
外部接続用の端子の改良に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus such as a transmitting / receiving unit for a portable telephone, a TV tuner or a modulator, and a method of manufacturing the same.
It relates to improvement of external connection terminals.

【0002】[0002]

【従来の技術】図9乃至図10は、この種の電子機器の
従来技術を説明するためのものであり、この電子機器2
1は、薄い鉄製平板等の板金からなるフレーム22と、
このフレーム22に保持された回路基板28と、この回
路基板28に固定された端子30とにより構成されてい
る。
2. Description of the Related Art FIGS. 9 and 10 are diagrams for explaining the prior art of this kind of electronic equipment.
1 is a frame 22 made of sheet metal such as a thin iron flat plate,
A circuit board 28 held by the frame 22 and terminals 30 fixed to the circuit board 28 are provided.

【0003】フレーム22は、上下面を開放した箱形状
に形成され、図9に示すように、その角部には、側壁部
23と側壁部24及び側壁部24と側壁部25とを各々
上端部で結合する結合部26,27が形成されている。
また、側壁部23及び側壁部25の下端部には、脚部2
3a,25aが各々一体に設けられ、この脚部23a,
25aの下端部には、各々取付片23b,25bが突設
されている。
The frame 22 is formed in a box shape having open upper and lower surfaces. As shown in FIG. 9, the corner portion has a side wall portion 23 and a side wall portion 24 and a side wall portion 24 and a side wall portion 25 each having an upper end. The connecting parts 26 and 27 which are connected by the parts are formed.
Further, the lower end of the side wall 23 and the side wall 25 has a leg 2.
3a and 25a are provided integrally with each other.
At the lower end of 25a, mounting pieces 23b and 25b are respectively provided to protrude.

【0004】回路基板28は、一対の孔29aが穿設さ
れた平板状の絶縁基板29を備え、その上下面には、一
対の孔29aの縁部から延出する図示せぬ導電パターン
が形成されているとともに、この導電パターンに接続さ
れて電気回路を構成する抵抗やコンデンサー等の図示せ
ぬ電気部品が実装されている。そして、この回路基板2
8は、かしめや半田付け等の適宜手段により、図9に示
すように、フレーム22の側壁部23,24,25の内
壁に取り付けられている。
The circuit board 28 is provided with a flat insulating substrate 29 having a pair of holes 29a formed therein, and a conductive pattern (not shown) extending from an edge of the pair of holes 29a is formed on upper and lower surfaces thereof. In addition, electrical components (not shown) such as a resistor and a capacitor connected to the conductive pattern and forming an electrical circuit are mounted. And this circuit board 2
8 is attached to the inner walls of the side walls 23, 24 and 25 of the frame 22 by appropriate means such as caulking or soldering, as shown in FIG.

【0005】端子30は、導電線材からなる一対の端子
部30aと、この一対の端子部30aを支持する角形の
絶縁部材30bとからなり、一対の端子部30aはイン
サート成形によって絶縁部材30bに取り付けられてい
る。そして、この端子30は、図10に示すように、そ
の一対の端子部30aを回路基板28の一対の孔29a
に各々挿通させて回路基板28の上面に載置され、回路
基板28の下面側で一対の端子部30aに半田付けを施
すことにより、一対の端子部30aを上述した回路基板
28の図示せぬ導電パターンに接続させて回路基板28
に取り付けられている。
The terminal 30 includes a pair of terminal portions 30a made of a conductive wire and a rectangular insulating member 30b supporting the pair of terminal portions 30a. The pair of terminal portions 30a are attached to the insulating member 30b by insert molding. Have been. Then, as shown in FIG. 10, the terminals 30 are connected to the pair of terminal portions 30a by the pair of holes 29a of the circuit board 28.
Are mounted on the upper surface of the circuit board 28 and soldered to the pair of terminal portions 30 a on the lower surface side of the circuit board 28, thereby connecting the pair of terminal portions 30 a to the above-described circuit board 28 (not shown). The circuit board 28 is connected to the conductive pattern.
Attached to.

【0006】そして、このように構成された電子機器2
1は、フレーム22の取付片23b,25bをかしめる
ことによって携帯電話機やVTRデッキ又はTV等の外
部機器の回路基板に取り付けられ、この外部機器の回路
基板に一対の端子部30aの下端部を接続し、上記外部
機器の回路基板と協同して所定の制御処理を行うように
なっている。
[0006] Then, the electronic apparatus 2 configured as described above.
1 is attached to a circuit board of an external device such as a mobile phone, a VTR deck or a TV by caulking the attachment pieces 23b and 25b of the frame 22, and the lower ends of the pair of terminal portions 30a are attached to the circuit board of the external device. Connected to perform a predetermined control process in cooperation with the circuit board of the external device.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、上述し
た電子機器の従来技術にあっては、端子30を使用して
いるため、部品点数が増大し電子機器のコストを低減で
きないという課題を有している。本発明は、上述した事
情に鑑みてなされたもので、その目的は、電子機器のコ
ストを低減できる電子機器並びに電子機器の製造方法を
提供することである。
However, in the above-mentioned prior art of electronic equipment, since the terminals 30 are used, there is a problem that the number of parts increases and the cost of the electronic equipment cannot be reduced. I have. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic device and a method for manufacturing the electronic device that can reduce the cost of the electronic device.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本発明の電子機器は、板金から形成され、回路基板
を保持するフレームと、前記回路基板に固着された外部
接続用の端子とを備え、前記フレームの側壁部の一部を
延設させて、該側壁部から切り離された連結部と、該連
結部に連続して形成された端子部とを設け、前記連結部
と前記端子部とで前記端子を構成し、前記端子部を前記
回路基板に固着したことを最も主要な特徴としている。
In order to achieve the above object, an electronic apparatus according to the present invention comprises a frame formed of sheet metal and holding a circuit board, and a terminal for external connection fixed to the circuit board. A part of a side wall portion of the frame is extended, and a connecting portion separated from the side wall portion and a terminal portion formed continuously with the connecting portion are provided, and the connecting portion and the terminal are provided. The main feature of the present invention is that the terminal is constituted by a portion and the terminal portion is fixed to the circuit board.

【0009】また、前記側壁部には、該フレームの上端
部を繋ぐ連設部を設けて該連設部の下部に切欠部を形成
し、この切欠部の縁部から延設させて前記連結部と前記
端子部とを設けた。
The side wall is provided with a continuous portion for connecting the upper end of the frame, a cutout is formed at a lower portion of the continuous portion, and the cutout is extended from an edge of the cutout to form the connection. Part and the terminal part.

【0010】また、前記側壁部には、該フレームの下端
部を繋ぐ連設部を設けて該連設部の上部に切欠部を形成
し、この切欠部の縁部から延設させて前記連結部と前記
端子部とを設けた。
The side wall is provided with a continuous portion connecting the lower end portion of the frame, a notch is formed at an upper portion of the continuous portion, and the notch is extended from an edge of the notch to form the connection. Part and the terminal part.

【0011】さらに、前記連結部を前記フレーム内に導
出して、前記端子部を前記フレーム内に位置させ、前記
端子部を前記フレーム内で前記回路基板に固着した。
Further, the connecting portion is led out into the frame, the terminal portion is positioned in the frame, and the terminal portion is fixed to the circuit board in the frame.

【0012】また、上記目的を達成するために、本発明
の電子機器の製造方法は、板金から形成されたフレーム
と、該フレームに保持される回路基板とを備え、前記フ
レームの側壁部の一部を切起して、該側壁部に一体に形
成された連結部と、該連結部に連続して形成された端子
部とからなる端子を設け、前記フレームに前記回路基板
を保持するとともに、該回路基板に前記端子部を固着
し、前記連結部を切断して前記側壁部と前記端子部とを
切り離し、外部接続用の端子を形成したことを最も主要
な特徴としている。
According to another aspect of the present invention, there is provided a method of manufacturing an electronic device, comprising: a frame formed of sheet metal; and a circuit board held by the frame. Cutting and raising a portion, a connecting portion formed integrally with the side wall portion, a terminal consisting of a terminal portion formed continuously with the connecting portion is provided, and the circuit board is held on the frame, The most main feature is that the terminal portion is fixed to the circuit board, the connection portion is cut, the side wall portion and the terminal portion are separated, and a terminal for external connection is formed.

【0013】また、前記連結部の一部を前記フレーム外
に導出して、前記端子部を前記フレーム内に位置させ、
前記端子部を前記フレーム内で前記回路基板に固着し、
前記フレーム外で前記連結部を切断して前記側壁部と前
記端子部とを切り離すようにした。
A part of the connecting portion is led out of the frame, and the terminal portion is positioned in the frame;
Fixing the terminal portion to the circuit board in the frame;
The connecting portion is cut outside the frame to separate the side wall portion and the terminal portion.

【0014】[0014]

【発明の実施の形態】以下、本発明の電子機器の第1の
実施の形態を図1乃至図5を用いて説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of an electronic apparatus according to the present invention will be described with reference to FIGS.

