CN101371186B - 用于分段显示器的背板的设计和制备方法 - Google Patents
用于分段显示器的背板的设计和制备方法 Download PDFInfo
- Publication number
- CN101371186B CN101371186B CN2006800079854A CN200680007985A CN101371186B CN 101371186 B CN101371186 B CN 101371186B CN 2006800079854 A CN2006800079854 A CN 2006800079854A CN 200680007985 A CN200680007985 A CN 200680007985A CN 101371186 B CN101371186 B CN 101371186B
- Authority
- CN
- China
- Prior art keywords
- heat
- radiation
- slurry
- curing material
- adjustable curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 238000012938 design process Methods 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 45
- 239000000463 material Substances 0.000 claims description 41
- 239000002002 slurry Substances 0.000 claims description 22
- 230000005855 radiation Effects 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 230000001680 brushing effect Effects 0.000 description 10
- 238000001259 photo etching Methods 0.000 description 9
- 239000000049 pigment Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000001962 electrophoresis Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000011218 segmentation Effects 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000001996 bearing alloy Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003847 radiation curing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134327—Segmented, e.g. alpha numeric display
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/1675—Constructional details
- G02F1/1676—Electrodes
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/165—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field
- G02F1/166—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect
- G02F1/167—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/42—Arrangements for providing conduction through an insulating substrate
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Geometry (AREA)
- Molecular Biology (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Liquid Crystal (AREA)
Abstract
本发明涉及用于分段显示器的背板的设计和制备方法。
Description
技术领域
本发明涉及用于分段显示器的背板(底板,backplane)的设计和制备方法。
背景技术
在直接驱动(或分段)显示器中,显示面板通常夹在公共电极层和背板之间。公共电极层是单电极层,其覆盖整个显示区域。背板包括其上用导电材料形成有所希望的图案的衬底层。显示面板可以是电泳显示器、液晶显示器或其它类型的显示器,如用Gyricon技术制备的显示器。
电泳显示器(EPD)是一种非发射性装置,其基于影响溶剂中、优选介电溶剂中带电荷颜料粒子的迁移的电泳现象。这种类型的显示器于1969年首次提出。EPD通常包括一对相对的、隔开的板状电极,其中隔离物预先确定它们之间的一定距离。这些电极的至少之一(通常在观看侧)是透明的。由介电溶剂和分散在其中的带电荷颜料粒子组成的电泳分散液被封装在两个极板之间。当在两个电极之间施加电压差时,带电荷颜料粒子由于吸引力而迁移到极性与颜料粒子相反的极板。因此,在透明极板呈现的颜色(通过选择性地充电该极板来确定)可以是溶剂的颜色或颜料粒子的颜色。反转极板极性将使粒子迁移回到相反极板,从而反转颜色。通过控制在一定电压范围或脉冲时间的极板电荷,可以在透明极板处获得由于中间颜料密度导致的中间色彩密度(或灰度)。
