CN2476837Y

CN2476837Y - Assembling structure of host board CPU and heat sink

Info

Publication number: CN2476837Y
Application number: CN 00268469
Authority: CN
Inventors: 张瑞祺
Original assignee: Mitac Technology Corp
Current assignee: Getac Technology Corp
Priority date: 2000-12-27
Filing date: 2000-12-27
Publication date: 2002-02-13
Anticipated expiration: 2010-12-27

Abstract

A package assembly of a CPU and a radiator on a motherboard is provided. The combination of a CPU subassembly containing a BGA type with a motherboard reduces the whole height of the structure and provides the radiator of the CPU with a bigger height and larger space in the enlarging of the radiating area; the CPU is assembled to one circuit wafer through the SMT, and a plurality of pins are arranged on the surface of the circuit wafer for inserting a CPU socket; the CPU socket is arranged on the back of the motherboard, forming a hole at a position corresponding to the motherboard, so that the CUP can be exposed, the radiator is arranged on the front face of the motherboard and contacted with the CPU to transmit heat by passing through the hole, so that the radiating aim is reached.

Description

The CPU of motherboard and the package assembly of heating radiator

The utility model relates to a kind of package assembly of CPU and heating radiator of motherboard, especially relates to a kind of radiator structure that is used for the CPU of ball-grid-array-type ball-grid-array-type (Ball Grid Array) type.

Along with developing rapidly of computer industry in recent years, the thermal value of electronic component such as microprocessor chip is more and more high, and size is more and more little, for this intensive heat effectively being dispersed into the environment outside the system, work under the temperature of permission to keep element, usually be attached on the electronical elements surface of heating with heat radiator, increase its overall area of dissipation to improve radiating effect with big base area.

For dissimilar CPU, with reference to Fig. 1 and Fig. 2, it is respectively the CPU of ball-grid-array-type and the CPU of pin array pin array type (Pin Grid Array) type is assembled in the synoptic diagram of computer motherboard.Wherein, as shown in Figure 1, the CPU12 of ball-grid-array-type type assembles a cpu chip (die) 10 in little (micro) ball-grid-array-type mode, the CPU12 of this ball-grid-array-type will form the bead 14 that trellis is arranged from the teeth outwards, and with surface installation technique (Surface Mounting Technology, surface installation technique) is assembled in a motherboard (Main Board, M/B) on 20 the front, so-called here front is meant that the surface has the one side of assemblings such as other electron component such as chipset or memory.As for structure shown in Figure 2, the CPUI6 of the pin array type of assembling out in little pin array mode, must just can finish by a CPU socket 18 cpu chip 10 is assembled on the motherboard 20, method is CPU socket (socket) 18 surfaces, for example also form the bead 14 that the tool trellis is arranged, the same surface installation technique that adopts is assembled in earlier on the motherboard 20, generally at the employed motherboard of the above computer of 80486/Pentium grade, be socket to be distinguished according to the different pin number of CPU, as the employed Socket-7 of Pentium is pin (pin) hole of tool 321, and being fit to PentiumPro employed then is Socket-8.So the pin (not illustrating) of the CPU I6 quantity of suitable pin array type will be arranged on the CPU socket 18, make the CPU16 of pin array type type can insert CPU socket 18.

The two structure, main discrepancy are the pin array type CPU16 of Fig. 2 can be upgraded (upgrade).Because the CPU12 of the ball-grid-array-type type of Fig. 1 welds extremely on motherboard 20, can not separate, and Fig. 2 is the joint that adopts pin, so just can be changed easily again.No matter yet be one of any in the above two, since among Fig. 1 among the CPU12 of ball-grid-array-type type or Fig. 2 CPU socket 18 all need directly beat on motherboard 20 with surface installation technique, generally all need be provided with one at the back side of motherboard and reinforce iron plate 22, and iron plate 22 is fixed on motherboard 20 with four fixed legs 24, to avoid loose contact.These four fixed legs 24 more can be used as follow-up heat radiator (not illustrating) fixing usefulness of when assembling.