【0015】この電子機器1は、薄い鉄製平板等の板金
からなるフレーム2と、このフレーム2に保持された回
路基板8と、この回路基板8に固定された端子10とに
より構成されている。
The electronic device 1 includes a frame 2 made of a sheet metal such as a thin iron flat plate, a circuit board 8 held by the frame 2, and terminals 10 fixed to the circuit board 8.

【0016】フレーム2は、上下面を開放した箱形状に
形成され、図1に示すように、その角部には、側壁部3
と側壁部4及び側壁部4と側壁部5とを各々上端部で結
合する結合部6,7が形成されている。また、側壁部3
及び側壁部5の下端部には、脚部3a,5aが各々一体
に設けられ、この脚部3a,5aの下端部には、各々取
付片3b,5bが突設されている。
The frame 2 is formed in a box shape having upper and lower surfaces open, and as shown in FIG.
And connecting portions 6 and 7 for connecting the side wall portion 4 and the side wall portion 5 at the upper end thereof. Also, the side wall 3
At the lower end of the side wall 5, legs 3a, 5a are provided integrally, and at the lower ends of the legs 3a, 5a, mounting pieces 3b, 5b are protrudingly provided, respectively.

【0017】また、側壁部4には、下端が開放された矩
形状の切欠部4aが形成されており、この切欠部4aの
上部には、フレームの側壁部4の上端部を繋ぐ連設部4
bが設けられている。
The side wall 4 is formed with a rectangular notch 4a having an open lower end. Above the notch 4a, a continuous portion connecting the upper end of the side wall 4 of the frame is formed. 4
b is provided.

【0018】回路基板8は、孔9aが穿設された平板状
の絶縁基板9を備え、その上下面には、孔9aの縁部か
ら延出する図示せぬ導電パターンが形成されているとと
もに、この導電パターンに接続された、電気回路を構成
する抵抗やコンデンサー等の図示せぬ電気部品が実装さ
れている。そして、この回路基板8は、かしめや半田付
け等の適宜手段により、図1に示すように、フレーム2
の側壁部3,4,5の内壁に取り付けられている。
The circuit board 8 is provided with a flat insulating substrate 9 having a hole 9a formed therein. On the upper and lower surfaces, a conductive pattern (not shown) extending from the edge of the hole 9a is formed. An unillustrated electric component such as a resistor or a capacitor constituting an electric circuit connected to the conductive pattern is mounted. Then, the circuit board 8 is formed by appropriate means such as caulking or soldering, as shown in FIG.
Are attached to the inner walls of the side walls 3, 4, and 5.

【0019】端子10は、フレーム2の側壁部4と同じ
薄い鉄製平板等の板金からL字状に形成され、一端部を
側壁部4を同一平面内に位置させて他端部をフレーム2
内に位置させた連結部10aと、この連結部10aの他
端部に連続して形成された端子部10bとからなってい
る。そして、この端子10は、図2に示すように、フレ
ーム2内でその端子部10bが回路基板8の孔9aに挿
通されて、回路基板8の下面側で端子部10bの下端部
に半田付けを施すことにより、端子部10bを上述した
回路基板8の図示せぬ導電パターンに接続させて回路基
板8に固着されている。
The terminal 10 is formed in an L-shape from the same metal plate as the side wall 4 of the frame 2 such as a thin iron flat plate. One end of the terminal 10 is located in the same plane with the other end of the frame 2.
And a terminal portion 10b formed continuously with the other end of the connecting portion 10a. As shown in FIG. 2, the terminal 10b of the terminal 10 is inserted into the hole 9a of the circuit board 8 in the frame 2 and soldered to the lower end of the terminal 10b on the lower surface of the circuit board 8. Is applied, the terminal portion 10b is connected to the above-described conductive pattern (not shown) of the circuit board 8 and is fixed to the circuit board 8.

【0020】次に、この電子機器1の製造方法について
説明すると、フレーム2を加工する段階での切り出し加
工にて、側壁部4に連設部4bを残して図3に示すよう
な切欠部4aを設けることによって、この切欠部4aの
縁部から延出されたコ字型の延設部4cを形成する。そ
して、折り曲げ加工を施してフレーム2を上述の如き形
状にフォーミングするとともに、延設部4cを折り曲げ
線4dに沿って外方(図3において紙面の表側から裏
側)に向けて曲げ起し、次いで、延設部4cの先端部を
折り曲げ線4eに沿って下方に折り曲げることにより、
フレーム2の側壁部4の一部を延設させて、図4に示す
ように、側壁部4に一体に形成された連結部10aと、
この連結部10aに連続して形成された端子部10bと
からなる端子10を設ける。このとき、連結部10aは
一部をフレーム2外に導出させてフレーム2内に位置し
ており、また、端子部10bはフレーム2内に位置した
状態となっている。
Next, a method of manufacturing the electronic device 1 will be described. In the cutting process at the stage of processing the frame 2, the notch portion 4a as shown in FIG. Is formed to form a U-shaped extension 4c extending from the edge of the cutout 4a. Then, the frame 2 is formed into a shape as described above by performing a bending process, and the extending portion 4c is bent outward along the bending line 4d (from the front side to the back side in FIG. 3). By bending the tip of the extension 4c downward along the bending line 4e,
A part of the side wall 4 of the frame 2 is extended, and as shown in FIG.
A terminal 10 consisting of a terminal portion 10b formed continuously with the connecting portion 10a is provided. At this time, a part of the connecting portion 10a is located outside the frame 2 and is located inside the frame 2, and the terminal portion 10b is located inside the frame 2.

【0021】次に、回路基板8を構成する絶縁基板9
は、図示せぬ電気部品が実装されて電気回路が構成され
たときにおいて、その一端縁には突片9bが一体に形成
されており、この突片9bの幅H1は切欠部4aの幅H
2とほぼ等しく形成されている。そして、突片9bを切
欠部4aに案内させて、回路基板8を図4における矢印
Aに沿って下方からフレーム2内に位置させると、図5
に示すように、突片9bがフレーム2の外方に突出した
状態で、孔9aに端子部10bがフレーム2内で挿通さ
れて回路基板8の下面から突出し、回路基板8の下面側
で端子部10bに半田付けを施すことにより、端子部1
0bを上述した回路基板8の図示せぬ導電パターンに接
続させて回路基板8に固着するとともに、この状態でか
しめや半田付け等の適宜手段により、回路基板8をフレ
ーム2の側壁部3,4,5の内壁に取り付ける。
Next, the insulating substrate 9 constituting the circuit board 8
When an electric circuit (not shown) is mounted to form an electric circuit, a protruding piece 9b is integrally formed on one end edge thereof, and the width H1 of the protruding piece 9b is equal to the width H of the notch 4a.
It is formed substantially equal to 2. When the projecting piece 9b is guided by the notch 4a and the circuit board 8 is positioned in the frame 2 from below along the arrow A in FIG.
As shown in the figure, with the protruding piece 9b protruding outside the frame 2, the terminal portion 10b is inserted into the hole 9a in the frame 2 and protrudes from the lower surface of the circuit board 8, and the terminal 9b By soldering the portion 10b, the terminal portion 1
0b is connected to the conductive pattern (not shown) of the circuit board 8 and fixed to the circuit board 8, and in this state, the circuit board 8 is connected to the side walls 3 and 4 of the frame 2 by appropriate means such as caulking or soldering. , 5 on the inner wall.

【0022】しかる後、フレーム2に設けられた連結部
10aを回路基板8の突片9bと共にフレーム2外で切
り取り線10cに沿って切断して側壁部4と端子部10
bとを切り離し、側壁部4から切り離された連結部10
aと、連結部10aに連続して形成された端子部10b
とが回路基板8に設けられて電子機器1の製造が完了す
る。
Thereafter, the connecting portion 10a provided on the frame 2 is cut along the cut line 10c outside the frame 2 together with the protruding piece 9b of the circuit board 8 to cut the side wall portion 4 and the terminal portion 10a.
b and the connecting portion 10 separated from the side wall portion 4.
a, and a terminal portion 10b formed continuously with the connecting portion 10a
Are provided on the circuit board 8, and the manufacture of the electronic device 1 is completed.

【0023】そして、このように構成・製造された電子
機器1は、フレーム2の取付片3b,5bをかしめるこ
とによって携帯電話機やVTRデッキ又はTV等の外部
機器の回路基板に取り付けられ、この外部機器の回路基
板に端子10の端子部10bの下端部を接続し、上記外
部機器の回路基板と協同して所定の制御処理を行うよう
になっている。
The electronic device 1 constructed and manufactured as described above is attached to a circuit board of an external device such as a portable telephone, a VTR deck or a TV by caulking the attachment pieces 3b and 5b of the frame 2. The lower end of the terminal portion 10b of the terminal 10 is connected to the circuit board of the external device, and a predetermined control process is performed in cooperation with the circuit board of the external device.

【0024】次に、本発明の電子機器の第2の実施形態
を図6乃至図8を参照して説明する。
Next, a second embodiment of the electronic apparatus of the present invention will be described with reference to FIGS.

【0025】図8に示すように、この電子機器11は、
薄い鉄製平板等の板金からなるフレーム12と、このフ
レーム12に保持された回路基板8と、この回路基板8
に固定された端子20とにより構成されている。
As shown in FIG. 8, this electronic device 11
A frame 12 made of a sheet metal such as a thin iron flat plate; a circuit board 8 held by the frame 12;
And the terminal 20 fixed to the terminal 20.

【0026】この第2の実施形態では、電子機器11の
フレーム12を加工する段階での切り出し加工にて、側
壁部14の下端部に連設部14bを残して、図7に示す
ような上端が開放された切欠部14aを設けることによ
り、この切欠部14aの縁部から延出された延設部14
cを形成する。そして、折り曲げ加工を施してフレーム
12を図6に示すが如き形状にフォーミングするととも
に、延設部14cを折り曲げ線14dに沿って外方(図
7において紙面の表側から裏側)に向けて曲げ起し、次
いで、延設部14cの先端部を折り曲げ線14eに沿っ
て上方に折り曲げることによって、フレーム12の側壁
部14の一部を延設させて、図6に示すように、側壁部
14に一体に形成された連結部20aと、この連結部2
0aに連続して形成された端子部20bとからなる端子
20を設ける。このとき、連結部20a一部はフレーム
12外に導出されており、また、端子部20bはフレー
ム12内に位置した状態となっている。
In the second embodiment, in the cutting process at the stage of processing the frame 12 of the electronic device 11, the continuous portion 14b is left at the lower end of the side wall portion 14, and the upper end as shown in FIG. By providing the notch portion 14a in which the opening portion is opened, the extension portion 14 extending from the edge of the notch portion 14a is provided.
Form c. Then, the frame 12 is formed into a shape as shown in FIG. 6 by bending, and the extending portion 14c is bent outward along the bending line 14d (from the front side to the rear side in FIG. 7). Then, a part of the side wall portion 14 of the frame 12 is extended by bending the distal end portion of the extension portion 14c upward along the bending line 14e, and as shown in FIG. The connecting portion 20a formed integrally and the connecting portion 2
A terminal 20 consisting of a terminal portion 20b formed continuously with 0a is provided. At this time, a part of the connecting portion 20a is led out of the frame 12, and the terminal portion 20b is located inside the frame 12.

【0027】そして、回路基板8の突片9bを切欠部1
4aに案内させて、回路基板8を上方からフレーム12
内に位置させると、突片9bがフレーム12の外方に突
出した状態で、孔9aに端子部20bがフレーム12内
で挿通されて回路基板8の上面から突出し、回路基板8
の上面側で端子部20bに半田付けを施すことにより、
端子部20bを上述した回路基板8の図示せぬ導電パタ
ーンに接続させて回路基板8に固着するとともに、この
状態でかしめや半田付け等の適宜手段により、回路基板
8をフレーム12の側壁部13,14,15の内壁に取
り付ける。
Then, the projecting piece 9b of the circuit board 8 is
4a to guide the circuit board 8 from above to the frame 12
When the terminal portion 20b is positioned inside the frame 12, the terminal portion 20b is inserted through the hole 9a into the hole 9a and protrudes from the upper surface of the circuit board 8 with the protruding piece 9b protruding outside the frame 12.
By soldering the terminal portion 20b on the upper surface side of
The terminal portion 20b is connected to the above-described conductive pattern (not shown) of the circuit board 8 and is fixed to the circuit board 8. In this state, the circuit board 8 is connected to the side wall portion 13 of the frame 12 by appropriate means such as caulking or soldering. , 14, and 15 on the inner wall.

【0028】しかる後、フレーム12に設けられた連結
部20aを回路基板8の突片9bと共にフレーム12外
で切り取り線20cに沿って切断して側壁部14と端子
部20bとを切り離し、側壁部14から切り離された連
結部20aと、連結部20aに連続して形成された端子
部20bとが回路基板8に設られて、電子機器11の製
造が完了する。
Thereafter, the connecting portion 20a provided on the frame 12 is cut together with the protruding piece 9b of the circuit board 8 along the cut line 20c outside the frame 12 to separate the side wall portion 14 from the terminal portion 20b. The connecting portion 20a separated from the connecting portion 14 and the terminal portion 20b formed continuously with the connecting portion 20a are provided on the circuit board 8, and the manufacture of the electronic device 11 is completed.

【0029】そして、このように構成・製造された電子
機器11も、フレーム12の側壁部13,15に形成さ
れた取付片13b,15bをかしめることによって携帯
電話機やVTRデッキ又はTV等の外部機器の回路基板
に取り付けられ、この外部機器の回路基板に端子20の
端子部20bの下端部を接続し、上記外部機器の回路基
板と協同して所定の制御処理を行うようになっている。
The electronic device 11 constructed and manufactured in this manner is also caulked with the attachment pieces 13b and 15b formed on the side walls 13 and 15 of the frame 12, thereby providing an external device such as a portable telephone, a VTR deck or a TV. Attached to the circuit board of the device, the lower end of the terminal portion 20b of the terminal 20 is connected to the circuit board of the external device, and a predetermined control process is performed in cooperation with the circuit board of the external device.

【0030】[0030]

【発明の効果】以上説明したように、本発明の電子機器
によれば、板金から形成され、回路基板を保持するフレ
ームと、前記回路基板に固着された外部接続用の端子と
を備え、前記フレームの側壁部の一部を延設させて、該
側壁部から切り離された連結部と、該連結部に連続して
形成された端子部とを設け、前記連結部と前記端子部と
で前記端子を構成し、前記端子部を前記回路基板に固着
したので、前記外部接続用の端子を前記フレームの側壁
部の一部で構成することができ、部品点数を削減し電子
機器のコストを低減できる。
As described above, according to the electronic apparatus of the present invention, it is provided with a frame formed of sheet metal and holding a circuit board, and an external connection terminal fixed to the circuit board. A part of the side wall portion of the frame is extended, and a connecting portion separated from the side wall portion and a terminal portion formed continuously with the connecting portion are provided. Since the terminal is configured and the terminal portion is fixed to the circuit board, the terminal for external connection can be configured by a part of the side wall portion of the frame, thereby reducing the number of parts and reducing the cost of the electronic device. it can.

【0031】また、前記側壁部には、該フレームの上端
部を繋ぐ連設部を設けて該連設部の下部に切欠部を形成
し、この切欠部の縁部から延設させて前記連結部と前記
端子部とを設けると、前記切欠部の上部において前記フ
レームが前記連設部によって繋がっているので、前記フ
レームの強度を高め前記フレームの変形を防止すること
ができる。
The side wall is provided with a continuous portion connecting the upper end of the frame, a notch is formed at a lower portion of the continuous portion, and the notch is extended from an edge of the notch to form the connection. When the portion and the terminal portion are provided, the frame is connected to the upper portion of the cutout portion by the connecting portion, so that the strength of the frame can be increased and the deformation of the frame can be prevented.

【0032】また、前記側壁部には、該フレームの下端
部を繋ぐ連設部を設けて該連設部の上部に切欠部を形成
し、この切欠部の縁部から延設させて前記連結部と前記
端子部とを設けると、前記切欠部の下部において前記フ
レームが前記連設部によって繋がっているので、前記フ
レームの強度を高め前記フレームの変形を防止すること
ができる。
Further, a continuous portion connecting the lower end portion of the frame is provided on the side wall portion, a cutout portion is formed at an upper portion of the continuous portion, and the cutout portion is extended from an edge of the cutout portion to form the connection. When the portion and the terminal portion are provided, the frame is connected by the connecting portion below the notch, so that the strength of the frame can be increased and the deformation of the frame can be prevented.

【0033】さらに、前記連結部を前記フレーム内に導
出して、前記端子部を前記フレーム内に位置させ、前記
端子部を前記フレーム内で前記回路基板に固着すると、
前記フレーム内において前記端子を前記回路基板の所望
の位置に配設することができるため、前記端子の配設位
置に設計的自由度を持たせることができる。
Further, when the connecting portion is led out into the frame, the terminal portion is positioned in the frame, and the terminal portion is fixed to the circuit board in the frame.
Since the terminals can be disposed at desired positions on the circuit board in the frame, the positions at which the terminals are disposed can have design flexibility.

【0034】また、本発明の電子機器の製造方法によれ
ば、板金から形成されたフレームと、該フレームに保持
される回路基板とを備え、前記フレームの側壁部の一部
を切起して、該側壁部に一体に形成された連結部と、該
連結部に連続して形成された端子部とからなる端子を設
け、前記フレームに前記回路基板を保持するとともに、
該回路基板に前記端子部を固着し、前記連結部を切断し
て前記側壁部と前記端子部とを切り離し、外部接続用の
端子を形成したので、前記外部接続用の端子を前記フレ
ームの側壁部の一部で構成することができ、部品点数を
削減し電子機器のコストを低減できる。
According to the method of manufacturing an electronic device of the present invention, the electronic device includes a frame formed of a sheet metal, and a circuit board held by the frame. Providing a terminal composed of a connecting portion integrally formed on the side wall portion and a terminal portion formed continuously with the connecting portion, and holding the circuit board on the frame;
The terminal portion is fixed to the circuit board, the connection portion is cut, the side wall portion and the terminal portion are separated, and the terminal for external connection is formed. It can be constituted by a part of the unit, and the number of parts can be reduced, and the cost of the electronic device can be reduced.

【0035】前記連結部の一部を前記フレーム外に導出
して、前記端子部を前記フレーム内に位置させ、前記端
子部を前記フレーム内で前記回路基板に固着し、前記フ
レーム外で前記連結部を切断して前記側壁部と前記端子
部とを切り離すと、前記レーム外で切断機を用いて前記
連結部を切断することができるため、製造工程の自動化
が図れ、前記外部接続用の端子の形成における作業性及
び生産性を向上させることができる。
A part of the connecting portion is led out of the frame, the terminal portion is positioned in the frame, the terminal portion is fixed to the circuit board in the frame, and the connecting portion is fixed outside the frame. When the portion is cut to separate the side wall portion and the terminal portion, the connecting portion can be cut using a cutting machine outside the frame, so that the manufacturing process can be automated and the terminal for external connection can be achieved. Workability and productivity in the formation of the film can be improved.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施形態に係る電子機器の斜視
図。
FIG. 1 is an exemplary perspective view of an electronic apparatus according to a first embodiment of the invention.

【図2】本発明の第1の実施形態に係る電子機器の断面
図。
FIG. 2 is an exemplary sectional view of the electronic apparatus according to the first embodiment of the invention.

【図3】本発明の第1の実施形態に係る電子機器の端子
の製造方法を示す説明図。
FIG. 3 is an explanatory view showing the method of manufacturing the terminal of the electronic device according to the first embodiment of the present invention.

【図4】本発明の第1の実施形態に係る電子機器の製造
方法を説明する斜視図。
FIG. 4 is an exemplary perspective view illustrating the method for manufacturing the electronic device according to the first embodiment of the invention.

【図5】本発明の第1の実施形態に係る電子機器の製造
方法を説明する斜視図。
FIG. 5 is an exemplary perspective view illustrating the method for manufacturing the electronic device according to the first embodiment of the invention.

【図6】本発明の第2の実施形態に係る電子機器の製造
方法を説明する斜視図。
FIG. 6 is an exemplary perspective view illustrating a method for manufacturing an electronic device according to a second embodiment of the invention.

【図7】本発明の第2の実施形態に係る電子機器の端子
の製造方法を示す説明図。
FIG. 7 is an explanatory view showing a method for manufacturing a terminal of an electronic device according to a second embodiment of the present invention.

【図8】本発明の第2の実施形態に係る電子機器の断面
図。
FIG. 8 is an exemplary sectional view of an electronic apparatus according to a second embodiment of the invention.

【図9】従来の電子機器の斜視図。FIG. 9 is a perspective view of a conventional electronic device.

【図10】従来の電子機器の断面図。FIG. 10 is a cross-sectional view of a conventional electronic device.

【符号の説明】[Explanation of symbols]

1 電子機器 2 フレーム 3 側壁部 4 側壁部 4a 切欠部 4b 連設部 4c 延設部 4d 折り曲げ線 4e 折り曲げ線 5 側壁部 8 回路基板 9 絶縁基板 9a 孔部 9b 突片 10 端子 10a 連結部 10b 端子部 10c 切り取り線 11 電子機器 12 フレーム 13 側壁部 14 側壁部 14a 切欠部 14b 連設部 14c 延設部 14d 折り曲げ線 14e 折り曲げ線 15 側壁部 20 端子 20a 連結部 20b 端子部 20c 切り取り線 DESCRIPTION OF SYMBOLS 1 Electronic device 2 Frame 3 Side wall part 4 Side wall part 4a Notch part 4b Continuous part 4c Extension part 4d Bending line 4e Bending line 5 Side wall part 8 Circuit board 9 Insulating board 9a Hole 9b Protrusion piece 10 terminal 10a connection part 10b terminal Part 10c Cut line 11 Electronic device 12 Frame 13 Side wall part 14 Side wall part 14a Notch part 14b Continuous part 14c Extension part 14d Bending line 14e Bending line 15 Side wall part 20 Terminal 20a Connecting part 20b Terminal part 20c Cutting line

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 板金から形成され、回路基板を保持する
フレームと、前記回路基板に固着された外部接続用の端
子とを備え、前記フレームの側壁部の一部を延設させ
て、該側壁部から切り離された連結部と、該連結部に連
続して形成された端子部とを設け、前記連結部と前記端
子部とで前記端子を構成し、前記端子部を前記回路基板
に固着したことを特徴とする電子機器。
1. A frame formed of a sheet metal and holding a circuit board, and an external connection terminal fixed to the circuit board, wherein a part of a side wall of the frame is extended to form the side wall. A connecting portion separated from the portion and a terminal portion formed continuously with the connecting portion are provided, the terminal is configured by the connecting portion and the terminal portion, and the terminal portion is fixed to the circuit board. Electronic equipment characterized by the above.
【請求項2】 前記側壁部には、該フレームの上端部を
繋ぐ連設部を設けて該連設部の下部に切欠部を形成し、
この切欠部の縁部から延設させて前記連結部と前記端子
部とを設けたことを特徴とする請求項1に記載の電子機
器。
2. A continuous portion connecting the upper end portion of the frame is provided in the side wall portion, and a cutout portion is formed at a lower portion of the continuous portion.
The electronic device according to claim 1, wherein the connecting portion and the terminal portion are provided so as to extend from an edge of the notch.
【請求項3】 前記側壁部には、該フレームの下端部を
繋ぐ連設部を設けて該連設部の上部に切欠部を形成し、
この切欠部の縁部から延設させて前記連結部と前記端子
部とを設けたことを特徴とする請求項1に記載の電子機
器。
3. A connecting portion connecting the lower end portion of the frame is provided on the side wall portion, and a cutout portion is formed on an upper portion of the connecting portion.
The electronic device according to claim 1, wherein the connecting portion and the terminal portion are provided so as to extend from an edge of the notch.
【請求項4】 前記連結部を前記フレーム内に導出し
て、前記端子部を前記フレーム内に位置させ、前記端子
部を前記フレーム内で前記回路基板に固着したことを特
徴とする請求項1,2,3に記載の電子機器。
4. The terminal according to claim 1, wherein the connecting portion is led into the frame, the terminal portion is positioned in the frame, and the terminal portion is fixed to the circuit board in the frame. , 2 and 3.
【請求項5】 板金から形成されたフレームと、該フレ
ームに保持される回路基板とを備え、前記フレームの側
壁部の一部を切起して、該側壁部に一体に形成された連
結部と、該連結部に連続して形成された端子部とからな
る端子を設け、前記フレームに前記回路基板を保持する
とともに、該回路基板に前記端子部を固着し、前記連結
部を切断して前記側壁部と前記端子部とを切り離し、外
部接続用の端子を形成したことを特徴とする電子機器の
製造方法。
5. A connecting portion, comprising: a frame formed from a sheet metal; and a circuit board held by the frame, wherein a part of a side wall of the frame is cut and raised, and a connecting portion formed integrally with the side wall. And a terminal comprising a terminal portion formed continuously with the connecting portion, and holding the circuit board on the frame, fixing the terminal portion to the circuit board, and cutting the connecting portion. A method for manufacturing an electronic device, wherein the side wall portion and the terminal portion are separated to form a terminal for external connection.
【請求項6】 前記連結部の一部を前記フレーム外に導
出して、前記端子部を前記フレーム内に位置させ、前記
端子部を前記フレーム内で前記回路基板に固着し、前記
フレーム外で前記連結部を切断して前記側壁部と前記端
子部とを切り離すことを特徴とする請求項5に記載の電
子機器の製造方法。
6. A part of the connecting portion is led out of the frame, the terminal portion is positioned in the frame, the terminal portion is fixed to the circuit board in the frame, and the terminal portion is fixed outside the frame. The method for manufacturing an electronic device according to claim 5, wherein the connecting portion is cut to separate the side wall portion and the terminal portion.
JP10369564A 1998-12-25 1998-12-25 Electronic equipment and its manufacture Ceased JP2000196256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10369564A JP2000196256A (en) 1998-12-25 1998-12-25 Electronic equipment and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10369564A JP2000196256A (en) 1998-12-25 1998-12-25 Electronic equipment and its manufacture

Publications (1)

Publication Number Publication Date
JP2000196256A true JP2000196256A (en) 2000-07-14

Family

ID=18494754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10369564A Ceased JP2000196256A (en) 1998-12-25 1998-12-25 Electronic equipment and its manufacture

Country Status (1)

Country Link
JP (1) JP2000196256A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076594A (en) * 2007-09-19 2009-04-09 Alps Electric Co Ltd Electronic circuit module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009076594A (en) * 2007-09-19 2009-04-09 Alps Electric Co Ltd Electronic circuit module

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