先前报道了不同像素或单元结构的EPD,例如,分区式EPD[M.A.Hopper and V.Novotny,IEEE Trans.Electr.Dev.,Vol.ED 26,No.8,pp.1148-2252(1979)]、微囊化的EPD(美国专利第5,961,804和5,930,026号以及2003年1月30日提交的美国申请序列号60/443,893和2004年1月27日提交的序列号10/766,757),以及利用微棱镜或微沟槽的全内反射(TIR)型EPD,如在M.A Mossman,et al.,SID 01 Digest PP.1054(2001)、SID IDRC proceedings,pp.311(2001)、以及SID 02 Digest,PP.522(2002)中所披露的。
美国专利第6,930,818号、第6,672,921号以及第6,933,098号披露了一种改进的EPD制造技术,将其全部内容以引用方式结合于此作为参考。该改进的EPD包括分开的由微杯形成并填充有分散在介电溶剂中的带电颜料离子的单元。为了将电泳分散液限制和隔离在该单元中,该填充后的单元用聚合物密封层加以顶部密封,其中聚合物密封层优选由包括一种选自由热塑性塑料、热塑性弹性体、热固性塑料及其前体组成的组中的材料的组合物形成。
在电泳分段显示器中,在所希望的图案区域中,显示面板中的带电荷颜料离子可以迁移到公共电极层侧或背板侧,这取决于公共电极层和导电图案之间的电压差。
美国专利第6,795,138号和第6,784,953号披露了一种液晶显示器,该液晶显示器包括通过微杯技术制造并填充有液晶组合物(可选地包含二色性染料)的显示单元。
还可以通过Gyricon技术来制备显示面板(如在授予GyriconMedia公司的美国专利第6,588,131号以及授予Xerox的第6,497,942号和第5,754,332号中所披露的)。Gyricon薄板是透明塑料薄层,其中随机分散有上百万的小珠,有点像调色剂颗粒。这些小珠(各自容纳在油填充的腔中)可以在那些腔中自由旋转。这些小珠是“二色性的”并具有两个对比色(例如,黑色和白色、红色和白色)的半球,充电而呈现为电偶极子。当将电压施加于薄板表面时,小珠旋转而将一个有色侧提供给观看者。可以将电压施加于该表面以产生图像如文本和图片。图像将持续存在直到施加新的电压模式(电压起伏图)。
在分段显示器中,所希望的图案可以是字母表中的字母、数字显示(如利用众所周知的7或14个分段电极的那些)、标识、符号或其它图案。
背板通常由柔性或刚性印刷电路板形成。用于制造印刷电路板的常规方法涉及多个步骤。分段电极和导线首先在非导电衬底层(层压或涂覆有导电金属)的相对侧上制成,并通过镀铜通孔彼此电连接。在形成通孔期间,采用了下述步骤:钻孔、化学镀(无电镀)、电镀、以及用非导电树脂堵塞镀铜通孔。因为在每个分段电极上的整个区域必须是导电性的并且是平的,所以接着在随后的电镀和分段图案化以前,需要刷光(brushing)和抛光步骤,以除去任何与用非导电树脂堵塞的镀铜通孔有关的突起。另外,在用常规方法形成的分段电极之间的间隙通常具有大约30μm至大约60μm或甚至更高的深度。如此显著深度的间隙会不利于层压在背板上的显示面板,尤其是用微杯技术制成的显示面板。因此,需要另外的间隙堵塞步骤如焊接掩模涂覆(阻焊剂涂覆,solder mask coating)、光刻以及刷光,以将间隙平面化。因此整个方法不仅昂贵和复杂而且产率低。
值得注意的是,在本申请中提到的每个文献的全部内容以引用方式结合于本申请作为参考。
发明内容
本发明涉及用于显示面板的背板设计,尤其是直接驱动显示面板。
本发明还涉及制造用于分段显示器的背板的方法。
本发明的方法涉及更少的步骤,因而成本更低。
附图说明
图1A-1H示出了背板制造的部分方法。
图2示出了本发明的间隙堵塞方法。
图3A-3G示出本发明的一种可替换方法。
图4A-4C以俯视图示出图3A-3G的方法。
图5A-5F示出本发明的另一种可替换方法。
具体实施方式
图1A-1H示出背板制造的部分方法。如图1A所示,该方法是在非导电衬底层(10)上实施的,其中导电金属(11)(如铝、锡、锌、镍或铜,优选铜或含铜合金)层压或涂覆在两侧上。
在图1B中,通孔(12a和12b)通过例如下述步骤形成:机械钻孔或激光打孔,接着进行化学镀和电镀以用导电金属(13)如铜涂覆通孔的内表面,如图1C所示。在用导电金属镀覆通孔的内表面的同时,在衬底层(10)两侧上的导电金属层(11)可能会变厚(11a)。
在图1D中,用非导电树脂(14)(如焊接掩模、粘合剂或负性光刻胶(negative-tone photoresist),优选焊接掩模(阻焊剂)和负性光刻胶)堵塞镀铜通孔。可以利用辊涂或丝网印刷来完成该步骤。一旦已将非导电树脂施加于通孔,则使用热源或辐射源来固化该树脂材料。如图1E所示,然后通过旋转或滚动刷光(roller brushing)来除去在通孔的开口处由树脂材料形成的突起(14a)。
因为在每个分段电极上的整个区域必须是导电的,所以在图1F中,在从图1E的步骤获得的薄膜两侧镀覆了另外的导电金属层(15)。为了制备如图1G所示的分段电极(16a和16b)和导线(17a和17b),采用了光刻和蚀刻。因此,通过通孔(12a或12b)内的导电金属(13)将每个分段电极(16a或16b)连接于导线(分别地,17a或17b)。在光刻和蚀刻过程中,根据所希望的分段设计来形成间隙(18)。必须使区域18a变空以分开导线(17a和17b)。如果区域18b是在两根导线之间,则也可以使它们变空。
在分段电极之间的间隙(18)通常具有30微米至60微米的深度。这样显著深度的间隙可能不利于层压在背板上的显示面板。因此,优选堵塞间隙。在用于制备印刷电路板的常规方法中,将通常为负性的光成像光刻胶(感光阻剂,photoimageable resist)涂覆在分段电极(16a和16b)上并填充入间隙(18)中。在辐射暴露步骤以后,利用适当的溶剂,选择性地剥除未暴露区域(即分段电极上方的区域)上的光刻胶(阻剂)。然后通过旋转或滚动刷光除去间隙(18)顶部上由暴露光刻胶形成的突起。这样的间隙堵塞方法不仅昂贵和复杂而且产率低。
本发明提供了如图2所示的新的间隙堵塞方法。首先将液体形式的辐射或热可固化材料(20)施加在分段电极的顶表面。然后将离型膜(释放膜,release film)(21)层压在顶表面上,以将辐射或热可固化材料挤入间隙(18)中。在印刷电路板工业的商业上可获得的许多热或辐射可固化材料例如焊接掩模和孔堵塞油墨都适用于本申请。另外,还可以使用辐射或热可固化粘合剂。为了避免在堵塞的间隙的顶部形成“倾斜(斜角,dip)”,辐射或热可固化材料可以具有大于85%(w/w)的固体含量,优选基本上为100%(w/w)的固体含量。固化之前,材料的粘度优选在大约10cps至大约30,000cps的范围内,更优选大约30cps至大约10,000cps的范围内。在某些情况下,可以优选将低介电常数的非导电材料用于间隙堵塞方法,以防止与电泳显示器相关的反偏压问题。介电常数优选在大约1至大约30的范围内,更优选在大约1至大约10的范围内。可以通过轧辊(压料锟,nip roller)(22)精确控制层压压力,以减少在分段电极的顶表面上保留的辐射或热可固化材料的量。实践中,在分段电极的顶表面上保留的辐射或热可固化材料的厚度可以薄到0.1μm或更小。在将辐射或热可固化材料填入间隙以后,施加辐射源或热源以使该可固化材料硬化。由于其剥离(或防粘)特性,在硬化步骤以后,可以容易地除去离型膜(21)并在间隙的顶部上留下平的表面而没有突起。
这种间隙堵塞方法具有许多优点。例如,可以免去在常规方法中所用的繁琐步骤,如涂覆光成像光刻胶、光刻以及刷光。因此,可以清洁、有效并且低成本地实施如图2中所描述的步骤。
为了完成图1A-1G的组件,如图1H所示,随后可以将焊接掩模或非导电材料(19)施加至导线侧,以防止导线腐蚀或擦伤。可以在间隙堵塞之前或之后施加焊接掩模或非导电材料(19)。
用于制备背板的本发明的一种可替换方法示于图3A-3G。如图3A所示,在层压或涂覆有导电金属(31)的非导电衬底层(30)上实施该方法。可以在衬底层的两侧上层压或涂覆导电金属,然而,仅层压或涂覆一侧就足够了。适合的导电金属是以上描述的那些,其中铜是最经常使用的。导电金属层的厚度通常在大约0.1微米至大约100微米的范围内,优选在大约1微米至大约50微米的范围内。
在图3B中,导线(32a和32b)通过光刻和蚀刻而由导电金属(31)形成。实践中,导电金属(31)并不是如常规印刷电路板方法中的只是被图案化以形成薄且窄的导线。相反,如图4A所示,导线(32a和32b)中的每一个可以在一侧具有更大的导电区域。利用这样的设计,可以更容易对准光掩模以暴露其顶层,即在随后步骤中使用的光成像材料(或感光材料)(33)。
在图3C中,利用模涂(die coating)、幕涂、浸涂、旋涂、喷涂或刮涂,将介电层(优选光成像材料(33))形成在导线上。适合的光成像材料可以包括但不限于商业上可获得的光成像焊接掩模、负性光刻胶以及正性光刻胶,其中环氧基焊接掩模是更优选的。光成像材料的厚度通常在大约1微米至大约1,000微米范围内,优选在大约2微米至大约500微米的范围内。
在图3D,通过光刻除去在连接于导线(优选在其顶部上)的区域(34a和34b)中的光成像材料,以便在导线和待形成的分段电极之间形成电连接。
然后,如图3E所示,借助于电镀,使开口区域(34a和34b)和导电材料(35a和35b)齐平。用于该步骤的适合导电材料可以包括但不限于铜、镍、钴、锡、银以及金,其中铜是最优选的。通过电镀时间和电流密度来控制导电材料(35a和35b)的厚度,以使导电材料(35a和35b)的顶部和光成像材料(33)的顶部齐平。因此,不需要在常规方法中经常使用的刷光步骤。
在图3F中,将导电金属(36)镀覆在光成像材料上,其中导电区域(35a和35b)包埋在光成像材料中。因为光成像材料(33)是非导电性的,所以在电镀步骤之前需要化学镀步骤,以提供薄籽晶层(thin seed layer)。然后借助于光刻和蚀刻形成分段电极(36a和36b)。如图3G所示,借助于导电区域(分别为35a和35b),将分段电极(36a和36b)的每一个连接于导线(分别为32a和32b)。将导线(32a和32b)连接于电源,以驱动分段电极。
可替换地,如果电镀系统具有良好的深镀能力(throwingpower),则可以以一步来镀覆导电金属(35a、35b和36)。两种方式可以用来增加深镀能力。一种方式涉及将高电流密度极化剂(polarizer)(或抑制剂)和宏观整平剂(macro leveler)整合到电镀溶液中,以增强低电流密度沉积。另一种方式涉及利用脉冲电流来电镀金属。两种方式均是商业上可获得的,例如,Technic公司的Technic CU 3000和TechniPulse 5300方法。在这种情况下,在电镀步骤以前,采用化学镀步骤以在图3D的已图案化的光成像材料(33)表面上提供薄籽晶层。
可以通过电镀时间和电流密度来将分段电极之间的间隙(37)深度控制为薄到大约1微米至大约5微米。该深度取决于镀覆的导电金属(36)的厚度。如果导电金属(36)的厚度(由此形成的间隙深度)高得不可接受,则可以应用如图2所示的间隙堵塞方法来消除这些间隙。
图4A-4C示出图3A-3G所示方法的俯视图。图4A对应于图3B,其中图3B中的导线32a和32b是图4A中导线32a和32b(在线X处)的剖视图。如上所述,每根导线在一侧具有更大的导电区域。图4B对应于图3E,并且示出了:已施加了光成像材料,通过光刻法已除去了区域34a和34b,以及在区域35a和35b中已镀覆导电金属。图4C对应于图3G。图4C中的方形是图3G中的分段电极36a和36b的俯视图。
图3A-3G的方法完全避免了使用通孔。因此,消除了在常规方法中用于通孔堵塞和平面化(例如,树脂填充和刷光)的所有步骤。另外,该方法中所使用的所有材料都是商业上可获得的,因此可以方便地以低成本实施该方法。
图5A-5F示出本发明的另一种可选替换的方法。在图5A和5B所示的步骤是与图1A和1B的那些相同,其中形成有通孔(52a和52b)。在图5C中,通孔填充了导电浆料(53),如碳浆料、铜浆料、镍浆料、钴浆料、银浆料、银涂覆的铜浆料、银涂覆的镍浆料、银涂覆的钴浆料及其复合物或合金浆料,其中铜浆料、银浆料以及银涂覆的铜浆料是更优选的。可以通过辊涂、丝网印刷或注射填充,将导电浆料施加于通孔,其中丝网印刷是更优选的选择。
可以通过热或辐射固化来硬化导电浆料(53)。可以通过刷光来除去在通孔开口处由导电浆料形成的突起(54),如图5D所示。在图5E中,实施光刻和蚀刻步骤,以在一侧形成分段电极(55a和55b)并在另一侧形成导线(56a和56b)。最后,将非导电材料或焊接掩模(57)涂覆在导线侧以完成背板组件。在这种背板组件中,通过通孔(分别为52a或52b)内的导电浆料(53),每个分段电极(55a或55b)连接于导线(分别地,56a或56b),如图5F所示。
可以将分段电极的厚度(由此形成的分段电极之间的间隙(58)深度)控制到小于大约10微米。然而,如果这些间隙太深以致不可接受,则可以应用图2的间隙堵塞步骤来消除这些间隙。
为了在储存和装运期间防止铜基分段电极发生腐蚀,可以通过化学镀或电镀将它们涂覆一薄层镍、锡或金。
实施例1
利用图1A-1G的工艺流程制备了一种背板,该背板具有用于数字显示的众所周知的14个分段电极图案。在蚀刻步骤以后,分段电极之间的间隙深度为大约40微米。通过注射器在背板的一个边缘附近施加Norland光学粘合剂61(Norland Optical Adhesive 61,NOA61)。在25℃下,NOA61的固体含量和粘度分别为100%和300厘泊。利用热辊层合机(Hot Roll Laminator)(Cheminstrument,Fairfield,Ohio),将UV10离型膜(由CPFilms公司提供)层压到背板上,其中的热辊层合机预先设置如下:辊温度为200,层压速度为1cm/sec,以及辊压力为50psi。利用UV强度为1.2mw/cm2的UV固化装置来固化填充在间隙中的NOA61。在固化以后,除去UV10离型膜。间隙深度从40微米减小到小于1微米。
虽然已参照具体实施方式对本发明进行了描述,但本领域技术人员应当明了,在不背离本发明的真正精神和范围的情况下,可以作出各种变化并且可以进行等效替换。另外,可以进行许多改进以使特定的情况、材料、组成、方法、工艺步骤或多个工艺步骤适合于对本发明的目的和范围。所有这样的改进属于所附权利要求的范围内。
Claims (14)
1.一种用于制备用于分段显示器的背板的方法,所述方法包括:
a)在非导电衬底层上形成导线;
b)用光成像材料覆盖所述导线;
c)形成导电区域,其连接于所述导线并包埋在所述光成像材料中;
d)在所述光成像材料上镀覆导电材料以形成分段电极;以及
e)用热或辐射可固化材料填充所述分段电极之间的间隙,接着硬化所述热或辐射可固化材料。
2.根据权利要求1所述的方法,其中,所述导线由铜形成。
3.根据权利要求1所述的方法,其中,所述光成像材料是焊接掩模、负性光刻胶或正性光刻胶。
4.根据权利要求1所述的方法,其中,所述光成像材料是环氧基焊接掩模。
5.根据权利要求1所述的方法,其中,所述热或辐射可固化材料具有大于85%(w/w)的固体含量。
6.根据权利要求5所述的方法,其中,所述热或辐射可固化材料具有为100%(w/w)的固体含量。
7.根据权利要求1所述的方法,其中,所述热或辐射可固化材料是焊接掩模、孔堵塞油墨、或者热或辐射可固化粘合剂。
8.一种用于制备用于分段显示器的背板的方法,所述方法包括:
a)在两侧层压或涂覆有导电材料的非导电衬底层上形成通孔;
b)用导电浆料填充所述通孔;
d)在层压或涂覆于所述非导电衬底层一侧的所述导电材料上形成分段电极,以及在层压或涂覆于所述非导电衬底层另一侧的所述导电材料上形成导线;以及
e)用热或辐射可固化材料填充所述分段电极之间的间隙,接着硬化所述热或辐射可固化材料。
9.根据权利要求8所述的方法,进一步包括:在步骤d之前,
c)在所述通孔的开口处去除由所述导电浆料形成的突起。
10.根据权利要求8或9所述的方法,其中,所述通孔是通过机械钻孔或激光打孔形成的。
11.根据权利要求8或9所述的方法,其中,所述导电浆料是碳浆料、铜浆料、镍浆料、钴浆料、银浆料、银涂覆的铜浆料、银涂覆的镍浆料、银涂覆的钴浆料或者其复合物或合金浆料。
12.根据权利要求8或9所述的方法,其中,所述热或辐射可固化材料具有大于85%(w/w)的固体含量。
13.根据权利要求12所述的方法,其中,所述热或辐射可固化材料具有基本上为100%(w/w)的固体含量。
14.根据权利要求8或9所述的方法,其中,所述热或辐射可固化材料是焊接掩模、孔堵塞油墨、或者热或辐射可固化粘合剂。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66174005P | 2005-03-14 | 2005-03-14 | |
US60/661,740 | 2005-03-14 | ||
US11/364,843 | 2006-02-27 | ||
US11/364,843 US8576162B2 (en) | 2005-03-14 | 2006-02-27 | Manufacturing processes of backplane for segment displays |
PCT/US2006/009611 WO2006099557A2 (en) | 2005-03-14 | 2006-03-14 | Design and manufacturing processes of backplane for segment displays |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101371186A CN101371186A (zh) | 2009-02-18 |
CN101371186B true CN101371186B (zh) | 2011-02-16 |
Family
ID=36992443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800079854A Active CN101371186B (zh) | 2005-03-14 | 2006-03-14 | 用于分段显示器的背板的设计和制备方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8576162B2 (zh) |
EP (1) | EP1859316A2 (zh) |
JP (1) | JP2008537601A (zh) |
KR (1) | KR20070112385A (zh) |
CN (1) | CN101371186B (zh) |
WO (1) | WO2006099557A2 (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8576162B2 (en) | 2005-03-14 | 2013-11-05 | Sipix Imaging, Inc. | Manufacturing processes of backplane for segment displays |
US20110013128A1 (en) * | 2009-07-20 | 2011-01-20 | Avery Dennison Corporation | Dynamic display with divided top electrode |
JP5733023B2 (ja) * | 2011-05-24 | 2015-06-10 | 大日本印刷株式会社 | 電子ペーパー用背面電極基材および電子ペーパー |
WO2013055189A1 (ko) | 2011-10-14 | 2013-04-18 | 주식회사 엘지화학 | 케이블형 이차전지 |
KR101483686B1 (ko) | 2011-11-02 | 2015-01-16 | 주식회사 엘지화학 | 케이블형 이차전지 |
US10317767B2 (en) | 2014-02-07 | 2019-06-11 | E Ink Corporation | Electro-optic display backplane structure with drive components and pixel electrodes on opposed surfaces |
KR102322762B1 (ko) * | 2014-09-15 | 2021-11-08 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
CN104698718A (zh) * | 2015-03-13 | 2015-06-10 | 深圳市迪佩科技有限公司 | 可挠曲电子纸显示屏及显示器件和制造方法 |
US10503041B2 (en) | 2016-11-30 | 2019-12-10 | E Ink Corporation | Laminated electro-optic displays and methods of making same |
US10324577B2 (en) | 2017-02-28 | 2019-06-18 | E Ink Corporation | Writeable electrophoretic displays including sensing circuits and styli configured to interact with sensing circuits |
WO2018183240A1 (en) | 2017-03-28 | 2018-10-04 | E Ink Corporation | Porous backplane for electro-optic display |
TWI682261B (zh) | 2017-05-19 | 2020-01-11 | 美商電子墨水股份有限公司 | 包含數位化及觸控感測的可折疊電光顯示器 |
US11404013B2 (en) | 2017-05-30 | 2022-08-02 | E Ink Corporation | Electro-optic displays with resistors for discharging remnant charges |
WO2018222638A1 (en) | 2017-05-30 | 2018-12-06 | E Ink Corporation | Electro-optic displays |
CA3075408C (en) | 2017-10-18 | 2022-06-28 | E Ink Corporation | Digital microfluidic devices including dual substrates with thin-film transistors and capacitive sensing |
US10824042B1 (en) | 2017-10-27 | 2020-11-03 | E Ink Corporation | Electro-optic display and composite materials having low thermal sensitivity for use therein |
US11175561B1 (en) | 2018-04-12 | 2021-11-16 | E Ink Corporation | Electrophoretic display media with network electrodes and methods of making and using the same |
US11353759B2 (en) | 2018-09-17 | 2022-06-07 | Nuclera Nucleics Ltd. | Backplanes with hexagonal and triangular electrodes |
EP3866903A4 (en) | 2018-10-15 | 2022-07-13 | E Ink Corporation | DIGITAL MICROFLUID DISPENSING DEVICE |
WO2020097462A1 (en) | 2018-11-09 | 2020-05-14 | E Ink Corporation | Electro-optic displays |
US11521565B2 (en) | 2018-12-28 | 2022-12-06 | E Ink Corporation | Crosstalk reduction for electro-optic displays |
CN118033960A (zh) | 2018-12-30 | 2024-05-14 | 伊英克公司 | 电光显示器 |
US11513415B2 (en) | 2020-06-03 | 2022-11-29 | E Ink Corporation | Foldable electrophoretic display module including non-conductive support plate |
WO2023023213A1 (en) | 2021-08-18 | 2023-02-23 | E Ink Corporation | Methods for driving electro-optic displays |
US11830449B2 (en) | 2022-03-01 | 2023-11-28 | E Ink Corporation | Electro-optic displays |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1409293A (zh) * | 2001-09-19 | 2003-04-09 | 奥博特瑞克斯株式会社 | 驱动液晶显示装置的方法 |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4917079B1 (zh) * | 1970-12-21 | 1974-04-26 | ||
US4188472A (en) * | 1978-10-06 | 1980-02-12 | Ppg Industries, Inc. | Curable lactone derived resins |
US4459320A (en) * | 1981-12-11 | 1984-07-10 | At&T Bell Laboratories | Maskless process for applying a patterned solder mask coating |
US5019748A (en) * | 1986-12-12 | 1991-05-28 | E-Lite Technologies, Inc. | Method for making an electroluminescent panel lamp as well as panel lamp produced thereby |
JPH04199696A (ja) | 1990-11-29 | 1992-07-20 | Nippon Cement Co Ltd | ランドレス高密度バイア充填方法 |
US5905558A (en) * | 1995-08-29 | 1999-05-18 | Canon Kabushiki Kaisha | Circuit plate, process for producing same and liquid crystal device including same |
JP3423495B2 (ja) * | 1995-08-29 | 2003-07-07 | キヤノン株式会社 | 配線基板の製造方法 |
JPH09274194A (ja) * | 1996-04-03 | 1997-10-21 | Canon Inc | 液晶素子の製造方法 |
US5754332A (en) * | 1996-06-27 | 1998-05-19 | Xerox Corporation | Monolayer gyricon display |
US6428868B1 (en) * | 1996-06-27 | 2002-08-06 | Xerox Corporation | Twisting-cylinder display |
US5930026A (en) * | 1996-10-25 | 1999-07-27 | Massachusetts Institute Of Technology | Nonemissive displays and piezoelectric power supplies therefor |
US6207268B1 (en) * | 1996-11-12 | 2001-03-27 | Dai Nippon Printing Co., Ltd. | Transfer sheet, and pattern-forming method |
US5961804A (en) * | 1997-03-18 | 1999-10-05 | Massachusetts Institute Of Technology | Microencapsulated electrophoretic display |
US6232950B1 (en) * | 1997-08-28 | 2001-05-15 | E Ink Corporation | Rear electrode structures for displays |
KR100536868B1 (ko) * | 1997-10-03 | 2006-02-28 | 다이니폰 인사츠 가부시키가이샤 | 전사시트 |
US6194053B1 (en) * | 1998-02-26 | 2001-02-27 | International Business Machines Corporation | Apparatus and method fabricating buried and flat metal features |
US6933098B2 (en) * | 2000-01-11 | 2005-08-23 | Sipix Imaging Inc. | Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web |
US6672921B1 (en) * | 2000-03-03 | 2004-01-06 | Sipix Imaging, Inc. | Manufacturing process for electrophoretic display |
US6930818B1 (en) * | 2000-03-03 | 2005-08-16 | Sipix Imaging, Inc. | Electrophoretic display and novel process for its manufacture |
US20070237962A1 (en) * | 2000-03-03 | 2007-10-11 | Rong-Chang Liang | Semi-finished display panels |
US7142351B2 (en) * | 2000-03-03 | 2006-11-28 | Sipix Imaging, Inc. | Electro-magnetophoresis display |
KR100767233B1 (ko) * | 2000-04-18 | 2007-10-17 | 이 잉크 코포레이션 | 박막 트랜지스터의 제조 공정 및 기판 |
KR100486333B1 (ko) * | 2000-07-21 | 2005-04-29 | 가부시끼가이샤 한도따이 프로세스 켄큐쇼 | 반도체 장치 및 그 제조 방법 |
US6391523B1 (en) * | 2000-09-15 | 2002-05-21 | Microchem Corp. | Fast drying thick film negative photoresist |
US6795138B2 (en) * | 2001-01-11 | 2004-09-21 | Sipix Imaging, Inc. | Transmissive or reflective liquid crystal display and novel process for its manufacture |
TW556044B (en) * | 2001-02-15 | 2003-10-01 | Sipix Imaging Inc | Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web |
JP3702859B2 (ja) * | 2001-04-16 | 2005-10-05 | セイコーエプソン株式会社 | 電気光学装置及び電子機器 |
US7110163B2 (en) * | 2001-07-09 | 2006-09-19 | E Ink Corporation | Electro-optic display and lamination adhesive for use therein |
US6982178B2 (en) * | 2002-06-10 | 2006-01-03 | E Ink Corporation | Components and methods for use in electro-optic displays |
US6588131B2 (en) * | 2001-08-31 | 2003-07-08 | Gyricon Media, Inc. | Animated sign assembly |
CN1209674C (zh) * | 2002-04-23 | 2005-07-06 | 希毕克斯影像有限公司 | 电磁泳显示器 |
US7261920B2 (en) * | 2002-04-24 | 2007-08-28 | Sipix Imaging, Inc. | Process for forming a patterned thin film structure on a substrate |
TWI240842B (en) * | 2002-04-24 | 2005-10-01 | Sipix Imaging Inc | Matrix driven electrophoretic display with multilayer back plane |
TWI310098B (en) * | 2002-05-03 | 2009-05-21 | Sipix Imaging Inc | Methods of surface modification for improving electrophoretic display performance |
TW556031B (en) * | 2003-01-17 | 2003-10-01 | Chunghwa Picture Tubes Ltd | Non-rubbing liquid crystal alignment method |
TWI230832B (en) * | 2003-01-24 | 2005-04-11 | Sipix Imaging Inc | Novel adhesive and sealing layers for electrophoretic displays |
TWI299101B (en) * | 2003-01-30 | 2008-07-21 | Sipix Imaging Inc | High performance capsules for electrophoretic displays |
JP4024172B2 (ja) * | 2003-03-19 | 2007-12-19 | 株式会社日立製作所 | 電気泳動表示装置および製造方法 |
KR101105991B1 (ko) * | 2003-07-09 | 2012-01-18 | 프라이즈 메탈즈, 인크. | 침착 및 패턴 공정 |
US7301693B2 (en) * | 2004-08-13 | 2007-11-27 | Sipix Imaging, Inc. | Direct drive display with a multi-layer backplane and process for its manufacture |
US7259106B2 (en) * | 2004-09-10 | 2007-08-21 | Versatilis Llc | Method of making a microelectronic and/or optoelectronic circuitry sheet |
KR100626049B1 (ko) * | 2004-12-11 | 2006-09-21 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널의 전극 제조 방법, 플라즈마디스플레이 패널의 전극 제조에 사용되는 몰드 플레이트및, 그에 의해 제조된 전극을 구비한 플라즈마 디스플레이패널 |
US7304780B2 (en) * | 2004-12-17 | 2007-12-04 | Sipix Imaging, Inc. | Backplane design for display panels and processes for their manufacture |
US8576162B2 (en) | 2005-03-14 | 2013-11-05 | Sipix Imaging, Inc. | Manufacturing processes of backplane for segment displays |
-
2006
- 2006-02-27 US US11/364,843 patent/US8576162B2/en active Active
- 2006-03-14 WO PCT/US2006/009611 patent/WO2006099557A2/en active Application Filing
- 2006-03-14 JP JP2008502075A patent/JP2008537601A/ja active Pending
- 2006-03-14 EP EP06738647A patent/EP1859316A2/en not_active Withdrawn
- 2006-03-14 CN CN2006800079854A patent/CN101371186B/zh active Active
- 2006-03-14 KR KR1020077021028A patent/KR20070112385A/ko not_active Application Discontinuation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1409293A (zh) * | 2001-09-19 | 2003-04-09 | 奥博特瑞克斯株式会社 | 驱动液晶显示装置的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20070112385A (ko) | 2007-11-23 |
JP2008537601A (ja) | 2008-09-18 |
EP1859316A2 (en) | 2007-11-28 |
WO2006099557A3 (en) | 2008-07-31 |
US20060215106A1 (en) | 2006-09-28 |
WO2006099557A2 (en) | 2006-09-21 |
CN101371186A (zh) | 2009-02-18 |
US8576162B2 (en) | 2013-11-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101371186B (zh) | 用于分段显示器的背板的设计和制备方法 | |
CN107771369B (zh) | 用于机械和电气地连接到显示器电极的方法 | |
CN106211793B (zh) | 用于背板组件的多层扩展电极结构 | |
US7304780B2 (en) | Backplane design for display panels and processes for their manufacture | |
CN104583853B (zh) | 用于生产电光显示器的工艺 | |
US7910175B2 (en) | Processes for the production of electrophoretic displays | |
CN101064329B (zh) | 光学器件和使用该光学器件的光学模块 | |
KR102308588B1 (ko) | 라미네이트된 전기-광학 디스플레이들 및 이를 제조하는 방법들 | |
KR19980070717A (ko) | 액정표시장치 및 그 제조방법 | |
JP4918974B2 (ja) | 電気泳動装置の製造方法、電気泳動装置、および電子機器 | |
JP2005024864A (ja) | 電気泳動表示装置、電気泳動表示装置の製造方法および電子機器 | |
JP4393173B2 (ja) | 電気泳動表示装置の製造方法および電子機器 | |
CN110888282A (zh) | 彩色滤光片模组及其制备方法、彩色电子纸及其制备方法 | |
KR100772032B1 (ko) | 접합방법 | |
JP2004199088A (ja) | フィルム液晶パネル製造用のベース基板およびアクティブマトリックス基板 | |
JP2010102293A (ja) | マイクロカプセル型電気泳動式表示パネルとその製造方法 | |
JP2011186289A (ja) | 多面付けカラー電気泳動表示装置及びその製造方法 | |
JPH05164913A (ja) | 電着基板、電着基板の製造方法および電着基板を用いたカラーフィルターの製造方法 | |
KR20090006792A (ko) | 대전 입자를 이용한 화상표시장치 및 이의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231019 Address after: Massachusetts Patentee after: E INK Corp. Address before: California, USA Patentee before: SIPIX IMAGING, Inc. |
|
TR01 | Transfer of patent right |