But such structure but goes up the installing heat radiator to CPU and forms restriction.With Fig. 1, the CPU12 of the ball-grid-array-type of motherboard more than 20 highly is about 3mm, and Fig. 2 has added CPU socket 18 thickness increases becoming 5.7mm, but the both must add the thickness of iron plate 22, this is for the host computer framework that height and space constraint are arranged, representing the heat radiator (not illustrating) that connects cpu chip 10 can not expand its height, but the heat radiator of CPU heat transmission but need have bigger height and space to be used to increase its area of dissipation.Relatively,, just can obtain big height and space heating radiator is set, CPU radiating efficiency preferably is provided if can reduce the overall height that CPU is assemblied in motherboard.Moreover, no matter the CPU that is ball-grid-array-type or pin array type is the technology of Intel, the dedicated cpu socket of higher cost if the CPU of employing pin array type must arrange in pairs or groups again, and be that the iron plate that adapts to the required setting of surface installation technique has also increased the step of assembling.

In view of this, one of the purpose of this utility model provides a kind of package assembly of CPU and heating radiator of motherboard, and it has reduced the overall height that CPU is assemblied in motherboard, makes the heating radiator of CPU that the height and the space of bigger setting can be arranged.

According to above-mentioned the purpose of this utility model, the package assembly of the CPU and the heating radiator of motherboard is provided, comprise a motherboard, a cpu package and a heating radiator at least.Wherein motherboard has a first surface and a second surface, and first surface is provided with a plurality of electronic components, forms a hole that runs through on the first surface; Cpu package comprises a cpu chip, is assemblied on the second surface of motherboard, makes cpu chip to expose at the hole of motherboard; Heating radiator then is assemblied on the first surface of motherboard, sees through the hole of motherboard, contacts with the cpu chip of cpu package, to conduct the heat that cpu chip sends.

Cpu package also comprises CPU, a switching circuit board and a CPU socket of a ball-grid-array-type.Utilize the microballoon grid array technology to finish the assembling of cpu chip, on switching circuit board one surface, form a plurality of pins, the CPU of ball-grid-array-type is assembled in this surface, again CPU socket is configured in the second surface of motherboard, make switching circuit board insert CPU socket with its pin, and its respective hosts plate holes position also forms one and runs through opening, and the CPU of ball-grid-array-type can be exposed at the hole of motherboard.Wherein, the CPU of ball-grid-array-type sticks to the central authorities of switching circuit board with a surface installation technique, and the pin of switching circuit board then is formed at periphery.Heating radiator has a contact mat, can contact with the cpu chip of the CPU of ball-grid-array-type by the hole of motherboard to form to fix; And CPU socket is to utilize a plurality of screws to be fixed on the motherboard, and screw will bore motherboard and lock admittedly with heating radiator.

Another purpose of the present utility model provides a kind of radiator structure that is used for the CPU of ball-grid-array-type, makes it have higher radiating efficiency.

According to above-mentioned the purpose of this utility model, be provided for the radiator structure of the CPU of ball-grid-array-type, comprise CPU, a switching circuit board, a CPU socket, a motherboard and a heating radiator of a ball-grid-array-type at least.Wherein, the CPU of ball-grid-array-type forms the assembling of a cpu chip with the microballoon grid array technology; Around switching circuit board one surface, be formed with a plurality of pins, and the CPU of ball-grid-array-type is assembled in surface central authorities with surface installation technique; The central hollow out that forms of corresponding CPU socket, when making switching circuit board insert CPU socket with its pin, the CPU of ball-grid-array-type can expose; Motherboard has a first surface and a second surface, first surface is provided with a plurality of electronic components, on it and be formed with a hole CPU socket that runs through and then be assembled on the second surface of motherboard, and the CPU of ball-grid-array-type can be exposed by the hole of motherboard; Last heating radiator then is assemblied on the first surface of motherboard, sees through the hole of motherboard, contacts with the CPU of ball-grid-array-type, to conduct the heat that it is sent.

Equally, heating radiator has a contact mat, and the hole that can see through motherboard contacts with the cpu chip of the CPU of ball-grid-array-type to form and fixes; And CPU socket is to utilize a plurality of screw closures on motherboard, and screw will bore motherboard and heating radiator locks together admittedly.

The utility model tool good heat dissipation effect, easy to assembly, advantage such as cost is lower.

For above-mentioned and other purposes, feature of the present utility model can be become apparent, especially exemplified by a preferred embodiment, conjunction with figs. elaborates.

Fig. 1 is that a kind of CPU of ball-grid-array-type is assembled in the structural representation on the motherboard;

Fig. 2 is that a kind of CPU of pin array type is assembled in the structural representation on the motherboard;

Fig. 3 is the exploded view of the package assembly of the CPU of a kind of motherboard of the utility model and heating radiator;

Fig. 4 is the combination synoptic diagram of the structure of Fig. 3.

With reference to Fig. 3, it is assembled in the STRUCTURE DECOMPOSITION figure of motherboard at the CPU of ball-grid-array-type for the utility model.As shown in the figure, the element that comprises has: the CPU12 of a switching circuit board (dot board) 30, one ball-grid-array-type, a CPU socket 32, a motherboard 20 and a heating radiator (heat sink) 40.Structure cut-away view after the combination of elements of Fig. 3 is Fig. 4.

Wherein, the CPU12 of ball-grid-array-type is for finishing the assembly of a cpu chip 10 with the microballoon grid array technology, be assemblied in earlier on the switching circuit board 30, be to be assembled on the switching circuit board 30 equally with surface installation technique, the operation of surface installation technique herein is to finish in a preposition program, therefore when the CPU12 of ball-grid-array-type stamps switching circuit board 30, be on another job platform, to support switching circuit board 30 with a fixture, need not on motherboard 20, add, just can reach the situation of avoiding loose contact and take place as the iron plate assembly.The CPU12 of preferable ball-grid-array-type is the central authorities that are configured in switching circuit board 30, and on around the same surface of switching circuit board 30, form a plurality of pin 34a, when being different from traditional die assembling or assembly, the set position of chip is two opposite surfaces with chip pin position.CPU socket 32 is with locking mode, utilize four screws 36 to be locked on the motherboard 20, and be the back side that is fixed on motherboard 20, it is the non-surface that comprises the electronic component that motherboard is set, CPU socket 32 forms hollow out 38 in central authorities, the corresponding position that is provided with also is formed with a hole that runs through 26 on motherboard 20, so after CPU socket 32 was assemblied in motherboard 20, the position of central authorities just formed the situation that runs through.As for the position of hollow out not on the CPU socket 32, just can be corresponding the situation that is provided with of switching circuit board 30 pins 34 form pin hole 34b, so switching circuit board 30 just can insert CPU socket 32, and make the cpu chip 10 of CPU12 of ball-grid-array-type expose by CPU socket 32 hollow out places 38 and hole 26, so the front (being provided with the surface of electronic component) by motherboard 20 just can touch cpu chip 10 through hole 26, above-mentioned switching circuit board 30 engages for male and female with CPU socket 32, clearly, also pin hole 34b can be arranged on switching circuit board 30, CPU socket 32 then has the purpose that pin 34a equally also can reach above-mentioned joint.At last, 40 in heating radiator is assemblied on the front face surface of motherboard 20, and it can see through the hole 26 of motherboard 20, contacts with the cpu chip 10 of the CPU12 of ball-grid-array-type, just can conduct the heat that cpu chip 10 sends and be shed by heating radiator 40.

Synoptic diagram by Fig. 4 can obviously be seen, with illustrated direction, cpu package on the motherboard 20 (comprises switching circuit board 30, the CPU12 of ball-grid-array-type and CPU socket 32) thickness includes only the height of switching circuit board 30 and CPU socket 32, heating radiator 40 then is located at the front of motherboard 20 alone, therefore, distance between heating radiator 40 and motherboard almost is not have distance, so the structure of heating radiator 40 all can be set in the height in motherboard 20 fronts and space, bigger space and height are arranged, certainly just can design heating radiator 40, reach radiator structure with better heat dissipation effect with big area of dissipation.

