CN101339369B - PS plate retouching paste - Google Patents
PS plate retouching paste Download PDFInfo
- Publication number
- CN101339369B CN101339369B CN2008100633598A CN200810063359A CN101339369B CN 101339369 B CN101339369 B CN 101339369B CN 2008100633598 A CN2008100633598 A CN 2008100633598A CN 200810063359 A CN200810063359 A CN 200810063359A CN 101339369 B CN101339369 B CN 101339369B
- Authority
- CN
- China
- Prior art keywords
- percent
- retouching
- version
- edition
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 10
- -1 alcohol amine Chemical class 0.000 claims abstract description 8
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 20
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 15
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims description 10
- 239000006210 lotion Substances 0.000 claims description 8
- 235000011187 glycerol Nutrition 0.000 claims description 7
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 6
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 6
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 claims description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 4
- 239000011505 plaster Substances 0.000 abstract 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000000443 aerosol Substances 0.000 abstract 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011538 cleaning material Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100633598A CN101339369B (en) | 2008-08-07 | 2008-08-07 | PS plate retouching paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008100633598A CN101339369B (en) | 2008-08-07 | 2008-08-07 | PS plate retouching paste |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101339369A CN101339369A (en) | 2009-01-07 |
CN101339369B true CN101339369B (en) | 2011-08-24 |
Family
ID=40213466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008100633598A Active CN101339369B (en) | 2008-08-07 | 2008-08-07 | PS plate retouching paste |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101339369B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102314100A (en) * | 2011-05-10 | 2012-01-11 | 刘华礼 | PS (Photoshop) version retouching paste containing dimethyl sulfate |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619217A (en) * | 1968-10-30 | 1971-11-09 | Fmc Corp | Desensitizer for photolithographic printing plate |
FR2098542A5 (en) * | 1970-07-20 | 1972-03-10 | Perraguin Gerard | Plates for offset reprodn - correction using a universal solvent mixt |
CN1393490A (en) * | 2001-07-04 | 2003-01-29 | 万裕全 | Cleaning cream for PS plate |
US6783695B1 (en) * | 1999-06-29 | 2004-08-31 | Micron Technology, Inc. | Acid blend for removing etch residue |
-
2008
- 2008-08-07 CN CN2008100633598A patent/CN101339369B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3619217A (en) * | 1968-10-30 | 1971-11-09 | Fmc Corp | Desensitizer for photolithographic printing plate |
FR2098542A5 (en) * | 1970-07-20 | 1972-03-10 | Perraguin Gerard | Plates for offset reprodn - correction using a universal solvent mixt |
US6783695B1 (en) * | 1999-06-29 | 2004-08-31 | Micron Technology, Inc. | Acid blend for removing etch residue |
CN1393490A (en) * | 2001-07-04 | 2003-01-29 | 万裕全 | Cleaning cream for PS plate |
Also Published As
Publication number | Publication date |
---|---|
CN101339369A (en) | 2009-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG KONITA NEW MATERIALS CO., LTD. Free format text: FORMER OWNER: WENZHOU KONITA PRINTING EQUIPMENT CO., LTD. Effective date: 20120319 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120319 Address after: Ca Mau road Wenzhou Industrial Park Zhejiang province 325013 No. 1 Patentee after: Zhejiang Konita New Materials Co., Ltd. Address before: 325013 Mount Lu Road, Zhejiang, Wenzhou Patentee before: Wenzhou Konita Printing Equipment Co., Ltd. |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: PS plate retouching paste Effective date of registration: 20200715 Granted publication date: 20110824 Pledgee: Wenzhou minshang Bank Co.,Ltd. Pledgor: ZHEJIANG KONITA NEW MATERIALS Co.,Ltd. Registration number: Y2020330000496 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210629 Granted publication date: 20110824 Pledgee: Wenzhou minshang Bank Co.,Ltd. Pledgor: ZHEJIANG KONITA NEW MATERIALS Co.,Ltd. Registration number: Y2020330000496 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: PS revision paste Effective date of registration: 20210629 Granted publication date: 20110824 Pledgee: Wenzhou minshang Bank Co.,Ltd. Pledgor: ZHEJIANG KONITA NEW MATERIALS Co.,Ltd. Registration number: Y2021990000563 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |