CN101393470A

CN101393470A - Joint back board for INTEL main board

Info

Publication number: CN101393470A
Application number: CNA2008102171343A
Authority: CN
Inventors: 陈海波; 黄晓东
Original assignee: SHENZHEN DONGWEIFENG ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: SHENZHEN DONGWEIFENG ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2008-10-28
Filing date: 2008-10-28
Publication date: 2009-03-25
Anticipated expiration: 2028-10-28
Also published as: CN100589062C

Abstract

The invention relates to a connecting backboard for an INTEL mainboard, which is characterized in that the backboard (1) is a rectangular metal plate; a rectangular concave surface (2) for receiving pins of the mainboard is formed on the surface of the backboard (1); a convex screw column (3) for connecting a radiator is respectively arranged on four corners on one side of the concave surface of the backboard (1); at least two stepped surfaces (4) are arranged on the outside of the concave surface of the backboard (1); each stepped surface is extended outwards in the trapezoidal form; the backboard is arranged on the rear of the mainboard (5); the backboard and the mainboard (5) are positioned through the four screw columns on one side of the concave surface of the backboard; a CPU (6) is arranged on the facade of the mainboard; and radiators (7) which are arranged on the CPU are connected with the screw columns through bolts. The backboard is completely compatible with a 45nm Nehalem series processor of an INTEL novel-generation LGA 1366 interface, is used to connect the mainboard and the CPU, is tightly connected with the mainboard, the CPU and the radiators, and has better heat dissipation effect and beautiful appearance.

Description

The connection backboard that is used for the INTEL mainboard

[technical field]

The present invention relates to the INTEL computing machine mainboard, CPU, and the connection of heating radiator with fixing.

[background technology]

As everyone knows, CPU need just can carry out work by what certain interface was connected with mainboard.CPU is through years of development, and the interface mode of employing has pinned, cassette, contact, stitch etc.And the interface of CPU all is the stitch interface at present, and corresponding to just has corresponding slot-type on the mainboard.Cpu i/f type difference all changes in jack number, volume, shape, so can not patch mutually.Socket775 is called Socket T again, be the pairing interface of CPU that is applied to Intel LGA775 encapsulation at present, adopt CPU such as the Pentium D of Pentium 4, Pentium 4 EE, Celeron D and double-core of the monokaryon that the LGA775 encapsulation is arranged of this kind interface and Pentium EE at present.Different with former Socket 478 interface CPU, the bottom of Socket775 interface CPU does not have traditional stitch, and replace 775 contacts, promptly be not stitch but contact, by with corresponding Socket 775 slots in 775 contact pilotages contact transmission signals.Socket 775 interfaces not only can effectively promote processor signal intensity, promote processor frequencies, also can improve simultaneously processor production yields, reduce production costs.This change can effectively overcome the signal interference that the stitch contact causes. and when adopting the pin type package design, can produce a large amount of noises when making processor operate in high frequency, cause signal to disturb owing to traditional CPU.And for avoiding the assorted letter of these high frequencies to disturb, Intel is that platform of new generation has redesigned SocketT processor installation interface.Though new design has solved some original problems, the also unexpected shortcoming of some that bring simultaneously: the contact on the SocketT socket fractures because of being easily damaged, and may cause the monoblock mainboard therefore to be scrapped when serious.New LGA1366 interface (claiming Socket B again) has more about 600 stitch and area big 20% than LGA775, because this interface will be used in QPI bus, three connections such as 64bit DDR3 main memory access, so cause the CPU thermal value huge.

[summary of the invention]

The present invention is intended to address the above problem, and provides a kind of INTEL of the being applicable to LGA of a new generation 1366 interfaces, the connection backboard that is used for the INTEL mainboard of better heat-radiation effect.

For achieving the above object, the invention provides a kind of connection backboard of the INTEL of being used for mainboard, this backboard is a rectangular metal plate, on its plate face, form the concave surface that holds the mainboard stitch of a rectangle, respectively be provided with the screw hole column that the connection heating radiator of a projection is used at the place, four angles of its concave surface one side, be provided with at least two terraces in its concave surface outside, each terrace is trapezoidal and extends laterally.

Backboard is contained in the back side of mainboard, and itself and mainboard are located by four screw hole columns of its concave surface one side, and CPU places the front of mainboard, and the heating radiator that is contained on the CPU is connected with described screw hole column with screw.

On the contact plane of backboard 1 and mainboard, be provided with heat conductive silica gel high temperature resistant and that thermal diffusivity is strong.

Be provided with at least two at the place, four angles of the concave surface of backboard and hold the breach that the mainboard stitch is used.

Contribution of the present invention is that the 45nmNehalem series processors of its complete compatible INTEL LGA of a new generation 1366 interface is used to connect mainboard and CPU, and it is connected closely with mainboard, CPU and heating radiator, and radiating effect is better, and good looking appearance.

[description of drawings]

Fig. 1 is an one-piece construction front perspective view of the present invention.

Fig. 2 is the parts exploded perspective synoptic diagram that the present invention is connected with mainboard, CPU and heating radiator.

[embodiment]

Following enforcement is to the further explanation and the explanation of invention, and the present invention is not constituted any limitation.

Consult Fig. 1, Fig. 2, the present invention is the connection backboard that is exclusively used in the INTEL mainboard, this backboard 1 is a square sheet metal, its with side plate face that mainboard 5 is connected on form a rectangular concave surface 2 by mold pressing, be used to hold the stitch of mainboard, the size of this concave surface and the degree of depth are enough to the stitch at mainboard 5 back sides is held wherein.Locate respectively to be provided with a screw hole column that has screw 3 that raises up by four angles of concave surface one side at backboard, be used to connect the heating radiator of CPU.Be provided with two trapezoidal terraces 4 that extend out to back plate edges in the outside of concave surface, this terrace can be used for holding part and divides stitch, and makes it more firm with being connected of mainboard.More firm for backboard is connected with mainboard, on the contact plane of backboard 1 and mainboard, be provided with heat conductive silica gel high temperature resistant and that thermal diffusivity is strong, it is more firm that backboard is connected with mainboard.In addition, be provided with two breach 9, be used to hold the stitch of the correspondence position of mainboard at one of them place, diagonal angle of the concave surface 2 of backboard 1.

As shown in Figure 2, mainboard 5 is placed concave surface 2 one sides of backboard 1, four screw hole column 3 corresponding positions on itself and the backboard respectively are provided with a connecting hole 8, and mainboard is contained in concave surface 2 one sides of backboard 1 by its connecting hole 8, makes mainboard be located by screw hole column 3.CPU 6 places on the mainboard 5, and the interface of mainboard LGA1366 contacts one by one with 1366 contacts of the CPU that is placed on it.Be provided with heating radiator 7 on CPU, the place, four angles of the side that heating radiator combines with CPU respectively is provided with a screw, and heating radiator 7 is threaded through screw and screw hole column 3 with backboard 1 usefulness screw, and backboard 1, mainboard 5, CPU 6, heating radiator 7 are connected as one.

Claims

1, a kind of connection backboard that is used for the INTEL mainboard, it is characterized in that, this backboard (1) is a rectangular metal plate, on its plate face, form the concave surface that holds the mainboard stitch (2) of a rectangle, respectively be provided with the screw hole column (3) that the connection heating radiator of a projection is used at the place, four angles of its concave surface one side, be provided with at least two terraces (4) in its concave surface outside, each terrace is trapezoidal and extends laterally.

2, the connection backboard that is used for the INTEL mainboard as claimed in claim 1, it is characterized in that, backboard is contained in the back side of mainboard (5), itself and mainboard are located by four screw hole columns of its concave surface one side, CPU (6) places the front of mainboard, and the heating radiator (7) that is contained on the CPU is connected with described screw hole column with screw.

3, the connection backboard that is used for the INTEL mainboard as claimed in claim 2 is characterized in that, is provided with heat conductive silica gel high temperature resistant and that thermal diffusivity is strong on the contact plane of backboard (1) and mainboard (5).

4, the connection backboard that is used for the INTEL mainboard as claimed in claim 3 is characterized in that, is provided with at least two at the place, four angles of the concave surface (2) of backboard (1) and holds the breach (9) that the mainboard stitch is used.