In addition, the heating radiator 40 among Fig. 3 has a contact mat 42, and the hole 26 that can see through motherboard 20 contacts heating radiator 40 fixing with the cpu chip 10 of the CPU12 of ball-grid-array-type; And CPU socket 32 utilizes 4 screws 36 to be locked together on the motherboard 20, this screw 36 can be bored motherboard 20 and be locked on the heating radiator 40, so more can strengthen the fixation case of heating radiator 40.

What need further specify is again, the private jack 18 that the CPU socket 32 more known pin array type CPU that the utility model adopts use will cheaply many on price, and could the upgrade function of CPU of the pin array type CPU that can reach the not necessarily non-Intel of employing.The utility model only utilizes the setting of a switching circuit board, just can the lower non-dedicated cpu socket of use cost, on cost, will reduce many, also be simultaneously because this switching circuit board, make the direction of the CPU energy transition sets of ball-grid-array-type type, and the program and the cost that reduce the material of reinforcing iron plate, fixed leg and assemble.

In sum; though the utility model is disclosed with preferred embodiment; right its is not in order to limit the utility model; anyly be familiar with this operator; in not breaking away from spirit and scope of the present utility model; may do some and change and retouching, therefore protection domain of the present utility model should be as the criterion with the scope of applying for a patent that claims were defined.

Claims

1, the package assembly of a kind of CPU of motherboard and heating radiator is characterized in which comprises at least:

One motherboard, above-mentioned motherboard have a first surface and a second surface, and above-mentioned first surface is provided with a plurality of electronic components, on it and be formed with a hole that runs through;

One cpu package comprises a cpu chip, is assemblied on the second surface of above-mentioned motherboard, makes above-mentioned cpu chip to expose at the hole of above-mentioned motherboard;

One heating radiator is assemblied on the first surface of above-mentioned motherboard, sees through the hole of above-mentioned motherboard, contacts with the cpu chip of above-mentioned cpu package, to conduct the heat that this cpu chip sends.

2, the package assembly of the CPU of motherboard as claimed in claim 1 and heating radiator is characterized in that above-mentioned cpu package further comprises:

The CPU of one ball-grid-array-type makes above-mentioned cpu chip assemble with the microballoon grid array technology;

One switching circuit board be formed with a plurality of pins on the surface thereof, and the CPU of above-mentioned ball-grid-array-type is assembled on this surface:

One CPU socket, be assembled in the second surface of above-mentioned motherboard, the CPU of above-mentioned ball-grid-array-type make these pins of above-mentioned built-up circuit can insert above-mentioned CPU socket, and the hole location of its respective hosts plate also form one and run through opening, so that can expose at the hole of above-mentioned motherboard.

3, the package assembly of the CPU of motherboard as claimed in claim 2 and heating radiator, the CPU that it is characterized in that above-mentioned ball-grid-array-type is assembled on the above-mentioned switching circuit board with a surface installation technique.

4, the package assembly of the CPU of motherboard as claimed in claim 3 and heating radiator, the CPU that it is characterized in that above-mentioned ball-grid-array-type is assembled in above-mentioned switching circuit board central authorities, and the pin of above-mentioned switching circuit board is then around it.

5, as the CPU of claim 2 a described motherboard and the package assembly of heating radiator, it is characterized in that above-mentioned heating radiator has a contact mat, the hole that can see through this motherboard contacts with the CPU core of the CPU of above-mentioned ball-grid-array-type type to form and fixes.

6, the package assembly of the CPU of motherboard as claimed in claim 5 and heating radiator is characterized in that above-mentioned CPU socket is to utilize a plurality of screws to be fixed on the above-mentioned motherboard.

7, the package assembly of the CPU of motherboard as claimed in claim 6 and heating radiator, it is fixing with above-mentioned heating radiator to it is characterized in that above-mentioned tommy bar is crossed above-mentioned motherboard.